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From Technologies to Markets
© 2019
From Technologies to Markets
© 2019
MRAM Technology and Business
2019
From Technologies to Market
Sample
22
Simone Bertolazzi, PhD
Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of the
Yole’s memory team and he contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and
fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging
semiconducting materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the
prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne
(Switzerland), where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics.
Simone earned a double M.A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Contact: [email protected]
Emilie Jolivet
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages
the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships
with semiconductor leaders and the development of market research and strategy consulting activities. With its previous collaborations at Freescale
and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software & computing.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated with an MBA
from IAE (Lyon, France).
Contact: [email protected]
ABOUT THE AUTHORS
Biographies & contacts
33
A*STAR, Advantest, Aeroflex, Antaios, Applied Materials, Avalanche, Canon, Capres-KLA, CEA
Leti, CNE, Crocus, CXMT, Cypress, Despatch, Dow, Evaderis, Evatec, Everspin, JHICC,
GlobalFoundries, H-Grace, HFC Semiconductor, Hikstor, Hitachi, Honeywell, HP, Hprobe,
Huawei, IBM, Imec, Infineon, Intermolecular, Inston, Intel, ITRI, Lam Research, Macronix,
Maxim, Materion, Mediatek, Merk, Microchip, Micron, MicroSense Mythic, Nantero, Nanya,
National Tsing Hua University, Nokia, Numen, NVE Corporation, NXP, OHT, Panasonic,
Qualcomm, Quantum, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Shanghai Ciyu,
SilTerra, Singulus, Smart Modular Technologies, SmartTip, SMIC, Sony, Spin Memory, Spintec,
STMicroelectronics, Stanford University, Synopsis, Syntiant, TDK, TEL, TEL Magnetic Solutions,
Teledyne e2v, Tezzaron, Tohoku University, Toshiba, Towerjazz, Tsinghua Unigroup , TSMC,
UMC, Veeco, Western Digital, Winbond, XFab, XMC, YMTC, and more
COMPANIES CITED IN THIS REPORT
©2019 | www.yole.fr | MRAM Technology and Business | Sample
4
Embedded memory (slow SRAM) – low-power memory for
ASICS/ASSP chips (e.G., Display drivers and edge-ai accelerators)
165
Embedded cache memory (SRAM, edram) – fast memory for
high-level caching in CPU and mobile processors
173
Long-term potential applications 180
MRAM supply chain and player dynamics 184
Supply chain analysis 188
MRAM players and activities 201
Mergers & acquisitions, partnerships and funding 219
China MRAM development 223
Technology description and trends 231
MRAM technologies 239
MRAM manufacturing 251
Next-generation magnetic memories (SOT- and VC-MRAM) 259
Summary and conclusions 264
Related reports 269
How should you use our data? 270
Yole Développement’s presentation 271
Introduction 7
Noteworthy MRAM news 2017-2019 19
Executive summary 25
Context - overview of the memory business 65
Stand-alone memory – NAND, DRAM, NOR, (NV)SRAM 72
Embedded memory – eflash, edram, SRAM 87
Emerging non-volatile memories – MRAM, PCM, RRAM, etc. 96
Overview of MRAM applications and market trends 107
Market forecast and financial analysis
Market forecast 2018-2024 (in $M, Gb and 12’’ eq. wafers with breakdown by
applications and technologies) for stand-alone and embedded MRAM
114
Stand-alone MRAM applications and market trends 124
Industrial, transportation and other (NVSRAM) 126
Enterprise storage – SSD caching and storage accelerators 134
Persistent memory (NVDIMM) 140
Embedded MRAM applications and market trends 148
Embedded storage (eflash) – code/data storage in mcus and other
ASICS/ASSP chips.
155
TABLE OF CONTENTS
55
REPORT METHODOLOGY
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
©2019 | www.yole.fr | MRAM Technology and Business | Sample
6©2019 | www.yole.fr | MRAM Technology and Business | Sample
After recognizing the growing importance of MRAM – particularly within the embedded space – Yole decided to publish the new report “MRAM
Technology and Business”, which provides a detailed overview of the latest MRAM technology developments together with a high-resolution
snapshot of the current state of the MRAM ecosystem
KEY FEATURES OF THIS REPORT - SCOPE
• Technology and MarketTrends
• (STT-)MRAM technology description, latestdevelopments, roadmaps and trends
• Market drivers, challenges & opportunities
• Market forecasts in M$, Gb and 12’’ eq. wafers
• Next-generation magnetic memories (e.g. SOT-andVC-MRAM) enabling new applications
• Supply chain and players analysis
• Mapping of the entire (STT-)MRAM supply chain
• Players’ activities at different levels of the supply chain
• Analysis of the ecosystem’s maturity, challenges, strengths
• Competitive landscape: players strategies and dynamics
The scope of the report is as follows:
Yours needs are
out of the report’
scope?
Contact us for a custom:
• Stand-Alone and Embedded Applications
• Stand-alone:
• Industrial, transportation, defense and other (<256 Mb).
• Enterprise storage, e.g. accelerators and SSD caching (≥256Mb)
• Persistent memory, e.g. (>1 Gb).
• Embedded:
• Code/data storage memory (e.g. eFlash replacement in MCUs),
• Working memory (Slow SRAM) for ASSPs/ASICs (e.g. AI edge accelerators)
• Cache memory (SRAM) in CPUs and mobile processors.
7©2019 | www.yole.fr | MRAM Technology and Business | Sample
KEY FEATURES OF THIS REPORT - OBJECTIVES
• Present an overview of the overall semiconductor memory market:
• Stand-alone memory (DRAM, NAND, NOR, (NV)SRAM): markets, forecast, and main trends
• Embedded memory (SRAM, eDRAM, eFlash) and emerging NVM businesses
• Provide an understanding of MRAM applications:
• Total addressable markets, market drivers & challenges, technology roadmaps, players, and main trends
• Offer market forecasts for stand-alone and embedded MRAM:
• 2018-2024 market forecast in units, Gb, US$/Gb, and number of equivalent 12’’ wafers
• Describe (STT-)MRAM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market
• Roadmap with technological nodes, and chip density evolution with main players
• Latest product development status for each key market player
• Detail and analyze the competitive landscape:
• Key players, by technologies and applications
• Recent acquisitions, partnerships and funding
• Latest company news
8
COMPARISON WITH THE “EMERGING NVM 2018” REPORT
• The “Emerging NVM 2018” report provides a systematic comparison among emerging memory technologies – particularly
phase-change memory (PCM), resistive RAM (RRAM) and magnetoresistive RAM (MRAM) – that could complement/replace the
industry workhorses NAND (non-volatile) and DRAM (volatile) in a number of market applications.
• More specifically, the “MRAM Technology and Business 2019” provides a deep insight into the spectrum of MRAM
technologies and applications, and analyzes the supply chain at different levels: chip manufacturers, equipment & material suppliers,
system integrators, and more. A profile for all key players with their MRAM activities is provided.
• In terms of market/business evolution, here are some new key facts discussed in this report:
• Foundry/IDM activities on embedded MRAM are advancing at fast pace: Samsung Foundry is now in mass production @28nm
FDSOI, Intel is ready for production @22nm FinFET, while TSMC is sampling embedded MRAM @22nm (planar bulk).
• Samsung and TSMC are focusing on embedded MRAM for replacing SRAM in applications where performance is not a priority,
whereas GlobalFoundries will continue to offer embedded MRAM as a code/data storage technology instead of eFlash
• Samsung’s embedded MRAM could be adopted as a slow SRAM implementation in CMOS image sensors or display driver ICs.
• Strong involvement of equipment players for solving deposition, etching and metrology/testing challenges Big R&D
investments for developing full MRAM manufacturing solutions for foundry customers. The latter are still evaluating the tools
offered by multiple players.
• China has plans to develop MRAM as an embedded memory option for its future foundry business.
• Density improvements in stand-alone STT-MRAM (1 Gb chips are now in pilot production) and cost/bit reduction could enable
new markets in the long term.
9
STAND-ALONE MEMORIES - OVERVIEW
• In 2018, NAND and DRAM account for ~97% of the stand-
alone memory market (~$160B).
• The remaining ~3% of the market (~$XXB) consists of:
- Flash NOR (~$2.6B)
- EEPROM, EPROM, Mask PROM/ROM, etc. (~$1B)
- Volatile RAM (~$280M)
• Asynchronous SRAM
• Synchronous SRAM
- Non-Volatile RAM (~$420M)
• nvSRAM
• BBSRAM
• Ferroelectric RAM
- Stand-alone emerging NVMs (~$275M)
• Compared to NAND and DRAM, these markets are much
less volatile and relatively more stable. Stand-alone memory market 2018
(~$XXXB)
1010
STAND-ALONE AND EMBEDDED MRAM APPLICATIONS
Key MRAM Applications
Industry, transportation,
and otherPersistent Memory
Code/Data Storage
(eFlash)
“Working” Memory (Slow SRAM)
Cache Memory (SRAM, eDRAM)
General Purpose
Automotive
Stand-alone Embedded
Required Speed/Density Required Speed/Density
IoT / Wearables
Enterprise Storage
CMOS Image SensorsImage memory buffer
Display Driver ICs
Edge AI accelerator chipsIn memory computing
CPU
Mobile AP
MCU, ASSP, ASIC, SoC
Storage Accelerators
Network Interface Cards
Solid State Drives Write caching, journaling, logs,
data buffering and streams
2023+
NVDIMMPersistent Memory for Servers
2023+
Industrial
automation
Transport
Aerospace
Medical
Gaming
Network &
Infrastructure
NVSRAM
Tcon, memory buffers
11©2019 | www.yole.fr | MRAM Technology and Business | Sample
0
1
2
3
4
5
Price ($/Gb)
Density (Gb)
Endurance
Speed
NAND PCM DRAM NOR STT-MRAM RRAM
STAND-ALONE MEMORY - TECHNOLOGY COMPARISON
2018 commercial products performance
Price and
scalability are
obstacles for
emerging
memories to
compete with
DRAM and
NAND
Data Storage
Working Memory
5: best value
0: worst value
$0,01
$0,10
$1,00
$10,00
$100,00
$1 000,00
NAND PCM DRAM NOR STT-MRAM RRAM
Memory pricing position in 2018 ($/Gb)
0,001
0,01
0,1
1
10
100
1000
10000
NAND PCM DRAM NOR STT-MRAM RRAM
Density position in 2018 (Gb)
1212©2019 | www.yole.fr | MRAM Technology and Business | Sample
• STT-MRAM will target enterprise storage (SCM) applications for a long time before trying to substitute DRAM (not before 2022)
STAND-ALONE STT-MRAM - ROADMAP
Chip density and technology node scaling - Comparison with DRAM
DRAM scalability finally went two generations below 20nm!
STT-MRAM must catch the DRAM running train…a big challenge!
2018 2019 2020 2021 2022 2023 2024
DRAM 16 16 16 32 32 32 32
STT-MRAM 0,256 1 1 4 4 8 8
Densi
ty (
Gb/c
hip
)
Stand-alone memory roadmap (Gb/die)
2018 2019 2020 2021 2022 2023 2024
DRAM 15 15 13 13 13 11 11
STT-MRAM 40 28 28 22 22 16 16
Tech
nolo
gy N
ode (
nm
)
Technology-node scaling (nm)
© Yole Development, July 2019
© Yole Development, July 2019
13©2019 | www.yole.fr | MRAM Technology and Business | Sample
2017 2018 2019 2020 2021 2022 2023 2024
SRAM 10 7 7 5 5 5 3 3
eFlash 40 28 28 28 28 22 22 22
eMRAM 40 28 22 22 22 14 14 14
Tech
nolo
gy N
ode (
nm
)
Technology-Node Scalng (nm)
EMBEDDED STT-MRAM - ROADMAP
Technology node evolution and embedded MRAM adoption
eFlash
substitution by
will be starting
in 2019, while
SRAM cache
applications will
begin in 2022
eFlash / “slow” SRAM
SRAM LL cache
© Yole Development, July 2019
14©2019 | www.yole.fr | MRAM Technology and Business | Sample
TECHNOLOGY ANALYSIS - COMPARISON WITH OTHER MEMORIES
15©2019 | www.yole.fr | MRAM Technology and Business | Sample
(STT-)MRAM KEY RESEARCH INSTITUTES AND LABORATORIES
17©2019 | www.yole.fr | MRAM Technology and Business | Sample
EMBEDDED STT-MRAM BUSINESS
Key partnerships and developments for the top players.
• The top foundry players are all preparing for 28/22nm embedded STT-MRAM. Intel has confirmed that its MRAM is now
achieving high yields making mass production viable.
Foundry / IDM (To be announced)
(STT-)MRAM
Players
Technology
Process
CMOS bulk
22nm planar
(sampling)
FD-SOI 22nm
planar
(sampling)
FD-SOI 28nm
planar
(in mass production)
CMOS bulk
28/22nm planar
(in development)
CMOS 22nm
FinFET
(sampling)
28/22nm
Expected Short-
Term Application“Slow” SRAM eFlash “Slow” SRAM
eFlash
“Slow” SRAM
eFlash
“Slow” SRAM“Slow” SRAM
1818
Embedded Cache Memory
(SRAM, eDRAM) – Mobile AP
Embedded Cache Memory
(SRAM, eDRAM) – High-End CPU
Embedded Memory (slow SRAM)
Embedded Data/Code Storage
(eFlash)
Persistent Memory (NVDIMM)
Enterprise Storage (SCM)
Industrial, transportation and
other applications
2018 2019 2020 2021 2022 2023 2024
TIME-TO-MARKET FOR (STT-)MRAM PLAYERS
By applications, for leading players – fabless/IP/IDM (stand-alone) and foundry/IDM (embedded) playersEm
bedded
Stan
d-a
lone
Entrance into the (STT-)MRAM market (commercial product availability)
© Yole Development, July 2019
©2019 | www.yole.fr | MRAM Technology and Business | Sample
1919©2019 | www.yole.fr | MRAM Technology and Business | Sample
(STT-)MRAM MARKET FORECAST
2020©2019 | www.yole.fr | MRAM Technology and Business | Sample
DENSITY AND PRICE EVOLUTION
2121©2019 | www.yole.fr | MRAM Technology and Business | Sample
CHINA MRAM DEVELOPMENTS
2222©2019 | www.yole.fr | MRAM Technology and Business | Sample
MRAM MANUFACTURING
23
Contact our
Sales Team
for more
information
23
Contact our
Sales Team
for more
information
©2019 | www.yole.fr | MRAM Technology and Business | Sample
Emerging Non-Volatile Memory 2018
Status of the Memory Industry 2019
DRAM & NAND Service – Memory Research
Memory Packaging Market and Technology Report
2017
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
24
Contact our
Sales Team
for more
information
24
Contact our
Sales Team
for more
information
©2019 | www.yole.fr | MRAM Technology and Business | Sample
Leading-edge 3D NAND Memory Comparison 2018
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Nowadays, there is broad consensus in the computer memory industry that the 28nm/22nm silicon lithography nodes will be the last technology nodes for embedded Flash (eFlash). This is not because of fundamental scalability limitations, but because of economic barriers. Therefore a new embedded non-volatile memory (NVM) for code/data storage is needed. At the same time, scaling of volatile static random access memory (SRAM) is slowing down due to cell footprint degradation occurring at advanced nodes. A denser working embedded memory would therefore be highly desirable.
Among various emerging NVM technologies, spin transfer torque magnetoresistive RAM (STT-MRAM) is gaining significant momentum. It is poised to become the next embedded memory solution for a variety of integrated circuit (IC) products manufactured at the 28nm node and below. That includes low-power wearables and Internet-of-Things (IoT) devices, microcontroller units (MCUs), automotive, imaging and display ICs, edge artificial intelligence (AI) accelerators, and other application specific ICs (ASICs) and application specific standard parts (ASSPs).
In 2018, the embedded STT-MRAM market was still limited, with no volume shipments. 2019 is expected to be the year this market takes off. Samsung has recently started mass production of embedded STT-MRAM, and we expect other major foundry/integrated device manufacturers (IDMs) to enter the race soon. At the same time, multiple equipment suppliers like Applied
Materials, Tokyo Electron Limited (TEL), Canon, and Lam Research, and logic companies like Qualcomm, ARM and Synopsis are increasing their research spending on MRAM. This is further propelling the development of the embedded STT-MRAM business. Thanks to the support of a large number of leading companies, Yole Développement analysts believe the embedded memory market has the potential to reach $1.2B by 2024, growing with a compound annual growth rate over this period (CAGR2018-2024) of 295%.
On the other hand, the stand-alone memory market is expected to grow less vigorously, with a CAGR2018-2024 of 54%, and will remain below $600M in 2024. So far, the growth has been driven by low-density (STT-)MRAM devices at 16Mb and below manufactured by a few key players, such as Everspin and Avalanche/Sony. In coming years, the stand-alone market will be mainly driven by enterprise storage applications. These include solid state drive (SSD) caching and storage/network accelerators, which are served by high-density STT-MRAM chips at 256Mb and above. The latter are typically sold to IDMs and system makers in the enterprise storage business. These companies require 12-18 months to develop new systems, so the ramp-up of STT-MRAM sales has taken a relatively long time. Notably, 1Gb 28nm devices from Everspin have recently moved into the pilot-production phase at GlobalFoundries. Their forthcoming availability in the market could trigger further growth of enterprise storage applications.
MRAM TECHNOLOGY AND BUSINESS 2019Market & Technology Report - August 2019
EMBEDDED MRAM IS PICKING UP STEAM THANKS TO THE STRONG INVOLVEMENT OF TOP FOUNDRY/IDM PLAYERS AND EQUIPMENT SUPPLIERS
MRAM promises life beyond eFlash: the embedded MRAM market is taking off and is expected to reach $1.2B by 2024.
(Yole Développement, August 2019)
Embedded memory technology trends & MRAM market evolution
KEY FEATURES• Overview of the spectrum of
(STT-)MRAM technologies, along with their manufacturing processes and related technical/economic challenges
• Description of three stand-alone and three embedded (STT-)MRAM applications> Stand-alone:
- industrial, transportation, defense and other applications requiring low-density memory chips
- enterprise storage, including accelerators and SSD caching
- persistent memory such as NVDIMM
> Embedded: - code/data storage memory, as
an eFlash replacement - working memory, or “slow”
SRAM, for ASSPs/ASICs such as AI edge accelerators
- last-level cache memory, as eDRAM/SRAM replacements, in CPUs and mobile processors
• 2018-2024 market forecast for stand-alone and embedded applications in $US, Gb and equivalents of 12’’ wafer starts
• Overview of the latest R&D developments and next-generation magnetic memories such as SOT-MRAM and VC-MRAM
• Overview of potential applications in the long term, including L1-L2 caching based on SOT-MRAM, execute-in-place (XIP) memory such as high-density NOR replacements at 2Gb and above, and storage class memory via STT-MRAM crosspoint architectures
• Mapping of the embedded and stand-alone MRAM supply chain with key partnerships
• Analysis of the ecosystem’s maturity, challenges and strengths and description of the players’ activities at different levels of the supply chain
• Presentation of the latest MRAM developments within the growing Chinese memory business
0
10
20
30
2018 2019 2020 2021 2022 2023 2024
Tech
nolo
gy n
ode
(nm
)
SRAM eFlash eMRAM
0
100
200
300
400
0
0,5
1
1,5
2
2018 2021 2024
MR
AM
mar
ket
in $
B
Stand-Alone Market (in $B)
Embedded Market (in $B)Total Wafer Production
Technology-node scaling roadmap for embedded memories Expected MRAM market evolution
eMRAM applications
Thousand w
afers
code/data storageworking memory
LL caching
MRAM TECHNOLOGY AND BUSINESS 2019
EVERSPIN IS THE CLEAR LEADER IN THE STAND-ALONE MARKET. THE COMPETITION IS GETTING FIERCER IN THE EMBEDDED MRAM BUSINESS
Everspin is the clear leader of the stand-alone (STT-)MRAM market. It is the only supplier of toggle MRAM at 16Mb and below for applications requiring high reliability, such as industrial, transportation, defence and medical markets, which have for long been served by non-volatile SRAM (NVSRAM). It is also the only player supplying high-density STT-
MRAM for the enterprise storage market. Avalanche has started shipping stand-alone STT-MRAM parts from 1-32Mb, manufactured at Sony using 40nm lithographic processes. It is targeting the NVSRAM market, partially challenging Everspin’s Toggle MRAM.
In the embedded business, foundry/IDM activities are advancing at a fast pace. Samsung is now in mass production on 28nm Fully Depleted Silicon On Insulator (FDSOI). Intel, after working silently on MRAM for several years, recently confirmed that its embedded MRAM, which uses a 22nm FinFET architecture, is ready for production. At the same time, TSMC is sampling on 22nm planar bulk silicon. Also, Gyrfalcon’s MRAM-based AI chips, manufactured at TSMC, should enter volume production by mid-2020. GlobalFoundries will enter the market with embedded MRAM for replacing eFlash on 22nm FDSOI, and is working on an SRAM-like version for the subsequent 12nm FDSOI node. Seemingly, Intel is targeting eFlash replacement. Samsung and TSMC seem to be focusing primarily on embedded MRAM for replacing SRAM in applications where performance is not a priority. They are expected to enter the market with a “slow SRAM” implementation.
STT-MRAM combines the best attributes of conventional memory types in a single technology. It features the speed of SRAM and the non-volatility of eFlash with unlimited endurance. It can be added to process flows for logic chips without significant cost increase, offering a remarkable density gain over SRAM, together with low power consumption. However, a number of difficult technical challenges need to be tackled to fully exploit the potential of STT-MRAM and enable its high-volume production. Fortunately, equipment suppliers are working hard to solve such issues and are offering new solutions enabling continuous progress.
The magnetic tunneling junction (MTJ) – the fundamental element of the MRAM memory cell – consists of a delicate multi-layer stack comprising 20-to-30 different layers, whose thickness must be controlled with sub-nanometer precision. For reliable MTJ production, deposition systems capable of on-board monitoring of key material properties are needed, such as the Endura® Clover™ MRAM physical vapor deposition (PVD) tool recently announced by Applied Materials. Furthermore, the etch steps for patterning MRAM cells are among the most challenging in the manufacturing process. The CoFe and CoFeB layers used in the MTJ cannot be etched with conventional reactive ion etch (RIE) tools because such materials are not prone to form volatile compounds with plasma gases. RIE could also damage the stack. Hence, the industry has to implement suitable ion-beam etching techniques and optimize them to avoid the re-deposition of byproducts. For instance, Lam Research and TEL have developed chemically-enhanced ion beam etching tools.
Last but not least, metrology and testing are also critical steps and cannot be overlooked. They have to be performed multiple times during the device fabrication process to assess the material/device response to electrical and magnetic stimuli. Also in this framework, there are companies developing ad hoc solutions for fast measurements on wafers, as well as packaged devices.
Key partnerships* within the embedded MRAM ecosystems
Foundry / IDM
(STT-)MRAM players
Technologyprocess
CMOS22nm
FinFET(sampling)
CMOS bulk28/22nm
planar(in
development)
CMOS bulk22nmplanar
(sampling)
FD-SOI22nmplanar
(sampling)
FD-SOI 28nmplanar(in mass
production)
28/22nm
Expected short-term application
eFlasheFlash eFlash
“Slow”SRAM
“Slow”SRAM
“Slow”SRAM
“Slow”SRAM
“Slow”SRAM
Partnership
(To be announced
*Non-exhaustive list of companies (Yole Développement, August 2019)
EQUIPMENT SUPPLIERS ARE TACKLING THE CHALLENGES OF HIGH-VOLUME MANUFACTURING OF STT-MRAM
Critical (STT-)MRAM manufacturing challenges and key equipmentplayers*’ involvement towards high volume production
Deposition of MTJ stack Goal: real-time property
monitoring
Testing and MetrologyGoal: high-speed measurement of
electrical and magnetics properties
Etching MTJ pillarsGoal: high-density, narrow
pitch patterning
*Non-exhaustive list of companies (Yole Développement, August 2019)
COMPANIES MONITORED IN THE PRODUCTA*STAR, Advantest, Aeroflex, Antaios, Applied Materials, Avalanche, Canon, Capres-KLA, CEA Leti, CNE, Crocus, CXMT, Cypress, Despatch, Dow, Evaderis, Evatec, Everspin, JHICC, GlobalFoundries, H-Grace, HFC Semiconductor, Hikstor, Hitachi, Honeywell, HP, Hprobe, Huawei, IBM, Imec, Infineon, Intermolecular, Inston, Intel, ITRI, Lam Research, Macronix, Maxim, Materion, Mediatek, Merk, Microchip, Micron, MicroSense Mythic, Nantero, Nanya, National Tsing Hua University, Nokia, Numen, NVE Corporation, NXP, OHT, Panasonic, Qualcomm, Quantum, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Shanghai Ciyu, SilTerra, Singulus, Smart Modular Technologies, SmartTip, SMIC, Sony, Spin Memory, Spintec, STMicroelectronics, Stanford University, Synopsis, Syntiant, TDK, TEL, TEL Magnetic Solutions, Teledyne e2v, Tezzaron, Tohoku University, Toshiba, Towerjazz, Tsinghua Unigroup , TSMC, UMC, Veeco, Western Digital, Winbond, XFab, XMC, YMTC, and more...
MARKET & TECHNOLOGY REPORT
Introduction 7
Noteworthy MRAM news 2017-2019 19
Context - Overview of the memory business 65
> Stand-alone memory – NAND, DRAM, NOR,(NV)SRAM
> Embedded memory – eFlash, eDRAM, SRAM> Emerging non-volatile memories – MRAM, PCM,
RRAM, etc. Overview of MRAM applications and market trends 107
Market forecast and financial analysis 114
Stand-alone MRAM applications and market trends 124
> Industrial, transportation and other (NVSRAM)> Enterprise storage – SSD caching and storage
accelerators> Persistent memory (NVDIMM)
Embedded MRAM applications and market trends 148
> Embedded storage (eFlash) – Code/data storagein MCUs and other ASICS/ASSP chips
> Embedded memory (slow SRAM) – Low-powermemory for ASICS/ASSP chips
> Embedded cache memory (SRAM, eDRAM) –Fast memory for high-level caching in CPU andmobile processors
Long-term potential applications 180
MRAM supply chain and player dynamics 184
> Supply chain analysis> MRAM players and activities> Mergers and acquisitions, partnerships and funding
China MRAM development 223
Technology description and trends 231
> MRAM technologies> MRAM manufacturing> Next-generation magnetic memories (SOT- and
VC-MRAM)Summary and conclusions 264
Yole Développement’s presentation 271
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the Memory Industry 2019• Memory Packaging Market and Technology
Trends 2017• NAND and DRAM Memory Research
Service – Monitor• Leading-edge 3D NAND Memory
Comparison 2018 - Reverse Costing® –Structure, Process & Cost Report by SystemPlus Consulting
Find all our reports on www.i-micronews.com
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AUTHORSSimone Bertolazzi, PhD is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memory technologies, their related materials and fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their opto-electronic device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of two-dimensional materials and high-k dielectrics. Simone earned a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
REPORT OBJECTIVES• Present an overview of the semiconductor memory industry with market insights and trends for
different stand-alone and embedded technologies.• Analyze embedded and stand-alone MRAM applications including: total addressable markets,
roadmaps, market drivers, challenges and players’ objectives.• Describe established and newly emerging magnetic memory technologies including: working principles,
manufacturing methods, advantages and limitations, average selling price and time-to-market.• Outline the latest activities for each key market player, as well as the current product development status.• Provide roadmaps with technological nodes, chip density and price evolution.• Analyze the MRAM ecosystems and its competitive landscape:
> Mapping of the entire supply chain> Recent acquisitions, partnerships and funding> Latest company news
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package & assembly, semiconductor manufacturing, memory and software & computing fields. Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the Semiconductor and Software Team. The team interacts daily with leading companies allowing semiconductor & software analysts to collect a large amount of data and integrate their understanding of the evolution of the market with technology breakthroughs. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside the Yole group. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France).
The overall MRAM ecosystem appears well developed and multiple companies, like NXP and Sony, are ready to adopt embedded MRAM in their IC products. We expect that 2019 will be the year of the MRAM market take off.
The new “MRAM Technology and Business” report by Yole Développement provides
an overview of embedded and stand-alone memory technologies. It details the market evolution for each application, the competitive landscape, the players’ dynamics, the challenges and the strategies in moving towards mass adoption of (STT-)MRAM.
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Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 120 collaborators worldwide covering MEMS and image sensors, Compound semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Power Electronics, Batteries & Energy Management and Memory.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO, KnowMade and Blumorpho, supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.
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& Software
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& Display
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o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now
provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as
intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports,
10 new monitors and 120 teardowns. Combining respective expertise and methodologies from the three companies, they cover:
o If you are looking for:
• An analysis of your product market and technology
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• An understanding of your manufacturing and production costs
• An understanding of your industry’s technology roadmap and related IPs
• A clear view supply chain evolution
Our reports and monitors are for you!
o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information,identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’slandscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the mainplayers of their industries and realized more than 5,000 interviews per year.
WHAT TO EXPECT IN 2019?In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also buildingon and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software andhardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Last but not least,System Plus Consulting is developing its teardowns service providing 120+ offers related to phones, smart home, wearables and connected devices. Discover our 2019program right now, and ensure you get a true vision of the industry. Stay tuned!
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• MEMS & Sensors
• RF devices & technologies
• Medical technologies
• Semiconductor Manufacturing
• Advanced packaging
• Memory
• Batteries and energy management
• Power electronics
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Imaging
• Photonics
About Yole Développement | www.yole.fr | ©2019
34
OUR 2019 REPORTS COLLECTION (1/4)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
Market –Technology – Strategy – by Yole DéveloppementYole Développement (Yole) offers market reports including quantitative market forecasts,
technology trends, company strategy evaluation and indepth application analyses. Yole will
publish more than 55 reports in 2019, with our partner PISEO contributing to some of
the lighting reports.
Reverse Costing® – Structure, Process and Cost Analysis – by
System Plus ConsultingThe Reverse Costing® report developed by System Plus Consulting provides full
teardowns, including detailed photos, precise measurements, material analyses,
manufacturing process flows, supply chain evaluations, manufacturing cost analyses and
selling price estimations. The reports listed below are comparisons of several analyzed
components from System Plus Consulting. More reports are however available, and over
60 reports will be released in 2019.The complete list is available at www.systemplus.fr.
Patent Reports – by KnowMadeMore than describing the status of the IP situation, these analyses provide a missing link
between patented technologies and market, technological and business trends. They offer
an understanding of the competitive landscape and technology developments from a
patent perspective. They include key insights into key IP players, key patents and future
technology trends. For 2019 KnowMade will release over 15 reports.
The markets targeted are :
• Mobile & Consumer
• Automotive & Transportation
• Medical
• Industrial
• Telecom & Infrastructure
• Defense & Aerospace
• Linked reports are dealing with the same topic to provide
• a more detailed analysis.
About Yole Développement | www.yole.fr | ©2019
35
OUR 2019 REPORTS COLLECTION (1/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT
• Status of the MEMS Industry 2019 - Update
• Status of the Audio Industry 2019 - New
• Uncooled Infrared Imagers and Detectors 2019 – Update
• Consumer Biometrics:Technologies and Market Trends 2018
• MEMS Pressure Sensor Market and Technologies 2018
• Gas & Particle Sensors 2018
o STRUCTURE, PROCESS & COST REPORT
• MEMS & Sensors Comparison 2019
• MEMS Pressure Sensor Comparison 2018
• Particle Sensors Comparison 2019
• Miniaturized Gas Sensors Comparison 2018
o PATENT REPORT
• MEMS Foundry Business Portfolio 2019 - New
• Miniaturized Gas Sensors 2019 - New
PHOTONIC AND OPTOELECTRONICS
o MARKET ANDTECHNOLOGY REPORT
• Silicon Photonics and Photonic Integrated Circuits 2019
• LiDARs for Automotive and Industrial Applications 2019 - Update
o PATENT REPORT
• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
• LiDAR for Automotive 2018
RF DEVICES AND TECHNOLOGIES
o MARKET ANDTECHNOLOGY REPORT
• RF GaN Market: Applications, Players, Technology,
and Substrates 2019 - Update
• 5G’s Impact on RF Front-End Module and Connectivity
for Cell Phones 2019 – Update
• 5G Impact on Telecom Infrastructure 2019 - New
• Radar and Wireless for Automotive: Market and Technology
Trends 2019 - Update
• Passive & Active Antenna Systems for Telecom
Infrastructure 2019 - New
• RF Standards and Technologies for Connected Objects 2018
o STRUCTURE, PROCESS & COST REPORT
• RF Front-End Module Comparison 2019 - Update
• Automotive Radar RF Chipset Comparison 2018
o PATENT REPORT
• Antenna for 5G Wireless Communications 2019 - New
• RF Front End Modules for Cellphones 2018
• RF Filter for 5G Wireless Communications: Materials and Technologies 2019
• RF GaN 2019 – Patent Landscape Analysis
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019
36
OUR 2019 REPORTS COLLECTION (2/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
IMAGING
o MARKET AND TECHNOLOGY REPORT
• Status of the CIS Industry 2019: Technology
and Foundry Business - Update
• Imaging for Automotive 2019 - Update
• Neuromorphic Technologies for Sensing 2019 - Update
• Status of the CCM and WLO Industry 2019 – Update
• 3D Imaging & Sensing 2018
• MachineVision for Industry and Automation 2018
• Sensors for Robotic Vehicles 2018
o STRUCTURE, PROCESS & COST REPORT
• Compact Camera Modules Comparison 2019
• CMOS Image Sensors Comparison 2019
o PATENT REPORT
• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New
• Apple iPhone X Proximity Sensor & Flood Illuminator 2018
MEDICAL IMAGING AND BIOPHOTONICS
o MARKET ANDTECHNOLOGY REPORT
• X-Ray Detectors for Medical, Industrial
and Security Applications 2019- New
• Microscopy Life Science Cameras: Market and Technology Analysis 2019
• Ultrasound technologies for Medical, Industrial
and Consumer Applications 2018
o PATENT REPORT
• Optical Coherence Tomography Medical Imaging 2018
MICROFLUIDICS
o MARKET ANDTECHNOLOGY REPORT
• Status of the Microfluidics Industry 2019 - Update
• Next Generation Sequencing & DNA Synthesis - Technology,
Consumables Manufacturing and Market Trends 2019 - New
• Organ-on-a-Chip Market & Technology Landscape 2019 - Update
• Point-of-Need Testing Application of Microfluidic Technologies 2018
• Liquid Biopsy: from Isolation to Downstream Applications 2018
• Chinese Microfluidics Industry 2018
o PATENT REPORT
• Microfluidic Manufacturing Technologies 2019 – New
• Nanopore Sequencing 2019 - New
INKJET AND ACCURATE DISPENSING
o MARKET ANDTECHNOLOGY REPORT
• Inkjet Printheads - Dispensing Technologies
& Market Landscape 2019 - Update
• Emerging Printing Technologies
for Microsystem Manufacturing 2019 - New
• Piezoelectric Devices from Bulk to Thin Film 2019 - New
• Inkjet Functional and Additive Manufacturing for Electronics 2018
o STRUCTURE, PROCESS & COST REPORT
• Piezoelectric Materials from Bulk to Thin Film Comparison 2019
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019
37
OUR 2019 REPORTS COLLECTION (3/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
BIOTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT
• CRISPR-Cas9 Technology: From Lab to Industries 2018
o PATENT REPORT
• Personalized Medicine 2019 – New
BIOMEMS & MEDICAL MICROSYSTEMS
o MARKET ANDTECHNOLOGY REPORT
• Medical Wearables: Market & Technology Analysis 2019 - New
• Neurotechnologies and Brain Computer Interface 2018
• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences
& Healthcare 2018
o PATENT REPORT
• 3D Cell Printing 2019 - New
• Circulating Tumor Cells Isolation 2019 - New
SOFTWARE AND COMPUTING
o MARKET ANDTECHNOLOGY REPORT
• Artificial Intelligence Computing For Automotive 2019 - New
• Hardware and Software for Artificial Intelligence (AI)
in Consumer Applications 2019 - Update
• Image Signal Processor and Vision Processor Market
and Technology Trends 2019
• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
and Gaming 2019 – New
o PATENT REPORT
• Artificial Intelligence for Medical Diagnostics - New
MEMORY
o MARKET AND TECHNOLOGY REPORT
• Status of the Memory Industry 2019 - New
• MRAM Technology and Business 2019 - New
• Emerging NonVolatile Memory 2018
o STRUCTURE, PROCESS & COST REPORT
• Memory Comparison 2019
o PATENT REPORT
• Magnetoresistive Random-Access Memory (MRAM) 2019 - New
• 3D Non-Volatile Memory 2018
ADVANCED PACKAGING
o MARKET ANDTECHNOLOGY REPORT
• Fan Out Packaging Technologies and Market Trends 2019 - Update
• 3D TSV Integration and Monolithic Business Update 2019 - Update
• Advanced RF SiP for Cellphones 2019 - Update
• Status of the Advanced Packaging Industry 2019 - Update
• Status of the Advanced Substrates 2019 - Update
• Panel Level Packaging Trends 2019 - Update
• Automotive Packaging Market & Technology Trends 2019 - New
• Trends in Automotive Packaging 2018
• Thin-Film Integrated Passive Devices 2018
o STRUCTURE, PROCESS & COST REPORT
• Advanced RF SiP for Cellphones Comparison 2019
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019
38
OUR 2019 REPORTS COLLECTION (4/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
SEMICONDUCTOR MANUFACTURING
o MARKET ANDTECHNOLOGY REPORT
• Nano-Imprint Technology Trends for Semiconductor
Applications 2019 - New
• Equipment and Materials for Fan Out Packaging 2019 - Update
• Equipment for More than Moore: Thin Film Deposition
& Etching 2019 - New
• Wafer Starts for More Than Moore Applications 2018
• Polymeric Materials at Wafer-Level
for Advanced Packaging 2018
• Bonding and Lithography Equipment Market
for More than Moore Devices 2018
o STRUCTURE, PROCESS & COST REPORT
• Wafer Bonding Comparison 2018
o PATENT REPORT
• Hybrid Bonding for 3D Stack 2019 – New
SOLID STATE LIGHTING
o MARKET ANDTECHNOLOGY REPORT
• Status of the Solid State Light Source Industry 2019 - New
• Edge Emitting Lasers (EELS) 2019 - New
• Light Shaping Technologies 2019 - New
• Automotive Advanced Front Lighting Systems 2019 - New
• VCSELs – Market and Technology Trends 2019 - Update
• IR LEDs and Laser Diodes – Technology, Applications,
and Industry Trends 2018
• Automotive Lighting 2018: Technology, Industry and Market Trends
• UV LEDs - Technology, Manufacturing and Application Trends 2018
• LiFi: Technology, Industry and Market Trends 2018
o STRUCTURE, PROCESS & COST REPORT
• VCSEL Comparison 2019
o PATENT REPORT
• VCSELs 2018
DISPLAY
o MARKET ANDTECHNOLOGY REPORT
• Next Generation 3D Displays 2019 - New
• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
• Micro-and Mini-LED Displays 2019 - Update
• Next Generation TV Panels: New Technologies, Features and
Market Impact 2019
• Displays & Optical Vision Systems for VR, AR & MR 2018
o PATENT REPORT
• MicroLED Displays : Intellectual Property Landscape 2018Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019
39
OUR 2019 REPORTS COLLECTION (5/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
POWER ELECTRONICS
o MARKET ANDTECHNOLOGY REPORT
• Power SiC: Materials, Devices and Applications 2019 - Update
• Power Electronics for EV/HEV and e-mobility:
Market, Innovations and Trends 2019 - Update
• Status of the Power Electronics Industry 2019 - Update
• Discrete Power Packaging : Material Market
and Technology Trends 2019 - New
• Status of the Power ICs Industry 2019 - Update
• Status of the Passive Components for the Power Electronics
Industry 2019 - Update
• Status of the Inverter Industry 2019 - Update
• Status of the Power Module Packaging Industry 2019 - Update
• Wireless Charging Market Expectations
and Technology Trends 2018
• Power GaN 2018: Epitaxy, Devices, Applications
and Technology Trends
o STRUCTURE, PROCESS & COST REPORT
• Automotive Power Module Packaging Comparison 2018
• GaN-on-Silicon Transistor Comparison 2019
• SiC Transistor Comparison 2019
o PATENT REPORT
• Power SiC : Materials, Devices and Modules 2019 - New
• Power GaN : Materials, Devices and Modules 2019 – Update
BATTERY & ENERGY MANAGEMENT
o MARKET ANDTECHNOLOGY REPORT
• Status of the Rechargeable Li-ion Battery Industry 2019 - New
• Li-ion Battery Packs for Automotive and Stationary Storage
Applications 2019 - Update
o PATENT REPORT
• Battery Energy Density Increase: Materials
and Emerging Technologies 2019 - New
• Solid-State Batteries 2019 - New
• Status of the Battery Patents 2018
COMPOUND SEMI.
o MARKET ANDTECHNOLOGY REPORT
• Emerging Semiconductor Substrates:
Market & Technology Trends 2019- New
• Status of the Compound Semiconductor Industry 2019 - New
• InP Materials, Devices and Applications 2019 - New
• GaAs Wafer and Epiwafer Market: RF, Photonics,
LED and PV Applications 2018
o PATENT REPORT
• GaN-on-Silicon Substrate: Materials, Devices
and Applications 2019 - Update
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019
40
OUR 2019 MONITORS COLLECTION (1/2)
Get the most updated overview of your market to monitor your strategy
Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to
provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can
benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.
Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.
MARKET MONITOR byYole Développement
A FULL PACKAGE:The monitors will provide the evolution of the market in units, wafer area and revenues.They will also offer insights into what is driving the business and a close look at what ishappening will also be covered in it.
The following deliverables will be included in the monitors:
• An Excel database with all historical and forecast data
• A PDF slide deck with graphs and comments/analyses covering the expected
evolutions
o ADVANCED PACKAGING – NEWThis monitor will provide the evolution of the advanced packaging platforms. It willcover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5Dand 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q32019
o COMPOUND SEMI. – NEWThis monitor will describe how the compound semiconductor industry is evolving. Itwill offer a close look at GaAs, InP, SiC, GaN and other compounds of interestproviding wafer volumes, revenues, application breakdowns and momentum.Frequency: Quarterly, starting from Q3 2019
o CAMERA MODULE – NEWThis monitor will provide the evolution of the imaging industry, with a close look atimage sensor, camera module, lens and VCM. Volumes, revenues and momentum ofcompanies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.Frequency: Quarterly, starting from Q3 2019
o MEMORY – UPDATEFor the memory industry you can have access to a quaterly monitor, as well as anadditional service, a monthly pricing. Both services can be bought seprately:
• DRAM Service: Including a quarterly monitor and monthly pricing.
• NAND Service: Including a quarterly monitor and monthly pricing.
REVERSETECHNOLOGY MONITOR by System Plus Consulting
o SMARTPHONES – NEWTo stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone ReverseTechnology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at thebeginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.
About Yole Développement | www.yole.fr | ©2019
41
OUR 2019 MONITORS COLLECTION (2/2)
Get the most updated overview of your market to monitor your strategy
PATENT MONITOR by KnowMade
A FULL PACKAGE:Starting at the beginning of the year, the KnowMade monitors include the following deliverables:
• An Excel file including the monthly IP database of:
• New patent applications
• Newly granted patents
• Expired or abandoned patents
• Transfer of IP rights through re-assignment and licensing
• Patent litigation and opposition
• Quarterly report including a PDF slide deck with the key facts & figures of thequarter: IP trends over the three last months, with a close look to key IP players andkey patented technologies.
o GaN for Power & RF ElectronicsWafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductordevices such as transistors, and diodes, devices and applications including converters,rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits(MMICs), packaging, modules and systems.
o GaN for Optoelectronics & PhotonicsWafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices suchas LEDs and lasers; and applications including lighting, display, visible communication,photonics, packaging, modules and systems.
o Li-ion BatteriesAnodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made ofLithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium NickelCobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), LithiumMetal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytesincluding liquid, polymer/gel, and solid inorganics; ceramic and other separators;battery cells including thin film/microbattery, flexible, cylindrical and prismatic; andbattery packs and systems.
o Post Li-ion BatteriesBattery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,battery cells and battery packs/systems.
o Solid-State BatteriesSupply chain including electrodes, battery cells, battery packs/systems andelectrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
o RF Acoustic Wave FiltersIncluding Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, BulkAcoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-Mounted Resonator (BAW-SMR), and Packaging.
o RF Power AmplifiersIncluding Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wavetechnology.
o RF Front-End Modules
o MicrofluidicsFrom components to chips and systems, including all applications.
About Yole Développement | www.yole.fr | ©2019
42
I-MICRONEWS MEDIA
To meet the growing demand for market,
technological and business information,
i-Micronews Media integrates several tools
able to reach each individual contact within its
network.
We will ensure your company benefits from
this
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Unique, cost-effective ways
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Contact: Camille Veyrier ([email protected]), Marketing & Communication Director
About Yole Développement | www.yole.fr | ©2019
43
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US & Canada
Email: [email protected] – + 1 310 600-8267
• Chris Youman, Senior Sales Director for Eastern US & Canada
Email: [email protected] – +1 919 607 9839
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager, Asia Business Development
(India & ROA)
Email: [email protected] - +81 34405-9204
• Miho Ohtake, Account Manager (Japan)
Email: [email protected] - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan & Singapore)
Email: [email protected] - +81-80-3577-3042
• Korea: Peter Ok, Business Development Director
Email: [email protected] - +82 10 4089 0233
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: [email protected] - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: [email protected] - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email [email protected] - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership with Woodside Capital
Partners)
• Jean-Christophe Eloy, CEO & President
Email: [email protected] - +33 4 72 83 01 80
• Ivan Donaldson, VP of Financial Market Development
Email: [email protected] - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar, Technical Project Development Director
Email: [email protected] - +33 6 27 68 69 33
o GENERAL
• Camille Veyrier, Director, Marketing & Communication
Email: [email protected] - +33 472 83 01 01
• Sandrine Leroy, Director, Public Relations
Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: [email protected] - +33 4 72 83 01 80
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