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mmW to THz ultra‐high‐data rate radio access technologies
Dr. Laurent HERAULTVP Europe, CEA‐LETI
Pierre VincentHead of RF IC design Lab, CEA‐LETI
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19th January 2012| 2
Outline
mmW communication use cases and standards mmW activities @ CEA‐LETI mmW communication challenges THz communication challenges Summary & conclusions
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19th January 2012| 3
Wireless HD
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19th January 2012| 4
WIGIG applications
Kiosk, P2P
Wireless Display
Cordless Computing
WLAN
Other potential applications: fine localization, chip to chip, board to board (connector replacement), etc
Forecasted market:
- 2 million chipsets by 2015 (ADI Research)
- 1 billion chipsets by 2020 (NICTA)
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Redefining Home Networks with mmWaveBS/CS/Digital Terrestrial Analog SignalDigitally Stored TV Program (Compressed)Digitally Stored TV Program (Compressed)
HD Uncompressed Digital Stream
HDD Home Server / Router
TV Monitor
Femto base stationon the ceiling& Backbone
Multiple Data Streams
No penetration through walls(High Security)
Digital Media Adaptor
Internet
Internet Access
HD-DVD Player
TV Monitor
Ultra High-Speed Stream
UC2
UC1
Fast synchronization
Low power, short range 1m 1 to 10 Gbps link
HD Video 2 to 6 GbpsMedium range 10m
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Other Gbps wireless standards
: Uncompressed Audio & Video streaming Up to 3Gbps over 30m In the unlicensed 4.9 – 5.9GHz band Commercial products by Amimon
: Short range Photo & Video transfer Up to 560Mbps over 15m In the 4.2 – 4.76GHz band Antenna is replaced by a specific coupler (close proximity)
(CameraJet, Wireless‐USB, Wireless‐1394…) Compressed 1080p Video transfer, Data transfer… Up to 1024Mbps (480Mbps historical limit) In the 3.1 – 10.6GHz band
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mmW Gbps wireless standards
: Uncompressed Audio & Video streaming,
multimedia kiosk, P2P link, multi‐Gbps WLAN Up to 6.8Gbps 4 channels @ 60GHz Active discussions with WiFi Alliance
Uncompressed Audio & Video streaming Up to 7.1Gbps 4 channels @ 60GHz Future evolutions: 10 – 28Gbps
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Technology challenges @ LETI Need of versatile and reconfigurable chip architecture to satisfy
multiple markets with a single packaging solution P2P, Wireless display, cordless computing & WLAN Internet access Multiple set of range and data rate (2.5Gbps @ 1 to 3m, 1.1Gbps @ 10m) Single carrier (priority) and OFDM (compatibility) 1 to 8 paths antenna array
High volume & Low cost Single chip on advance 65 nm CMOS Bulk & SOI Low form factor 3D packaging (organic, silicon interposer)
Low Power efficient RFFE & digital processing Digital compensation of RF impairments
Address manufacturability Testability with standard industrial equipment
at silicon and packaging level
Leti’s tester Verigy 93000
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Leti developments Two 60GHz developments have been implemented and tested.
Frequency domain: Industrial partner STM Objectives: Demonstration of 3.8Gbps OFDM 60GHz wireless link at 3meters
using standard CMOS 65nm RFFE “Roller” with industrial HTCC package
Time domain: Industrial partner Nokia Objectives: Merge UWB power efficient architecture and high performances
65nm SOI High Resistivity substrate technology to provide 0,5m, 2.5Gbps very low power and cost solution
Concept « Explore & Share »http://www.youtube.com/watch?v=72QimFfjKUo
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13.5*8.5mm² Industrial HTCC 3.8Gbps, 3 meters, single IPD glass antenna 3 Chips on CMOS standard 65nm : RFFE, PA et Digital BB.
60GHz WiHD industrial module
ADC/DACDigital BBCMOS 65
Transceiver chip3.3x2.8mm²
CMOS PA1.0X0.7mm²
RX antenna
TX antenna
Flip chip
HTCC module (13.5x8.5mm²)
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Sliding IF architecture TX mode: 474 mW + 700mW external CMOS PA RX mode: 530 mW State of the art: 3 ISSCC papers 2010 & 2011
60GHz RFFE architecture
5th order
20GHz 0°/90°and 40GHz
PLL
3rd order
90°
0°
I2C,Registers,Channel selection,
Power management
PPA
LNA
Mixer
Mixer
40GHz LO
40GHz LO
20GHz LO
20GHz LO
Baseband input I (50)
Baseband input Q (50)
Baseband output Q (50)
Baseband output I (50)
60GHz RF output (50)
60GHz RF input (50)
36MHz External Ref.
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WiHD Digital Base Band processing WiHD specification need Digital compensation of RF impairments: IQ mismatch Time and frequency offset Common phase noise
26 mm
12mm• CMOS 65nm
• 2.53GHz 9bit ADC & DAC
• Mux & Dmux
• 320MHz Digital clock
• HRP & LRP modem
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Compliant with WiHD HRP2 modulation OFDM 16QAM 3.8Gbps 4 channels, Single Antenna, Up to 3m
60GHz Wireless demonstration
RX
TX
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Time Domain 60GHz transceiver IR UWB at 60GHz will offer new uses cases for device to device communications 100mW @ 2.5Gbps (RFFE +DBB): TX 30mW, RX 70mW Range 0.5m meter single antenna Scalable data rate from 100Mbps to 2.5Gbps Integrated 4dBi 60GHz Antenna (thanks to SOI 65nm HR process) Very low cost (standard package)
Detection, analogue base band, digitizationRF input Data output
Synchronization managment
LNA
Re-generation
Data inputRF outputSignal shaping
PulseGenerator
PA
TX
RX
60GHz UWB RX
60GHz UWB TX
RX antenna
TX antenna
2mm x 3.5mm
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19th January 2012| 15
mmW challenge: long range backhauling Explore mmW spectrum for larger bandwith for backhauling Mobile data explosion Video becoming major content
Target: > 1Gbps data Range from 250 to 1000m BW from 500Mhz to 1GHz Carrier from 30GHz to 90GHz
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Other challenges: 70‐80GHz outdoor
Private networksEnterprise LAN extensions
Fiber extensions
Fiber backupDiversity
Connections
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mmW long range communications challenges Spectrum allocation mmW outdoor channel models Antennas: directionality Increasing antenna and RF efficiencies High gain power amplifier Digital BB CMOS implementation Low power, area & cost effective solutions
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Terahertz
Transition region between Electronics and Photonics: λ = 1mm‐0,1mm
Measurement instrumentation is scarce and expensive THz communications: spectrum not yet allocated above 0,3THz THz electronics limited by the device performance (Ft, Fmax) IEEE 802.15 WPAN Terahertz Interest Group (started from 2008)
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THz chip to chip communication Target: replace high speed wired links that requires complex networking in
a limited area. Terahertz advantages: wide bandwidth allows to provide tens of Gb/s data
rate for chip to chip or intra chip communication Smaller antenna size reducing die area and cost
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To conclude mmW communications require high performance components
implementing radio access technologies: CEA‐LETI is developing prototypes.
Some key challenges Spectrum allocation Propagation Antennas design: directionality, beamforming RFFE, including high gain PA Digital BB Energy efficiency Versatile and reconfigurable ICs covering several standards CMOS implementation (CMOS bulk or SOI (65nm, 28nm)) Area & cost effective solutions
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Publications 2 papers at ISSCC ‘10
A 17.5 to 20.94GHz and 35 to 41.88GHz PLL in 65nm CMOS for Wireless HD applications. A 53‐68GHz 18dBm Power Amplifier with 8 combined ways in standard 65nm CMOS.
ISSCC ‘11 A 65nm CMOS fully integrated transceiver module for 60GHz Wireless HD applications
Journal JSSC’10 A 60GHz Power Amplifier with 14.5dBm Saturation Power and 25% Peak PAE in CMOS 65nm SOI
Journal JSSC’12 accepted A 65nm CMOS fully integrated transceiver module for 60GHz Wireless HD applications
EuCAP ‘10 “European Conference on Antennas and Propagation” 60 GHz Antennas in HTCC and Glass Technology
SIRF 2011 “A 60 GHz UWB impulse radio transmitter with integrated antenna in CMOS65nm SOI
technology”
IEEE CNCC 2010 (Consumer Communications and Networking Conference ) “A wirelessHD Baseband Development under RF and Implementation Constraints”,
Thanks for your attention