Muon trigger upgrades, missing since not aimed towards DOE funding

PHENIX upgrades: view presented to DOE

R&D $3.5MConstruction $16.6M

Au-Au p-p 200 Si-Si ++ p-p 500 Au-Au

PHENIXD M Lee 6-17-2003

ID Task Name Duration

39 Endcap Assembly 715 days

40 Sensors 550 days

41 design ministrips layout 8 wks

42 procure prototype sensor 20 wks

43 test prototype sensor 8 wks

44 bump bond PHX 12 wks

45 test PHX sensor assembly 16 wks

46 procure sensors 20 wks

47 bump bond 20 wks

48 Ministrip electronics 440 days

49 develop specifications 12 wks

50 design PHX chip 28 wks

51 submit prototype PHX 14 wks

52 test prototype PHX 10 wks

53 redesign 4 wks

54 engineering run 8 wks

55 kapton cabling design 8 wks

56 procure kapton cable 12 wks

57 Mechanical-ladders 515 days

58 design ministrip ladder 8 wks

59 prototype ministrip ladder 12 wks

60 test ministrip ladder 4 wks

61 final ministrip ladder design 4 wks

62 procure ladders 20 wks

63 assemble ladders 20 wks

64 test ladders 20 wks

M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J2003 2004 2005 2006

PHENIXD M Lee 6-17-2003

ID Task Name Duration

1 Silicon Vertex Detector Upgrade 846 days?

2 Detector Assembly 65 days

3 Assemble Barrel 12 wks

4 Assemble Endcaps 12 wks

5 Mechanical Support Structure 611 days

6 design Barrel Support Structure 10 wks

7 prototype barrel structure 20 wks

8 procure barrel support structure 20 wks

9 design Endcap Support Structure 20 wks

10 procure endcap support structure 20 wks

11 Integration into magnet 30 wks

12 cooling system design 4 wks

13 Barrel Assembly 781 days?

14 Sensors 521 days

15 pixel sensors 50 wks

16 strip sensors 521 days

17 Pixel Electronics 400 days

18 define heat load 1 day

19 pixel bus 360 days

20 pixel hybrid 280 days

21 pixel system test 8 wks

22 Strip Electronics 1 day

23 define heat load 1 day

24 Mechanical-ladders 1 day?

27 Design pixel ladder 8 wks

28 prototype pixel ladder 12 wks

29 test pixel ladder 4 wks

30 final pixel ladder design 4 wks

31 procure ladder 8 wks

32 assemble ladder 40 wks

J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M2003 2004 2005 2006

PHENIXInstitutional Responsibilities

D M Lee 6-17-2003

task institution

mechanical support, cooling HYTEC/LANL

integration, infrastructure BNL

pixel hybrids, sensor/readout LANL

pixel pilot ISU

pixel assembly, ladder bus LANL

pixel fem SUNY-S/B

DCM’s Columbia

•Simulations Tasks endcap

• • Implementation of new geometry in PISA • Continual update of geometry with evolving mechanical design • Ministrip size determination -• Detailed simulation of pp capability • Detailed simulation of Au-Au capability • Vertex tracking code • Detailed track matching • Integration with barrel and HPD/TPC • Overall coordination -• •UNM, Doug Fields has expressed an interest in helping with the simulation and has a student. He hasn’t defined the level of effort yet. The simulations to date for the end caps have been done by Pat McGaughey and Dave Lee and the new geometry has been done by Hua Pei. Some interest in simulations has been expressed by Pat,Gerd, and Dave.• 

•Mechanical Tasks endcap and barrel• • Overall coordinaton Lee• Ladder prototyping cooling test HYTEC• Overall structure prototype HYTEC• Production liason Lee, HYTEC• Ladder assembly -• Combined endcap/barrel assembly - • Cooling system production • Integration with PHENIX/HBD/TPC - •

•Dave Lee has been working with a company, HYTEC, to do the mechanical design of the total support structure and cooling design for the barrel and endcap. They produced a conceptual design based on their work on ATLAS that covered ladder structures, cooling, and the combined barrel and endcap support. •

D M Lee 6-17-2003

•Sensor Tasks endcap• Overall coordination -• Ministrip Design • Prototyping -• Testing • Testing with bump bonded frontend chip • Bump bonding -• Production liason • 

•Electronics endcap• • Overall coordination Kunde?• Frontend ministrip chip design Kunde• Prototype Frontend chip fermilab• Testing frontend chip Kunde, fermilab• Production frontend chip Kunde, fermilab• Supporting chip design, pilot chip/chips • Test supporting chip • Slow control • HV design - • Readout cable design • Power plant • DCM liason to Chi • •Gerd Kunde has established a collaboration with Ray Yarema of FERMILAB to design the frontend chip to bump bond to the sensors. In addition all facilities at FERMILAB are available to us for Q/A, assembly testing, etc.• •Construction where ?• Coordinator • •Integration electrical and mechanical who?•

D M Lee 6-17-2003

FermiLab Electronics Cost Estimate

•Chip design/testing – 2 man-years - $275K (includes all overhead costs)•Prototype chip fabrication- $40K (small chip), or $80K (large chip)•Test board $5K•Engineering run (10-12 wafers) $200K•9 Extra wafers using same masks - $45K•Production wafer level testing –engineering, tech time, circuit board, probe card - $60K•Contingency??

PHENIXBeginning cost basis

D M Lee 6-17-2003

Fermilab Electronics Schedule Estimate

•Design specifications completed 10/03•Start design 12/03•Submit prototype 7/04•Prototype testing completed 12/04•Redesign completed for engineering run 1/05•Engineering run back 3/05

PHENIXD M Lee 6-17-2003

PHENIXD M Lee 6-17-2003

Physicist- mechanical liason, electronic liason, simulation – 3 FTE

Electronic Engineer – Fermilab – construction Budget – 2 FTE

Electronic Integration Engineer – construction Budget - 0.5 FTE

Tech – construction budget – 2 FTE

Lab space, Q/A,Assembly

Infrastructure – lab space, testing assembly, FNAL, HYTEC, LANL, BNL

InstitutionalsLANL, ISU,Columbia,UofCol,UNM,NMSU?,Ecole Poly?, Saclay?, SUNY-SB,

PHENIXLANL Manpower Estimate

D M Lee 6-17-2003

 

Construction Project 2 – EndCaps DOE (k$)

Mechanical support and cooling (2 endcaps) 195

Hybrid pixel layers (2 encaps) 4766

Management 100

Total 5061

Overhead on DOE contribution 1257

50% contingency 2458

Total 8849

 

PHENIXInitial endcap cost estimate

D M Lee 6-17-2003

Physicist Physics Analysis Silicon Upgrade

•Barnes 20 20•Brooks 75 25•Burward-Hoy 100•Kunde 40 40 •Lee 25 50•Leitch 100 •Liu 75 25•McGaughey 50 50•Moss 20•Silvermyr 100•Sullivan 40 vanHecke 50 50

PHENIXPhysicist Manpower Estimate

D M Lee 6-17-2003