July 2009

Agilent EEsof EDA Overview

New Capabilities in ADS 2011:

Multi-Technology Design Flow

Extending MMIC technology

description for easy and accurate

EM simulations of complex 3D

structures

MMIC Design

Symposium

Agilent EEsof EDA

Ingo Nickeleit,

Application Engineer

ingo_nickeleit@agilent.com

February 2012

http://www.agilent.com/find/eesof

Agenda – Complete MMIC/Module Design Flow

I) Multi-Technology

III) Foundry Updates

Integrated EM &

Package Design

II) Emerging 3D Technologies

Technology Foundry Scope

MMIC

(GaAs / GaN)

• Front-to-Back PDK creation

• DRC rule deck

• EM substrate

• MMIC tool bar

• Training

• Joint webinar and customer visit

RFIC

(SiGe/CMOS)

• Front-end PDK creation

• Momentum module support

• Increasing back-end support (for SiGe)

• GoldenGate qualification

• EM Qualification

Foundry Engagement – A Major Focus Area

www.agilent.com/find/eesof-foundries

ADS 2011: The IC/Module/Package/PCB Design Solution Realizing the Multi-Technology Vision

Multi-Technology Circuit Design

• Multiple die (IC and IPD)

• Multiple substrates (die, laminate, LTCC,

package, PCB)

• Multiple process design kits (PDKs)

– GaAs (HBT, pHEMT), GaN, SiGe, Si …

Integrated Electro-Magnetic Solvers

• Multi-Technology EM simulation

– Full 3D EM Simulation

• Finite Element Simulator

• Parameterized Solid Models of Components

• Multi-layer 3D Planar EM simulation

• Easy EM simulation for the every engineer Mounted on Board

Multiple ICs Multiple Technologies

On Laminate &

Packaged

Designing Across Multiple Technologies

Open Access1) Database

1) Si2 OpenEDA industry consortium www.si2.org

Views & Libraries – New safety features in ADS 2011

• OA provides inherent mechanisms to

prevent unintended access to designs

Views

• Each open view generates a locking

information

Libraries

• Accessing libraries has 3 modes

– Shared – other users can access and modify

cells simultaneously

– NonShared – only the current user has

exclusive access to this library

– Read-only – opens a library with read-only

access. Typical for PDKs

Cell & Views – Easily Manage Models & Design

Representations

• Cells represent a single design

object

• Cell Views provide multiple

representations of that design

object

– Different schematic variants,

behavioral, measured, layout,

EM data views, etc.

– User defined

• Simplifies schematics

• Easily select simulation model

• Explore design variants

Cell name

Views

Technology Setup – each library...

Has Technology – individual or inherits technology (from PDK

or other user). Technologies are effectively combined

Attached – points to one master technology

No Technology – for special artwork macros only (no

schematic layers!)

Multi Technology Setup Supports flip chips, wire bonding, and backside mounting

Nested Technology

Essential for multi technology

design

Permits instantiation of

components from another

library into layout

Library Configuration Editor

Mechanism for ADS where

to find supplemental

information

Provides essential

flexibility to organize

(PDK) data

Matches eesof_lib.cfg

contents

Multi-technology EM

Native Physical Multi-Substrate Support

• Easily add one or more pre-defined

substrates

– IC in a package, IC in a module, module on a

board, etc.

• Unlimited levels of technology stacking

– i.e. IC on a module on a PCB

• Supports flip chips, wire bonding, and

backside mounting

• No modification of layers required

• Directly modify any of the designs

– No flattening required

• Works with all the ADS tools

– Layout, 3D Visualization, Momentum and

FEM, etc.

Easy to combine multiple substrates

New graphical substrate editor

ADS Integrated 3D EM Flow Momentum & FEM in ADS, 3D EM Components & EMPro/FDTD link

EMPro Platform ADS Platform

FDTD Simulator FEM Simulator Momentum Simulator

Parameterized

3D EM

Components

Layout

CAD Data

Multi-Technology EM Simulation Capabilities & Vision

• Discover coupling effects prior to

fabrication

• More effectively optimize design elements

for final packaging

• More easily make design trade-offs

• Help diagnose and solve performance

problems

+ =

3D view FEM Momentum

+

Package IC IC

Multi-technology

EM Simulation

Multi Technology Design Example MMIC amp in a package and mounted on a Laminate

Mounting LO Amplifier onto a QFN package, wire bonded,

and mounted on a laminate board

Multi Technology Design Example

MMIC amp in a package and mounted on a Laminate

Mounting LO Amplifier onto a QFN package, wire bonded,

and mounted on a laminate board

Multi Technology Design Example Full module FEM analysis is essential

Case 1:

MMIC LO AMP

Circuit Level

Case 2:

MMIC LO AMP

Momentum 3D

Planar Simulation

+

Case 3:

Combining Two Separate

EM Simulation:

1. Momentum of MMIC Amp

2. FEM of Package, Bond

wires, and Laminate

Case 4:

FEM on the Whole Module

Momentum

FEM

FEM

Momentum

Circuit

Multi Technology Design Example Full module FEM analysis is essential

Cases: 1-6

MMIC

Black: Circuit Model

Red: Momentum

Pink: FEM

MMIC + Package

Light Blue

MMIC_Mom +Pkg_FEM

Dark Blue:

MMIC_FEM + Pkg_FEM

Green

Whole Module_FEM

EMPro

Multi Technology Design Example Full module FEM analysis is essential

Cases: 1-6

MMIC

Black: Circuit Model

Red: Momentum

Pink: FEM

MMIC + Package

Light Blue

MMIC_Mom +Pkg_FEM

Dark Blue:

MMIC_FEM + Pkg_FEM

Green

Whole Module_FEM

EMPro

Multi Technology Co-Design Example Anticipating packaging effects through co-design

Solid Traces Dashed Traces

Original Final

Improved RF Circuit Design and Simulation

Dynamic Simulation Model Selection

Design, by its nature, is evolutionary. Selecting model type and accuracy is key to this. This

makes it simple and virtually instantaneous.

• Easily select the model to use

for simulation

– Tradeoff speed vs. accuracy

• Works on one or more

selected components

• Current active model is shown

on the schematic

• Easily create a model priority

list to work on entire design

hierarchy

Control Model Selection Through Design Hierarchy

• User defined model priority policies

• Activate policy to specify which models

will be preferred

• Option to individually override

• Easy way to control model selection

for complex designs

– i.e. trade-off between speed and

accuracy

Example “fast” policy

Example “accurate” policy

Selecting which policy to use

Optimization Optimization Cockpit on a low-noise amp (LNA)

Spec lines

Pause optimization and edit algorithm or

goals and resume optimization

Optimized

component

values and

history

The error

contribution

on each

goal

Store

optimization

solutions

and recall

them at any

time

Tune

Major Improvements to Load Pull From load pull to design in a few clicks

• New load pull data controller

– Handles Maury load pull data

• Direct, instant loading of load pull data

– Handles multiple files

– Easier review of data

• Immediately simulate matching network

– Easier design optimization, including

improved discrete optimization

– Automatic interpolation of scattered

measurement data

• Automatically display performance

parameters

Fast, Easy, Intuitive

Data Display Improvements

• Improved Smith Chart graphics

– Better display of chart values

– Better overall look and data granularity

–

• Set color for a group of traces

– Easier interpretation of sweeps

• Improved Data Display Template Browser

– Real time quick search

– Direct editing of template properties

– Save As and Delete from the Browser

Improved Accuracy for Conductor Models New Multi-level Hemispherical Model

Available in Momentum and Circuit Simulation

Closer correlation to measured data Hammerstad

The original hemispherical model

Hemispherical

NEW Multi-level

2 4 6 8 10 12 14 16 180 20

-5

-4

-3

-2

-1

-6

0

freq, GHz

dB

(meas_2000m

il_ro

4350b..

S(2

,1))

dB

(yunhui_

bb4_hfc

orr

0..

S(2

,1))

dB

(S(2

,1))

dB

(yunhui_

bb4_hfc

orr

1_9..

S(2

,1))

SEM photograph of rough copper at

5000x magnification at a 30 degree angle.

Courtesy of Steven Hall et al. 2007

Measured Data

Agilent 5500

Atomic Force Microscope

• More accurately reflects conductor surface

• Can use AFM measurements to set params

MMIC Backend Design Process

MMIC Toolbar

Available in ADS 2011 with Enhanced PDKs)

Features

• MMIC Toolbar (Layout)

– Layout Editing

• Easy editing of transmission lines

• Automatic via insertion

• Compound metal layers

– Verification Tools

• Check Connectivity

• 3D Viewer

• DRC

• LVS

• Makes layout editing commands work with foundry-defined metal layers

• Provides easy access to a full suite of layout verification tools

• The MMIC Toolbar is available in all enhanced foundry PDKs

Select All, Deselect All

Select Area

Clear Highlighting

Redraw the Drawing Area

Convert Traces

Transmission Line Move

Split, Tap, and Stretch a

Transmission Line

Change Layer To

Reposition to Origin

Fast Grid Spacing

Toolbox

Check Design

Show Nodal Interconnect

Show Physical Interconnect

3D Viewer, DRC and LVS

Automatic Via Insertion

Example

• Insert M0 trace (blue) and click once to stop the insertion process.

• Click on the period key

to automatically insert

an M0-M1 Via

• Extend the M1 trace

(green) horizontally.

• Click once and bend up

for another vertical trace

• Click once and bend

right for another

horizontal green trace

• Click once to stop the

insertion process

Layout Usability: Object Handles

• Directly work on objects – quick &

efficient

• Objects with handles

– Arcs, Circles, Polylines, Polygons, Rectangles,

Text

– Transmission Lines, Paths, Wires, Traces,

Annotations, Wire Labels, Rulers, Dimension

Lines

• Infrastructure available for end user

customization

– Add handles to pdk components and design kits

– Customizable behavior

Desktop Design Rule Check (DRC)

Invoke DRC (from the pull down menu) Invoke DRC (from the tool bar)

Select Design Kit you are using

Rule file(s) automatically appear here

Desktop Design Rule Check (DRC) Results

These two Vias are

separated by < 60 um Auto Zoom and Auto Select Features

Provides X,Y coordinates

Layout Versus Schematic (LVS)

• Catch errors early by running ADS Desktop LVS from within ADS

schematic or layout

• Run Calibre LVS to check designs prior to submitting to the foundries

• Keep schematics and layouts in synch using “Design

Synchronization” Access ADS Desktop

LVS from the tool bar

Making EM Simulation

Part of Everyone’s Design Flow

New Graphical Layer Definition

• Graphical, unified entry of layer and stackup data

– Defines layers and properties for Layout, Momentum, and FEM

• Easy drag and drop operations

– Easily select and modify properties

• Simpler, faster, and less error prone

New Streamlined EM Setup Making EM Work for Everyone

• Single dialog replaces 8 – Easily navigate & review the setup options

• Same setup for Momentum, Momentum RF, & FEM

– Easy to try different solvers on the same design

• Setup is automatically saved and can be reused for other EM simulations

Previous EM Setup ADS 2011

What’s New in ADS2011.10 Bounding Area Layer

If we mount this Amp onto a package and

Laminate, its substrate will be bounded

when we perform FEM on the whole module

This is key enhancement towards paving the ground

to enable EM simulation on adjacent ICs with

different design kits

Example: PDN impedance

Freq sweep 0-3 GHz

Matrix size: 17.501

2005 2008 2010

solve

time

load

time

solve

time

load

time

load

time

2003

Release Load Solve Storage

2005A

2008U1

2011

dense (N2) direct (N3) dense (N2)

dense (N2) iterative (NpN2) dense (N2)

dense (N2) direct (NlogN)1.5 sparse (NlogN)

sparse (NlogN) direct (NlogN)1.5 sparse(NlogN)

2003A

Momentum Solver – 5 years of (R)evolution

* Performance will vary dependent on complexity, frequency and other factors

Preprocessor Mesher (2nd generation ) Solver

New Momentum 2nd Generation Mesher

• Increased accuracy, robustness and performance

– Fast floating-point interval arithmetic

• Improved mesh quality

– Avoids slivers

– Improved handling of small and wide shapes

– New algorithm for edge mesh and overlap extraction

• Reduced mesh complexity

– New quadrangles

rectangle

NEW

quadrilateral

triangle

OLD

NEW

Improved Causal substrate model in Momentum

Dielectric Loss Model

• Uses the causal Svensson / Djordjevic model

• Same technology as in ADS circuit simulator

Substrate Material editor

New Integrated EM Port Viewer/Editor

Features of new Port Editor

• Copy a value and paste to

multiple ports

• New filtering

– Quickly find ports by

attributes

– Filter on one or multiple

attributes

• Automatic port generation

• Automatic port re-sequencing

Auto

Multi-port Editor

Combined

Multi-port

Viewer & Editor

Single port Editor

Expanded Bondwire Support

• New, fast analysis of bondwires in Momentum

– Automatically modeled as part of Momentum

simulation

– Calculates self and mutual inductance

– FEM provides the most accurate analysis

• Bondwires work for both Momentum and FEM

– Easily create the bondwire in Layout

– Full parametric control of bondwire profile

• Jedec Bondwire – Follows the JEDEC

standard parameters

• Shape Bondwire – More flexible control of the

bondwire profile

• Bondwires now have edit handles

Set parameters

Create and edit in 2D

Render in 3D

Performance w/ & w/o package

Accurately predict real performance

QFN Designer Predict Packaged Performance in Minutes

Quickly synthesize complex package,

combine with IC & PCB data

Configure QFN package

Extending MMIC technology description for easy and

accurate EM simulations of complex 3D structures

II) Emerging 3D Technologies

EM Setup Configurations packaged with ADS PDK Making EM Work for Everyone

Makes it possible for non-experts to create accurate EM models

Big productivity improvement for all users

Easier to experiment with different setup options

Foundry

PDK

EM

Expert Design

Engineer

Designer’s

own setups

EM setup configuration bundles 3 things:

• Substrate stack technology specific, but

layout independent with validated settings

that give the best trade-off accuracy/speed

• Layout pre-processing utilities in support

of automatic creation of layer to support

complex 3D structures

• Default simulation options that get loaded

every time the EM setup window is

opened.

EM Derived Layers Design Example Creating an Air Bridge

• The Boolean operations are part of the technology definition

– Nothing else required for the end user

• User places a single shape to define the location of an air bridge

• User sends the design to Momentum/FEM

– Boolean operations are triggered

– The complex air bridge structure is automatically generated.

• Other examples

– Variable height vias

– Dielectric opening

– Complex capacitors

– Merge via arrays to single via

Metal signal path Desired airbridge locations

Auto-generated airbridges

New in ADS2011.10: Derived Layers

• A full complement of Boolean functions

– AND, DIFF, OR, Oversize, Undersize, etc.

• Layers are generated for EM only

– Can be viewed in 3D Viewer

– Can be used in combination with standard layers for EM simulation

• Simplifies substrate definition for complex structures

– Easier substrate definition by Foundries and EM specialists

• Simplifies the creation of structures for the designer end user

Add derived layer Define Boolean operation

Add derived layers to substrate definition

Defining derived layers

Air Bridge Example

M2 Line

AirBridge

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

Air Bridge Example (contd)

“AirBridge” Layer

Air Bridge Example (contd)

Air Bridge Example (contd)

For More Information

Agilent ADS 2011 Web page (new feature details)

www.agilent.com/find/eesof-ads2011

ADS 2011 on YouTube

www.youtube.com/user/AgilentEEsof

ADS 2011 Overview (Quick Start Video, Multi-technology Tutorials, …)

www.agilent.com/find/eesof-ads2011-overview

ADS 2011 Summary

• RF design has moved to complex ICs in multi-chip RF modules

• Today’s design flows are not able to address multiple technology design

• The IC, laminate, package, and PCB need to be designed together

• Electro-magnetic interactions between substrates need to be modeled

• ADS 2011 is the only EDA software able to address these multi-

technology design challenges

Agilent EEsof EDA

“Innovative Solutions,

Breakthrough Results”