103
NT7553E 396 X 162 RAM-Map STN LCD Controller/Driver for 32 Grayscale V3.0

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Page 1: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

396 X 162 RAM-Map STN LCD

Controller/Driver for 32 Grayscale

V3.0

Page 2: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

2 Ver. 3.0

Revision History................................................................................................................................. 3

Features.............................................................................................................................................. 4

General Description........................................................................................................................... 5

Pad Configuration.............................................................................................................................. 6

Block Diagram.................................................................................................................................... 7

Pad Descriptions................................................................................................................................ 8

Functional Descriptions .................................................................................................................. 14

General Commands Description..................................................................................................... 62

Absolute Maximum Rating .............................................................................................................. 83

Electrical Characteristics ................................................................................................................ 83

Bonding Diagram............................................................................................................................. 92

Ordering Information ..................................................................................................................... 103

Cautions ......................................................................................................................................... 103

Page 3: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Revision History

NT7553E Specification Revision History

Version Content Prepared

by Checked

by Approved

by Date

1.0 Released - - - Sep. 2007

2.0

1. Correct the stabilization time between instruction (1) to (3) on figure 21.(Page 39)

2. Add ITO Layout Notice for Segment outputs. (Page 57) 3. Add Application Notice for Large Panel Design section.

(Page 58) 4. Add Absolute Maximum Rating of VOUT condition.

(Page 81)

Mike Chen

Edwards Tseng

Dennis Kuo

Sep. 2008

3.0

1. Add 100ms delay time between “display on sequence” and “display on” (Page 39)

2. Add specification of Schottky Barrier Didoe.(Page 45) 3. Correct recommend resistance of VDD and VSS from 100Ω

to 50Ω.(Page 55) 4. Add recommend external VOUT voltage on/off

sequence.(Page 59, 60) 5. Add MTPT description in table32. (Page 74) 6. Add specification of Sleep Mode Current Consumption.

(Page 83) 7. Add specification of Reset Timing. (Page 91) 8. Add specification of Chip Thickness. (Page 102)

Mike Chen

Edwards Tseng

Dennis Kuo

Nov. 2008

Page 4: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 4 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Features

396 x 162-dot graphics display LCD controller/driver for 32 level grayscale. RAM capacity: 396x 162 x 5 = 320,760 bits 8-bit and 16-bit parallel bus interface for both 8080 and 6800 series, and 4-wire Serial Peripheral

Interface (SPI) Various grayscale-display control functions

- 32 grayscale out of 52 possible grayscale can be displayed at the same time (grayscale palette incorporated) - Vertical scroll display function in raster-row units - Partial LCD drive of two screens in any position

Shift change of segment and common drivers Power supply voltage:

- VDD = 2.4 ~ 3.6 V (REGENB=L) - VDD = 1.6 ~ 2.3 V (REGENB=H) - VDD2 = 2.4 ~ 3.6 V - VDD3 = 2.4 ~ 3.6 V - VCC = 1.6 ~2.3V

- Common driving voltage = 8 ~ 36 V (power for DC-DC converter) - Segment driving voltage = 2 ~ 4 V

- VOUT = 4.5 ~ 5.5 V - VCI2 Maximum 4-times step-up circuit for liquid crystal drives voltage and voltage inverting circuit - VCI1 Maximum 3-times step-up circuit for VOUT

Power save functions such as standby and sleep mode On chip LCD driving voltage generator or external power supply selectable 128-step contrast adjuster and on chip voltage follower to decrease direct current flow in the LCD

drive bleeder-resisters Programmable drive duty ratios (1/8~1/162) and bias values (1/2~1/13) displayed on LCD Programmable partial display function Bit-operation functions for graphics processing: - Write-data mask function in bit units - Logical operation in pixel unit and conditional write function N-line inversion AC liquid-crystal drive (C-pattern waveform drive) On chip oscillation and hardware reset Multi-Time Programming (2 times) for VSH voltage Programmable LCD Driving Voltage Temperature Compensation Coefficients (selected by software

command) COM positioned on both sides in one chip for COG form CMOS process

Page 5: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 5 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

General Description

The NT7553E is a single-chip LCD controller/driver LSI for grayscale-graphics, which displays 396 x 162-dot graphics for 32 levels STN grayscale. It accepts display data through 8-bit or 16-bit parallel (8080 or 6800 series) or serial interface directly sent from a microcomputer and stores it in an on-chip display RAM. It generates an LCD drive signal independent of microprocessor clock. The set of the on-chip display RAM of 396 x 162 x 5 bits and every 5 bits correspondence between LCD panel dots and on-chip RAM bits permits implementation of displays with a high degree of freedom. The NT7553E contains 162 common output circuits and 396 segment output circuits. It can make 8 to 162 x 396-dot displays with instructions. The NT7553E has various functions for reducing the power consumption, such as low operation voltage of 2.4/Min., a DC-DC converter to generate a maximum of 12-times the LCD drive voltage from the supplied voltage, voltage follower to decrease the direct current flow in the LCD drive bleeder-resisters, and no external operation clock is required for RAM read/write operations. Accordingly, this driver can be operated with minimum current consumption and its on-board low-current-consumption liquid crystal power supply can implement a high-performance handy display system with minimum current consumption and the smallest LSI configuration.

Page 6: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 6 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Pad Configuration

Page 7: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 7 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Block Diagram

Timing Generator

Instruction Register

(IR)

Scan Data

Generator

Circuit

CommonDriver

Address Counter

(AC)

Instruction

Decoder

SystemInterface

16-bit or

8-bit bus

Bit Operation

Read

Data

Latch SegmentDriver

LCD Drive Power

Supply Circuit

Display Data RAM

132x162x16bits

LCD Driver

Voltage Selector

16

16

16

16

16

16

TEST

RESBn

VDD3

C11+~C12+C11 -~C12+

VOUT

SEG1 /396 ~ SEG396/1

COM1/162 ~ COM162/1

Oscillator

OSCI OSCO

16

S8/16

CSB

A0

D0 (SDI),D1 (SDO)

~ D15

R/W (RDB)

E (WRB)

C86

VDD1

VSS

S/P

VCI2C21+ ~ C23+

CE+C21- ~ C23-

CE-VREFL

VREFM

VSH

VCH

VM

VCL

VDD

VSS1

VSS2

VDD2

Write

Data

Latch

64

Latch

Circuit

PWM/FRC

Control

Circuit

Grayscale

Selector

Circuit

396-bit

Latch

Circuit

VSS2

VSL2112

Power Regulator

VDD

Logic & DDRAMPower supply

VDDR

VSS

VDD

VCI1

VCC

Figure 1. NT7553E Block Diagram Description

Page 8: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 8 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Pad Descriptions

Power Supply

Pad No. Designation I/O Description

134~136 VDD Supply Power supply for logic

160,166,172 VDD1 O Power supply output for pad option

137~139 VDD2 Supply Power supply for analog, input the same level of voltage as VDD

140~143 VDD3 Supply Voltage-input pin for step-up circuit 1.

144~146 VSS Supply Ground for logic

163,169 VSS1 O Ground output for pad option

147~149 VSS2 Supply Ground for analog

150~153 VSS3 Supply Ground for VDD3

173~174 VREFL Supply Inputs reference voltage for LCD drives power supply. Inputs a lower level than VDD. Since input current does not run, level input, which is divided by resistors, is also possible.

205~208 VCI1 Supply Voltage-input pin for step-up circuit 1. When the VCI adjuster is used, input the power supply from VCIOUT. When not used, input the external power supply.

57~60 VCI2 Supply Capacitor for stabilization or open, connect capacitor for stabilization. When the internal power supply circuit is not used, leave this pin open.

185~188 VOUT Supply

A voltage that doubles or triples the voltage between VCI1 and VSS is output here. The step-up factor can be set in an internal register. When internal operational amplifier is not used, supply external voltage.

181~184 VSH Supply

The selection level for the segment signal. When internal operational amplifier is used, it is output from the internal operational amplifier and connects the capacitors for stabilization. When internal operational amplifier is not used, supply external voltage.

28~32 VCH Supply

Selection level for the common signal. When internal power supply is used, connect the capacitors for stabilization to VCH, When internal power supply is not used, supply external voltage.

23~27 VCL Supply

Selection level for the common signal. When internal power supply is used, connect the capacitors for stabilization to VCL, and shot key barrier diode to VCL. When internal power supply is not used, supply external voltage.

Page 9: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 9 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Power Supply (CONTINUTE)

177~180 VM Supply

Non-selection level for the common signal. When internal operational amplifier is used, it is output from the internal operational amplifier and connects the capacitors for stabilization. When internal operational amplifier is not used, supply external voltage.

175~176 VREFM Supply

Capacitor for stabilization or external power supply. Connect capacitor for stabilization for internal power supply. When internal operational amplifier is not used, supply external voltage.

130~133 VCC Supply Capacitor for stabilization or open Connect capacitor for stabilization for internal power supply.

127~129 VDDR O Capacitor for stabilization or open Connect capacitor for stabilization for internal power supply.

STEP-UP Capacitor Pad

Pad No. Designation I/O Description

13~17 CEP O

18~22 CEM O

Connect a step-up capacitor to generate VCL level by VCH and VM. When step-up circuit is not used, leave

this pin open.

33~36 C23+ O When step-up circuit is used, connect a step-up capacitor.

37~40 C23- O When step-up circuit is used, connect a step-up capacitor.

41~44 C22+ O When step-up circuit is used, connect a step-up capacitor.

45~48 C22- O When step-up circuit is used, connect a step-up capacitor.

49~52 C21+ O When step-up circuit is used, connect a step-up capacitor.

53~56 C21- O When step-up circuit is used, connect a step-up capacitor.

189~192 C12+ O When step-up circuit is used, connect a step-up capacitor.

193~196 C12- O When step-up circuit is used, connect a step-up capacitor.

197~200 C11+ O When step-up circuit is used, connect a step-up capacitor.

201~204 C11- O When step-up circuit is used, connect a step-up capacitor.

Page 10: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 10 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Liquid Crystal Drive Pad

Pad No. Designation I/O Description

306~701 SEG1 ~ SEG396

O

Output signals for segment drive. In the display-off period (D1–0 = 00, 01) or standby mode (STB = 1), all pins output VSS level. The SGS bit can change the shift direction of the segment signal. For example, if SGS = 0, RAM address 0000 is output from SEG1 to SEG396. If SGS = 1, it is output from SEG396 to SEG1.

222~254,

257~304,

703~750,

753~785

COM1 ~ COM162

O

Output signals for common drive. In the display-off period (D1–0 = 00, 01) sleep mode (SLP = 1) or standby mode (STB = 1), all pins output VSS level. The CMS bit can change the shift direction of the common signal. For example, if CMS = 0, driver outputs from COM1 to COM162. If CMS = 1, driver outputs COM162 to COM1. Note that the start position of the common driver output is changed by screen diving position function.

Page 11: NT7553E V3.0 - MASTERSpdf.masters.com.pl/NOVATEK/NT7553E_V3.0.pdf · NT7553E 2008/11/14 3 Ver 3.0 With respect to the information represented in this in this document, Novatek makes

NT7553E

2008/11/14 11 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

System Bus Connection Pads

Pad No. Designation I/O Description

164~165 S/P I

Serial/Parallel selection pad: S/P = ”L”: parallel interface S/P = ”H”: serial interface

167~168 C86 I

Select MPU parallel interface mode: When S/P = “L”: C86 = ”L”: 6800 series MPU interface C86 = ”H”: 8080 series MPU interface When S/P = “H”: C86 should be connected to VSS.

170~171 S8/16 (SID)

I

8/16-bit parallel interface selection pad: When S/P = “L”: S8/16 = ”L”: 16-bit parallel interface S8/16 = ”H”: 8-bit parallel interface When S/P = “H”: This pad is used as the serial ID (SID) setting for a device code.

124~126 CSB I This is the chip select signal. When CSB = “L”, then the chip select becomes active, and data/command I/O is enabled. It must be fixed to VSS when not in use.

121~123 A0 I

A0 = “L”: Indicates that D0 to D7 are Index or Status data A0 = “H”: Indicates that D0 to D7 are Control data When a register or serial interface is selected, fix this pad to VDD or VSS level.

12

154~155

209

RESB1

RESB2

RESB3

I

Reset pin. Initializes the LSI when low. Must be reset after power-on. Since NT7553E has three RESET pins, use one pin and open two unused pins.

115~117 R/W

(RDB) I

When connected to a 6800 Series MPU, this is the read/write control signal input terminal. Low: Write, High: Read

When connected to an 8080 MPU, this is active LOW. This terminal connects to the 8080 MPU RDB signal and the NT7553E data bus is in an output status when this signal is LOW. When the serial interface is selected, fix this pad to VDD or VSS level.

118~120

E

(WRB)

(SCL)

I

When connected to a 6800 Series MPU, this is active HIGH. This is used as an enable clock input of the 6800 series MPU. When connected to an 8080 MPU, it is active LOW. This pad is connected to the WRB signal of the 8080 MPU, and writes data at the low level. When the serial interface is selected, it serves as the serial clock input pin (SCL).

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NT7553E

2008/11/14 12 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

System Bus Connection Pads (continued)

112~114 D0

(SDI) I/O

When 16-bit parallel interface is selected, it serves as the bi-directional data bus. When 8-bit parallel interface is selected, data transfer uses D8 ~ D15; fix the unsed pads: D0 ~ D7 to the VDD or VSS level. When the serial interface is selected, it serves as the serial data input terminal (SDI). The input level is read on the rising edge of SCL signal.

109~111 D1

(SDO) I/O

When 16-bit parallel interface is selected, it serves as the bi-directional data bus. When 8-bit parallel interface is selected, data transfer uses D8 ~ D15; fix the unsed pads: D0 ~ D7 to the VDD or VSS level. When the serial interface is selected, it serves as the serial data output terminal (SDO).

67~108 D2 ~ D15 I/O

When 16-bit parallel interface is selected, it serves as the bi-directional data bus. When 8-bit parallel interface is selected, data transfer uses D8 ~ D15; fix the unsed pads: D0 ~ D7 to the VDD or VSS level. When the serial interface is selected, fix these pads to VDD or VSS level.

161~162 REGENB I

Input pin for VDDR supply control,

REGENB = “L”: VDDR regulator enable

REGENB = “H”: VDDR regulator disable

Oscillation Pads

Pad No. Designation I/O Description

158~159

156~157

OSCI

OSCO I/O

For external clock supply, input clock pulses to OSCI.

For internal clock mode, OSCI must connect to OSCO.

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NT7553E

2008/11/14 13 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Dummy Pads

Pad No. Designation I/O Description

1~11,

210~221,

255~256,

305,702,

751~752,

786

Dummy -

Dummy pads. No connection for user.

Test Pads

Pad No. Designation I/O Description

61~62 Test1 - Test pad. Must disconnect this pad.

63~64 Test2 - Test pad. Must disconnect this pad.

65~66 Test3 - Test pad. Must disconnect this pad.

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NT7553E

2008/11/14 14 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Functional Descriptions

Microprocessor Interface

The NT7553E can transfer data via 8-bit (D8 ~D15)/16-bit (D0~D15) bi-directional data bus or via serial data input (SDI). When high or low is selected for the S/P, C86, and S8/16 pads, either 8-bit/16-bit parallel data input or serial data input can be selected as shown in Table 1. When serial data input is selected, the RAM data can also be read out via serial data output (SDO).

Table 1. Data Bus Interface Selection Mode

S/P C86 S8/16(SID)

Type CSB A0 E

(WRB) (SCL)

R/W (RDB)

D0 D1 D2~D7 D8~D15

L L Serial interface bus SID = 0 CSB A0 SCL - SDI SDO - - H

L H Serial interface bus SID = 1 CSB A0 SCL - SDI SDO - -

L L 6800 series 16-bit parallel bus CSB A0 E R/W D0 D1 D2~D7 D8~D15

L H 6800 series 8-bit parallel bus CSB A0 E R/W - - - D8~D15

H L 8080 series 16-bit parallel bus CSB A0 WRB RDB D0 D1 D2~D7 D8~D15 L

H H 8080 series 8-bit parallel bus CSB A0 WRB RDB - - - D8~D15

“-” Must always be high or low

Parallel Interface

When the NT7553E selects parallel input (S/P = Low), the 8080 series microprocessor or 6800 series microprocessor can be selected by the C86 pad to be connected high or low. The NT7553E identifies the data bus signal according to A0, E (WRB), R/W (RDB) signals as shown in Table 2.

Table 2.Parallel Interface Read/Write Status

Common 6800 processor 8080 processor

A0 E R/W RDB WRB Function

0 1 1 0 1 Reads internal status

0 1 0 1 0 Writes indexes into IR (index register)

1 1 1 0 1 Read from RAM data through RDR

1 1 0 1 0 Write control registers or RAM data through WDR

A dummy read is required before the first actual display data is read for parallel interface.

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NT7553E

2008/11/14 15 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

16-bit Bus Interface

Setting the C86 and S8/16 (interface mode) to the VSS/VSS level allows 68-system E-clock-synchronized 16-bit parallel data transfer. Setting the C86 and S8/16 to the VDD/VSS level allows 80-system 16-bit parallel data transfer. When the number of buses or the mounting area is limited, use an 8-bit bus interface.

MCU

CSBA0

WRBRDB

D15-D0

NT7553E

A0

D15-D016

CSB

WRBRDB

. Interface to 16-bit Microcomputer

8-bit Bus Interface

Setting the C86 and S8/16 (interface mode) to the VSS/VDD level allows 68-system E-clock-synchronized 8-bit parallel data transfer using pins D15 to D8. Setting the C86 and S8/16 to the VDD/VDD level allows 80-system 8-bit parallel data transfer. The 16-bit instructions and RAM data are divided into eight upper/lower bits and the transfer starts from the upper eight bits. Fix unused pins D7 to D0 to the VDD or VSS level. Note that the upper bytes must also be written when the index register is written.

MCU

CSB

A0

WRB

RDB

D15-D8

NT7553E

A0

D15-D88

D7-D0

GND8

CSB

WRB

RDB

Interface to 8-bit Microcomputer

Note: Transfer synchronization function for an 8-bit bus interface The NT7553E supports the transfer synchronization function, which resets the upper/lower counter to count upper/lower 8-bit data transfer in the 8-bit bus interface. Noise causing transfer mismatch between the eight upper and lower bits can be corrected by a reset triggered by consecutively writing a 00H instruction four times. The next transfer starts from the upper eight bits. Executing synchronization function periodically can recover any runaway in the display system.

E

A0

R/W

upper/lower

00H

(1) (2)

00H 00H 00H

(3) (4)

upper lowerD15-D8

Figure 2. 8-bit Transfer Synchronization

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NT7553E

2008/11/14 16 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Serial Interface

When the serial interface has been selected (S/P = High, C86 = Low), the SID (serial device ID) can be selected by the S8/16 pad to be connected high or low. The unused pads (D2~15) should be connected to VDD or VSS. When the chip is in serial interface, using the chip select input (CSB), serial clock input (SCL), serial data input (SDI) and serial data output (SDO) pins. The NT7553E initiates serial data transfer by transferring the start byte at the falling edge of CSB input. It ends serial data transfer at the rising edge of CSB input. The NT7553E is selected when the 6-bit chip address in the start byte transferred from the transmitting device matches the 6-bit device identification code assigned to the NT7553E. The NT7553E, when selected, receives the subsequent data string. The ID (S8/16) pin can determine the LSB of the identification code. The five upper bits must be “01110”. Two different chip addresses must be assigned to a single NT7553E because the seventh bit of the start byte is used as a register select bit (A0): that is, when A0 = “0”, data can be written to the index register or status can be read, and when A0 = “1”, an instruction can be issued or data can be written to or read from RAM. Read or write is selected according to the eighth bit of the start byte (R/W bit). The data is received when the R/W bit is “0”, and is transmitted when the R/W bit is “1”. After receiving the start byte, the NT7553E receives or transmits the subsequent data byte-by-byte. The data is transferred with the MSB first. All NT7553E instructions are 16 bits. Two bytes are received with the MSB first (D15 to 0), and then the instructions are internally executed. After the start byte has been received, the first byte is fetched internally as the upper eight bits of the instruction and the second byte is fetched internally as the lower eight bits of the instruction. Five bytes of RAM read data after the start byte are invalid. The NT7553E starts to read correct RAM data from the sixth byte.

Table 3.Serial Interface Read/Write Status

A0 R/W Function

0 1 Reads internal status

0 0 Writes indexes into IR (index register)

1 1 Read from RAM data through RDR

1 0 Writes control registers and RAM data through WDR

Note: 1. When the chip is not active, the shift registers and the counter is reset to their initial states. 2. Caution is required on the SCL signal when it comes to line-end reflections and external noise. We recommend the operation be rechecked on the actual equipment.

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NT7553E

2008/11/14 17 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Serial Data Transfer

Setting the S/P pin to the “VDD” level and the C86 pin to the “VSS” level allows standard clock-synchronized serial data transfer, using the chip select line (CSB), serial transfer clock line (SCL), serial input data line (SDI), and serial output data line (SDO). For a serial interface, the S8/16/ID pin function uses an ID pin. If the chip is set up for serial interface, the D15-2 pins, which are not used, must be fixed at “VDD” or “VSS”. The NT7553E initiates serial data transfer by transferring the start byte at the falling edge of CSB input. It ends serial data transfer at the rising edge of CSB input. The NT7553E is selected when the 6-bit chip address in the start byte transferred from the transmitting device matches the 6-bit device identification code assigned to the NT7553E. The NT7553E, when selected, receives the subsequent data string. The LSB of the identification code can be determined by the ID pin. The five upper bits must be “01110”. Two different chip addresses must be assigned to a single NT7553E because the seventh bit of the start byte is used as a register select bit (A0): that is, when A0 = “0”, data can be written to the index register or status can be read, and when A0 = “1”, an instruction can be issued or data can be written to or read from RAM. Read or write is selected according to the eighth bit of the start byte (R/W bit). The data is received when the R/W bit is “0”, and is transmitted when the R/W bit is “1”. After receiving the start byte, the NT7553E receives or transmits the subsequent data byte-by-byte. The data is transferred with the MSB first. All NT7553E instructions are 16 bits. Two bytes are received with the MSB first (D15 to 0), and then the instructions are internally executed. After the start byte has been received, the first byte is fetched internally as the upper eight bits of the instruction and the second byte is fetched internally as the lower eight bits of the instruction. Five bytes of RAM read data after the start byte are invalid. The NT7553E starts to read correct RAM data from the sixth byte.

Table 4. Start Byte Format

Transfer Bit S 1 2 3 4 5 6 7 8 Device ID code Start byte

format Transfer start

0 1 1 1 0 ID A0 R/W

Note: The S8/16/ID pin selects ID bit.

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NT7553E

2008/11/14 18 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

a) Timing of basic data-transfer through clock synchronized serial interface

CSB

SCL

SDI

1 2 3 4 5 6 7 8 10 11 12 13 14 15 19 20 219 18 22 23

SDO

0 1 1 1 0 D A0 RWD

15

D

14

D

13

D

12

D

11

D

10

D

9

D

5

D

4

D

3

D

2

D

1

D

0

24

D15

D14

D13

D12

D11

D10

D9

D5

D4

D3

D2

D1

D0

Device D code

Start Byte Index Register / InstructionDDRAM Write Data

Status Read / DDRAM Data Read

Transfer Start Transfer End

Figure 3. Procedure for transfer through the clock synchronized serial interface (a)

b) Timing of consecutive data transfer through clock synchronized serial interface

Start Byte

CSB

SCL

SDI

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Instruction(1)upper 8-bit

Instruction(1)lower 8-bit

Instruction(2)upper 8-bit

Instruction(2)lower 8-bit

Start EndInstruction(1)execution timeThe first byte after start byte must be upper 8-bit.

Instruction is not exected.

Figure 4. Procedure for transfer through the clock synchronized serial interface (b)

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2008/11/14 19 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

c) Transfer data read from DDRAM

Start Byte

CSB

SCL

SDI

1 2 3 4 5 6 7 8 10 11 12 13 14 15 16 17 19 20 21 22 23 24 40 41 43 44 45 46 47 48 49 50 52 53 54 55 56 57 58

Five bytes invalid dummy data are read after start byte.6th data is valid from DDRAM.

DummyRead (1)

DummyRead (2)

DummyRead (5)

RAM readupper 8-bit

9 18 42 51 59 60 61 62 63 64

A0=1, R/W=1

RAM readlower 8-bitSDO

Figure 5. Procedure for transfer through the clock synchronized serial interface (c)

d) Status Read / Instruction Read

Start Byte

CSB

SCL

SDI

1 2 3 4 5 6 7 8 10 11 12 13 14 15 16 17 19 20 21 22 23 24

One byte invalid dummy data is read after start byte.2nd data is valid from DDRAM.

DummyRead (1)

Status readupper 8-bit

Status readlower 8-bit

9 18

A0=0, R/W=1

SDO

25 27 28 29 30 31 3226

Figure 6. Procedure for transfer through the clock synchronized serial interface (d)

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2008/11/14 20 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

High-Speed Burst RAM Write Function

The NT7553E has a high-speed burst RAM-write function that can be used to write data to RAM in one-fourth the access time required for an equivalent standard RAM-write operation. This function is especially suitable for applications which require the high-speed rewriting of the display data, for example, display of gray animations, etc. When the high-speed RAM-write mode (HWM) is selected, data for writing to RAM is stored once to the NT7553E internal register. When data is selected four times per word, all data is written to the on-chip RAM. While this is taking place, the next data can be written to an internal register so that high-speed and consecutive RAM writing can be executed for animated displays, etc.

MCU

Display Data RAM(DDRAM)

Address

counter(AC)

/16

16/ NT7553

64/Register1 Register2 Register3 Register4

0001h 0002h 0003h ...0000h

Figure 7. High-Speed Burst RAM Write Function

RAM

DATA

(1)

CSB1 2 3 4

"0000h"RAM ADDRESS

AC15-0

1 2 3 4 1 2 3 4

INDEX:

(R22)

RAMDATA

(2)

RAM

DATA

(3)

RAMDATA

(4)

RAMDATA

(5)

RAM

DATA

(6)

RAM

DATA

(7)

RAMDATA

(8)

RAMDATA

(9)

RAMDATA

(10)

RAM

DATA

(11)

RAMDATA

(12)D15-0

RAM data 1 to 4 RAM data 5 to 8 RAM data 9 to 12

"0004h" "0008h"

RAM WRITE DATA(64 bit)

E

Figure 8. High-Speed Burst RAM Write timing

Note the following when using high-speed RAM write mode. 1. The lower two bits of the address must be set in the following way in high-speed write mode. When D0 becomes 0,

the lower two bits of the address must be set to "11". When D1 becomes 1, the lower two bits of the address must be set to "00".

2. When a high-speed RAM write is canceled, the next instruction must only be executed after the RAM write execution time has elapsed.

3. The logical and compare operation cannot be used.

NT7553E

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4. Data is written to RAM for each four words. When an address is set, the lower two bits in the address must be set to the following values.

*When I/D0=0, the lower two bits in the address must be set to “11” and be written to RAM. *When I/D0=1, the lower two bits in the address must be set to “00” and be written to RAM.

5. Data is written to RAM for each four words. If less than four words of data are written to RAM, the last data will not be written to RAM.

6. When the index register and RAM data write (“22”h) have been selected, the data is always written first. RAM cannot be written to and read from at the same time. HWM must be set to “0” while RAM is being read.

7. High-speed and normal RAM write operations cannot be executed at the same time. The mode must be switched and the address must then be set.

8. When high-speed RAM write is used with a window address-range specified, dummy write operation may be required to suit the window address range-specification. Refer to the High-Speed RAM Write in the Window Address section.

Table 5. Comparisons between Normal and High-Speed RAM Write Operations

Normal RAM Write

(HWM=0) High-Speed RAM Write

(HWM=1)

Logical operation function Can be used Can’t be used

Compare operation function

Can be used Can’t be used

Write mask function Can be used Can be used

RAM address set Can be specified by word ID0 bit=0: Set the lower two bits to 11 ID0 bit=1: Set the lower two bits to 00

RAM read Can be read by word Cannot be used

RAM write Can be written by word Dummy write operations may have to be inserted according to a window address range specification

Window address Can be set by word Can be set by four words

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NT7553E

2008/11/14 22 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

High-Speed RAM Write in the Window Address

When a window address range is specified, RAM data which is in an optional window area can be rewritten consecutively and quickly by inserting dummy write operations so that RAM access counts become 4N as shown in the tables below. Dummy write operations may have to be inserted as the first or last operations for a row of data, depending on the horizontal window-address range specification bits (HSA1 to 0, HEA1 to 0). The number of dummy write operations of a row must be 4N.

Table 6. Number of Dummy Write Operations in High-Speed RAM Write (HSA Bits)

HSA1 HSA0 Number of Dummy Write Operations to be

Inserted at the Start of a Row

0 0 0

0 1 1

1 0 2

1 1 3

Table 7. Number of Dummy Write Operations in High-Speed RAM Write (HEA Bits)

HEA1 HEA0 Number of Dummy Write Operations to be

Inserted at the End of a Row

0 0 3

0 1 2

1 0 1

1 1 0

Each row of access must consist of 4 x N operations, including the dummy writes. Horizontal access count = first dummy write count + write data count + last dummy write count = 4 x N

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An example of high-speed RAM write with a window address-range specified is shown below. The window address-range can be rewritten consecutively and quickly by inserting two dummy writes at the start of a row and three dummy writes at the end of a row, as determined by using the window address-range specification bits (HSA1 to 0 = “10”, HEA1 to 0 =“00”).

Writing in the horizontal direction

Window address-range settingHSA=12h, HEA=30h

VSA=08h, VEA=A0h

High-speed RAM write mode HWM=1

Address set * Note 1

Dummy RAM write x 2

RAM write x 31x 152

AD=0810h

AM=0, I/D0=1

Dummy RAM write x 3

Figure 9. High-Speed Burst RAM with a window mask write

*Note1The address set for the high-speed RAM write must be 00 or 11 according to the value of I/D0 bit. Only RAM in the specified window address-range will be overwritten.

Window address-rangespecification (rewrite area)

0000h

A183h

0812h

A030h

DDRAM address map

Window address-range setting HSA=12h, HEA=30h VSA=08h, VEA=A0h

Figure 10. Example of the High-Speed RAM write with a window address-range specification

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Window Address Function

When data is written to the on-chip DDRAM, a window address-range that is specified by the horizontal address register (start: HSA[7:0], end: HEA[7:0]) or the vertical address register (start: VSA[7:0], end: VEA[7:0]) can be written consecutively. Data is written to addresses in the direction specified by the AM bit (increment/decrement). When image data, etc. is being written, data can be written consecutively without thinking a data wrap by doing this. The window must be specified to be within the DDRAM address area described below. Addresses must be set within the window address.

0000h

A183h

2010h

5F2Fh

DDRAM address map

5F10h

202Fh

Window address area

A100h

0083h

I/D0=1 (increment) AM=0 (horizontal writing) Window address-range specification area HSA5-0=10h, HSE5-0=2Fh VSA7-0=20h, VEA7-0=5Fh

Figure 11. Example of Address Operation in the Window Address Specification

[Restriction on window address-range settings]

(Horizontal direction) 00h ≤ HSA[7:0] ≤ HEA[7:0] ≤ 83h (Vertical direction) 00h ≤VSA[7:0] ≤ VEA[7:0] ≤ A1h

[Restriction on address settings during the window address]

(RAM address) HSA[7:0] ≤ AD[7:0] ≤ HEA[7:0] VSA[7:0] ≤ AD[15:8] ≤ VEA[7:0]

Note: In high-speed RAM-write mode, the lower two bits of the address must be set as shown below according to the value of the ID0 bit. ID0 = 0: The lower two bits of the address must be set to “11”. ID0 = 1: The lower two bits of the address must be set to “00”.

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Display Data RAM (DDRAM)

The display data RAM stores the segment data for the display. It has 162 x 396 x 5 bit structure for 32 gray scale levels.

DDRAM Address Map

Table 8. Relationship between Display Position and DDRAM Address

Horizontal Address

00h 01h 02h 03h … 80h 81h 82h 83h

SGS=0

SE

G1

SE

G2

SE

G3

SE

G4

SE

G5

SE

G6

SE

G7

SE

G8

SE

G9

SE

G10

SE

G11

SE

G12

SE

G385

SE

G386

SE

G387

SE

G388

SE

G389

SE

G390

SE

G391

SE

G392

SE

G393

SE

G394

SE

G395

SE

G396

SGS=1

SE

G396

SE

G395

SE

G394

SE

G393

SE

G392

SE

G391

SE

G390

SE

G389

SE

G387

SE

G386

SE

G385

SE

G384

SE

G12

SE

G11

SE

G10

SE

G9

SE

G8

SE

G7

SE

G6

SE

G5

SE

G4

SE

G3

SE

G2

SE

G1

CMS=0 CMS=1 Vertical Address

D15 ~ D0 D15 ~ D0 D15 ~ D0 D15 ~ D0 … D15 ~ D0 D15 ~ D0 D15 ~ D0 D15 ~ D0

COM1 COM162 00h 0000h 0001h 0002h 0003h … 0080h 0081h 0082h 0083h

COM2 COM161 01h 0100h 0101h 0102h 0103h … 0180h 0181h 0182h 0183h

COM3 COM160 02h 0200h 0201h 0202h 0203h … 0280h 0281h 0282h 0283h

COM4 COM159 03h 0300h 0301h 0302h 0303h … 0380h 0381h 0382h 0383h

COM5 COM158 04h 0400h 0401h 0402h 0403h … 0480h 0481h 0482h 0483h

COM6 COM157 05h 0500h 0501h 0502h 0503h … 0580h 0581h 0582h 0583h

COM7 COM156 06h 0600h 0601h 0602h 0603h … 0680h 0681h 0682h 0683h

COM8 COM155 07h 0700h 0701h 0702h 0703h … 0780h 0781h 0782h 0783h

COM9 COM154 08h 0800h 0801h 0802h 0803h … 0880h 0881h 0882h 0883h

COM10 COM153 09h 0900h 0901h 0902h 0903h … 0980h 0981h 0982h 0983h

… …

COM159 COM4 9Eh 9E00h 9E01h 9E02h 9E03h … 9E80h 9E81h 9E82h 9E83h

COM160 COM3 9Fh 9F00h 9F01h 9F02h 9F03h … 9F80h 9F81h 9F82h 9F83h

COM161 COM2 A0h A000h A001h A002h A003h … A080h A081h A082h A083h

COM162 COM1 A1h A100h A101h A102h A103h … A180h A181h A182h A183h

Table 9. Relationship between DDRAM data and Segment output pin

DDRAM Data D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Selected Palette PK palette PK palette 0 PK palette

Output Pin SEG (3n+1) SEG (3n+2) 0 SEG (3n+3)

Output Pin SEG (396-3n) SEG (395-3n) 0 SEG (394-3n)

Note: 1. n=Lower 8 bits address (00h ~83h)

2. D5 is dummy bit must fixed this bit to “0”.

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Bit Operation

The NT7553E supports the following functions. A write data mask function that selects data into the display data RAM in bit units, and a logic operation function that performs logic operations or conditional determination on the display data set in the RAM and writes into the RAM. With the 16-bit bus interface, these functions can greatly reduce the processing load of the MPU graphics software for the display data in the RAM at high speed. For details, see the Graphics Operation Function section.

Graphic Operation Function

The NT7553E can greatly reduce the load of the microcomputer graphics software processing through the 16-bit bus architecture and internal graphics-bit operation function. This function supports the following: 1. A write data mask function that selectively rewrites some of the bits in the 16-bit write data. 2. A conditional write function that compares the write data and compares-bit data and writes the data sent from the microcomputer only when the conditions match. Even if the display size is large, the display data in the display data RAM (DDRAM) can be quickly rewritten. The graphics bit operation can be controlled by combining the entry mode register. The bit set value of the RAM-write-data mask register, and the write from the microcomputer.

Table 10. Graphics Operation

Bit Setting Operation Mode

I/D AM LG[2:0] Operation and Usage

Write mode 1 0/1 0 000 Horizontal data replacement, horizontal-border drawing

Write mode 2 0/1 1 000 Vertical data replacement, vertical-border drawing

Write mode 3 0/1 0 110,111 Conditional horizontal data replacement, horizontal-border drawing

Write mode 4 0/1 1 110,111 Conditional vertical data replacement, vertical-border drawing

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MCU

Write data latch

Write bit mask

Display Data RAM(DDRAM)

Logical operation bit (LG[2:0])000: replacement bit

110: replacement with matched write

111: replacement with unmatched write

Write-mask register

(WM[15:0])

Addresscounter

(AC)

+1/-1

+256/16

16/16/ NT7553

16/16/16/

Compare bit(CP[15:0])

16/ Logical operation bit

(LG[2:0])

3/

Figure 12. Graphics Operation Flow

Write-data Mask Function

The NT7553E has a bit-wise write-data mask function that controls writing the 16-bit data from the microcomputer to the DDRAM. Bits that are “0” in the write-data mask register (WM [15:0]) cause the corresponding D bit to be written to the DDRAM. Bits that are “1” prevent writing to the corresponding DDRAM bit to the DDRAM; the data in the DDRAM is retained. This function can be used when only one dot data is rewritten or the particular display gray level is selectively rewritten.

Table 11. Write-data Mask Function Operation

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Interface data bus P04 P03 P02 P01 P00 P14 P13 P12 P11 P10 0 P24 P23 P22 P21 P20

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Write mask register 1 1 1 1 1 0 0 0 0 0 0 1 1 0 0 0

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DDRAM data

* * * * * P14 P13 P12 P11 P10 0 * * P22 P21 P20

* D5 is dummy bit must fixed this bit to “0”.

NT7553E

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Graphics Operation Processing

1. Write mode 1: AM = 0, LG [2:0] = “000” This mode is used when the data is horizontally written at high speed. It can also be used to initialize the graphics RAM (DDRAM) or to draw borders. The write-data mask function (WM [15:0]) is also enabled in these operations. After writing, the address counter (AC) automatically increments by 1 (I/D = 1) or decrements by 1 (I/D = 0), and automatically jumps to the counter edge one-raster below after it has reached the left or right edge of the DDRAM.

DDRAM

Operation Examples:1) I/D =1, AM=0, LG[2:0]=000

2) WM[15:0]=07FFH3) AC=0000H

WM15 WM0

Write data mask:

D15

Write data (1):

D0

Write data (2):

Write data (3):

1 0 0 1 1 * * * * * * * * * * * 1 1 0 0 0 * * * * * * * * * * * 0 0 0 1 0 * * * * * * * * * * *

Write data (1) Write data (2) Write data (3)

.....

1 0 0 1 1 0 0 0 1 0 1 0 0 0 1 1

1 1 0 0 0 0 1 1 1 0 0 0 1 0 0 0

0 0 0 1 0 1 1 1 1 0 1 0 1 1 1 0

0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1

0000H 0001H 0002H

Figure 13. Writing Operation of Write Mode 1

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2008/11/14 29 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

2. Write mode 2: AM = 1, LG [2:0] = “000” This mode is used when the data is vertically written at high speed. It can also be used to initialize the DDRAM, develop the font pattern in the vertical direction, or draw borders. The write-data mask function (WM [15:0]) is also enabled in these operations. After writing, the address counter (AC) automatically increments by 256, and automatically jumps to the upper-right edge (I/D =1) or upper left edge (I/D = 0) following the I/D bit after it has reached the lower edge of the DDRAM.

DDRAM

Operation Examples:1) I/D =1, AM=0, LG[2:0]=0002) WM[15:0]=07FFH3) AC=0000H

WM15 WM0

Write data mask:

D15

Write data (1):

D0

Write data (2):

Write data (3):

1 0 0 1 1 * * * * * * * * * * *

1 1 0 0 0 * * * * * * * * * * *

0 0 0 1 0 * * * * * * * * * * *

Write data (1)

Write data (2)

Write data (3)

.

.

.

1 0 0 1 1 0 0 0 1 0 1 0 0 0 1 1

1 1 0 0 0 0 1 1 1 0 0 0 1 0 0 0

0 0 0 1 0 1 1 1 1 0 1 0 1 1 1 0

0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1

0000H

0100H

0200H

Figure 14. Operation of Write Mode 2

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2008/11/14 30 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

3. Write mode 3: AM = 0, LG [2:0] = 110/111 This mode is used when the data is horizontally written by comparing the write data and the set value of the compare register (CP [7:0]). When the result of the comparison in a byte unit satisfies the condition write-data mask function (WM [15:0]) is also enabled. After writing, the address counter (AC) automatically increments by 1 (I/D =1) or decrements by 1 (I/D = 0), and automatically jumps to the counter edge one-raster-raw below after it has reached the left or right edge of the DDRAM.

DDRAM

Operation Examples:1) I/D =1, AM=0, LG[2:0]=110 (Matched Write)

3) WM[15:0]=0000H3) AC=0000H

WM15 WM0

Write data mask:

CP15

Compare register:

CP0

Write data (1):

Write data (2):

* * * * * * * * * * * * * * * *

Matched replacement of

Write data (1)

.....

0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0

0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0

0 0 0 1 0 1 1 1 1 0 1 0 1 1 1 0

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

0000H 0001H

2) CP[15:0]=2860H

D15 D0(Matched)

0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0

* * * * * * * * * * * * * * * *

0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0

C

C

R

R

Compare

OperationConditional

Replacement

Write data (2) is not changed

(Unmatched)

Figure 15. Operation of Write Mode 3

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4. Write mode 4: AM = 1, LG [2:0] = 110/111 This mode is used when a vertical comparison is performed between the write data and the set value of the compare register (CP [15:0]) to write the data. When the result by the comparison in a byte unit satisfies the condition, the write data sent from the microcomputer is written to the DDRAM. In this operation, write data mask function (WM [15:0]) is also enabled. After writing, the address counter (AC) automatically increments by 256, and automatically jumps to the upper-right edge (I/D = 1) or upper-left edge (I/D = 0) following the I/D bit after it has reached the lower edge of the DDRAM.

DDRAM

Operation Examples:1) I/D =1, AM=1, LG[2:0]=111 (Unmatched Write)

3) WM[15:0]=0000H3) AC=0000H

WM15 WM0

Write data mask:

CP15

Compare register:

CP0

Write data (1):

Write data (2):

* * * * * * * * * * * * * * * *

Unmatched replacement of Write data (1)

.

.

0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0

0 1 1 1 0 1 0 1 0 0 1 0 0 0 1 1

0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

0000H 0001H

2) CP[15:0]=2860H

D15 D0

(Matched)

0 1 1 1 0 1 0 1 0 1 1 0 0 0 1 1

* * * * * * * * * * * * * * * *

0 1 1 1 0 1 0 1 0 0 1 0 0 0 1 1

C

C

R

R

Compare

OperationConditional

Replacement

Write data (2) is not changed

(Unmatched)

0000H

0100H

AF00H

Figure 16. Writing Operation of Write Mode 4

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Grayscale Palette

The NT7553E incorporates a grayscale palette to simultaneously display 32-grayscale of the 52-grayscale possible levels. The grayscales consist of 32 6-bit palettes. The 52-stage grayscale levels can be selected from the 6-bit palette data. For the display data, the four-bit data in the DDRAM written from the microcomputer is used. In this palette, a pulse-width control system (PWM) is used to eliminate flickers in the LCD display. The time over which the LCD is switched on is adjusted according to the level and grayscales are displayed so that flicker is reduced and grayscales are clearly displayed.

D10

DISPLAYRAM

(DDRAM)D15

D14

D13

D12

D11

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

52 gray scale control

52 gray scale control

52 gray scale control

LCD Driver LCD Driver LCD Driver

5

5

LCD

Palette register

Display DataPalette

...................................

...................................

...................................

..

"00000"PK05 PK04 PK03 PK02 PK01 PK00

"00001"PK15 PK14 PK13 PK12 PK11 PK10

"00010"PK25 PK24 PK23 PK22 PK21 PK20

"00011"PK35 PK34 PK33 PK32 PK31 PK30

"00100"PK45 PK44 PK43 PK42 PK41 PK40

"00101"PK55 PK54 PK53 PK52 PK51 PK50

"00110"PK65 PK64 PK63 PK62 PK61 PK60

"00111"PK75 PK74 PK73 PK72 PK71 PK70

"01000"PK85 PK84 PK83 PK82 PK81 PK80

"01001"PK95 PK94 PK93 PK92 PK91 PK90

"01010"PK105 PK104 PK103 PK102 PK101 PK100

"01011"PK115 PK114 PK113 PK112 PK111 PK110

"01100"PK125 PK124 PK123 PK122 PK121 PK120

"01101"PK135 PK134 PK133 PK132 PK131 PK130

"01110"PK145 PK144 PK143 PK142 PK141 PK140

"01111"PK155 PK154 PK153 PK152 PK151 PK150

"10000"PK165 PK164 PK163 PK162 PK161 PK160

"10001"PK175 PK174 PK173 PK172 PK171 PK170

"10010"PK185 PK184 PK183 PK182 PK181 PK180

"10011"PK195 PK194 PK193 PK192 PK191 PK190

"10100"PK205 PK204 PK203 PK202 PK201 PK200

"10101"PK215 PK214 PK213 PK212 PK211 PK210

"10110"PK225 PK224 PK223 PK222 PK221 PK220

"10111"PK235 PK234 PK233 PK232 PK231 PK230

"11000"PK245 PK244 PK243 PK242 PK241 PK240

11001PK255 PK254 PK253 PK252 PK251 PK250

"11010"PK265 PK264 PK263 PK262 PK261 PK260

"11011"PK275 PK274 PK273 PK272 PK271 PK270

"11100"PK285 PK284 PK283 PK282 PK281 PK280

"11101"PK295 PK294 PK293 PK292 PK291 PK290

"11110"PK305 PK304 PK303 PK302 PK301 PK300

"11111"PK315 PK314 PK313 PK312 PK311 PK310

LSB

MSB

5

32 32 32

"DisplayData"

SEG(n) SEG(n+1) SEG(n+2)

Figure 17. Grayscale Palette Control

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Grayscale Palette Table

The grayscale register that is set for each palette register (PK) can be set to any level. 52-grayscale lighting levels can be set according to palette values (“000000” to “110100”).

Table 12. Grayscale Control Level

Palette Register Value (PK) Value Grayscale

Control Level

0 0 0 0 0 0 00h All off level 0 0 0 0 0 1 01h 1/52 level

0 0 0 0 1 0 02h 2/52 level 0 0 0 0 1 1 03h 3/52 level

0 0 0 1 0 0 04h 4/52 level

0 0 0 1 0 1 05h 5/52 level 0 0 0 1 1 0 06h 6/52 level

0 0 0 1 1 1 07h 7/52 level

0 0 1 0 0 0 08h 8/52 level

0 0 1 0 0 1 09h 9/52 level 0 0 1 0 1 0 0Ah 10/52 level

0 0 1 0 1 1 0Bh 11/52 level 0 0 1 1 0 0 0Ch 12/52 level

0 0 1 1 0 1 0Dh 13/52 level 0 0 1 1 1 0 0Eh 14/52 level

0 0 1 1 1 1 0Fh 15/52 level

0 1 0 0 0 0 10h 16/52 level 0 1 0 0 0 1 11h 17/52 level

0 1 0 0 1 0 12h 18/52 level 0 1 0 0 1 1 13h 19/52 level

0 1 0 1 0 0 14h 20/52 level

0 1 0 1 0 1 15h 21/52 level 0 1 0 1 1 0 16h 22/52 level

0 1 0 1 1 1 17h 23/52 level 0 1 1 0 0 0 18h 24/52 level

0 1 1 0 0 1 19h 25/52 level

0 1 1 0 1 0 1Ah 26/52 level

0 1 1 0 1 1 1Bh 27/52 level

0 1 1 1 0 0 1Ch 28/52 level 0 1 1 1 0 1 1Dh 29/52 level

0 1 1 1 1 0 1Eh 30/52 level

1 0 1 1 1 0 2Eh 46/52 level

1 0 1 1 1 1 2Fh 47/52 level

1 1 0 0 0 0 30h 48/52 level 1 1 0 0 0 1 31h 49/52 level

1 1 0 0 1 0 32h 50/52 level 1 1 0 0 1 1 33h 51/52 level

1 1 0 1 0 0 34h All on level

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Display data and Grayscale level

Table 13. Display data and output level

Display data Output level

00000 PK0

00001 PK1

00010 PK2

00011 PK3

00100 PK4

00101 PK5

00110 PK6

00111 PK7

01000 PK8

01001 PK9

01010 PK10

01011 PK11

01100 PK12

01101 PK13

01110 PK14

01111 PK15

10000 PK16

10001 PK17

10010 PK18

10011 PK19

10100 PK20

10101 PK21

10110 PK22

10111 PK23

11000 PK24

11001 PK25

11010 PK26

11011 PK27

11100 PK28

11101 PK29

11110 PK30

11111 PK31

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Address Counter (AC)

The address counter (AC) assigns an address to the data display RAM. When an address set instruction is written into the IR, the address information is sent from the IR to the AC. After writing into the RAM, the AC is automatically incremented by 1 (or decremented by 1). After reading from the RAM, the AC is not updated.

PWM Control Circuit

The grayscale palette generates a PWM signal for segment pins, which corresponds to the specified grayscale level. Any 32-grayscale out of the 52-grayscale possible levels can be displayed simultaneously.

Display Data Latch

The display data latch circuit is a latch that temporarily stores the display data that is output to the liquid crystal driver circuit from the display data RAM.

Oscillation Circuit

The NT7553E can set internal oscillate mode and external clock mode, when use internal oscillate mode, OSCI must connect to OSCO to set R-C start oscillation and select oscillation frequency by R0B command .

1 ) Internal oscillator mode

NT7553E

OSCI

OSCO

NT7553E

OSCI

OSCO

2 ) External clock mode

Clock(275kHz)

Damping resister

2kohm

Figure 18. Oscillation Circuits

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The relationship between the SEG and COM output levels is as shown in the following figure. While the display is off, SEG and COM outputs go to VSS level. MMMM VCHVCHVCHVCH

VSHVSHVSHVSHVMVMVMVMVSLVSLVSLVSL(GND)(GND)(GND)(GND)VCLVCLVCLVCL

COM waveformCOM waveformCOM waveformCOM waveformSEG waveformSEG waveformSEG waveformSEG waveform

ONONONONONONONON

Figure 19. Relationship with SEG/COM output level

Liquid Crystal Display Driver Circuit

The liquid crystal display driver circuit consists of 162 common signal drivers (COM1 to COM162) and 396 segment signal drivers (SEG1 to SEG396). Display pattern data from display data RAM is latched to the 396-bit latch circuit. The latched data then enables the segment signal drivers to generate drive waveform outputs. The common driver outputs one of the VCH, VM or VCL voltage level. The SGS bit can change the shift direction of 396-bit data for the segment. The CMS bit can also change the shift direction for the common by selecting an appropriate direction for the device-mounting configuration. When display is off, or during the standby or sleep mode, all the above common and segment signal drivers output the VSS level, halting the display.

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LCD drive power supply circuit

LCD drive power supply circuit generates VCH, VSH, VM and VCL voltage level to drive the LCD panel.

Display Timing Generator Circuit

The display timing generator circuit generates the timing signal to the display data latch circuit using the system clock. The display data is latched into the display data latch circuit synchronized with the display clock, and is output to the data driver output terminal. Reading to the display data liquid crystal driver circuits is completely independent of access to the display data RAM by the MPU. Moreover, the display timing generator circuit generates a drive waveform using an alternating current drive method that is determined by N -Line Inversion command for the liquid crystal drive circuit.

Common Output Control Circuit

This circuit controls the relationship between the number of common output and specified duty ratio. Common output mode select instruction specifies the scanning direction of the common output pads.

Sleep Mode

Setting the sleep mode bit (SLP) to “1” puts the NT7553E in the sleep mode, where the device stops all internal display operations, thus reducing current consumption. Specifically, LCD operation is completely halted. Here, all the SEG (SEG1 to SEG396) and COM (COM1 to COM162) pins output the “VSS” level, resulting in no display. If the AP [1:0] bits in the power control register are set to “00” in the sleep mode, the LCD drive power supply can be turned off, reducing the total current consumption of the LCD module.

Table 14. Comparisons of Sleep Mode and Standby Mode

Function Sleep Mode (SLP = 1) Standby Mode (STB = 1)

LCD control Turned off Turned off

Oscillation circuit Operates normally Operation stopped

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Standby Mode

Setting the standby mode bit (STB) to “1” puts the NT7553E in the standby mode, where the device stops completely, halting all internal operations including the Oscillation circuit, thus further reducing current consumption compared to that in the sleep mode. Specifically, all the SEG (SEG1 to SEG396) and COM (COM1 to COM162) pins for the time-sharing drive output the VSS level, resulting in no display. If the AP [1:0] bits are set to “00” in the standby mode, the LCD drive power supply can bet turned off. During the standby mode, no instructions can be accepted other than the start-oscillation instruction. To cancel the standby mode, issue the start-oscillation instruction to stabilize oscillation before setting the STB bit to “0”.

Turn off the LCD power supply: AP1-0 = "00"

Set stand-by mode: STB = "1"

Stand-by mode

Issue the start-oscillation instruction

Wait at least 10 ms

Cancel stand-by mode: STB = "0"

Turn on the LCD power supply: AP0-1 = 01/10/11

Wait at least 150 ms

Turn on the display: D1-0 = "11"

See the power supplycircuit setting.

Turn off the display: D1-0 = "01"

Figure 20. Procedure for Setting and Canceling Standby Mode

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Setting Flows for Power Supply and Display Instruction Power-on / off Sequence To prevent pulse lighting of LCD screens at power-on/off, the power-on/off sequence is activated as shown below. However, since the sequence depends on LCD materials to be used, confirm the conditions by using your own system.

Figure 21. Power On sequence

Power off the VDD

Display off

use-state instruction

Display off sequence

Normal display

Bits for display off

D1-0="00"

Power off setting bit

Power supply circuit off

control set by AP1-0

Figure 22. Power Off sequence

Power on the VDD

Hardware Reset

Issue use- state instruction ( 1)

Issue use -state instruction (2 )

Issue other mode setting instruction (3 )

Display on Sequence

Display on

more than 10ms ( oscillation circuit stabilization time )

1 ms

more than 50 ms ( set - up circuit 1 , 2 stabilization time )

more than 200 ms ( set- up circuit 2 / voltage inverting circuit

stabilization time )

Power on Initialized bits Set VC 2- 0 bit Set BT 2- 0 bit Set DC 2 - 0 bit Set AP 1 - 0 bit Voltage polarity inverting circuit operation starting bit

Display on D 1- 0=" 11 "

Set BT 3 bit

more than 100ms

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Power-off Sequence

Turn off the powervoltages : VDD

Issue LCD power instruction

Turn off the display: D1-0 = 00

To the power on sequence

Figure 23. Normal case

Turn off the power

voltages : VDD

RESET = "L"

To the power on sequence

Driver SEG/COM output: GND level

Turn off the power voltage

RESET is input as soon as possible.

Driver

SEG/COM

output

RESET

VDD

VDD

GND

VDD

GND

VDD

GND

Figure 24. Emergency case

Note: When hardware reset is input during the power-off period, the D1-0 bits are cleared to "00" and SEG/COM output is forcibly lowered to the VSS levels.

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Partial Sequence Setting Flow

Display OFF

Normal display

Power supply setting change

Display Duty change

Issue instruction for other mode setting

Display ON

D1-0 = 00

BT2-0 bit setting

BS3-0 bit setting

DC2-0 bit setting

VR2-0 bit setting

CT6-0 bit setting

NL-4-0 bit setting

DIV, RTN bit setting

D1-0 = 01

more than 200ms

Step-up circuit output

stabilizing time

D1-0 = 11

Frame frequency adjustment

Display OFF

Partial display

Figure 25. Normal to partial case

D1-0 = 00

BT2-0 bit setting

BS3-0 bit setting

DC2-0 bit setting

VR2-0 bit setting

CT6-0 bit setting

NL-4-0 bit setting

DIV, RTN bit setting

D1-0 = 01

more than 200ms

Step-up circuit output

stabilizing time

D1-0 = 11

Partial display

Display OFF

Power supply setting change

Display Duty change

Frame frequency adjustment

Display OFF

Issue instruction for other mode setting

Display ON

Normal display

Figure 26. Partial to normal case

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Frame-Frequency Adjustment Function

The NT7553E has an on-chip frame-frequency adjustment function. The frame frequency can be adjusted by the instruction setting (DIV, RTN) during the LCD drive, as the oscillation frequency is always the same. When the display duty is changed, the frame frequency can be adjusted to be the same. If the oscillation frequency is set to high, an animation or a static image can be displayed in suitable ways by changing the frame frequency. When a static image is displayed, the frame frequency can be set low and the low-power consumption mode can be entered. When high-speed screen switching, for an animated display, etc. is required, the frame frequency can be set high.

Relationship between LCD Drive Duty and Frame Frequency

The relationship between the LCD driver duty and the frame frequency is calculated by the following expression. The frame frequency can be adjusted in the retrace-line period bit (RTN) and in the operation clock division bit (DIV) by the instructions.

n-raster-row Reversed AC Drive

The NT7553E supports not only the LCD reversed AC drive in a one-frame unit (B-pattern waveform) but also the n-raster-row reversed AC drive which alternates in an n-raster-row unit from one to 64 raster rows (C-pattern waveform). When a problem affecting display quality occurs, such as cross talk at high-duty driving of more than 1/64 duty, the n-raster-row reversed AC drive (C-pattern waveform) can improve the quality. Determine the number of raster-rows n (NW bit set value + 1) for alternating after confirmation of the display quality with the actual LCD panel. However, if the number of AC raster-rows is reduced, the LCD alternating frequency becomes high. Because of this, the charge or discharge current is increased in the LCD cells.

BC=0

M

BC=1

EOR=0M'

BC=1

EOR=1 ''' MMM ⊕=

n

B type

C type

n

C type

1 2 3 4 5 6 m

Figure 27. Example of an AC Signal under n-raster-row Reversed AC Drive

(Formula for the frame frequency)

Frame frequency = fosc / (Clock cycles per raster-row × division ratio × duty cycle) [Hz] fosc: Oscillation frequency Duty: drive duty (NL bit) Clock cycles per raster-row: (RTN + 26) clock cycles Division ratio: DIV bit

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NT7553E

2008/11/14 43 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Screen-division Driving Function

The NT7553E can select and drive two screens at any position with the screen-driving position registers (R14h and R15h). Any two screens required for display are selectively driven and a duty ratio is lowered by LCD-driving duty setting (NL [4:0]), thus reducing LCD-driving voltage and power consumption. For the 1st division screen, start line (SS1[7:0]) and end line (SE1[7:0]) are specified by the 1st screen-driving position register (R14h). For the 2nd division screen, start line (SS2 [7:0]) and end line (SE2 [7:0]) are specified by the 2nd screen-driving position register (R15h). The 2nd screen control is effective when the SPT bit is “1”. The total count of selection-driving lines for the 1st and 2nd screens must correspond to the LCD-driving duty set value.

NOVATEK

NT 7553

1/32-duty driving on 2 screens

COM11

COM20

COM81

COM102

1st screen

10 line driving

2nd screen

22 line driving

Always applying

non-selection level

Always applying

non-selection level

Always applying

non-selection level

Driving Duty: NL[4:0]= ”00011” (1/32 duty) , SPT=1 1st Screen setting: SS1[7:0]=”0A”H, SE1[7:0]= ”13”H 2nd Screen setting: SS2[7:0]=”50”H, SE2[7:0]= ”65”H SPT=1

Figure 28. Display examples in 2-screen division driving

Restrictions on the 1st / 2nd Screen Driving Position Register Settings

The following restrictions must be satisfied when setting the start line (SS1[7:0]) and end line (SE1[7:0]) of the 1st screen driving position register (R14h) and the start line (SS2[7:0]) and end line (SE2[7:0]) of the 2nd screen driving position register (R15h) for the NT7553E. Note that incorrect display may occur if the restrictions are not satisfied.

Table 15. Restrictions on the 1st/2nd Screen Driving Position Register Settings

1st Screen Driving (SPT = 0) 2nd Screen Driving (SPT = 1)

Register setting SS1 [7:0] ≤ SE1 [7:0] ≤ DUTY SET ≤ A1h SS1 [7:0] ≤SE1 [7:0] < SS2 [7:0] ≤ SE2 [7:0] ≤ DUTY SET ≤ A1h

Display operation

Time-sharing driving for COM pins (SS1+1) to (SE1+1)

Non-selection level driving for others

Time-sharing driving for COM pins (SS1+1) to (SE1+1) and (SS2+1) to (SE2+1)

Non-selection level driving for others

Notes:1. When the total line count in screen division driving settings is less than the duty setting, non-selection level driving is

performed without the screen division driving setting range. 2. When the total line count in screen division driving settings is larger than the duty setting, the start line, the duty

setting line and the lines between them are displayed and no selection level driving is performed for other lines. 3. For the 1st screen driving, the SS2[7:0] and SE2[7:0] settings are ignored.

NT7553E

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NT7553E

2008/11/14 44 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

LCD Voltage Supply Circuit

Figure 29 shows NT7553E LCD controller circuit of the single power supply mode.

VDD2

VSS2

VSS

VDDR

VDD

C

VDD

VDDR regulatorenable

C

VCC

VDD3

VSS3

NT7553

REGENB

Supply Voltage= 2.4V~3.6V

Figure 30 shows NT7553E LCD controller circuit of the dual power supply mode.

VDD2

VSS2

VSS

VDDR

VDD

C

VDD

VDDR regulatordisable

VCC

VDD3

VSS3

NT7553

REGENB

Supply Voltage = 2.4V~3.6V

VDD

C

Supply Voltage = 1.6V~2.3V

NT7553E

NT7553E

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NT7553E

2008/11/14 45 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

LCD Voltage Generation Circuit

Figure 31 shows a configuration of the NT7553E LCD drive voltage generation circuit. It consists of step-up circuit 1 that doubles or triples the voltage that is applied to VCI1, step-up circuit 2 that multiplies the voltage from step-up circuit 1 by two to five times, and a polarity circuit that generates a VCL level by inverting the VCH level centered around the VM level. These circuits generate VCH and VCL that are the power supply for COM outputs. The LCD driving level for SEG outputs (VSH and VM) are generated by dividing resistance at the VREF level.

VREFL <= VDD

VSH = VREFM X 2R/(RB+2R)

VM = VREFM X R /(RB+2R)

VDD2

VSS2

VSS

VOUT

VDDR

VSH

VM

VCL

VCI2

Amplifier

CEM

CEP

VREFL

VCI2

VSHAmplifier

VM

Amplifier

VDD

C 1

C1

C21-

C21+

C22-

C22+

C23-

C23+

C11- C11+

VOUT GeneratorBoost Circuits 1

VCH

Generator

Boost

Circuits 2

C1

C1

C1

C1

VCL

Generator

Inverting

Circuits 3 C3

C1

C2VCH

C2

VDD

Electronic

VolumeControl Circuit

RB

R

R

SEG Driver

Circuit

COM Driver

Circuit

Bias Control

Circuit

VREFLAmplifier

VSH

VSL

VCH

VM

VCL

VREFM = 1 .1 ~ 3 .4 X VREFLVREFM <= VOUT

VDD3 = 2.4V~3.6V

VOUT = 4.5 ~ 5.5 V

VCI2 = 1.5 ~ 4.67 x VM

VCH = 2 x~ 4x VCI2

VCH - VCL <= 36 V

VCL = VM - VCH

D1

VCI2 <= VOUT - 0.5V

C1 C1

C1

VDD

VDDR regulator

C1

VCL

VCHVM

VREG Genrator

&

Temp

Compensation

Circuits

C12- C12+

C1

VCI1 Control

Generator

VDD3

VCC

Digital

Circuits

VDD3

VSS3

VCI1

Figure 31. Configuration of internal power circuit

Notes: 1. Generate an output voltage (VOUT) from step-up circuit 1 within the range from 4.5 to 5.5V.

2. Do not allow the output voltage (VCH-VCL) from step-up circuit 2 and step-up circuit 3 to exceed 36 V. 3. Do not allow the output from VCI2 to exceed VOUT-0.5v voltage. 4. When capacitor with polarity is used, be sure that an inverted voltage is not applied to it in any state of the system. 5. VCI1 is used as both the reference voltage input and power supply in the step-up circuit. Keep sufficient LCD drive

current. 6. Rated voltage of capacitors possible to be used are as described below. Required voltage depends on used panels.

When actual voltage is less than 16V, capacitors with 16V rated voltage can be used. 7. The VCL must be connected one schottky barrier diode. The specification of SBD are VF=Max. 0.3V@1mA and

VR=Min. 20V. The recommended SBD is Toshiba 1SS388 (VF=0.28V@1mA and VR=40V)

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NT7553E

2008/11/14 46 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

LCD Drive Voltage

The required voltage can be calculated by applying the following expressions. Drive voltages are standard; generate a voltage to suit the panel to be used.

LCD Drive Bias

An optimal bias can be calculated by applying the following expression. The value that has been calculated is theoretically optimal. If a lower bias value than the optimal value is used to drive the LCD, contrast may be reduced depending on lighting conditions. However, lowering the drive voltage can reduce the power consumption. Adjust the value according to the system to be used. Bias value =1/Root (N)

How to determine the VCH voltage

VCH =2 x VM x NB x ND2 NB: Bias ratio ND2: Step-up factor of the step-up circuit 2

Contrast adjustment

Rb: Contrast resistance (0.000R to 1.016R) VSH = VREFM x 2R / (Rb + 2R)

Electronic

VolumeControl Circuit

VREFM

Rb

Bias Control

Circuit

VSH

VM

VSL

R

R

Rb: Resistor foradjusting contrast

Boostcircuit 2

VCI 2

VCI2= 2x VM x NB

VCH = 2 x VM x NB x ND2

VCH

Figure 32. Contrast control circuit

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NT7553E

2008/11/14 47 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Multi-time Calibration Function

The multi-time calibration function can be modifies and offset the contrast value. Because the variation of LCD module in term of contrast level, the multi-time calibration function can be used to achieve the best visual contrast of every LCD module by adjusting VSH voltage.

Multi-time calibration for contrast flow

Hardware reset

Send the original initialization settings to display properly

Set any test patterns to judge the contrast is best

Start

Set the fixed Contrat value CT[6:0] = 00h~7Fh

Set MTPT=1 into MTP write test mode

Set Vout value >5V

Execute the one time calibration programing command PG = 1

Hardware reset

End

Delay 2s for program

Add External Voltage(7v) to Vout

Exit external voltage (7v) to Vout

MTPT= 1

Adjust the MT[4:0] value(offset value)to find the best visual contrast MT[4:0] = 00h~1Fh

Figure 33. Contrast control circuit

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NT7553E

2008/11/14 48 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Example source C code for MTP Flow

Read MTP function Flow

Hardware reset

Read R0E register

Check PM1=1 or not

Start

readbuf = R0E

READ MP[4:0] DATA

End

MP[4:0] is the already

programed DATA

PM1=1;already programed 1 time

Check PM2=1 or not PM1=2;already programre 2 times

Example source C code for read MTP function Flow

LCD_RES=0; //hardware reset

Delay (1);

LCD_RES=1;

Init7553 (); //Call initialization function

Command (0x0004, 0x013F); //Set the default value for the contrast

Command (0x000D, 0x0100 ); //set MTPT INTO MTP test mode

Command (0x000D, 0x0112 ); //Adjust the contrast value to the best visual

Command (0x000C,0x0001); //Execute the MTP programming command

Command (0x0003,0x017C); //Set pump on and set Vout > 5V

Extenal_7v_ON(); //External 7v to Vout on

Delay (2000); //Delay 2 sec

Extenal_7v_OFF(); //External 7v to vout off

LCD_RES=0; //hardware reset

Delay (1)

LCD_RES=0; //hardware reset

Delay (1);

LCD_RES=1;

write_i (0x000E); readbuf = read_ i(); if ((readbuf & 0x0020) != 0) PM1=1 //CHECK PM1 if ((readbuf & 0x0040) != 0) PM2=1 //CHECK PM2 MP_DATA = readbuf & 0x001F ; //Load already programmed DATA to

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NT7553E

2008/11/14 49 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Application information for LCD panel (for reference only) Type I (CMS = 0, SGS = 0)

NT7553

Display

Scan Direction

IC Bumper Face Up

SEG1

COM65

COM1

COM161COM67 SEG1

SEG396

COM66

COM2

COM162 COM68SEG396

COM65

COM67

COM161

COM2COM1

COM68

COM162

CMS=0, SGS=0

COM66

Figure 34. Application information for LCD panel type1

Type II (CMS = 0, SGS = 1)

NT7553

Display

Scan Direction

IC Bumper Face Down

SEG396

COM65

COM1

COM161 COM67SEG396

SEG1

COM66

COM2

COM162COM68 SEG1

COM65

COM67

COM161

COM2 COM1

COM68

COM162

CMS=0, SGS=1

COM66

Figure 35. Application information for LCD panel type2

NT7553E

NT7553E

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NT7553E

2008/11/14 50 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Type III (CMS = 1, SGS = 0)

Display

Scan Direction

SEG396SEG1

COM98

COM96

COM161

COM2 COM1

COM95

COM162

COM97

CMS=1, SGS=0

NT7553

IC Bumper Face Down

COM65

COM1

COM67 SEG1

COM66

COM2

COM68SEG396COM161 COM162

Figure 36. Application information for LCD panel type3

Type IV (CMS = 1, SGS = 1)

Display

Scan Direction

SEG396SEG1

COM98

COM96

COM161

COM2COM1

COM95

COM162

COM97

CMS=1, SGS=1

NT7553

IC Bumper Face Up

COM65

COM1

COM67SEG1

COM66

COM2

COM68 SEG396 COM161COM162

Figure 37. Application information for LCD panel type4

Note: If segment of the display panel is less than 396 outputs , we would recommend connecting most

central segment pins to display panel. For example, in terms of 320 outputs application, connecting SEG 39~SEG359 to display panel is recommended.

NT7553E

NT7553E

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NT7553E

2008/11/14 51 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Application information for Pin Connection to MPU (for reference only)

0.47uF

NT7553

2.4 ~ 3.6V

[ : ]

n

16

VDD

D[15:0]

RESET

R/W

E

A0

CSB

PUMP2 CAP

PUMP3 CAP

1.0uF

1.0uF

1.0uF

1.0uF

1.0uF

1.0uF

0.1uF

1.0uF

1.0uF

1.0uF

1M

1.0uF

1.0uF

1.0uF

1.0uF

PUMP1 CAP

Selects the MCU interface mode:

S8/16C86S/PMCU interface mode

GND GND GND68-system 16-bit

GND GND VDD68-system 8-bit

GND VDD GND80-system 16-bit

GND VDD VDD80-system 8-bit

VDD GND IDSerail interface

Selects the MCU interface mode:

MCU interface mode

68-system 16-bit

68-system 8-bit

80-system 16-bit

80-system 8-bit

Serail interface

D15~D8 D7~D2 D1 D0 R/W E A0 CSB

D15~D8

D15~D8

D15~D8

D15~D8

GND

D7~D2

D7~D2

D1 D0

D1 D0

GND GND GND

GND GND GND

GND SDO SDI

R/W

R/W

RDB

RDB

GND

E

E

WRB

WRB

SCL GND

CSB

CSB

CSB

CSB

CSB

A0

A0

A0

A0

1.0uF

S/P

C86

S8/16

1.0uF

Figure 38. Application information for Pin Connection to MPU

NT7553E

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NT7553E

2008/11/14 52 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Application information for Pin Connection to of step up circuit (for reference only)

1. 2 times step-up circuit1 (2 x VCI1) 2. 3 times step-up circuit1 (3 x VCI1)

NT7553

1.0uF

1.0uF

VOUTgenerating

step-upcircuit 1

1.0uF

NT7553

1.0uF

1.0uF

1.0uF

VOUTgenerating

step-upcircuit 1

1.0uF

Figure 39. Figure 40.

3. 2 times step-up circuit2 (2 x VCI2) 4. 3 times step-up circuit2 (3 x VCI2)

NT7553

VCHgenerating

step-upcircuit 2

1.0uF

1.0uF

1.0uF

NT7553

VCHgenerating

step-upcircuit 2

1.0uF

1.0uF

1.0uF

1.0uF

Figure 41. Figure 42.

5. 4 times step-up circuit2 (4 x VCI2)

NT7553

VCHgenerating

step-upcircuit 2

1.0uF

1.0uF

1.0uF

1.0uF

1.0uF

Figure 43.

NT7553E

NT7553E NT7553E

NT7553E

NT7553E

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NT7553E

2008/11/14 53 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Application information for LCD panel (for reference only) External supply voltage for driver application circuit (for reference only)

VOUT

VSH

VM

VCL

VCH

NT7553COMn

SEGn

VSS VSS2

VDD VDD2

0V ~ -15V

1.0V ~ 1.65V

2.4V ~ 3.6V

2.0V ~ 3.3V

4.5V~5.5V

0V~19V

External supply

voltage for driver

GND

GND

VCH

VCL

VM

VSH

OUTPUT WAVEFORM

VDD3

2.4V ~ 3.6V2.4V ~ 3.6V

VSS3

Figure 44. External supply voltage for driver application circuit

Notes: 1. When use external supply voltages, the internal operational amplifier must be off (AP[1:0]=00). 2. When use external supply voltages, the VOUT must supply 4.5V~5.5V. 3. The external supply voltages, must always keep the relationship of VCH ≥ VSH ≥ VM ≥ VSS2 ≥ VCL. 4. The external supply voltages, must always keep the relationship of VCH – VCL< 36V

NT7553E

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NT7553E

2008/11/14 54 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Power supply level correlation

VSS

VREFL(<VDD3 or =2.2V)

VCI1

VDD3

VREFM(<VOUT)

VOUT(4.5V~5.5V)

VSS

VM

VSH

VCI2

VCH

VCL

VC[2:0] (x0.92~x0.68)

BT0 (x2~x3)

VR[2:0] (x1.1~x3.4)

CT[6:0] (contrast adjustment)

BS[3:0] (x1.5~x4.0)

BT[2:3](x2~x4)

BT3(Voltage polarity inversion between VCH and VM)

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2008/11/14 55 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

ITO Layout Notice

1. Specifically with COG application, it is important to reduce the resistance of the ITO path. To make the overall display performance of the LCM better, there are some suggestions for ITO layout described as below: a) Please keep the resistance of VDD & VSS path between PCB and corresponding pads of IC ≤

50Ω. This value includes the ITO resistors’ values, the FPC/Heat seal resistor; the ACF contact resistors between IC and Glass, Glass and FPC/Heat seal, FPC/Heat seal and PCB.

b) Large resistance will reduce the efficiency of the voltage booster; the user should make the ITO resistance of charge pump pads as small as possible. The resistance of C11+, C11-, C12+, C12-, C21+, C21-, C22+, C22-, C23+, C23-,CEM and CEP ≤ 100Ω; the resistance of VOUT, VM, VSH,VCH,VCL,VCI2 and VCI1 ≤ 300Ω.

c) The value of the other pins of the interface ≤ 500Ω (except the RSTB pin). d) Make a long thin ITO line with an impedance of 5KΩ ~ 10KΩ between the RESET of interface

and IC’s RSTB pads to work as a low-pass filter. With experience, it can filter some EMI and prevent the errors caused by ESD.

ITO Path Max. Resistance

VDD, VSS, VDD2, VSS2, VDD3, VSS3, VDDR, VCC 50Ω

C11+, C11-, C12+, C12-, C21+, C21-, C22+, C22-, C23+, C23-, CEM, CEP

100Ω

VOUT, VM, VSH, VCH, VCL, VCI2, VCI1 300Ω

RSTB 5KΩ~10KΩ

A0, CSB, E, R/W, D0 ~ D15 500Ω

2. To meet the value demanded above while laying out ITO, users may accept the rules below:

a) In order to keep the ITO resistance to a minimum, the vary pitch and position of the module connection to the outside should be selected to make the power lines go as straight as possible.

b) The distance between NT7553E and FPC is the shorter the better. Then the length of ITO will be the shortest and you can get a smaller resistor value.

c) The ITO interface may fill the blank area on the LCD panel to reduce the ITO resistance.

3. Reference the figures for ITO Layout: a) Figure 45 is ITO Layout for All-interface mode.

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NT7553E

2008/11/14 56 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Figure 45. ITO Layout for all-interface mode.

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2008/11/14 57 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

4. If not all segment be used, we suggest the selection of segments should according to below figure.

Total Segment outputs

1/2 Segments 1/2 Segments

SE

G19

7

SE

G19

6

SE

G1

SE

G0

SE

G39

5

SE

G39

4

SE

G19

9

SE

G19

8

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NT7553E

2008/11/14 58 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Application Notice of Large Panel Design 1. If active display areas of LCD larger than 4”, we recommend below items could be apply.

a) Set register of VC[2:0] = 111B to turn off VCI1 generator circuit.

R0C W 1 0 0 0 0 0 0 TC1 TC0 0 0 0 RV0 0 VC2 VC1 VC0

R0C W 1 0 0 0 0 0 0 1/0 1/0 0 0 0 1/0 0 1 1 1

b) Supply a voltage on VOUT pad by external power supply in order to enhance the display

quality and steady LCD driving voltages. The application circuit showed as below.

C 11 - C 11 +

VOUT Generator

Boost Circuits 1

C1

C 12 - C 12 +

VCI 1 Control

Generator

VDD 3

VCI 1

4.5V~5.5V

VOUT

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NT7553E

2008/11/14 59 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

c) Recommend external VOUT voltage on/off sequence.

Power on sequence for external VOUT

Power off sequence for external VOUT

Power off the VDD

Turn off LCD power supply: AP1-0=00

Turn off external VOUT voltage

Display off

Display off Sequence

Normal Display

Bit for Display off D1-0 = “00”

Display on

Display on Sequence

Issue other mode setting instruction (3)

Issue use-state instruction (2)

Issue use-state instruction (1)

Turn on external VOUT voltage

Turn on LCD power supply: AP1-0=01/10/11

Turn off VCI1 voltage: VC2-0=”111”

Hardware Reset

Power on the VDD

1ms

More than 10ms (Oscillation circuit stabilization time)

More than 10ms (External VOUT stabilization time)

More than 50ms (Set-up circuit1,2 stabilization time)

More than 200ms (Voltage inverting stabilization time)

Power on initialized bits Set BT2-0 bit Set DC22-0 bit

Voltage polarity inverting circuit operation starting bit Set BT3 bit

Display on D1-0 = “11”

More than 100ms

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2008/11/14 60 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Stand-by on/off sequence for external VOUT

Turn on the display D1-0=”11”

Wait at least 150ms

Turn on external VOUT voltage

Turn on LCD power supply: AP1-0=01/10/11

Turn off VCI1 voltage: VC2-0=”111”

Cancel stand-by mode: STB=”0”

Wait at least 10ms

Issue the start – oscillation instruction

Stand-by mode

Set stand-by mode: STB=”1”

Turn off LCD power supply: AP1-0=“00”

Turn off the display: D1-0=“01”

Turn off external VOUT voltage

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2008/11/14 61 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Reset Function The NT7553E is internally initialized by RESB input pin. Reset the gate driver/Power supply IC, as its settings are not automatically reinitialized when the NT7553E is reset. The reset input must be held to Low for at least 10 ms. Don’t access the DDRAM or initially set the instructions until the oscillation frequency is stable after power has been supplied (10 ms).

Instruction Set Initialization

After resetting the NT7553E, the default settings are shown below: 1. Start oscillation executed 2. Driver output control: NL [4:0] = (1,0,0,1,1), SGS = 0, CMS = 0 3. B-pattern waveform AC drive: RST=0,B/C = 0, EOR = 0, NW [5:0] = (0,0,0,0,0,0) 4. Power control 1: DC [2:0] = (0,0,0), AP [1:0] = (0,0): LCD power off, STB = 0: Standby mode off,

SLP = 0, BS [3:0] = (0,0,0,0), BT[3:0] = (0,0,0,0) 5. Contrast control (Weak contrast): VR [2:0] = (0,0,0), CT [6:0] = (0,0,0,0,0,0,0) 6. Entry mode set: SPR= 0, HWM = 0, I/D [1:0] = (1,1): Increment by 1, AM = 0: Horizontal move, LG

[2:0]=(0,0,0): Replace mode 7. Compare register: CP [15:0] = (0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0) 8. Display control: VLE [2:1] = (0,0): No vertical scroll, SPT = 0,B/W = 0,REV = 0,DIP[1:0]= (0,0)

D[1:0] = (0,0): Display off , DIP[1:0] =(0,0). 9. Frame cycle control: CLK [2:0] =(0,0,0), DIV [1:0] = (0,0): 1-divided clock, RTN [3:0]: No line retrace

period 10. Power control 2: VC [2:0] = (0,0,0),RV0 = 0,TC[1:0]=(0,0) 11. MTPT = 0, MT[4:0]= (0,0,0,0,0), PG = 0 12. Vertical scroll: VL2 [7:0] = (0,0,0,0,0,0,0,0), VL1 [7:0] = (0,0,0,0,0,0,0,0) 13. 1st screen division: SE1 [7:0] = (1,1,1,1,1,1,1,1), SS1 [7:0] = (0,0,0,0,0,0,0,0) 14. 2nd screen division: SE2 [7:0] = (1,1,1,1,1,1,1,1), SS2 [7:0] = (0,0,0,0,0,0,0,0) 15. Horizontal RAM address position: HEA [7:0] = (1,0,0,0,0,0,1,1), HSA [7:0] = (0,0,0,0,0,0,0,0) 16. Vertical RAM address position: VEA [7:0] = (1,0,1,0,0,0,0,1), VSA [7:0] = (0,0,0,0,0,0,0,0) 17. RAM write data mask: WM [15:0] = (0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0): No mask 18. RAM address set: AD [15:0] = (0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0) 19. Grayscale palette:

PK0 = (0,0,0,0,0,0), RK1= (0,0,0,0,1,1), PK2= (0,0,0,1,1,0), PK3= (0,0,1,0,0,0), PK4= (0,0,1,0,1,0), PK5= (0,0,1,1,0,0), PK6= (0,0,1,1,1,0), PK7= (0,0,1,1,1,1), PK8= (0,1,0,0,0,0), PK9= (0,1,0,0,0,1), PK10= (0,1,0,0,1,0), PK11= (0,1,0,0,1,1), PK12= (0,1,0,1,0,0), PK13= (0,1,0,1,0,1), PK14= (0,1,0,1,1,0), PK15= (0,1,0,1,1,1), PK16 = (0,1,1,0,0,0), PK17= (0,1,1,0,0,1), PK18= (0,1,1,0,1,0), PK19= (0,1,1,0,1,1), PK20= (0,1,1,1,0,0), PK21= (0,1,1,1,0,1)”, PK22= (0,1,1,1,1,0), PK23= (1,0,0,0,0,0), PK24= (1,0,0,0,1,0), PK25= (1,0,0,1,0,0), PK26= (1,0,0,1,1,0), PK27= (1,0,1,0,0,0), PK28 = (1,0,1,0,1,1), PK29= (1,0,1,1,1,0), PK30= (1,1,0,0,0,1), PK31= (1,1,0,1,0,0)

DDRAM Data Initialization

This is not automatically initialized by reset input but must be initialized by software while display is off (D [1:0] = (0,0)).

Output Pin Initialization 1. LCD driver output pins (SEG/COM): Output VSS level 2. Oscillator output pin (OSCO): Output oscillation signal

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2008/11/14 62 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

General Commands Description

Outline

The NT7553E uses the 16-bit bus architecture. Before the internal operation of the NT7553E starts, control information is temporarily stored in the registers described below to allow high-speed interfacing with a high-performance microcomputer. The internal operation of the NT7553E is determined by signals sent from the microcomputer. These signals, which include the register selection signal (A0), the read/write signal (R/W), and the data bus signals (D15 to D0), make up the NT7553E instructions. There are eight categories of instructions that: Specify the index Read the status Control the display Control power management Process the graphics data Set internal DDRAM addresses Transfer data to and from the internal DDRAM Set the grayscale level for the internal grayscale palette table Normally, instructions that write data are used the most. However, an auto-update of internal DDRAM addresses after each data write can lighten the microcomputer program load. Because instructions are executed in 0 cycles, they can be written in succession.

Instruction Descriptions

1. Index (IR):

The index instructions specify the RAM control indexes (R00h to R3Fh). It sets the register number in the range of 000000 to 111001 in binary form. However, R40 to R44 are disabled since they are test registers.

NO. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 IR W 0 * * * * * * * * * ID6 ID5 ID4 ID3 ID2 ID1 ID0

Index Instruction

2. Status Read (SR):

The status read instruction reads the internal status of the NT7553E. No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 SR R 0 L7 L6 L5 L4 L3 L2 L1 L0 0 C6 C5 C4 C3 C2 C1 C0

Status Read Instruction

L [7:0]: Indicates the driving raster-row position where the liquid crystal display is being driven. C [6:0]: Reads the contrast setting values (CT[6:0])

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2008/11/14 63 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

3. Start Oscillation (R00h):

The start oscillation instruction restarts the oscillator from the halt state in the standby mode. After issuing these instruction, wait at least 10 ms for oscillation to stabilize before issuing the next instruction. (See the Standby Mode section.) If this register is read forcibly, “7553”H is read.

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 W 1 * * * * * * * * * * * * * * * 1

R00 R 1 0 1 1 1 0 1 0 1 0 0 1 0 0 0 1 1

Start Oscillation Instruction

4. Driver Output Control (R01h):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R01 W 1 * * * * * * CMS SGS * * * NL4 NL3 NL2 NL1 NL0

Driver Output Control Instruction

CMS: Selects the output shift direction of a common driver. When CMS = 0, COM1 shifts to COM162. When CMS = 1, COM162 shifts to COM1. SGS: Selects the output shift direction of the segment driver. When SGS = 0, data are output SEG1 to SEG396. When SGS = 1, data are output SEG396 to SEG1. Re-write to the RAM when intending to change the SGS bit. NL[4:0]: Specify the LCD drive duty ratio. The duty ratio can be adjusted for every eight raster-rows. DDRAM address mapping does not depend on the setting value of the drive duty ratio.

Table16. NL Bits and Drive Duty

Common Driver Used NL4 NL3 NL2 NL1 NL0

Display Size (Dots)

LCD Drive Duty CMS=”0” CMS=”1”

0 0 0 0 0 396 x 8 1/8 COM1 – COM8 COM162 – COM155

0 0 0 0 1 396 x 16 1/16 COM1 - COM16 COM162 – COM147

0 0 0 1 0 396 x 24 1/24 COM1 - COM24 COM162 – COM139

0 0 0 1 1 396 x 32 1/32 COM1 - COM32 COM162 – COM101

0 0 1 0 0 396 x 40 1/40 COM1 – COM40 COM162 – COM123

0 0 1 0 1 396 x 48 1/48 COM1 - COM48 COM162 – COM115

0 0 1 1 0 396 x 56 1/56 COM1 – COM56 COM162 – COM107

0 0 1 1 1 396 x 64 1/64 COM1 – COM64 COM162 – COM99

0 1 0 0 0 396 x 72 1/72 COM1 - COM72 COM162 – COM91

0 1 0 0 1 396 x 80 1/80 COM1 – COM80 COM162 – COM83

0 1 0 1 0 396 x 88 1/88 COM1 - COM88 COM162 – COM75

0 1 0 1 1 396 x 96 1/96 COM1 – COM96 COM162 – COM67

0 1 1 0 0 396 x 104 1/104 COM1- COM104 COM162 – COM59

0 1 1 0 1 396 x 112 1/112 COM1 - COM112 COM162 – COM51

0 1 1 1 0 396 x 120 1/120 COM1 - COM120 COM162 – COM43

0 1 1 1 1 396 x 128 1/128 COM1 - COM128 COM162 – COM35

1 0 0 0 0 396 x 136 1/136 COM1 - COM136 COM162 – COM27

1 0 0 0 1 396 x 144 1/144 COM1 - COM144 COM162 – COM19

1 0 0 1 0 396 x 152 1/152 COM1 - COM152 COM162 – COM11

1 0 0 1 1 396 x 160 1/160 COM1 - COM160 COM162 – COM3

1 0 1 0 0 396 x 162 1/162 COM1 - COM162 COM162 – COM1

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2008/11/14 64 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

5. LCD Driving Waveform Control (R02h):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R02 W 1 0 0 0 0 0 RST B/C EOR 0 0 NW5 NW4 NW3 NW2 NW1 NW0

LCD Drive Waveform Control Instruction

B/C: When B/C = 0, a B-pattern waveform is generated and alternates in every frame for the LCD drive.When B/C = 1, a C-pattern waveform is generated and alternates in each raster-row specified by bits EOR and NW[4:0] in the LCD-driving-waveform control register. For details, see the n-raster-row Reversed AC Drive section. EOR: When the C-pattern waveform is set (B/C = 1) and EOR = 1, the odd/even frame-select signals and the n-raster-row reversed signals are EORed for alternating drive. EOR is used when combining the set values of the number of the LCD drive duty ratio and the n raster-row does not alternate the LCD. For details, see the n-raster-row Reversed AC Drive section. RST: When RST = 1, software reset function is started. This function is the same as the hardware RESET pin. It takes a 10-clock cycle period. This bit is automatically cleared after reset function is completed. Therefore, before the 10-clock cycle other instructions cannot be issued. Do not set the RST bit during stand-by mode. NW[5:0]: Specify the number of raster-rows n that will alternate at the C-pattern waveform setting (B/C =1). NW [5:0] alternate for every set value + 1 raster-row, and the first to the 64th raster-rows can be selected.

6. Power Control 1 (R03h) & Power Control 2 (R0Ch)

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R03 W 1 BS3 BS2 BS1 BS0 BT3 BT2 BT1 BT0 0 DC2 DC1 DC0 AP1 AP0 SLP STB

R0C W 1 0 0 0 0 0 0 TC1 TC0 0 0 0 RV0 0 VC2 VC1 VC0

Power Control Instructions

STB: When STB = 1, the NT7553E enters the standby mode, where display operation completely stops, the COM driver signal and SEG driver signal are at the VSS level, halting all the internal operations including the internal oscillator and no external clock pulses are supplied. During the stand by mode the DDRAM data is not cleared, but the DDRAM data can’t be read and written through the MPU interface. Only the following instructions can be executed during the standby mode.

a. Standby mode cancel (STB = “0”) b. Start oscillation

SLP: When SLP = 1, the NT7553E enters the sleep mode, where the internal display operations are halted except for the oscillator, thus reducing current consumption. Only the following instructions can be executed during sleep mode. Power control (BS [2:0], BT [3:0], DC [2:0], AP [1:0], SLP, STB). During sleep mode, the other DDRAM data and instructions cannot be updated although they are retained.

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2008/11/14 65 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

BS[3:0]: The LCD drive bias value is set. The LCD drive bias value can be selected according to its drive duty ratio and voltage. Determine the LCD drive bias according to its display duty, and select combination of boosting ratio of the step-up circuit 2 and bias amplifier ratio so as not to exceed voltage control of VCI2 and VCH. See the LCD Voltage Generation Circuit regarding how to determine the LCD drive bias, VCH voltage and contrast adjustment for the following settings.

Table 17-1. Display bias setting

LCD bias

Booster ratio of

the set-up circuit2 (ND2)

BS3 BS2 BS1 BS0 Bias ratio

(NB) VCI2

≤ (Vout-0.5)

Recommended value of the (VCH-VCL ≤

36V)

Total booster ratio

(VCH =N x VM)

1/2 x 2 0 0 0 0 0.75 1.50 x VM VCI2 x 2 3 x VM

x 2 0 1 0 0 1.25 2.50 x VM VCI2 x 2 5 x VM 1/4

x 3 0 0 0 1 0.875 1.75 x VM VCI2 x 3 5.25 x VM

x 2 1 0 1 1 1.75 3.50 x VM VCI2 x 2 7 x VM

x 3 0 0 1 1 1.165 2.33 x VM VCI2 x 3 6.99 x VM 1/6

x 4 0 0 0 1 0.875 1.75 x VM VCI2 x 4 7 x VM

x 3 1 0 0 0 1.50 3.00 x VM VCI2 x 3 9 x VM 1/8

x 4 0 0 1 0 1.125 2.25 x VM VCI2 x 4 9 x VM

x 3 1 0 1 0 1.675 3.35 x VM VCI2 x 3 10.05 x VM 1/9

x 4 0 1 0 0 1.25 2.50 x VM VCI2 x 4 10 x VM

x 3 1 1 0 0 1.825 3.65 x VM VCI2 x 3 10.95 x VM 1/10

x 4 0 1 1 0 1.375 2.75 x VM VCI2 x 4 11 x VM

x 3 1 1 0 1 2.00 4.00 x VM VCI2 x 3 12 x VM 1/11

x 4 1 0 0 0 1.50 3.00 x VM VCI2 x 4 12 x VM

x 3 1 1 1 0 2.165 4.33 x VM VCI2 x 3 12.99 x VM 1/12

x 4 1 0 0 1 1.625 3.25 x VM VCI2 x 4 13 x VM

x 3 1 1 1 1 2.335 4.67 x VM VCI2 x 3 14.01 x VM 1/13

x 4 1 0 1 1 1.75 3.50 x VM VCI2 x 4 14 x VM

Table 17-2. Display bias setting

BS3 BS2 BS1 BS0 VCI2 ≤ (Vout-0.5)

0 0 0 0 1.50 x VM

0 0 0 1 1.75 x VM

0 0 1 0 2.25 x VM

0 0 1 1 2.33 x VM

0 1 0 0 2.50 x VM

0 1 0 1 2.60 x VM

0 1 1 0 2.75 x VM

0 1 1 1 2.80 x VM

1 0 0 0 3.00 x VM

1 0 0 1 3.25 x VM

1 0 1 0 3.35 x VM

1 0 1 1 3.50 x VM

1 1 0 0 3.65 x VM

1 1 0 1 4.00 x VM

1 1 1 0 4.33 x VM

1 1 1 1 4.67 x VM

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AP [1:0]: The amount of fixed current from the fixed current source in the operational amplifier for the LCD is adjusted. When the amount of fixed current is large, the LCD driving ability and the display quality becomes high, but the current consumption is increased. Adjust the fixed current considering the display quality and the current consumption. During no display, when AP [1:0] = “00”, the current consumption can be reduced by ending the operational amplifier and step-up circuit operation.

Table 18. AP Bits and Amount of Fixed Current

AP1 AP0 Amount of Fixed Current in the Operational

Amplifier

0 0 Operational amplifier does not operate.

0 1 Small

1 0 Middle

1 1 Large

DC [2:0]: The operating frequency in the step-up circuit is selected. When the step-up operating frequency is high, the driving ability of the step-up circuit becomes high, but the current consumption is increased. Adjust the frequency considering the step-up ability and the current consumption.

Table 19. DC Bits and Operating Clock Frequency

DC2 DC1 DC0 Operating clock frequency in

the booster 1

Operating clock frequency in the voltage inverting circuit and

the booster 2

0 0 0 32-divided clock 32-divided clock

0 0 1 64-divided clock 32-divided clock

0 1 0 32-divided clock 64-divided clock

0 1 1 64-divided clock 64-divided clock

1 0 0 32-divided clock 96-divided clock

1 0 1 64-divided clock 96-divided clock

1 1 0 32-divided clock 128-divided clock

1 1 1 64-divided clock 128-divided clock

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BT [2:0]: The output factor of step-up circuit is switched. The LCD drive voltage level can be selected according to its drive duty ratio and bias. Lower amplification of the step-up circuit consumes less current.

Table 20. BT[2:0] Bits and Output Level

BT2 BT1 BT0 VOUT output of the booster 1

(Use VOUT within the range of 4.5 to 5.5V.)

VCH output of the booster 2 (Set VCH-VCL lower than 36v)

0 0 0 2 x VCI1 2 x VCI2

0 0 1 3 x VCI1 2 x VCI2

0 1 0 2 x VCI1 3 x VCI2

0 1 1 3 x VCI1 3 x VCI2

1 0 0 2 x VCI1 4 x VCI2

1 0 1 3 x VCI1 4 x VCI2

Notes: Set the factor of the booster 2 according to voltage of VCI2 and VCH. When the factor is set low, current consumption can be lowered.

VC [2:0]: Set an adjustment factor for the VCI1 voltage (VC [2:0]).

Table 21. Display bias setting table

VC2 VC1 VC0 VCI1 control range

0 0 0 0.92 x VDD

0 0 1 0.87 x VDD

0 1 0 0.83 x VDD

0 1 1 0.80 x VDD

1 0 0 0.76 x VDD

1 0 1 0.73 x VDD

1 1 0 0.68 x VDD

1 1 1 VCI1 control amplifier suspends.

(VCI1 can be supplied externally.)

The VSH voltage should be controlled to be less than supply voltage or device proof voltage level since VCH voltage level is generated by bias amplifier ratio corresponding to LCD driving bias value and boosting the ratio of the step-up circuit 2.

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BT3: Operation/halt of voltage inverting circuit is set. BT3=”0”: voltage-inverting circuit is halted. BT3=”1”: voltage-inverting circuit is operated. See the Power-on/off Sequence section to be activated.

Table 22. BT3 Bit and Operation of Voltage Inverting Circuit

BT3 VCL output of the voltage inverting circuit

(Set VCH-VCL lower than 36v)

0 Halt boosting

1 Output voltage between VCH and VM by

inverting

The VSH voltage should be controlled to be less than supply voltage or device proof voltage level since VCH voltage level is generated by bias amplifier ratio corresponding to LCD driving bias value and boosting ratio of the step-up circuit 2.

RV0: This bit set the reference voltage generation circuit. .

Table 23. RV0 Bits and reference Voltage

RV0 VREFL voltage

0 VREFL can be supplied externally.

1 2.2V (Fuse adjust)

TC [1:0]: These bits can select the average temperature compensation coefficients.

The four sets of temperature compensation coefficients can be selected as follows:

Table 24. Temperature compensation table

TC[1:0] Temperature Compensation Coefficient (at 25°C)

00 -0.05%/°C

01 -0.10%/°C

10 -0.15%/°C

11 -0.20%/°C

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2008/11/14 69 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

7. Contrast Control (R04h)

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R04 W 1 0 0 0 0 0 VR2 VR1 VR0 0 CT6 CT5 CT4 CT3 CT2 CT1 CT0

Contrast Control Instruction

CT [6:0]: These bits control the LCD drive voltage to adjust 128-step contrast.

Table 25. CT Bits and Contrast Control

CT6 CT5 CT4 CT3 CT2 CT1 CT0 Contrast

0 0 0 0 0 0 0 1.016R (Minimum)

0 0 0 0 0 0 1 1.008R

0 0 0 0 0 1 0 1.000R

0 0 0 0 0 1 1 0.992R

0 0 0 0 1 0 0 0.984R

……

..

……

..

……

..

……

..

……

..

……

..

……

..

……

..

1 1 1 1 1 1 0 0.008R

1 1 1 1 1 1 1 0.000R (Maximum)

VR [2:0]: These bits amplify 1.1 to 3.4 times the VREFL as output voltage VREFM of LCD drive reference voltage generation circuit. The VREFM should be smaller than VOUT level.

Table 26. VR Bits and VREFM Voltage

VR2 VR1 VR0 VREFM voltage

0 0 0 1.1 x VREFL

0 0 1 1.3 x VREFL

0 1 0 1.4 x VREFL

0 1 1 1.5 x VREFL

1 0 0 1.7 x VREFL

1 0 1 1.8 x VREFL

1 1 0 3.4 x VREFL

1 1 1 2.6 x VREFL

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8. Entry Mode (R05h) and Compare Register (R06h):

The write data sent from the microcomputer is modified in the NT7553E and written to the DDRAM. The display data in the DDRAM can be quickly rewritten to reduce the load of the microcomputer software processing. For details, see the Graphics Operation Function section.

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R05 W 1 0 0 0 0 0 0 HWM 0 0 0 I/D1 I/D0 AM LG2 LG1 LG0

R06 W 1 CP15CP14CP13CP12CP11 CP10 CP9 CP8 CP7 CP6 CP5 CP4 CP3 CP2 CP1 CP0

Compare Register Instruction

HWM: When HWM=1, data can be written to the DDRAM at high speed. In high-speed write mode, Write to RAM four times, otherwise the four words cannot be written to the DDRAM. Thus, set the lower 2 bits to 0 when setting the RAM address. For details, see the High-Speed RAM Write Mode section. I/D [1:0]: When I/D[1:0] = “1”, the address counter (AC) is automatically incremented by 1 after the data is written to the DDRAM. When I/D [1:0] = “0”, the AC is automatically decremented by 1 after the data is written to the DDRAM. The increment/decrement setting of the address counter by I/D[1:0] is done independently for the upper (AD[15:8]) and lower (AD[7:0]) addresses. The AM bit sets the direction of moving through the addresses when the DDRAM is written. AM: Set the automatic update method of the AC after the data is written to the DDRAM. When AM= “0”, the data is continuously written in horizontally. When AM = “1”, the data is continuously written vertically. When window address range is specified, the DDRAM in the window address range can be written according to the I/D [1:0] and AM settings.

I/D[1:0]="00"

Horizontal: decrement Vertical: decrement

I/D[1:0]="01" Horizontal: increment Vertical: decrement

I/D[1:0]="10" Horizontal: decrement

Vertical: increment

I/D[1:0]="11" Horizontal: increment

Vertical: increment

AM = 0

Horizontal

00h, …………. , 83h

00h 01h : : : A0h A1h

00h, …………. , 83h

00h 01h : : : A0h A1h

00h, …………. , 83h

00h 01h : : : A0h A1h

00h, …………. , 83h

00h 01h : : : A0h A1h

AM = 1

Vertical

00h, …………. , 83h

00h 01h : : : A0h A1h

00h, …………. , 83h

00h 01h : : : A0h A1h

00h, …………. , 83h

00h 01h : : : A0h A1h

00h, …………. , 83h

00h 01h : : : A0h A1h

Note: When a window address range has been set, the DDRAM can only be written to within that range.

Figure 46. Address Direction Settings

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LG [2:0]: Compare the data read from the DDRAM by the microcomputer with the compare registers (CP [15:0]) by a compare/logical operation and writes the results to DDRAM. For details, see the Logical/Compare Operation Function in page 28 for details. CP [15:0]: Set the compare register for the compare operation with the data read from the DDRAM or written by the microcomputer.

0 0 0 1 1 1 0 0 1 1 1 0 0 0 1 1

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Logic operation (with compare register)

LG[2:0] = 110: Replacement of matched write data

DDRAM

Write data mask (WM[15:0])

Write data sent from

the MCU (D15 - 0)

Logical/compare

(LG[2:0])

Write data mask*

(WM[15:0])

Note: The write data mask (WM[15:0]) is set by the register in the RAM Write Data Mask section.

LG[2:0] = 111: Replacement of unmatched write data

operation

Figure 47. Logical/Compare Operations for the DDRAM

9. Display Control (R07h):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R07 W 1 DIP

1 DIP

0 0 0 0

VLE2

VLE1

SPT 0 0 0 0 B/W REV D1 D0

Display Control Instruction

VLE [2:1]: When VLE1 = 1, a vertical scroll is performed in the 1st screen. When VLE2 = “1”, a vertical scroll is performed in the 2nd screen. Vertical scrolling on the two screens can be independently controlled. SPT: When SPT = 1, the 2-division LCD drive is performed. For details, see the Screen-division Driving Function section. B/W: When B/W = “1”, displayed data can be “all on” or “all off” regardless DDRAM contents. (B/W = “1”, REV = “0”: all dot on, B/W = “1”, REV = “1”: all dot off) When B/W = “1”, grayscale palette has to be default value. REV: Displays all character and graphics display sections with reversal when REV = 1.Since the grayscale level can be reversed, display of the same data is enabled on normally white and normally black panels.

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D [1:0]: Display is on when D1 = “1” and off when D1 = 0. When off, the display data remains in the DDRAM, and can be displayed instantly by setting D1 = “1”. When D1 is “0”, the display is off with all of the SEG/COM pin outputs set to the VSS level. Because of this, the NT7553E can control the charging current for the LCD with AC driving. When D [1:0] = “01”, the internal display of the NT7553E is performed although the display is off. When D [1:0] = “00”, the internal display operation halts and the display is off.

Table 27. D Bits and Operation

D1 D0 SEG/COM Output Internal Display Operation

0 0 VSS Halt

0 1 VSS Operate

1 0 All off display Operate

1 1 Display Operate

Notes: 1. Writing from the microcomputer to the DDRAM is independent from the state of D [1:0].

2. In the sleep and standby modes, D [1:0] = 00. However, the register contents of D [1:0] are not modified.

DIP [1:0]: Sets the DIP [1:0] = 11 to improve the display quality by controlling the rising time and falling time of the internal LCD output waveform. When DIP [1:0] = 00 disable this function.

10. Frame Cycle Control (R0Bh):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R0B W 1 0 CLK

2 CLK

1 CLK

0 0 0

DIV1

DIV0

0 0 0 0 RTN

3 RTN

2 RTN

1 RTN

0

Frame Cycle Control Instruction

RTN[3:0]: Set the line retrace period (RTN[3:0]) to be added to raster-row cycles. The raster-row cycle becomes long according to the number of clocks set at RTN [3:0].

Table 28. RTN Bits and Clock Cycles

RTN3 RTN2 RTN1 RTN0 Line retrace period

(Clock Cycles) Clock Cycles per one raster-row

0 0 0 0 0 clock 26 clock

0 0 0 1 1 clock 27 clock

0 0 1 0 2 clock 28 clock

1 1 1 0 14 clock 40 clock

1 1 1 1 15 clock 41 clock

DIV [1:0]: Set the division ratio of clocks for internal operation (DIV [1:0]). Internal operations are driven by clocks, which are frequency divided according to the DIV [1:0] setting. Frame frequency can be adjusted along with the line retrace period (RTN [3:0]). When changing the drive-duty, adjust the frame frequency. For details, see the Frame Frequency Adjustment Function section.

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Table 29. DIV Bits and Clock Frequency

DIV1 DIV0 Division ratio Internal Operation Clock Frequency

0 0 1 fosc/1

0 1 2 fosc/2

1 0 4 fosc/4

1 1 8 fosc/8

Formula for the frame frequency: Frame frequency = fosc / (Clock cycles per raster-row x division ratio x 1/duty cycle) [Hz] fosc: oscillation frequency Duty: Drive duty (NL bit) Division ratio: DI V bit Clock cycles per raster-row: (RTN+26) clock

CLK [2:0]: Set the oscillation frequency clocks for operation (CLK [2:0]).

Table 30. CLK Bits and Clock oscillation Frequency

CLK2 CLK1 CLK0 Internal Operation Clock Frequency

0 0 0 R-C start oscillation

0 0 1 210kHz

0 1 0 250kHz

0 1 1 280kHz (Recommend)

1 0 0 310kHz

1 0 1 330kHz

1 1 0 360kHz

1 1 1 380kHz

NT7553

internal

oscillator

CLK[2:0]=000

RC start

oscillator

CLK [2:0]=001~111

FOSC

OSCOOSCI

NT7553E

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11. Multi- Time Calibration Setting and Programming

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R0D W 1 0 0 0 0 0 0 0 MTPT 0 0 0 MT4 MT3 MT2 MT1 MT0

W 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PG R0E

R 1 0 0 0 0 0 0 0 0 PG PM2 PM1 MP4 MP3 MP2 MP1 MP0

Multi- Time Calibration Setting and Programming Instruction

MT [4:0]: This command sets the offset value of contrast

Table 31. The Setting of the offset value of contrast

MT[4:0] Offset Value MT[4:0] Offset Value MT[4:0] Offset Value MT[4:0] Offset Value

00000 Original 01000 +8 step 10000 Original 11000 -8 step

00001 +1 step 01001 +9 step 10001 -15 step 11001 -7 step

00010 +2 step 01010 +10 step 10010 -14 step 11010 -6 step

00011 +3 step 01011 +11step 10011 -13 step 11011 -5 step

00100 +4 step 01100 +12 step 10100 -12 step 11100 -4 step

00101 +5 step 01101 +13 step 10101 -11 step 11101 -3 step

00110 +6 step 01110 +14 step 10110 -10 step 11110 -2 step

00111 +7 step 01111 +15 step 10111 - 9 step 11111 -1 step

PG: When PG = 1, start to program LCD driver with MTP offset value. MP [4:0]: It can read the programmed data with this register.

AD

DE

R

MTP1 calibration

5bit offset MP1[4:0]

MTP2 calibration

MUX

CalibratedContrast Control

Value

Contrast ControlRegister1 (CT[6:0])

5

5

PM1 PM2

7

5

7

MTPT(MTP TEST MODE CONTROL)

5

MUX

5MT[4:0]

Setting of the offset

5bit offset MP2[4:0]

MP[4:0] if PM1=1,PM2=0; MP[4:0]=MTP1[4:0]

if PM1=1,PM2=1; MP[4:0]=MTP2[4:0]

MTPT PM bits MP[4:0] Calibrated Contrast Control Value [6:0]

0 MTP 2 is not programmed CT[6:0] (if PM1 = 0) PM2

1 MTP 2 is programmed MP2[4:0] + CT[6:0]

0 MTP 1 is not programmed CT[6:0]

0 (Default)

PM1 1 MTP 1 is programmed MP1[4:0] + CT[6:0]

0 PM2

1

0 1

PM1 1

Don't care; the programmed data of MTP will be bypass.

MT[4:0] + CT[6:0]

Table 32. The Setting of the PM1, PM2 and MTPT

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12. Vertical Scroll Control (R11h):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R11 W 1 VL2

7 VL2

6 VL2

5 VL2

4 VL2

3 VL2

2 VL2

1 VL2

0 VL1

7 VL1

6 VL1

5 VL1

4 VL1

3 VL1

2 VL1

1 VL1

0

Vertical Scroll Control Instruction

VL1 [7:0]: Specify the display-start raster-row at the 1st screen display for vertical smooth scrolling. Any raster-row from the first to 162th can be selected. After the 162th raster-row is displayed, the display restarts from the first raster-row. The display-start raster-row (VL1 [7:0]) is valid only when VLE1 = “1”. The raster-row display is fixed when VLE1 = “0”. (VLE1 is the 1st -screen vertical-scroll enable bit.) VL2 [7:0]: Specify the display-start raster-row at the 2nd screen display. The display-start raster-row (VL2 [7:0]) is valid only when VLE2 = “1”. The raster-row display is fixed when VLE2 = “0”. (VLE2 is the 1st -screen vertical-scroll enable bit.)

Table 33. VL Bits and Display Start Line Control

VL27

VL17

VL26

VL16

VL25

VL15

VL24

VL14

VL23

VL13

VL22

VL12

VL21

VL11

VL20

VL10 Display start line

0 0 0 0 0 0 0 0 1st

raster - row

0 0 0 0 0 0 0 1 2nd

raster - row

0 0 0 0 0 0 1 0 3rd

raster - row

1 0 1 0 0 0 0 0 161th

raster - row

1 0 1 0 0 0 0 1 162th

raster - row

Note: Do not set over the 162th ("A1"H) raster - row

13. 1st Screen Driving Position (R14h) and 2nd Screen Driving Position (R15h):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R14 W 1 SE1

7 SE1

6 SE1

5 SE1

4 SE1

3 SE1

2 SE1

1 SE1

0 SS1

7 SS1

6 SS1

5 SS1

4 SS1

3 SS1

2 SS1

1 SS1

0

R15 W 1 SE2

7 SE2

6 SE2

5 SE2

4 SE2

3 SE2

2 SE2

1 SE2

0 SS2

7 SS2

6 SS2

5 SS2

4 SS2

3 SS2

2 SS2

1 SS2

0

Screen Driving Position Instructions

SS1 [7:0]: Specify the driving start position for the first screen in a line unit. The LCD driving starts from the 'set value+1' common driver. SE1 [7:0]: Specify the driving end position for the first screen in a line unit. The LCD driving is performed to the 'set value +1 ' common driver. For instance, when SS1 [7:0] = “07”h and SE1 [7:0] = “10”h are set, the LCD driving is performed from COM8 to COM17, and non-selection driving is performed from COM1 to COM7, COM18 and others. Ensure that SS1[7:0] ≦ SE1[7:0] ≦ “A1”h.

For details, see the Screen-division Driving Function section. SS2 [7:0]: Specify the driving start position for the second screen in a line unit. The LCD driving starts from the 'set value+1' common driver. The second screen is driven when SPT = “1”. SE2 [7:0]: Specify the driving end position for the second screen in a line unit. The LCD driving is performed to the 'set value+1' common driver. For instance, when SPT = “1”, SS2 [7:0] = “20”H, and SE2 [7:0] = “4F”h are set, the LCD driving is performed from COM33 to COM80. Ensure that SS1 [7:0] ≤ SE1 [7:0] ≤ SS2 [7:0] ≤ SE2 [7:0] ≤ DUTYSET ≤ “A1”h. For details, see the Screen-division Driving Function section.

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14. Horizontal RAM Address Position (R16h) and Vertical RAM Address Position (R17h):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R16 W 1 HEA

7 HEA

6 HEA

5 HEA

4 HEA

3 HEA

2 HEA

1 HEA

0 HSA

7 HSA

6 HSA

5 HSA

4 HSA

3 HSA

2 HSA

1 HSA

0

R17 W 1 VEA

7 VEA

6 VEA

5 VEA

4 VEA

3 VEA

2 VEA

1 VEA

0 VSA

7 VSA

6 VSA

5 VSA

4 VSA

3 VSA

2 VSA

1 VSA

0

Horizontal/Vertical RAM Address Position Instruction

HSA [7:0]/HEA [7:0]: Specify the horizontal start/end positions of a window for access in memory. Data can be written to the DDRAM from the address specified by HEA [7:0] from the address specified by HSA [7:0]. Note that an address must be set before RAM is written. Ensure “00”h ≤ HSA [7:0] ≤HEA [7:0] ≤ “83”h VSA [7:0]/VEA [7:0]: Specify the vertical start/end positions of a window for access in memory. Data can be written to the DDRAM from the address specified by VEA [7:0] from the address specified by VSA [7:0]. Note that an address must be set before RAM is written to. Ensure “00”h ≤ VSA [7:0] ≤ VEA [7:0] ≤ “A1”h.

Window

Address

HSA HEA

VSA

VEA

0000h

A183hDDRAM Address space

Window address setting range:

00h HSA7-0 HEA7-0 83h00h VSA7-0 VEA7-0 A1h

Figure 48. Window Address Setting Range

Notes: 1. Ensure that the window address area is within the DDRAM address space.

2. In high-speed write mode, data are written to DDRAM in four-words. Thus, dummy write operations should be inserted depending on the window address area. For details, see the High-Speed Burst RAM Write Function section.

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15. RAM Write Data Mask (R20h)

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R20 W 1 WM 15

WM 14

WM 13

WM 12

WM 11

WM 10

WM 9

WM 8

WM 7

WM 6

WM 5

WM 4

WM3

WM2

WM1

WM0

RAM Write Data Mask Instruction

WM [15:0]: In writing to the DDRAM, these bits mask writing in a bit unit. When WM15 = “1”, this bit masks the write data of D15 and does not write to the DDRAM. Similarly, the WM14 to 0 bits mask the write data of D14 to D0 in a bit unit.

16. RAM Address Set (R21h)

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R21 W 1 AD 15

AD 14

AD 13

AD 12

AD 11

AD 10

AD 9

AD 8

AD 7

AD 6

AD 5

AD 4

AD 3

AD 2

AD 1

AD 0

RAM Address Set Instruction

AD [15:0]: Initially set DDRAM addresses to the address counter (AC). Once the DDRAM data is written, the AC is automatically updated according to the AM and I/D bit settings. This allows consecutive access without resetting addresses. Once the DDRAM data is read, the AC is not automatically updated. DDRAM address setting is not allowed in the standby mode. Ensure that the address is set within the specified window address.

Table 34. DDRAM Address Range

AD15 to AD0 DDRAM Setting

"0000"h to “0083"h Bitmap data for COM1

"0100"h to "0183"h Bitmap data for COM2

"0200”h to "0283"h Bitmap data for COM3

"0300"h to "0383"h Bitmap data for COM4

"9E00"h to "9E83"h Bitmap data for COM159

"9F00"h to "9F83"h Bitmap data for COM160

"A000"h to "A083"h Bitmap data for COM161

"A100"h to "A183"h Bitmap data for COM162

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17. Write Data to DDRAM (R22h)

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R22 W 1 WD 15

WD 14

WD 13

WD 12

WD 11

WD 10

WD 9

WD 8

WD 7

WD 6

WD 5

WD 4

WD 3

WD 2

WD 1

WD 0

Write Data to DDRAM Instructions

WD [15:0]: Write 16-bit data to the DDRAM; this data calls each grayscale palette. After a write, the address is automatically updated according to the AM and I/D bit settings. During stand by mode, the DDRAM cannot be accessed.

DDRAM writes data during normal mode ( 16 bit mode )

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

WD 15

WD 14

WD 13

WD 12

WD 11

WD 10

WD 9

WD 8

WD 7

WD 6

WD 5

WD 4

WD 3

WD 2

WD 1

WD 0

P04 P03 P02 P01 P00 P14 P13 P12 P11 P10 0 P24 P23 P22 P21 P20

SEG(n) SEG(n+1) SEG(n+2)

* WD5 is dummy bit must fixed this bit to “0”

DDRAM writes data during normal mode ( 8 bit mode)

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

WD 15

WD 14

WD 13

WD 12

WD 11

WD 10

WD 9

WD 8

WD 7

WD 6

WD 5

WD 4

WD 3

WD 2

WD 1

WD 0

1st write SEG(n) SEG(n+1)

WD 15

WD 14

WD 13

WD 12

WD 11

WD 10

WD 9

WD 8

2nd write

SEG(n+1) 0 SEG(n+2)

Fixed these pins to VDD or VSS

* WD13 is dummy bit must fixed this bit to “0” while 2nd write cycle.

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2008/11/14 79 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

18. Read Data to DDRAM (R22h)

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R22 R 1 RD 15

RD 14

RD 13

RD 12

RD 11

RD 10

RD 9

RD 8

RD 7

RD 6

RD 5

RD 4

RD 3

RD 2

RD 1

RD 0

Read Data from DDRAM Instruction

RD [15:0]: Read 16-bit data from the DDRAM. When the data is read to the microcomputer, the first-word read immediately after the DDRAM address setting is latched from the DDRAM to the internal read-data latch. The data on the data bus (D[15:0]) becomes invalid and the second-word read is normal.

Figure 49. DDRAM Read Sequence

Set the I/D, AM, HAS / HSE, VSA / VEA

Dummy read (invalid data) DDRAM -> data latch

Address: N Set

Read (data of address N) Read-data latch -> D15-0

First word

Second word

Address M Set

Dummy read (invalid data) DDRAM -> data latch

First word

Read (data of address N) Read-data latch -> D15-0

Second word

i) Data read to the MCU

Set the I/D, AM, HAS / HSE, VSA / VEA

Dummy read (invalid data) CGRAM -> data latch

Address: N Set

Write (data of address N) D15-0 -> DDRAM

First word

Second word

Automatic address update: N+1

Dummy read (invalid data) DDRAM -> data latch

First word

Write (data of address N) D15-0 -> DDRAM

Second word

ii) Logic Operation process in NT7553E

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2008/11/14 80 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

19. Grayscale Palette Control (R30h to R3Fh):

No. RW A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

R30 W 1 0 0 PK 15

PK 14

PK 13

PK 12

PK 11

PK 10

0 0 PK 5

PK 4

PK 3

PK 2

PK 1

PK 0

R31 W 1 0 0 PK 35

PK 34

PK 33

PK 32

PK 31

PK 30

0 0 PK 25

PK 24

PK 23

PK 22

PK 21

PK 20

R32 W 1 0 0 PK 55

PK 54

PK 53

PK 52

PK 51

PK 50

0 0 PK 45

PK 44

PK 43

PK 42

PK 41

PK 40

R33 W 1 0 0 PK 75

PK 74

PK 73

PK 72

PK 71

PK 70

0 0 PK 65

PK 64

PK 63

PK 62

PK 61

PK 60

R34 W 1 0 0 PK 95

PK 94

PK 93

PK 92

PK 91

PK 90

0 0 PK 85

PK 84

PK 83

PK 82

PK 81

PK 80

R35 W 1 0 0 PK 115

PK 114

PK 113

PK 112

PK 111

PK 110

0 0 PK 105

PK 104

PK 103

PK 102

PK 101

PK 100

R36 W 1 0 0 PK 135

PK 134

PK 133

PK 132

PK 131

PK 130

0 0 PK 125

PK 124

PK 123

PK 122

PK 121

PK 120

R37 W 1 0 0 PK 155

PK 154

PK 153

PK 152

PK 151

PK 150

0 0 PK 145

PK 144

PK 143

PK 142

PK 141

PK 140

R38 W 1 0 0 PK 175

PK 174

PK 173

PK 172

PK 171

PK 170

0 0 PK 165

PK 164

PK 165

PK 162

PK 161

PK 160

R39 W 1 0 0 PK 195

PK 194

PK 193

PK 192

PK 191

PK 190

0 0 PK 185

PK 184

PK 183

PK 182

PK 181

PK 180

R3A W 1 0 0 PK 215

PK 214

PK 213

PK 212

PK 211

PK 210

0 0 PK 205

PK 204

PK 203

PK 202

PK 201

PK 200

R3B W 1 0 0 PK 235

PK 234

PK 233

PK 232

PK 231

PK 230

0 0 PK 225

PK 224

PK 223

PK 222

PK 221

PK 220

R3C W 1 0 0 PK 255

PK 254

PK 253

PK 252

PK 251

PK 250

0 0 PK 245

PK 244

PK 243

PK 242

PK 241

PK 240

R3D W 1 0 0 PK 275

PK 274

PK 273

PK 272

PK 271

PK 270

0 0 PK 265

PK 264

PK 263

PK 262

PK 261

PK 260

R3E W 1 0 0 PK 295

PK 294

PK 293

PK 292

PK 291

PK 290

0 0 PK 285

PK 284

PK 283

PK 282

PK 281

PK 280

R3F W 1 0 0 PK 315

PK 314

PK 313

PK 312

PK 311

PK 310

0 0 PK 305

PK 304

PK 303

PK 302

PK 301

PK 300

Table 35. Grayscale Palette Control Instruction

PK [31:0]: Specify the grayscale level for thirty-two palettes from the 52-grayscale levels. For details, see the Grayscale Palette and the Grayscale Palette Table sections.

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2008/11/14 81 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

General Command Table

Upper Code Lower Code

Reg.No.

Register Name

R/W A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Description Exe-

cution Cycle

IR Index 0 0 * * * * * * * * * ID6 ID5 ID4 ID3 ID2 ID1 ID0 Sets the index register value 0

SR Status read 1 0 L7 L6 L5 L4 L3 L2 L1 L0 0 C6 C5 C4 C3 C2 C1 C0 Reads the setting of N-line inversion L[7:0] and contrast setting C[6:0]

0

Start oscillation 0 1 * * * * * * * * * * * * * * * 1 Starts the oscillation mode 10 ms

R00 Device code read

1 1 0 1 1 1 0 1 0 1 0 0 1 0 0 0 1 1 Reads 7553h 0

R01 Driver output control

0 1 0 0 0 0 0 0 CMS SGS 0 0 0 NL4 NL3 NL2 NL1 NL0

Sets the common driver shift direction (CMS), segment driver shift direction (SGS), driving duty ratio (NL[4:0])

0

R02 LCD Drive-waveform control

0 1 0 0 0 0 0 RST B/C EOR 0 0 NW5 NW4 NW3 NW2 NW1 NW0

Sets the LCD drive AC waveform (B/C), EOR output (EOR), the number of N-line inversion (NW[4:0]) at C-type LCD driver, and software reset (RST).

0

R03 Power control 1 0 1 BS3 BS2 BS1 BS0 BT3 BT2 BT1 BT0 0 DC2 DC1 DC0 AP1 AP0 SLP STB

Sets the sleep mode (SLP), standby mode (STB), LCD power on (AP[1:0]), boosting cycle (DC[3:0]), boosting output multiplying factor (BT[2:0]), operation of voltage inverting circuit (BT3), and LCD driver bias value (BS[3:0]).

0

R04 Contrast control 0 1 0 0 0 0 0 VR2 VR1 VR0 0 CT6 CT5 CT4 CT3 CT2 CT1 CT0 Sets the regulator adjustment (VR[2:0]) and contrast adjustment (CT[6:0])

0

R05 Entry mode 0 1 0 0 0 0 0 0 HWM 0 0 0 I/D1 I/D0 AM LG2 LG1 LG0

Specifies the logical operation (LG[2:0]), AC counter mode (AM[1:0]), increment/ decrement mode (I/D[1:0]), high-speed write mode (HWM).

0

R06 Compare register

0 1 CP15 CP14 CP13 CP12 CP11 CP10 CP9 CP8 CP7 CP6 CP5 CP4 CP3 CP2 CP1 CP0 Specifies the compare register (CP[15:0]).

0

R07 Display control 0 1 DIP1 DIP0 0 0 0 VLE2 VLE1 SPT 0 0 0 0 B/W REV D1 D0

Control Specifies display on (D[1:0]), black-and-white reversed display (REV), all on/off (B/W), screen division (SPT), and vertical scroll (VLE[2:1])

0

R0B Frame frequency control

0 1 0 CLK2 CLK1 CLK0 0 0 DIV1 DIV0 0 0 0 0 RTN3RTN2RTN1RTN0Specifies the line retrace period (RTN[3:0]) and operating clock frequency division ratio (DIV[1:0])

0

R0C Power control 2 0 1 0 0 0 0 0 0 TC1 TC0 0 0 0 RV0 0 VC2 VC1 VC0 Sets the adjustment factor for the VCI voltage (VC[2:0])

0

R0D MTP setting 0 1 0 0 0 0 0 0 0 MTPT 0 0 0 MT4 MT3 MT2 MT1 MT0 This command set the offset value of contrast (MT[4:0])

0

R0E MTP programming

0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PG This command starts to program LCD driver with OTC offset value (PG)

2s

R11 Vertical scroll control

0 1 VL27 VL26 VL25 VL24 VL23 VL22 VL21 VL20 VL17 VL16 VL15 VL14 VL3 VL12 VL11 VL10 Sets the 1

st screen display start

line (VL[17:10]) and 2nd

screen display start line (VL[27:20]).

0

R14 1

st screen driving

position 0 1

SE 17

SE 16

SE 15

SE 14

SE 13

SE 12

SE 11

SE 10

SS 17

SS 16

SS 15

SS 14

SS 13

SS 12

SS 11

SS 10

Sets 1st screen start (SS1[7:0])

and end (SE1[7:0]). 0

R15 2

nd screen

driving position 0 1

SE 27

SE 26

SE 25

SE 24

SE 23

SE 22

SE 21

SE 20

SS 27

SS 26

SS 25

SS 24

SS 23

SS 22

SS 21

SS 20

Sets 2nd

screen start (SS2[7:0]) and end (SE2[7:0]).

0

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2008/11/14 82 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

General Command Table (Continued)

Upper Code Lower Code

Reg. No.

Register Name

R/W A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Description Exe-

cution Cycle

R16 Horizontal RAM address position

0 1 HEA

7

HEA

6

HEA

5

HEA

4

HEA

3

HEA

2

HEA

1

HEA

0

HSA

7

HSA

6

HSA

5

HSA

4

HSA

3

HSA

2

HSA

1

HSA

0

Sets start (HSA[7:0]) and end (HEA[7:0]) of the horizontal RAM address range.

0

R17 Vertical RAM

address position 0 1 VEA7VEA6VEA5VEA4VEA3VEA2VEA1VEA0VSA7VSA6VSA5VSA4VSA3VSA2VSA1VSA0

Sets start (VSA[7:0]) and end (VEA[7:0]) of the vertical RAM address range.

0

R20 RAM write data mask

0 1 WM 15

WM 14

WM 13

WM 12

WM 11

WM 10

WM 9

WM 8

WM 7

WM 6

WM 5

WM 4

WM 3

WM 2

WM 1

WM 0

Specifies write data mask (WM[15:0]) at RAM write

0

R21 RAM address set 0 1 AD[15:8] (upper) AD[7:0] (lower) Initially set the RAM address to the counter (AC)

0

RAM data write 0 1 Write data (upper) Write data (lower) Write data to the RAM 0 R22

RAM data read 1 1 Read data (upper) Read data (lower) Read data from the RAM 0

R30 Grayscale palette control 1

0 1 0 0 PK15 PK14 PK13 PK12 PK11 PK10 0 0 PK05 PK04 PK03 PK02 PK01 PK00 Specified the grayscale palette 1 0

R31 Grayscale palette control 2

0 1 0 0 PK35 PK34 PK33 PK32 PK31 PK30 0 0 PK25 PK24 PK23 PK22 PK21 PK20 Specified the grayscale palette 2 0

R32 Grayscale palette control 3

0 1 0 0 PK55 PK54 PK53 PK52 PK51 PK50 0 0 PK45 PK44 PK43 PK42 PK41 PK40 Specified the grayscale palette 3 0

R33 Grayscale palette control 4

0 1 0 0 PK75 PK74 PK73 PK72 PK71 PK70 0 0 PK65 PK64 PK63 PK62 PK61 PK60 Specified the grayscale palette 4 0

R34 Grayscale palette control 5

0 1 0 0 PK95 PK94 PK93 PK92 PK91 PK90 0 0 PK85 PK84 PK83 PK82 PK81 PK80 Specified the grayscale palette 5 0

R35 Grayscale palette control 6

0 1 0 0 PK

115

PK

114

PK

113

PK

112

PK

111

PK

110 0 0

PK

105

PK

104

PK

103

PK

102

PK

101

PK

100 Specified the grayscale palette 6 0

R36 Grayscale palette control 7

0 1 0 0 PK

135

PK

134

PK

133

PK

132

PK

131

PK

130 0 0

PK

125

PK

124

PK

123

PK

122

PK

121

PK

120 Specified the grayscale palette 7 0

R37 Grayscale palette control 8

0 1 0 0 PK

155

PK

154

PK

153

PK

152

PK

151

PK

150 0 0

PK

145

PK

144

PK

143

PK

142

PK

141

PK

140 Specified the grayscale palette 8 0

R38 Grayscale palette control 9

0 1 0 0 PK

175

PK

174

PK

173

PK

172

PK

171

PK

170 0 0

PK

165

PK

164

PK

163

PK

162

PK

161

PK

160 Specified the grayscale palette 9 0

R39 Grayscale palette control 10

0 1 0 0 PK

195

PK

194

PK

193

PK

192

PK

191

PK

190 0 0

PK

185

PK

184

PK

183

PK

182

PK

181

PK

180 Specified the grayscale palette 10 0

R3A Grayscale palette control 11

0 1 0 0 PK

215

PK

214

PK

213

PK

212

PK

211

PK

210 0 0

PK

205

PK

204

PK

203

PK

202

PK

201

PK

200 Specified the grayscale palette 11 0

R3B Grayscale palette control 12

0 1 0 0 PK

235

PK

234

PK

233

PK

232

PK

231

PK

230 0 0

PK

215

PK

214

PK

213

PK

212

PK

211

PK

210 Specified the grayscale palette 12 0

R3C Grayscale palette control 13

0 1 0 0 PK

255

PK

254

PK

253

PK

252

PK

251

PK

250 0 0

PK

245

PK

244

PK

243

PK

242

PK

241

PK

240 Specified the grayscale palette 13 0

R3D Grayscale palette control 14

0 1 0 0 PK

275

PK

274

PK

273

PK

272

PK

271

PK

270 0 0

PK

265

PK

264

PK

263

PK

262

PK

261

PK

260 Specified the grayscale palette 14 0

R3E Grayscale palette control 15

0 1 0 0 PK

295

PK

294

PK

293

PK

292

PK

291

PK

290 0 0

PK

285

PK

284

PK

283

PK

282

PK

281

PK

280 Specified the grayscale palette 15 0

R3F Grayscale palette control 16

0 1 0 0 PK

315

PK

314

PK

313

PK

312

PK

311

PK

310 0 0

PK

305

PK

304

PK

303

PK

302

PK

301

PK

300 Specified the grayscale palette 16 0

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2008/11/14 83 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Absolute Maximum Rating

DC Supply Voltage1 (VDD, VDD2)…………………………………………………………… -0.3V to +4.6V

DC Supply Voltage2 (VCI1) ………………………………………………………………… -0.3V to +4.6V

DC Supply Voltage3 (VCH - VCL) ………………………………………………………… -0.3V to +36.0V

DC Supply Voltage4 (VOUT) ………………………………………………………… -0.3V to +6.5V

Input Voltage …………………………………………………………………. -0.3V to VDD+0.3V

Operating Ambient Temperature ……………………………………………………………-40°C to +85°C

Storage Temperature …………………………………………………………………………-55°C to +110°C

*Comments

Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device under these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.

Electrical Characteristics

DC Characteristics

(VSS = 0V, VDD = 2.4 ~ 3.6V, VCH-VCL=8V to 36V, Ta = - 40 to 85°°°°C unless otherwise specified)

Symbol Parameter Min. Typ. Max. Unit Condition

VDD Operating Voltage 2.4 2.8 3.6 V

VDD2 Operating Voltage VDD - 3.6 V

VCC Operating Voltage 1.6 1.9 2.3 V For dual power supply mode

VDDR Operating Voltage 1.8 1.9 2.0 V For single power supply to VCC

IDD Dynamic Current Consumption 1

- 480 600 µA

VDD, VDD2 = 3.0V, VCH = 19.2V, VM = 1.6V, VCL = -16V, fosc = 280KHz (1/162duty), 1/11bias, CT = 0, AP = 01, display on, display

data = all on and no MPU access, Ta = 25°C, Boost1 = 2X, Boost2 = 4X, VCI1 = 0.92 x VDD, with oscillation. Step up cycle of step up circuit 2: 128 divided cycle

- 5 15 During standby mode, Ta = 25°C ISB

Standby Mode Current Consumption - - 50

µA During standby mode, Ta = 85°C

70 100 During standby mode, Ta = 25°C ISLP

Sleep Mode Current Consumption 150

µA During standby mode, Ta = 85°C

ILI Input Leakage Current -1.0 - 1.0 µA VIN = VDD or VSS (S/P, C86, S8/16, A0, R/W (RDB),E(WRB),CSB,RESB)

IHZ HZ Leakage Current -3.0 - 3.0 µA When the D0 - D15, are in high impedance

VIH High-level Input Voltage

0.80 x VDD

- VDD V A0, R/W (RDB),E(WRB),CSB,RESB, D0 - D15, OSCI, C86, S/P, S8/16

VIL Low-level Input Voltage VSS - 0.20 x VDD

V

VOH High-level Output Voltage

0.80 x VDD

- VDD V VDD = 2.4 ~ 3.6V, IOH = -0.1mA

(D0 - D15)

VOL Low -level Output Voltage

VSS - 0.20 x VDD

V VDD = 2.4 ~ 3.6V, IOL = 0.1mA

(D0 - D15)

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2008/11/14 84 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

DC Characteristics (Continued)

Symbol Parameter Min. Typ. Max. Unit Condition

fosc Oscillation Clock 266 280 294 kHz VDD = 3.0V,

TA = 25°C

fEXT External Oscillation Clock

151 275 640 kHz VDD2 = 2.4 ~ 3.6V

fDUTY External Oscillation Clock Duty

45 50 55 % VDD2 = 2.4 ~ 3.6V

trosc External Oscillation Rise Time

-- -- 0.2 µs VDD2= 2.4 ~ 3.6V

tfosc External Oscillation Fall Time

-- -- 0.2 µs VDD2 = 2.4 ~ 3.6V

RSEG LCD SEG Driver ON Resistance

- 0.35 3 KΩ Id = +/- 0.05mA, VSH = 3V

RCOM LCD COM Driver ON Resistance

- 0.9 3 KΩ Id = +/-0.05mA, VCH - VCL = 36V

VREF Internal Reference Voltage

2.15 2.2 2.25 V Ta = 25°C

VCI2 Boost Circuit2 Output Voltage

- - VOUT V

VREFL Input Voltage - - VDD V

VREFM Output Voltage - - VOUT-0.5

V

VOUT Step up circuit 1 5.25 5.48 - V

VDD = 3.0V,VCI factor=0.92,Step up

factor: two times,Step up cycle: 32 divided

cycle,Load current = 400uA

VCH Step up circuit 2 19.55 19.75 19.95 V

VDD = 3.0V,VOUT=5.5V,VREFL = 2.2V,VREFM = 1.5 x VREFL,Constant current of

operation amplifier: small Contrast adjustment value = 0.000R 1/11 bias,Step up cycle of step up circuit 2:

96 divided cycle,Step up factor: Four times

VM=1.65V, display on, display data = all on

VCL Step up circuit 3 -16.55 -16.45 -16.25 V

VDD = 3.0V,VOUT=5.5V,VREFL = 2.2V,VREFM= 1.5 x VREFL,Constant current of

operation amplifier: small Contrast adjustment value = 0.000R 1/11 bias,Step up cycle of polarity inversion

circuit: 96 divided cycle Step up factor: Four times VM=1.65V, display on, display data = all on

Note: Voltages VCH≥VSH≥VM≥VSS2≥VCL must always be satisfied.

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NT7553E

2008/11/14 85 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

AC Characteristics (TA = -40°°°°C ~ +85°°°°C, unless otherwise noted)

1. System Buses Read/Write Characteristics (for 8080 Series MPU)

(VDD = VCC = 1.6 ~ 2.3V, TA = -40 ~ 85°C) (Dual power supply mode)

D0 to D15

(Write)

D0 to D15(Read)

CSB

tCYCR

RDB

A0

WRB

tDHR

tAS t AH

tCSLW tCSHW

t r

tDHWtDSW

t f

t DSR

Valid Data

Valid Data

tCSLR tCSHR

tCYCW

Figure 50. 80-system Bus Timing

Symbol Parameter Min. Typ. Max. Unit Condition

tas Address setup time 10 - - ns

tAH Address hold time 5 - - ns

600 - - Normal Mode (HWM = 0) tCYCW Write system cycle time

200 - - ns

High-Speed Write (HWM = 1)

tCYCR Read system cycle time 800 ns

tCSLW Write control L pulse width 90 - - ns

300 Normal Mode (HWM = 0) tCSHW Write control H pulse width

90 - - ns

High-Speed Write (HWM = 1)

tCSLR Read control L pulse width 350 - - ns

tCSHR Read control H pulse width 400 - - ns

tr / tf Rise time / Fall time - - 25 ns

tDSW Write data setup time 60 - - ns

tDHW Write data hold time 15 - - ns

tDSR Read data setup time - - 200 ns CL = 50pF

tDHR Read data hold time 5 - - ns CL = 50pF

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2008/11/14 86 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

2. System Buses Read/Write Characteristics (for 8080 Series MPU)

(VDD = 2.4 ~ 3.6V, VCC = VDDR =1.9+0.1V, TA = -40 ~ 85°C) (Single power supply mode)

D0 to D15

(Write)

D0 to D15(Read)

CSB

tCYCR

RDB

A0

WRB

tDHR

tAS t AH

tCSLW tCSHW

t r

tDHWtDSW

t f

t DSR

Valid Data

Valid Data

tCSLR tCSHR

tCYCW

Figure 51. 80-system Bus Timing

Symbol Parameter Min. Typ. Max. Unit Condition

tAS Address setup time 10 ns

tAH Address hold time 2 - - ns

200 - - Normal Mode (HWM = 0) tCYCW Write system cycle time

100 - - ns

High-Speed Write (HWM = 1)

tCYCR Read system cycle time 300 ns

tCSLW Write control L pulse width 40 - - ns

100 Normal Mode (HWM = 0) tCSHW Write control H pulse width

40 - - ns

High-Speed Write (HWM = 1)

tCSLR Read control L pulse width 150 - - ns

tCSHR Read control H pulse width 100 - - ns

tr / tf Rise time / Fall time - - 25 ns

tDSW Write data setup time 60 - - ns

tDHW Write data hold time 2 - - ns

tDSR Read data setup time - - 100 ns CL = 50pF

tDHR Read data hold time 5 - - ns CL = 50pF

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NT7553E

2008/11/14 87 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

3. System Buses Read/Write Characteristics (for 6800 Series MPU)

(VDD = VCC = 1.6 ~ 2.3V, TA = -40 ~ 85°C) (Dual power supply mode)

D0 to D15

(Write)

D0 to D15(Read)

CSB

tCYCR

A0

R/W

tDHR

tAS t AH

tCSLW tCSHW

tDHWtDSW

t DSR

Valid Data

Valid Data

tCSLR tCSHR

E t rt r

tCYCW

Figure 52. 68-system Bus Timing

Symbol Parameter Min. Typ. Max. Unit Condition

tas Address setup time 10 - - ns

tAH Address hold time 5 - - ns

600 - - Normal Mode (HWM = 0) tCYCW Write system cycle time

200 - - ns

High-Speed Write (HWM = 1)

tCYCR Read system cycle time 800 ns

tCSLW Write control L pulse width 90 - - ns

300 Normal Mode (HWM = 0) tCSHW Write control H pulse width

90 - - ns

High-Speed Write (HWM = 1)

tCSLR Read control L pulse width 350 - - ns

tCSHR Read control H pulse width 400 - - ns

tr / tf Rise time / Fall time - - 25 ns

tDSW Write data setup time 60 - - ns

tDHW Write data hold time 15 - - ns

tDSR Read data setup time - - 200 ns CL = 50pF

tDHR Read data hold time 5 - - ns CL = 50pF

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NT7553E

2008/11/14 88 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

4. System Buses Read/Write Characteristics (for 6800 Series MPU)

(VDD = 2.4 ~ 3.6V, VCC = VDDR = 1.9+0.1V, TA = -40 ~ 85°C) (Single power supply mode)

D0 to D15

(Write)

D0 to D15(Read)

CSB

tCYCR

A0

R/W

tDHR

tAS t AH

tCSLW tCSHW

tDHWtDSW

t DSR

Valid Data

Valid Data

tCSLR tCSHR

E t rt r

tCYCW

Figure 53. 68-system Bus Timing for

Symbol Parameter Min. Typ. Max. Unit Condition

tAS Address setup time 10 ns

tAH Address hold time 2 - - ns

200 - - Normal Mode (HWM = 0) tCYCW Write system cycle time

100 - - ns

High-Speed Write (HWM = 1)

tCYCR Read system cycle time 300 ns

tCSLW Write control L pulse width 40 - - ns

100 Normal Mode (HWM = 0) tCSHW Write control H pulse width

40 - - ns

High-Speed Write (HWM = 1)

tCSLR Read control L pulse width 150 - - ns

tCSHR Read control H pulse width 100 - - ns

tr / tf Rise time / Fall time - - 25 ns

tDSW Write data setup time 60 - - ns

tDHW Write data hold time 2 - - ns

tDSR Read data setup time - - 100 ns CL = 50pF

tDHR Read data hold time 5 - - ns CL = 50pF

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NT7553E

2008/11/14 89 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

5. Serial Interface

(VDD = VCC = 1.6 ~ 2.3V, TA = -40 ~ 85°C) (Dual power supply mode)

CSB

SCL

SDI(D0)

t CLKL

tCSH

tCYC

t f t r

tDSW tDHW

Input Data

tCLKH

SDO(D1) Output Data

tCSS

DHRttDSR

Figure 54. Clock Synchronized Serial Interface Timing

Symbol Parameter Min. Typ. Max. Unit Condition

tCYCW Serial write clock cycle 0.1 - - µs

tCYCR Serial read clock cycle 0.25 - - µs

tCLKHW Serial write clock H pulse 40 - - ns

tCLKLW Serial write clock L pulse 40 - - ns

tCLKHR Serial read clock H pulse 120 - - ns

tCLKLR Serial read clock L pulse 120 - - ns

tCSS Chip select setup time 20 - - ns

tCSH Chip select hold time 60 - - ns

tr / tf Rise time / Fall time - - 20 ns

tDSW Write data setup time 30 - - ns

tDHW Write data hold time 30 - - ns

tDSR Read data setup time - - 130 ns

tDHR Read data hold time 5 - - ns

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NT7553E

2008/11/14 90 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

6. Serial Interface

(VDD = 2.4 ~ 3.6V, VCC = VDDR = 1.9+0.1V, TA = -40 ~ 85°C) (Single power supply mode)

CSB

SCL

SDI(D0)

t CLKL

tCSH

tCYC

t f t r

tDSW tDHW

Input Data

tCLKH

SDO(D1) Output Data

tCSS

DHRttDSR

Figure 55. Clock Synchronized Serial Interface Timing

Symbol Parameter Min. Typ. Max. Unit Condition

tCYCW Serial write clock cycle 0.076 - - µs

tCYCR Serial read clock cycle 0.15 - - µs

tCLKHW Serial write clock H pulse

40 - - ns

tCLKLW Serial write clock L pulse

35 - - ns

tCLKHR Serial read clock H pulse

70 - - ns

tCLKLR Serial read clock L pulse 70 - - ns

tCSS Chip select setup time 20 - - ns

tCSH Chip select hold time 60 - - ns

tr / tf Rise time / Fall time - - 20 ns

tDSW Write data setup time 30 - - ns

tDHW Write data hold time 30 - - ns

tDSR Read data setup time - - 130 ns

tDHR Read data hold time 5 - - ns

NOTE: *1. All timing is specified using VIL and VIH as the reference. *2. tCSLW and tCSLR are specified as the overlap between CSB is “L” when WRB or RDB is at “L” level, or E is at

the “H” level.

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NT7553E

2008/11/14 91 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

7. Reset Timing

/RESB Internal Status

Figure 56. Reset Timing

(VDD = 1.6 ~ 3.6V, Ta = -40 ~ +85°C)

Symbol Parameter Min. Typ. Max. Unit Condition

tR Reset Time - - 10 ms

tRW Reset low pulse width 100 - - µs /RESB

During Reset

tR tRW

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NT7553E

2008/11/14 92 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Diagram

(0,0)

Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

1 DUMMY1 -7665 -525 34 C23+ -5355 -525 2 DUMMY2 -7595 -525 35 C23+ -5285 -525 3 DUMMY3 -7525 -525 36 C23+ -5215 -525 4 DUMMY4 -7455 -525 37 C23- -5145 -525 5 DUMMY5 -7385 -525 38 C23- -5075 -525 6 DUMMY6 -7315 -525 39 C23- -5005 -525 7 DUMMY7 -7245 -525 40 C23- -4935 -525 8 DUMMY8 -7175 -525 41 C22+ -4865 -525 9 DUMMY9 -7105 -525 42 C22+ -4795 -525

10 DUMMY10 -7035 -525 43 C22+ -4725 -525 11 DUMMY11 -6965 -525 44 C22+ -4655 -525 12 RESB1 -6895 -525 45 C22- -4585 -525 13 CEP -6825 -525 46 C22- -4515 -525 14 CEP -6755 -525 47 C22- -4445 -525 15 CEP -6685 -525 48 C22- -4375 -525 16 CEP -6615 -525 49 C21+ -4305 -525 17 CEP -6545 -525 50 C21+ -4235 -525 18 CEM -6475 -525 51 C21+ -4165 -525 19 CEM -6405 -525 52 C21+ -4095 -525 20 CEM -6335 -525 53 C21- -4025 -525 21 CEM -6265 -525 54 C21- -3955 -525 22 CEM -6195 -525 55 C21- -3885 -525 23 VCL -6125 -525 56 C21- -3815 -525 24 VCL -6055 -525 57 VCI2 -3745 -525 25 VCL -5985 -525 58 VCI2 -3675 -525 26 VCL -5915 -525 59 VCI2 -3605 -525 27 VCL -5845 -525 60 VCI2 -3535 -525 28 VCH -5775 -525 61 TEST1 -3465 -525 29 VCH -5705 -525 62 TEST1 -3395 -525 30 VCH -5635 -525 63 TEST2 -3325 -525 31 VCH -5565 -525 64 TEST2 -3255 -525 32 VCH -5495 -525 65 TEST3 -3185 -525 33 C23+ -5425 -525 66 TEST3 -3115 -525

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NT7553E

2008/11/14 93 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

67 D15 -3045 -525 108 D2 -175 -525 68 D15 -2975 -525 109 D1 -105 -525 69 D15 -2905 -525 110 D1 -35 -525 70 D14 -2835 -525 111 D1 35 -525 71 D14 -2765 -525 112 D0 105 -525 72 D14 -2695 -525 113 D0 175 -525 73 D13 -2625 -525 114 D0 245 -525 74 D13 -2555 -525 115 R/WB 315 -525 75 D13 -2485 -525 116 R/WB 385 -525 76 D12 -2415 -525 117 R/WB 455 -525 77 D12 -2345 -525 118 E 525 -525 78 D12 -2275 -525 119 E 595 -525 79 D11 -2205 -525 120 E 665 -525 80 D11 -2135 -525 121 A0 735 -525 81 D11 -2065 -525 122 A0 805 -525 82 D10 -1995 -525 123 A0 875 -525 83 D10 -1925 -525 124 CSB 945 -525 84 D10 -1855 -525 125 CSB 1015 -525 85 D9 -1785 -525 126 CSB 1085 -525 86 D9 -1715 -525 127 VDDR 1155 -525 87 D9 -1645 -525 128 VDDR 1225 -525 88 D8 -1575 -525 129 VDDR 1295 -525 89 D8 -1505 -525 130 VCC 1365 -525 90 D8 -1435 -525 131 VCC 1435 -525 91 D7 -1365 -525 132 VCC 1505 -525 92 D7 -1295 -525 133 VCC 1575 -525 93 D7 -1225 -525 134 VDD 1645 -525 94 D6 -1155 -525 135 VDD 1715 -525 95 D6 -1085 -525 136 VDD 1785 -525 96 D6 -1015 -525 137 VDD2 1855 -525 97 D5 -945 -525 138 VDD2 1925 -525 98 D5 -875 -525 139 VDD2 1995 -525 99 D5 -805 -525 140 VDD3 2065 -525

100 D4 -735 -525 141 VDD3 2135 -525 101 D4 -665 -525 142 VDD3 2205 -525 102 D4 -595 -525 143 VDD3 2275 -525 103 D3 -525 -525 144 VSS 2345 -525 104 D3 -455 -525 145 VSS 2415 -525 105 D3 -385 -525 146 VSS 2485 -525 106 D2 -315 -525 147 VSS2 2555 -525 107 D2 -245 -525 148 VSS2 2625 -525

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NT7553E

2008/11/14 94 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

149 VSS2 2695 -525 190 C12+ 5565 -525 150 VSS3 2765 -525 191 C12+ 5635 -525 151 VSS3 2835 -525 192 C12+ 5705 -525 152 VSS3 2905 -525 193 C12- 5775 -525 153 VSS3 2975 -525 194 C12- 5845 -525 154 RESB2 3045 -525 195 C12- 5915 -525 155 RESB2 3115 -525 196 C12- 5985 -525 156 OSCO 3185 -525 197 C11+ 6055 -525 157 OSCO 3255 -525 198 C11+ 6125 -525 158 OSCI 3325 -525 199 C11+ 6195 -525 159 OSCI 3395 -525 200 C11+ 6265 -525 160 VDD1 3465 -525 201 C11- 6335 -525 161 REGENB 3535 -525 202 C11- 6405 -525 162 REGENB 3605 -525 203 C11- 6475 -525 163 VSS1 3675 -525 204 C11- 6545 -525 164 S/P 3745 -525 205 VCI1 6615 -525 165 S/P 3815 -525 206 VCI1 6685 -525 166 VDD1 3885 -525 207 VCI1 6755 -525 167 C86 3955 -525 208 VCI1 6825 -525 168 C86 4025 -525 209 RESB3 6895 -525 169 VSS1 4095 -525 210 DUMMY12 6965 -525 170 S8/16 4165 -525 211 DUMMY13 7035 -525 171 S8/16 4235 -525 212 DUMMY14 7105 -525 172 VDD1 4305 -525 213 DUMMY15 7175 -525 173 VREFL 4375 -525 214 DUMMY16 7245 -525 174 VREFL 4445 -525 215 DUMMY17 7315 -525 175 VREFM 4515 -525 216 DUMMY18 7385 -525 176 VREFM 4585 -525 217 DUMMY19 7455 -525 177 VM 4655 -525 218 DUMMY20 7525 -525 178 VM 4725 -525 219 DUMMY21 7595 -525 179 VM 4795 -525 220 DUMMY22 7665 -525 180 VM 4865 -525 221 DUMMY23 7785 -536.5 181 VSH 4935 -525 222 COM2 7785 -496 182 VSH 5005 -525 223 COM4 7785 -465 183 VSH 5075 -525 224 COM6 7785 -434 184 VSH 5145 -525 225 COM8 7785 -403 185 VOUT 5215 -525 226 COM10 7785 -372 186 VOUT 5285 -525 227 COM12 7785 -341 187 VOUT 5355 -525 228 COM14 7785 -310 188 VOUT 5425 -525 229 COM16 7785 -279 189 C12+ 5495 -525 230 COM18 7785 -248

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NT7553E

2008/11/14 95 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

231 COM20 7785 -217 272 COM98 7176.5 515 232 COM22 7785 -186 273 COM100 7145.5 515 233 COM24 7785 -155 274 COM102 7114.5 515 234 COM26 7785 -124 275 COM104 7083.5 515 235 COM28 7785 -93 276 COM106 7052.5 515 236 COM30 7785 -62 277 COM108 7021.5 515 237 COM32 7785 -31 278 COM110 6990.5 515 238 COM34 7785 0 279 COM112 6959.5 515 239 COM36 7785 31 280 COM114 6928.5 515 240 COM38 7785 62 281 COM116 6897.5 515 241 COM40 7785 93 282 COM118 6866.5 515 242 COM42 7785 124 283 COM120 6835.5 515 243 COM44 7785 155 284 COM122 6804.5 515 244 COM46 7785 186 285 COM124 6773.5 515 245 COM48 7785 217 286 COM126 6742.5 515 246 COM50 7785 248 287 COM128 6711.5 515 247 COM52 7785 279 288 COM130 6680.5 515 248 COM54 7785 310 289 COM132 6649.5 515 249 COM56 7785 341 290 COM134 6618.5 515 250 COM58 7785 372 291 COM136 6587.5 515 251 COM60 7785 403 292 COM138 6556.5 515 252 COM62 7785 434 293 COM140 6525.5 515 253 COM64 7785 465 294 COM142 6494.5 515 254 COM66 7785 496 295 COM144 6463.5 515 255 DUMMY24 7785 536.5 296 COM146 6432.5 515 256 DUMMY25 7672.5 515 297 COM148 6401.5 515 257 COM68 7641.5 515 298 COM150 6370.5 515 258 COM70 7610.5 515 299 COM152 6339.5 515 259 COM72 7579.5 515 300 COM154 6308.5 515 260 COM74 7548.5 515 301 COM156 6277.5 515 261 COM76 7517.5 515 302 COM158 6246.5 515 262 COM78 7486.5 515 303 COM160 6215.5 515 263 COM80 7455.5 515 304 COM162 6184.5 515 264 COM82 7424.5 515 305 DUMMY26 6153.5 515 265 COM84 7393.5 515 306 SEG396 6122.5 515 266 COM86 7362.5 515 307 SEG395 6091.5 515 267 COM88 7331.5 515 308 SEG394 6060.5 515 268 COM90 7300.5 515 309 SEG393 6029.5 515 269 COM92 7269.5 515 310 SEG392 5998.5 515 270 COM94 7238.5 515 311 SEG391 5967.5 515 271 COM96 7207.5 515 312 SEG390 5936.5 515

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NT7553E

2008/11/14 96 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

313 SEG389 5905.5 515 354 SEG348 4634.5 515 314 SEG388 5874.5 515 355 SEG347 4603.5 515 315 SEG387 5843.5 515 356 SEG346 4572.5 515 316 SEG386 5812.5 515 357 SEG345 4541.5 515 317 SEG385 5781.5 515 358 SEG344 4510.5 515 318 SEG384 5750.5 515 359 SEG343 4479.5 515 319 SEG383 5719.5 515 360 SEG342 4448.5 515 320 SEG382 5688.5 515 361 SEG341 4417.5 515 321 SEG381 5657.5 515 362 SEG340 4386.5 515 322 SEG380 5626.5 515 363 SEG339 4355.5 515 323 SEG379 5595.5 515 364 SEG338 4324.5 515 324 SEG378 5564.5 515 365 SEG337 4293.5 515 325 SEG377 5533.5 515 366 SEG336 4262.5 515 326 SEG376 5502.5 515 367 SEG335 4231.5 515 327 SEG375 5471.5 515 368 SEG334 4200.5 515 328 SEG374 5440.5 515 369 SEG333 4169.5 515 329 SEG373 5409.5 515 370 SEG332 4138.5 515 330 SEG372 5378.5 515 371 SEG331 4107.5 515 331 SEG371 5347.5 515 372 SEG330 4076.5 515 332 SEG370 5316.5 515 373 SEG329 4045.5 515 333 SEG369 5285.5 515 374 SEG328 4014.5 515 334 SEG368 5254.5 515 375 SEG327 3983.5 515 335 SEG367 5223.5 515 376 SEG326 3952.5 515 336 SEG366 5192.5 515 377 SEG325 3921.5 515 337 SEG365 5161.5 515 378 SEG324 3890.5 515 338 SEG364 5130.5 515 379 SEG323 3859.5 515 339 SEG363 5099.5 515 380 SEG322 3828.5 515 340 SEG362 5068.5 515 381 SEG321 3797.5 515 341 SEG361 5037.5 515 382 SEG320 3766.5 515 342 SEG360 5006.5 515 383 SEG319 3735.5 515 343 SEG359 4975.5 515 384 SEG318 3704.5 515 344 SEG358 4944.5 515 385 SEG317 3673.5 515 345 SEG357 4913.5 515 386 SEG316 3642.5 515 346 SEG356 4882.5 515 387 SEG315 3611.5 515 347 SEG355 4851.5 515 388 SEG314 3580.5 515 348 SEG354 4820.5 515 389 SEG313 3549.5 515 349 SEG353 4789.5 515 390 SEG312 3518.5 515 350 SEG352 4758.5 515 391 SEG311 3487.5 515 351 SEG351 4727.5 515 392 SEG310 3456.5 515 352 SEG350 4696.5 515 393 SEG309 3425.5 515 353 SEG349 4665.5 515 394 SEG308 3394.5 515

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NT7553E

2008/11/14 97 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

395 SEG307 3363.5 515 436 SEG266 2092.5 515 396 SEG306 3332.5 515 437 SEG265 2061.5 515 397 SEG305 3301.5 515 438 SEG264 2030.5 515 398 SEG304 3270.5 515 439 SEG263 1999.5 515 399 SEG303 3239.5 515 440 SEG262 1968.5 515 400 SEG302 3208.5 515 441 SEG261 1937.5 515 401 SEG301 3177.5 515 442 SEG260 1906.5 515 402 SEG300 3146.5 515 443 SEG259 1875.5 515 403 SEG299 3115.5 515 444 SEG258 1844.5 515 404 SEG298 3084.5 515 445 SEG257 1813.5 515 405 SEG297 3053.5 515 446 SEG256 1782.5 515 406 SEG296 3022.5 515 447 SEG255 1751.5 515 407 SEG295 2991.5 515 448 SEG254 1720.5 515 408 SEG294 2960.5 515 449 SEG253 1689.5 515 409 SEG293 2929.5 515 450 SEG252 1658.5 515 410 SEG292 2898.5 515 451 SEG251 1627.5 515 411 SEG291 2867.5 515 452 SEG250 1596.5 515 412 SEG290 2836.5 515 453 SEG249 1565.5 515 413 SEG289 2805.5 515 454 SEG248 1534.5 515 414 SEG288 2774.5 515 455 SEG247 1503.5 515 415 SEG287 2743.5 515 456 SEG246 1472.5 515 416 SEG286 2712.5 515 457 SEG245 1441.5 515 417 SEG285 2681.5 515 458 SEG244 1410.5 515 418 SEG284 2650.5 515 459 SEG243 1379.5 515 419 SEG283 2619.5 515 460 SEG242 1348.5 515 420 SEG282 2588.5 515 461 SEG241 1317.5 515 421 SEG281 2557.5 515 462 SEG240 1286.5 515 422 SEG280 2526.5 515 463 SEG239 1255.5 515 423 SEG279 2495.5 515 464 SEG238 1224.5 515 424 SEG278 2464.5 515 465 SEG237 1193.5 515 425 SEG277 2433.5 515 466 SEG236 1162.5 515 426 SEG276 2402.5 515 467 SEG235 1131.5 515 427 SEG275 2371.5 515 468 SEG234 1100.5 515 428 SEG274 2340.5 515 469 SEG233 1069.5 515 429 SEG273 2309.5 515 470 SEG232 1038.5 515 430 SEG272 2278.5 515 471 SEG231 1007.5 515 431 SEG271 2247.5 515 472 SEG230 976.5 515 432 SEG270 2216.5 515 473 SEG229 945.5 515 433 SEG269 2185.5 515 474 SEG228 914.5 515 434 SEG268 2154.5 515 475 SEG227 883.5 515 435 SEG267 2123.5 515 476 SEG226 852.5 515

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NT7553E

2008/11/14 98 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

477 SEG225 821.5 515 519 SEG183 -480.5 515

478 SEG224 790.5 515 520 SEG182 -511.5 515

479 SEG223 759.5 515 521 SEG181 -542.5 515

480 SEG222 728.5 515 522 SEG180 -573.5 515

481 SEG221 697.5 515 523 SEG179 -604.5 515

482 SEG220 666.5 515 524 SEG178 -635.5 515

483 SEG219 635.5 515 525 SEG177 -666.5 515

484 SEG218 604.5 515 526 SEG176 -697.5 515

485 SEG217 573.5 515 527 SEG175 -728.5 515

486 SEG216 542.5 515 528 SEG174 -759.5 515

487 SEG215 511.5 515 529 SEG173 -790.5 515

488 SEG214 480.5 515 530 SEG172 -821.5 515

489 SEG213 449.5 515 531 SEG171 -852.5 515

490 SEG212 418.5 515 532 SEG170 -883.5 515

491 SEG211 387.5 515 533 SEG169 -914.5 515

492 SEG210 356.5 515 534 SEG168 -945.5 515

493 SEG209 325.5 515 535 SEG167 -976.5 515

494 SEG208 294.5 515 536 SEG166 -1007.5 515

495 SEG207 263.5 515 537 SEG165 -1038.5 515

496 SEG206 232.5 515 538 SEG164 -1069.5 515

497 SEG205 201.5 515 539 SEG163 -1100.5 515

498 SEG204 170.5 515 540 SEG162 -1131.5 515

499 SEG203 139.5 515 541 SEG161 -1162.5 515

500 SEG202 108.5 515 542 SEG160 -1193.5 515

501 SEG201 77.5 515 543 SEG159 -1224.5 515

502 SEG200 46.5 515 544 SEG158 -1255.5 515

503 SEG199 15.5 515 545 SEG157 -1286.5 515

504 SEG198 -15.5 515 546 SEG156 -1317.5 515

505 SEG197 -46.5 515 547 SEG155 -1348.5 515

506 SEG196 -77.5 515 548 SEG154 -1379.5 515

507 SEG195 -108.5 515 549 SEG153 -1410.5 515

508 SEG194 -139.5 515 550 SEG152 -1441.5 515

509 SEG193 -170.5 515 551 SEG151 -1472.5 515

510 SEG192 -201.5 515 552 SEG150 -1503.5 515

511 SEG191 -232.5 515 553 SEG149 -1534.5 515

512 SEG190 -263.5 515 554 SEG148 -1565.5 515

513 SEG189 -294.5 515 555 SEG147 -1596.5 515

514 SEG188 -325.5 515 556 SEG146 -1627.5 515

515 SEG187 -356.5 515 557 SEG145 -1658.5 515

516 SEG186 -387.5 515 558 SEG144 -1689.5 515

517 SEG185 -418.5 515 559 SEG143 -1720.5 515

518 SEG184 -449.5 515 560 SEG142 -1751.5 515

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NT7553E

2008/11/14 99 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

561 SEG141 -1782.5 515 602 SEG100 -3053.5 515

562 SEG140 -1813.5 515 603 SEG99 -3084.5 515

563 SEG139 -1844.5 515 604 SEG98 -3115.5 515

564 SEG138 -1875.5 515 605 SEG97 -3146.5 515

565 SEG137 -1906.5 515 606 SEG96 -3177.5 515

566 SEG136 -1937.5 515 607 SEG95 -3208.5 515

567 SEG135 -1968.5 515 608 SEG94 -3239.5 515

568 SEG134 -1999.5 515 609 SEG93 -3270.5 515

569 SEG133 -2030.5 515 610 SEG92 -3301.5 515

570 SEG132 -2061.5 515 611 SEG91 -3332.5 515

571 SEG131 -2092.5 515 612 SEG90 -3363.5 515

572 SEG130 -2123.5 515 613 SEG89 -3394.5 515

573 SEG129 -2154.5 515 614 SEG88 -3425.5 515

574 SEG128 -2185.5 515 615 SEG87 -3456.5 515

575 SEG127 -2216.5 515 616 SEG86 -3487.5 515

576 SEG126 -2247.5 515 617 SEG85 -3518.5 515

577 SEG125 -2278.5 515 618 SEG84 -3549.5 515

578 SEG124 -2309.5 515 619 SEG83 -3580.5 515

579 SEG123 -2340.5 515 620 SEG82 -3611.5 515

580 SEG122 -2371.5 515 621 SEG81 -3642.5 515

581 SEG121 -2402.5 515 622 SEG80 -3673.5 515

582 SEG120 -2433.5 515 623 SEG79 -3704.5 515

583 SEG119 -2464.5 515 624 SEG78 -3735.5 515

584 SEG118 -2495.5 515 625 SEG77 -3766.5 515

585 SEG117 -2526.5 515 626 SEG76 -3797.5 515

586 SEG116 -2557.5 515 627 SEG75 -3828.5 515

587 SEG115 -2588.5 515 628 SEG74 -3859.5 515

588 SEG114 -2619.5 515 629 SEG73 -3890.5 515

589 SEG113 -2650.5 515 630 SEG72 -3921.5 515

590 SEG112 -2681.5 515 631 SEG71 -3952.5 515

591 SEG111 -2712.5 515 632 SEG70 -3983.5 515

592 SEG110 -2743.5 515 633 SEG69 -4014.5 515

593 SEG109 -2774.5 515 634 SEG68 -4045.5 515

594 SEG108 -2805.5 515 635 SEG67 -4076.5 515

595 SEG107 -2836.5 515 636 SEG66 -4107.5 515

596 SEG106 -2867.5 515 637 SEG65 -4138.5 515

597 SEG105 -2898.5 515 638 SEG64 -4169.5 515

598 SEG104 -2929.5 515 639 SEG63 -4200.5 515

599 SEG103 -2960.5 515 640 SEG62 -4231.5 515

600 SEG102 -2991.5 515 641 SEG61 -4262.5 515

601 SEG101 -3022.5 515 642 SEG60 -4293.5 515

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NT7553E

2008/11/14 100 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

643 SEG59 -4324.5 515 685 SEG17 -5626.5 515

644 SEG58 -4355.5 515 686 SEG16 -5657.5 515

645 SEG57 -4386.5 515 687 SEG15 -5688.5 515

646 SEG56 -4417.5 515 688 SEG14 -5719.5 515

647 SEG55 -4448.5 515 689 SEG13 -5750.5 515

648 SEG54 -4479.5 515 690 SEG12 -5781.5 515

649 SEG53 -4510.5 515 691 SEG11 -5812.5 515

650 SEG52 -4541.5 515 692 SEG10 -5843.5 515

651 SEG51 -4572.5 515 693 SEG9 -5874.5 515

652 SEG50 -4603.5 515 694 SEG8 -5905.5 515

653 SEG49 -4634.5 515 695 SEG7 -5936.5 515

654 SEG48 -4665.5 515 696 SEG6 -5967.5 515

655 SEG47 -4696.5 515 697 SEG5 -5998.5 515

656 SEG46 -4727.5 515 698 SEG4 -6029.5 515

657 SEG45 -4758.5 515 699 SEG3 -6060.5 515

658 SEG44 -4789.5 515 700 SEG2 -6091.5 515

659 SEG43 -4820.5 515 701 SEG1 -6122.5 515

660 SEG42 -4851.5 515 702 DUMMY27 -6153.5 515

661 SEG41 -4882.5 515 703 COM161 -6184.5 515

662 SEG40 -4913.5 515 704 COM159 -6215.5 515

663 SEG39 -4944.5 515 705 COM157 -6246.5 515

664 SEG38 -4975.5 515 706 COM155 -6277.5 515

665 SEG37 -5006.5 515 707 COM153 -6308.5 515

666 SEG36 -5037.5 515 708 COM151 -6339.5 515

667 SEG35 -5068.5 515 709 COM149 -6370.5 515

668 SEG34 -5099.5 515 710 COM147 -6401.5 515

669 SEG33 -5130.5 515 711 COM145 -6432.5 515

670 SEG32 -5161.5 515 712 COM143 -6463.5 515

671 SEG31 -5192.5 515 713 COM141 -6494.5 515

672 SEG30 -5223.5 515 714 COM139 -6525.5 515

673 SEG29 -5254.5 515 715 COM137 -6556.5 515

674 SEG28 -5285.5 515 716 COM135 -6587.5 515

675 SEG27 -5316.5 515 717 COM133 -6618.5 515

676 SEG26 -5347.5 515 718 COM131 -6649.5 515

677 SEG25 -5378.5 515 719 COM129 -6680.5 515

678 SEG24 -5409.5 515 720 COM127 -6711.5 515

679 SEG23 -5440.5 515 721 COM125 -6742.5 515

680 SEG22 -5471.5 515 722 COM123 -6773.5 515

681 SEG21 -5502.5 515 723 COM121 -6804.5 515

682 SEG20 -5533.5 515 724 COM119 -6835.5 515

683 SEG19 -5564.5 515 725 COM117 -6866.5 515

684 SEG18 -5595.5 515 726 COM115 -6897.5 515

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NT7553E

2008/11/14 101 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Bonding Dimensions (Continued) Unit: µm

Pad No. Designation X Y Pad No. Designation X Y

727 COM113 -6928.5 515 768 COM35 -7785 31

728 COM111 -6959.5 515 769 COM33 -7785 0

729 COM109 -6990.5 515 770 COM31 -7785 -31

730 COM107 -7021.5 515 771 COM29 -7785 -62

731 COM105 -7052.5 515 772 COM27 -7785 -93

732 COM103 -7083.5 515 773 COM25 -7785 -124

733 COM101 -7114.5 515 774 COM23 -7785 -155

734 COM99 -7145.5 515 775 COM21 -7785 -186

735 COM97 -7176.5 515 776 COM19 -7785 -217

736 COM95 -7207.5 515 777 COM17 -7785 -248

737 COM93 -7238.5 515 778 COM15 -7785 -279

738 COM91 -7269.5 515 779 COM13 -7785 -310

739 COM89 -7300.5 515 780 COM11 -7785 -341

740 COM87 -7331.5 515 781 COM9 -7785 -372

741 COM85 -7362.5 515 782 COM7 -7785 -403

742 COM83 -7393.5 515 783 COM5 -7785 -434

743 COM81 -7424.5 515 784 COM3 -7785 -465

744 COM79 -7455.5 515 785 COM1 -7785 -496

745 COM77 -7486.5 515 786 DUMMY30 -7785 -536.5

746 COM75 -7517.5 515

747 COM73 -7548.5 515

748 COM71 -7579.5 515

749 COM69 -7610.5 515

750 COM67 -7641.5 515

751 DUMMY28 -7672.5 515

752 DUMMY29 -7785 536.5

753 COM65 -7785 496

754 COM63 -7785 465

755 COM61 -7785 434

756 COM59 -7785 403

757 COM57 -7785 372

758 COM55 -7785 341

759 COM53 -7785 310

760 COM51 -7785 279

761 COM49 -7785 248

762 COM47 -7785 217

763 COM45 -7785 186

764 COM43 -7785 155

765 COM41 -7785 124

766 COM39 -7785 93

767 COM37 -7785 62

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NT7553E

2008/11/14 102 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Alignment Mark Location (Total: 2) [Unit: µm]

No. Designation X Y

AL_L Alignment Mark (Button Left) -6672 -334

AL_R Alignment Mark (Button Right) 6672 -334

Alignment Mark (Button Left side and Button Right side)

Pad Dimensions

SIZE PAD NO.

X Y UNIT

Chip Size - 15830 1290 µm

Chip thickness - 525 µm

1~220 70 µm

221~222,254~255,752~753,785~786 40.5 µm Pad Pitch

222~254,256~751,753~785 31 µm

1~220 42 90 µm

221,255,752,786 38 110 µm Bump Size

222~254,256~751,753~785 19 110 µm

Bump Height All pads 15 ± 3 µm

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NT7553E

2008/11/14 103 Ver 3.0 With respect to the information represented in this in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantability, fitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any such information.

Ordering Information

Part No. Packages

NT7553H-BDT Gold Bump on Chip Tray

Cautions

1. The contents of this document will be subjected to change without notice. 2. Precautions against light projection:

Light has the effect of causing the electrons of semiconductor to move; so light projection may change the characteristics of semiconductor devices. For this reason, it is necessary to take account of effective protection measures for the packages (such as COB, COG, TCP and COF, etc.) causing chip to be exposed to a light environment in order to isolate the projection of light on any part of the chip, including top, bottom and the area around the chip. Observe the following instructions in using this product:

a. During the design stage, it is necessary to notice and confirm the light sensitivity and preventive measures for using IC on substrate (PCB, Glass or Film) or product.

b. Test and inspect the product under an environment free of light source penetration.

c. Confirm that all surfaces around the IC will not be exposed to light source.