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1 © 2012 Oclaro Inc. | Confidential and ProprietaryOPN-PRS-13035-0.0© 2012 Oclaro Inc. | Confidential and Proprietary

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Multichannel 1.3-um Lens-Integrated Surface-Emitting DFB Laser (LISEL) Arrays for High-speed Optical Interconnects at 100Gbps and beyond

September 2013Kiyo Hiramoto

Oclaro Japan Inc.Takashi Takemoto

Koichiro AdachiHitachi Ltd.,

Central Research Laboratory

ECOC 2013 WorkshopWS4 - Technologies for Short Reach Optical Interconnects

2 © 2012 Oclaro Inc. | Confidential and ProprietaryOPN-PRS-13035-0.0

ContentsBackground Market & ApplicationTrend for Inter‐connection inside systems

Multi‐channel LISEL array for Multi‐Tbps optical inter‐connectionTest Data at 25Gbps/chTest data at 40Gbps/ch

Demonstration results of Low power consumption 100Gbps CMOS micro‐transceiver Transmission Test DataVideo transmission demonstration Result

Summary


IP Traffic Growth, 2012-20171 ExaByte = 1018 Bytes = 100,000 Libraries of Congress

Exabytes of Traffic Per M

onth

IP traffic will grow 3‐fold from 2012 to 2017, a compound annual growth rate of 23%. IP traffic in 2017 will be equivalent to 362 billion DVDs per year, 30 billion DVDs per month, or 41 million DVDs per hour.

Source: Cisco Visual Networking Index, 2013


Network Architecture Ready for Higher Speeds

DSL

PON

Optical DWDM CoreUp to 80ch 40G

Optical DWDM CoreUp to 80ch 40G

BXC

ADM

10G Meshed 10G Aggregates to 40G

Cable

ADM

WirelessMedium

Business

Government

Access100M to 2.5G

40GbE & 100GbE Standard

Mobile BroadbandMobile Backhaul

Growing Traffic is spurring demand for higher speed

interfaces

WirelineAccess

MetroAccess

MetroCore

DWDMCore

1G/2.5G/10G 10G/40G/100G

21M 42M/100M+

1G/2.5G 1G/2.5G/10G

Data Centers Core Aggregation

10G 40G/100G 10G/40G 40G/100G/400G


100Gbps interface expansion

Core networking Larger front panel bandwidth >2Tbps front panel bandwidth in 2015

IEEE is defining next generation 100GbE specifications to realize >2Tbps front panel bandwidth under IEEE 802.3bm Study Group.

Data centers Lowe cost and small size 100GbE


Trend on data transmission inside systemsGrowing capacity on system

interface (>2Tbps)

Requirement for ≧ 20Gbps data rate/lane

Saturation on electrical I/F between LSIs and boards around 20Gbps

Requirement for Optical interconnection emerging

Backplane Board

Rack to rack

On board

Board to board

Server/Router


0 25 50 75 100 125 150Temperature (⁰C)

Bit

rate

(Gb/

s)0

10

20

30

40

50850nm VCSEL1060nm VCSE1310nm VCSE

Berlin(2008)

NEC(2009)

NEC(2008)

NEC(2007)

Berlin(2010)NEC

(2007)

Agilent(2003)

Corning(2006)

Ulm(2007)

Berlin(2009)

Agilent(2007)

EMCORE(2010)

Avago(2010)

Milano(2009)

Chalmers .(2009)

Berlin (2011)

Berlin(2011)

Berlin(2010)

Berlin (2011)

Berlin (2011)Berlin

(2012)

JDSU(2007)

EPFL(2009)

Berlin(2011)

Chalmers(2010)

Berlin (2012)

Technology Trend for Multi-Tbps Optical transmission• Commonly used 850-nm VCSEL has limit in speed and transmission length

– Modulation Speed Limit due to small active cavity– Transmission Limit due to modal noise– Tradeoff between speed and reliability

• Low cost 1310-nm solution is required for >100G connection– Proven higher speeds of >40G– Link range of >2km at 40G– SMF has been becoming not expensive even for Data Center application

1m 10m 100m 1km 10km 100km 1000km10cm

400G

100G

40G

10G

1550nmCoherentPSK

850nm VCSEL(N=1)

1310nm DFB(N=1)

1550nmEML (N=1)

Multi-Fiber(N x 10G

850nm VCSEL)

Multi-Wavelength(N x 1310nm LISEL

Cooled > 2km)

Multi-Fiber(N x 1310nm LISELUn-cooled < 2km)

Multi-Wavelength(N x 1310nm DFB)

1550nmCoherent

1550nmPSK

Modula-tion

Speed Limit

TransmissionLimit


Solution for Multi-Tbps optical interconnect 1310nm LISEL/LIPD technology

• Lens-Integrated Surface Emitting Laser (LISEL) developed by Hitachi Central Research Laboratory (CRL)– 1310nm DFB with surface emitting laser structure– High speed performance over 25Gb/s at high temperature – Low cost as VCSEL using on-wafer testing and burn-in – Easy to couple to single (mono-) and array fiber– Lens Integrated Surface Illuminated Photo-diode (LIPD) that is

compatible structure with LISEL

Fig. LISEL structure Fig. LIPD structure


Objectives

Minimize Component

Objectives and LISEL Approaches

VCSELLISEL

Low CostOptical Coupling

Low Cost Chip

Low PowerConsumption

High Speed

Transmission Coverage

Chip Reliability

Wafer Level testing and Burn-in

Narrow divergenceoutput

Speed per Chip at Wide Temperature

Trade-off withSpeed at >10G

<100m w/FEC @ 25G

Speed at High Temperature

Small Cavity

Wafer Level testingand Burn-in

Lens Integrated

High Speed per Chip at >40G

Established DFB

10m-10km @ 25G

Confirmed at 40GExpected at >40G

Short Cavity byposition of Mirror

Low Cost

Reliable

HighPerformanc

e

Limit


1310nm LISEL 25Gbps/ch operation• High speed operation of 25Gbps/ch achieved with short

cavity structure (<160 um)25Gbps x 4ch LISEL Array View Un-cooled 25Gbps Optical Waveforms

• Narrow far-field angle: 2o

• High speed:25Gbps• Flip-chip die bond

25Gbps

20 psIbias = 30 mA, Imod = 20 mA,

25ºC

Ibias = 60 mA, Imod = 30 mA,

85ºC

K. Adachi et al., CLEO2010, CME4 (2010)

K. Adachi et al., IPRM2011, We-7.2.1 (2011)


1310nm LISEL Output Beam Pattern• Ultra-narrow far field patterns (2.5º (cavity) and 1.9º (horizontal))

achieved with lens-integration for easy coupling with fibers.Cavity (vertical) Horizontal

2.5º 1.9º28.2º 29.0º

LISEL LISELEELD EELD

Angle (degree)-50 -30 -10 10 30 50

Angle (degree)-50 -30 -10 10 30 50

Inte

nsity

(a.u

.)

Inte

nsity

(a.u

.)

K. Shinoda et al., OECC2010,6D1-3(2010)


Ref: K. Adachi et al., IPC 2011, TuD3 (2011).

Measurement of SMF transmission

A part of this work was performed under management of the PETRA supported by NEDO.


High Speed Operation at 40G

ISLC2012


Lens Integrated Photodiode (LIPD)

A part of this work was performed under management of the PETRA supported by NEDO.


Optical connecter

Heat-sink

LGA socket

Compact size (914mm2) Surface mount with passive alignment enables low cost module. Use of lens-integrated optical devices reduces components and assembly costs in transceiver design.

PD arrayDFB-LD array

Multi-layer ceramic package

１２chparallelMMF

CMOSTransceiver

Chip（65nm CMOS）

Micro-transceiver with 25Gbps x 4ch Optical I/F

Courtesy of NEC


5.3

mm

10 6.25 Gb/s SerDes

Sta

ndar

d I/O

IF Logic

4 25 Gb/s

SerDes(RX)

4 25Gb/s

SerDes(TX)

LC-PLL

RX 4ch

#0 #1

#2 #3

TIA

TX 4ch

#0 #1 #2 #3

LDD

3.6 mm

Low power consumption 100Gbps CMOS Transceiver Chip Analog frontend IC + Optical component: 1000mW or 10mW/Gbps


Test configurationOptical Transceiver Optical Receiver

25-Gb/s Optical Waveform

25Gb/s

CICC’10

PRBS31

Electrical output waveform

MMF (4m)

PRBS31

6.25Gb/s LDD

TIA

Ele. I/F circuit Analog FE

PD

Opticalcomponent

Transceiver Chip

DFB-LD25

Gb/sIF

6.25 Gb/s

IF

IFlogic

Data 25Gb/sOptical

46.25Gb/s Electrical

Test results of CMOS Optical Transceiver


MMF

Wavelength1.3µmDFB

Laser14 ～

28Gb/sNRZ

Optical source

PPG LNDriver

LN Modulator

4 25-Gb/s Optical Receiver

PCB

Package

4ch PIN-PD

TIA chipOscillo-scope

BERT

425Gb/s PD array(1.3m)

Test set up for receiver sensitivity measurement

Optical source：1.3μm LNModulator PD responsivity：0.8 A/W


29-1 PRBS pattern, ER: 4.3dB High sensitivity –11.6dBm＠14Gb/s; –9.7dBm＠25Gb/s; –8.2dBm＠28Gb/sLow jitter65%＠25Gb/s; 51%＠28Gb/s

Time (UI)

Bit

erro

r rat

e

28 Gb/s 25 Gb/s

51%

65%

-3

Bit

erro

r rat

e

–14 –12 –10 –8 OMA (dBm)

28 Gb/s 25 Gb/s 14 Gb/s -4

-5

-6-7-8-9

-10-11-12

-4-5-6-7-8-9

-10-11-12

0 0.2 0.4 -0.2 -0.4

–7.6-dBmOMA

ISSCC’13

Test results of High sensitivity CMOS optical receiver


Electrical backplane

SWSWIFIF

IFIF

Courtesy of ALAXALA Networks

IF Board

SW Board

Opt.Ele.

100Gb/s CMOS Transceiver

Huge reduction in weight and # of cables Improved cooling efficiency due to wider

open space

Demonstration of router with optical backplane inter-connection

Optical backplane


20Gb/s x 1ch

HDMI board

HDMI boardReceiver board

FPGA

Transmitter board

FPGAMMF

(100 m)

Videosource

Display

Transmitter board Receiver board

MMF（100m）

Display

Demonstration of video transmission over 100m MMF


SummaryOptical interconnect is current urgent issue to connect chips on separate boards of next gen. routers and servers. 25Gb/s x 4‐lane micro transceiver with a signal format conversion to interface with switch or processor ASICs was demonstrated. Hybrid integration of surface accessible optical device arrays and one chip CMOS LSI on a common ceramic substrate was quite effective to build up the minimized 100Gb/s transceiver. The hybrid approach could be most practical way for electronics optics integration.

This work was partly supported by Photonics Electronics Technology Research Association (PETRA) and New Energy and Industrial Technology Development Organization (NEDO) in “Next-generation High-efficiency Network Device Project”

23 © 2012 Oclaro Inc. | Confidential and ProprietaryOPN-PRS-13035-0.023 © 2012 Oclaro Inc. | Confidential and Proprietary

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Multichannel 1.3-um Lens-Integrated Surface- Emitting DFB ... · Multichannel 1.3-um Lens-Integrated Surface-Emitting DFB Laser ... Arrays for High-speed Optical Interconnects at