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Packaging
Last updated 6/17/19
2 © tjEE 2920
Packaging
• Chip Resistor
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Packaging
• Chip Capacitor
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System Design
• Chip Inductor
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Packaging
• Die Bond PadLead Frame
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Packaging
• Die Bond Pad
video
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Packaging
• TO – Transistor Outline
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Packaging
• PDIP – Plastic Dual Inline Package
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Packaging
• SOT – Standard Outline Transistor
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• SSOP – Shrink Small Outline
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• TSOP – Thin Small Outline
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Packaging
• TQFP – Thin Quad Flat
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Packaging
• PLCC – Plastic Leaded Chip Carrier
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Packaging
• Ball Grid Array (BGA)
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Packaging
• Ball Grid Array (BGA)
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Packaging
• Flip Chip BGA/CSP (Chip Scale Package)
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Packaging
• Stacked CSP
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Packaging
• Flip Chip Stacked
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Packaging
• Package on Package (PoP)
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• Wafer level CSP
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Packaging
• Stacked Package
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• SiP – System in Package
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Packaging
• SiP – System in Package
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Packaging
• Silicon Through Vias
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• Micro-Electro-Mechanical Device
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• SMT Carriers
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Packaging
• Power Dissipation
• Power dissipated in a part that is not provided to some load is converted into heat
• Electrical Analogy• Temp (ΔT) <-> Voltage
• Heat Flow (Q) <-> Current
• Thermal Resistance (θ) <-> Electrical Resistance
• Where Q corresponds to power dissipated
TA – Ambient Temperature
TPart – Part Temperature
θQ
29 © tjEE 2920
Packaging
• Power Dissipation
θTA – Ambient Temperature
TPart – Part Temperature
PD
A regulator has a θ = 50°C/W
If it dissipates 1W in an area where the ambient temperature is 27°C
Its temperature will be: Tpart = (Pd x θ) + TA =
(1W x 50°C/W) + 27°C = 77°C
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Packaging
• Power Dissipation
• Semiconductor devices are typically characterized by two thermal resistances
• θJC – thermal resistance from the junction to the case
• θCA – thermal resistance from the case to the ambient
• Since most users do not care about the intermediate temperature• Often combined to be θJA
• e.g. θJC = 60°C/W, θCA = 180°C/W → θJA 240°C/W
θJA
TA – Ambient Temperature
TJ – Junction Temperature
PD
31 © tjEE 2920
Packaging
• Power Dissipation
A regulator has a θJA = 240°C/W and a TJMax = 150°C
If it dissipates 1W in an area where the ambient temperature is 27°C
Its junction temperature will be: TJ = (PD x θJA) + TA =
(1W x 240°C/W )+ 27°C = 267°C
θJA
TA – Ambient Temperature
TJ – Junction Temperature
PD
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Packaging
• Power Dissipation
• We can’t impact the θJC but we can impact θCA
• Attach a heat sink
• Heat Sink• By increasing the air–heat interface area heat sinks allow more heat
to be dissipated faster
• Reduce the effective thermal resistance
θCA = 15 °C/W
33 © tjEE 2920
Packaging
• Power Dissipation
θJC
TA – Ambient Temperature
TJ – Junction Temperature
PD
A regulator has: θJC = 60°C/W, θCA = 180°C/W and TJMax = 150°C
A heat sink is attached with θCA = 15°C/W
If it dissipates 1W in an area where the ambient temperature is 27°C
Its junction temperature will be: TJ = (PD x (θJC + θCA)) + TA =
(1W x (60°C/W + 15°C/W) + 27°C = 102°C
θCA
TC – Case Temperature
