OS-PCN-2020-013-A Introduction of Backend production

www.osram-os.com

OS-PCN-2020-013-A

Introduction of Backend production location Wuxi for

premolded detector products and other changes

Customer information package

OS QM CQM | 15.07.2020

Light is OSRAM

Customer information package | OS QM CQM

OS-PCN-2020-013-A Introduction of Backend production location | 15.07.2020

2

OS-PCN-2020-013-A



Page

1. Reason for change 3

2. Description of change 4

3. List of affected products 7

4. PCN samples 8

5. Time schedule 9



3

Reason for change

OS-PCN-2020-013-A



Item Description

1 Introduction of backend production location Wuxi for premolded detector

products to secure continuous supply and to increase production capacity.

For better traceability, laser marking on device will be rotated by 180° for

devices assembled at location Wuxi.

2 Only applicable for SFH 320G:

produced at backend location Wuxi:

Harmonization of plating composition from NiAu with NiSn plating finish to

NiPdAu without NiSn plating finish.

Harmonization of casting resin with higher glass transition temperature

(Tg).



4

OS-PCN-2020-013-A



Current status New status

Production location Penang/Malaysia:

-> No laser marking rotation.

Production location Penang/Malaysia:-> No laser marking rotation.

Or:

Production location Wuxi/China:-> 180° laser marking rotation with underscore.

Note: Previous backend production location for above mentioned products might be phased out after customer approval of new location - without further information to customer

Description of change (1): Production location + Laser marking orientation

applicable for all products



5

OS-PCN-2020-013-A



Description of change (2): Leadframe type and Plating

only applicable for SFH 320G,

Current status

(previous location Penang)

New status

(new location Wuxi)

Front Side NiAu LDF on function area NiPdAu LDF on function area

Lead Side NiSn plating finish NiPdAu LDF without plating finish



6

OS-PCN-2020-013-A



Description of change (3): Harmonization of casting resin

only applicable for SFH 320G

Current status

(previous location Penang)

New status

(new location Wuxi)

Glas

transition

Temperat.

(Tg)

typ. 115°C typ. 135°C

No change in electro optical properties



7

List of affected products

OS-PCN-2020-013-A



SIDELED TOPLED

SFH 325 SFH 320

SFH 325 FA SFH 320 FA

SFH 325 FAG SFH 320G



8

OS-PCN-2020-013-A



PCN Samples

available

on request

SIDELED TOPLED

SFH 325 SFH 320

SFH 325 FA SFH 320 FA

SFH 325 FAG SFH 320G



9

Time schedule for PCN material (after implementation of change):

Final qualification report 15.07.2020

Samples available 15.07.2020

Intended Start of delivery 15.10.2020 *)

*) or earlier if released by customer and upon mutual agreement

Time schedule for Pre-PCN material(prior to implementation of change):

Last time order date (LTO) 15.11.2020 **)

**) expected approval date needs to be available at this time. Lead time and LTO quantity shall be mutually agreed between OSRAM OS and customer.

Last time delivery date (LTD) 15.02.2021 ***)

***) planned last date for delivery of products of current status

Note:

Pre-PCN material: Products of current status, means before implementation of the changes as described in the PCN.

PCN material: Products with implementation of the changes as described in the PCN.

OS-PCN-2020-013-A



www.osram-os.com

Thank you.

www.osram-os.com

Light is OSRAM

Qualification Report 200176C1

Subject Reliability test results for TOPLED SFH 320 & SFH 320 FA

according to OS-PCN-2020-013-A

Date 13.07.2020

Tested device SFH 320 FA, SFH 320 G

Brand (including sub brands) TOPLED

Applies to

SFH 320; SFH 320 FA


Page 2 of 15 Department

OS QM CQM ICI

Performed by

Dr. D. Fiedler (signed)

Reviewed by

C. Wensauer (signed)

Template revision

21.01.2015

Preconditioning according to Jedec Level II

Note: 1) SFH 320 G; Eval lot (Wuxi Production);

2) SFH 320 FA; Lot A, B: Eval lot (Wuxi Production); Lot C: Control lot (PEN Production)

3) SFH 320 G; Lot A, B, C: Eval lot (Wuxi Production); Lot D: Control lot (PEN Production)

Failure criteria: Electrical failures: Iceo (Vce = 20V) > 50nA

Optical failures: Ipce (Vce=5V; Ee=0,1mW/m2) absolute limit: ±20% max. and

∆%max - ∆%min> 20% Visual failures: broken or damaged package or leads, solderability <95% wetting

Conclusion: Devices fulfill the reliability requirements.

Test Performed Condition Duration Sample

Size

Failures

El. Opt. Vis

Resistance to soldering heat

(RTSH) JESD22-A113 Reflow soldering 260°C

3x

3x

1x261)

3x262)

0

0

0

0

0

0

High temperature reverse bias

(HTRB) JESD22-A108

TA = 100°C,

VCE =28V 1000h 4x263) 0 0 0

Temperature & humidity reverse

bias (T&HRB) JESD22A101

85°C/85%r.H.

Vce=28V 1000h 4x263) 0 0 0

Temperature & humidity reverse

bias (T&HRB) JESD22A101

40°C/93%r.H.

Vce=28V 1000h 3x262) 0 0 0

Temperature cycle

(TC) JESD22-A104 -40°C/+100°C 15min each extreme

500c

500c

1x261)

3x262)

0

0

0

0

0

0

Electrostatic Discharge

(HBM) ANSI/ESDA/

JEDEC JS-001

Human Body Model 2000V

2000V

1x101)

3x102)

0

0

0

0

0

0



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

Disclaimer PLEASE CAREFULLY READ THE BELOW TERMS AND CONDITIONS BEFORE USING THE INFORMATION.

IF YOU DO NOT AGREE WITH ANY OF THESE TERMS AND CONDITIONS, DO NOT USE THE INFORMATION.

The Information contained in this Document does not constitute an independent warranty. The committed behavior is

described in the Product data sheet and/or further, mutually agreed specifications.

Distribution of part or all of the contents of this Document to any 3rd party in any form without the prior permission of

OSRAM Opto Semiconductors GmbH is prohibited except in accordance with applicable mandatory law.

Further explanations:

Data: The Data used in this Document consider the reliability test results under the mentioned driving conditions only.

For Product information on the maximum operating conditions and the OSRAM OS standard qualification profile please

refer to the Product data sheet or contact your local sales partner.

Conditions: The conditions for the generation of the Data are as follows:

1. The Data and curves shown in this Document are based on experiments carried out under laboratory conditions on a

random sample size of LED/IRED/Laser/Detector with readouts at discrete readout times (where applicable). Thus, the

Data above represent a limited number of production lots only and may differ between different assembly lots over time

(including chip or package changes). Thus, the behavior of the LED/IRED/Laser/Detector in the final application may

differ from the Data. The behavior of the LED/IRED/Laser/Detector at conditions or readout times deviating from those

stated above may not be deduced from the Data.

2. If applicable:

a) Extended driving conditions:

The tested driving conditions exceed the maximum limits stated in the Product data sheet. Therefore a reduced

lifetime or an accelerated degradation is expected. Failure limits noted in the Document refer to the testing

condition according to the OSRAM OS standard Product qualification profile and not to the actual testing

condition.

b) Extended testing duration:

The testing duration exceed the OSRAM OS standard qualification profile of the mentioned Product. Failure

limits noted in the Document refer to the testing duration according to the OSRAM OS standard Product

qualification profile and not to the actual testing duration.

c) Exceeding standard qualification conditions – (Product data sheet limits not affected):

The tested driving conditions exceed the OSRAM OS standard qualification profile of the mentioned Product.

Therefore a reduced lifetime or an accelerated degradation is expected. Failure limits noted in the Document

refer to the testing condition according to the OSRAM OS standard Product qualification profile and not to the

actual testing condition.

3. For long term operation additional failure modes of the chip or package can occur which are not shown in this

Document.

4. Possible differences in the thermal management of OSRAM OS and customer’s setup may lead to a different aging

behavior.



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

RTSH Reflow-soldering

SFH 320 G



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


SFH 320 FA

Lot A

Lot B

Lot C



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

HTRB 100°C/28V

SFH 320 G

Lot A

Lot B

Lot C

SFH 320G HTRB100°C/28V W19_01115_11I 26 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [h]

0 200 400 600 800 1000

SFH 320G HTRB100°C/28V W19_01115_11I 26 pcs

-10

0

10

20

30

40

50

Readout [h]

0 200 400 600 800 1000



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

Lot D

SFH 320G HTRB100°C/28V W19_01115_11G 26 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [h]

0 200 400 600 800 1000

SFH 320G HTRB100°C/28V W19_01115_11G 26 pcs

-10

0

10

20

30

40

50

Readout [h]

0 200 400 600 800 1000



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

T&HRB 85°C/85%r.H.; VCE=28V

SFH 320 G

Lot A

Lot B

Lot C

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10A 26 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [h]

0 200 400 600 800 1000

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10A 26 pcs

-10

0

10

20

30

40

50

Readout [h]

0 200 400 600 800 1000

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10B 26 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [h]

0 200 400 600 800 1000

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10B 26 pcs

-10

0

10

20

30

40

50

Readout [h]

0 200 400 600 800 1000

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10I 30 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [h]

0 200 400 600 800 1000

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10I 30 pcs

-10

0

10

20

30

40

50

Readout [h]

0 200 400 600 800 1000



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

Lot D

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10G 26 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [h]

0 200 400 600 800 1000

SFH 320G T&HRB85°C; r.H. = 85 %;28V W19_01115_10G 26 pcs

-10

0

10

20

30

40

50

Readout [h]

0 200 400 600 800 1000



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


SFH 320 FA

Lot A

Lot B

Lot C



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

TC -40°C/100°C

SFH 320 G



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

TC -40°C/100°C

SFH 320 FA

Lot A

Lot B

Lot C



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

ESD HBM

SFH 320 G

SFH 320G ESDHBM W19_01115_7B 10 pcs

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

Readout [V]

0 500 1000 1500 2000

SFH 320G ESDHBM W19_01115_7B 10 pcs

-10

0

10

20

30

40

50

Readout [V]

0 500 1000 1500 2000



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

ESD HBM

SFH 320 FA

Lot A

Lot B

Lot C



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

END OF DOCUMENT

OSRAM Opto Semiconductors

GmbH

Head Office:

Leibnizstrasse 4

93055 Regensburg, Germany

Phone +49 941 850-5

Fax +49 941 850-1002

www.osram-os.com

www.osram-os.com

Light is OSRAM


Subject Reliability test results for TOPLED SFH 320G according to

OS-PCN-2020-013-A

Date 13.07.2020

Tested device SFH 320G

Brand (including sub brands) TOPLED

Applies to

SFH 320G

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

Note: Lot A, B, C: Eval lot (Wuxi Production); Lot D: Control lot (PEN Production)

Pre-conditioning according to Jedec Level II AEC-Q102 #2


Size

Failures

El. AEC-Q102 #1

Opt. AEC-Q102 #1

Vis AEC-Q102 #3

Temperature Cycling

TC JESD22-A104 AEC-Q102 #7

Test PCB: FR4

TA = -40°C/+100°C

15min each extreme 1000c 4x26 0 0 0


HBM ANSI/ESDA/

JEDEC JS-001 AEC-Q102 #10a

Test PCB: FR4

Human Body Model 2000V 4x26 0 0 0

Temperature & humidity reverse bias

H³TRB JESD22-A101 AEC-Q102 #6c

Test PCB: FR4

TA = 85°C,

r.H.= 85%;

VCE = 28V

1000h 4x26 0 0 0

High temperature & reverse bias

HTRB JESD22-A108 AEC-Q102 #5c

Test PCB: FR4

TA = 100°C,

VCE = 28V 1000h 4x26 0 0 0


CDM AEC-Q101-005 AEC-Q102 #10b

Charged Device Model -

CDM testing of small

packages under

evaluation

Vibration Variable Frequency

VVF JESD22-A103 AEC-Q102 #15

20g, 20-2000Hz;

4min / cy; 4cy/axis -

for uncasted packages

only Mechanical shock

MS JESD22-B104 AEC-Q102 #16

1500g; 5 blows

X12, Y12, Z12 -

Resistance to Solder Heat

RSH JESD22-A113 AEC-Q102 #18a

Test PCB: FR4

Reflow soldering

260°C 3x 4x26 0 0 0

Hydrogen Sulphide

H2S IEC 60068-2-43 AEC-Q102 #22

Test PCB: FR4

10ppm H2S

25°C/75%r.H. 336h 4x26 0 0 0

Flowing Mixed Gas

FMG IEC 60068-2-60 AEC-Q102 #23

Test PCB: FR4

TA = 25°C,

r.H.= 75%

Test method 4

500h 4x26 0 0 0

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018




Conclusion: The tested devices fulfill the reliability requirements of AEC-Q102.

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018


















2. If applicable:





condition.











Document.


behavior.

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

TC -40°C/100°C

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

TC -40°C/100°C

Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

HBM

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

HBM

Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

H³TRB 85°C/85%r.H.; 28V

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

H³TRB 85°C/85%r.H.; 28V

Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

HTRB 100°C/28V

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

HTRB 100°C/28V

Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

RSH Resistance to Solder Heat

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018


Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

H2S

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

H2S

Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

FMG

Lot A

Lot B

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

FMG

Lot C

Lot D

200173C1


OS QM CQM ICI

Performed by

Dr. D. Fiedler

Reviewed by

C. Wensauer

Template revision

08.08.2018

END OF DOCUMENT


GmbH

Head Office:

Leibnizstrasse 4


Phone +49 941 850-5

Fax +49 941 850-1002

www.osram-os.com

www.osram-os.com

Light is OSRAM


Subject Reliability test results for SIDELED SFH 325 & SFH 325

FA according to OS-PCN-2020-013-A

Date 13.07.2020

Tested device SFH 325 FA

Brand (including sub brands) SIDELED

Applies to

SFH 325; SFH 325 FA



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

Preconditioning according to Jedec Level II

Note: Lot A, B, C: Eval lot (Wuxi Production); Lot D: Control lot (PEN Production)




Conclusion: The tested devices fulfill the reliability requirements.


Size

Failures

El. Opt. Vis

Resistance to soldering heat

(RTSH) JESD22-A113 Reflow soldering 260°C 3x 4x26 0 0 0

High temperature reverse bias

(HTRB) JESD22-A108

TA = 100°C

VCE =28V 1000h 4x26 0 0 0


(T&HRB) JESD22A101

40°C/93%r.H.

Vce=28V 1000h 4x26 0 0 0

Temperature cycle

(TC) JESD22-A104 -40°C/+100°C 15min each extreme 1000c 4x26 0 0 0


HBM ANSI/ESDA/

JEDEC JS-001 Human Body Model 2000V 4x26 0 0 0



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


















2. If applicable:





condition.











Document.


behavior.



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


Lot A

Lot B



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


Lot C

Lot D



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

HTRB 100°C/28V

Lot A

Lot B



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

HTRB 100°C/28V

Lot C

Lot D



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


Lot A

Lot B



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015


Lot C

Lot D



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

TC -40°C/100°C

Lot A

Lot B



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

TC 2 Chamber -40°C/100°C

Lot C

Lot D



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

ESD HBM

Lot A

Lot B



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

ESD HBM

Lot C

Lot D



OS QM CQM ICI

Performed by


Reviewed by


Template revision

21.01.2015

END OF DOCUMENT


GmbH

Head Office:

Leibnizstrasse 4


Phone +49 941 850-5

Fax +49 941 850-1002

www.osram-os.com

www.osram-os.com

Light is OSRAM


Subject Reliability test results for SIDELED SFH 325 FAG

according to OS-PCN-2020-013-A

Date 13.07.2020

Tested device SFH 325 FAG, SFH 325 G

Brand (including sub brands) SIDELED

Applies to

SFH 325 FAG

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

Note: 1) SFH 325 FAG; Lot A: Eval lot (Wuxi Production); Lot B: Control lot (PEN Production)

2) SFH 325 G Lot A, B: Eval lot (Wuxi Production)

Pre-conditioning according to Jedec Level II AEC-Q102 #2


Size

Failures

El. AEC-Q102 #1

Opt. AEC-Q102 #1

Vis AEC-Q102 #3

Temperature Cycling

TC JESD22-A104 AEC-Q102 #7

Test PCB: FR4

TA = -40°C/+100°C

15min each extreme

1000c

1000c

2x261)

2x262)

0

0

0

0

0

0


HBM ANSI/ESDA/

JEDEC JS-001 AEC-Q102 #10a

Test PCB: FR4

Human Body Model 2000V

2000V

2x261)

2x262)

0

0

0

0

0

0


H³TRB JESD22-A101 AEC-Q102 #6c

Test PCB: FR4

TA = 85°C,

r.H.= 85%;

VCE = 28V

1000h

1000h

2x261)

2x262)

0

0

0

0

0

0

High temperature & reverse bias

HTRB JESD22-A108 AEC-Q102 #5c

Test PCB: FR4

TA = 100°C,

VCE = 28V 1000h 1000h

2x261)

2x262)

0

0 0

0 0

0


CDM AEC-Q101-005 AEC-Q102 #10b

Charged Device Model - CDM testing of small

packages under evaluation

Vibration Variable Frequency

VVF JESD22-A103 AEC-Q102 #15

20g, 20-2000Hz;

4min / cy; 4cy/axis

for uncasted packages

only Mechanical shock

MS JESD22-B104 AEC-Q102 #16

1500g; 5 blows

X12, Y12, Z12

Resistance to Solder Heat

RSH JESD22-A113 AEC-Q102 #18a

Test PCB: FR4

Reflow soldering

260°C

3x

3x

2x261)

2x262)

0

0

0

0

0

0

Hydrogen Sulphide

H2S IEC 60068-2-43 AEC-Q102 #22

Test PCB: FR4

10ppm H2S

25°C/75%r.H.

336h

336h

2x261)

2x262)

0

0

0

0

0

0

Flowing Mixed Gas

FMG IEC 60068-2-60 AEC-Q102 #23

Test PCB: FR4

TA = 25°C,

r.H.= 75%

Test method 4

500h

500h

2x261)

2x262)

0

0

0

0

0

0

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018




Conclusion: The tested devices fulfill the reliability requirements of AEC-Q102.

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018


















2. If applicable:





condition.











Document.


behavior.

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

TC -40°C/100°C

SFH 325 FAG

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

TC -40°C/100°C

SFH 325 G

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

HBM

SFH 325 FAG

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

HBM

SFH 325 G

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

H³TRB 85°C/85%r.H.; 28V

SFH 325 FAG

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

H³TRB 85°C/85%r.H.; 28V

SFH 325 G

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

HTRB 100°C/28V

SFH 325 FAG

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

HTRB 100°C/28V

SFH 325 G

Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018


SFH 325 FAG Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018


SFH 325 G Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

H2S

SFH 325 FAG Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

H2S

SFH 325 G Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

FMG

SFH 325 FAG Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

FMG

SFH 325 G Lot A

Lot B

200174C1


OS QM CQM ICI

Performed by


Reviewed by


Template revision

08.08.2018

END OF DOCUMENT


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NotifID NotifNumber NotifName ReleaseDate ResponseDueDate

1151 OS-PCN-2020-013-A Introduction of Backend 15-Jul-20 20-Aug-20


























ImplementDate ProdAffected QNbr QNbrDesc QNbrDesc_Z1 Status

15-Okt-20 SFH 320 Q65110A2469 SFH 320-3-Z SFH 320-3-Z 10

15-Okt-20 SFH 320 Q65110A2471 SFH 320-Z SFH 320-Z 10

15-Okt-20 SFH 320 Q65110A2509 SFH 320-3/4 R33-Z SFH 320-3/4-Z 10


15-Okt-20 SFH 320 FA Q65110A1836 SFH 320 FA-4-Z SFH 320 FA-4-Z 10

15-Okt-20 SFH 320 FA Q65110A2472 SFH 320 FA-Z SFH 320 FA-Z 10

15-Okt-20 SFH 320 FA Q65110A2507 SFH 320 FA-3 R33-Z SFH 320 FA-3-Z 10

15-Okt-20 SFH 320 FA Q65110A2508 SFH 320 FA-3/4 R33-Z SFH 320 FA-3/4- 10

15-Okt-20 SFH 320 FA Q65110A2511 SFH 320FA-3/4 E9544-Z SFH 320FA-3/4 10

15-Okt-20 SFH 320 FA Q65111A0002 SFH 320 FA-4 R33-Z SFH 320 FA-4 10

15-Okt-20 SFH 320G Q65110A6837 SFH 320G-3-Z SFH 320G-3-Z 10

15-Okt-20 SFH 320G Q65110A6838 SFH 320G-4-Z SFH 320G-4-Z 10

15-Okt-20 SFH 320G Q65110A6839 SFH 320G-3/4-Z SFH 320G-3/4-Z 10


15-Okt-20 SFH 325 Q65110A2486 SFH 325-Z SFH 325-Z 10


15-Okt-20 SFH 325 Q65110A2491 SFH 325-3/4-Z SFH 325-3/4-Z 10



15-Okt-20 SFH 325 FA Q65110A2487 SFH 325 FA-Z SFH 325 FA-Z 10

15-Okt-20 SFH 325 FA Q65110A2490 SFH 325 FA-3/4-Z SFH 325 FA-3/4- 10

15-Okt-20 SFH 325 FA Q65110A3506 SFH 325 FA -3/4A-Z SFH 325 FA - 10

15-Okt-20 SFH 325 FA Q65111A6157 SFH 325FA-3B4B-XX SFH 325FA- 10

15-Okt-20 SFH 325 FAG Q65110A6841 SFH 325 FAG-3/4-Z SFH 325 FAG- 10

15-Okt-20 SFH 325 FAG Q65110A6842 SFH 325 FAG-Z SFH 325 FAG-Z 10

15-Okt-20 SFH 325 FAG Q65111A2812 SFH 325 FAG-4-Z SFH 325 FAG-4- 10

Documents

OS-PCN-2020-013-A Introduction of Backend production