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Active MEMS for Wireless and Optical Space Communications
Principal Investigators: Frank Merat, Stephen PhillipsTask Number: NAG3-2578
Case Western Reserve UniversitySeptember 18, 2002
NASA SpaceCommunications Symposium
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Active MEMS for Communications
Project Overview
Design MEMS focusing mirrors with electrostatic actuated pointing mechanisms. Develop batch microfabrication processes. Produce and test devices.start date 12/01/01.
100 m
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Active MEMS for Communications
Enterprise Relevance and Impact
Enterprise Relevance:This technology has applications in access and proximity networks. Planetary exploration missions are the primary targets where: 1. Access networks are used for communications between satellites and surface vehicles. 2. Proximity networks are used for communications between surface vehicles.
Impact:Mass produced MEMS based transmitters and receivers for optical links in proximity and access networks promise:1. Reduced manufacturing costs2. Reduced system mass
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Active MEMS for Communications
Milestones - Technical Accomplishments and Schedules
Due Date Milestone Description Tech Accomplishments
1 April 2002 Characterize MultiPoly for mirror design
1mm radius of curvature
achieveable
Schedule Status Schedule Deviation
Completed none
-700
-600
-500
-400
-300
-200
-100
0 0.5 1 1.5 2
0
100
200
300
400
0 0.5 1 1.5 2
Film Thickness (µm, from SiO2 interface)
Film
Str
ess
(MP
a)
615 C570 C
-300
-200
-100
0
100
200
300
700 800 900 1000 1100 1200
tensile
compressive
as-deposited Annealing Temperature (C)
Str
ess
(MP
a)
570
615
MultiPoly
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Active MEMS for Communications
Milestones - Technical Accomplishments and Schedules
Due Date Milestone Description Tech Accomplishments
2 June 2002 Verify MultiPoly fabrication for device fabrication
Multilayers with prescribed curvatures demonstrated
Schedule Status Schedule Deviation
Completed none
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Active MEMS for Communications
Milestones - Technical Accomplishments and Schedules
Due Date Milestone Description Tech Accomplishments
4 December 2002 Verify actuated devices with electrodes and doped structures
Devices in process
Schedule Status Schedule Deviation
In progress none
Due Date Milestone Description Tech Accomplishments
3 September 2002 Develop deposition and etch processes for doped Multipoly
Wafers processed, Verification in progress
Schedule Status Schedule Deviation
In progress Near schedule
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Active MEMS for Communications
Risks
Risk Impact Resolution Plan
1 Poor doped device etching
Delays schedule
Delays demonstration
Modify etch process.
Process new wafers
2 Unexpected doped device curvature
Delays schedule
Delays demonstration
Modify device design
Process new wafers
3 Doped devices do not actuate
Delays demonstration Isolate failure source
Redesign devices/processes
Process new wafers
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Active MEMS for Communications
Funding Issues
Phase one funding ended on budget.Phase two funding through March 2003.Student funding (1 graduate assistant) budgeted.Processing fees are thin.
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Active MEMS for Communications
Future Plans
Event Goals
1 Doped device verification Successful release of devices
Achieve desired curvature
2 Active device demonstration Electrical actuation demonstration
Achieve desired steering angles
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Active MEMS for Communications
Papers and Awards
Provide a list of all papers published and awards received.
