MJF18008 Data Sheets

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    SWITCHMODENPN Bipolar Power TransistorFor Switching Power Supply Applications

    The MJE/MJF18008 have an applications specific stateoftheart

    die designed for use in 220 V lineoperated Switchmode Power

    supplies and electronic light ballasts. These high voltage/high speed

    transistors offer the following:

    Improved Efficiency Due to Low Base Drive Requirements:

    High and Flat DC Current Gain hFEFast Switching

    No Coil Required in Base Circuit for TurnOff (No Current Tail)

    Tight Parametric Distributions are Consistent LottoLot

    Two Package Choices: Standard TO220 or Isolated TO220

    MJF18008, Case 221D, is UL Recognized at 3500 VRMS

    : File

    #E69369

    MAXIMUM RATINGS

    Rating

    Symbol

    MJE18008

    MJF18008

    Unit

    CollectorEmitter Sustaining Voltage

    VCEO

    450

    Vdc

    CollectorEmitter Breakdown Voltage

    VCES

    1000

    Vdc

    EmitterBase Voltage

    VEBO

    9.0

    Vdc

    Collector Current Continuous

    Peak(1)

    ICICM

    8.0

    16

    Adc

    Base Current Continuous

    Peak(1)

    IBIBM

    4.0

    8.0

    Adc

    RMS Isolation Voltage(2)

    Test No. 1 Per Fig. 22a(for 1 sec,] R.H. < 30%,

    Test No. 1 Per Fig. 22b

    TC = 25_C)

    Test No. 1 Per Fig. 22c

    VISOL

    4500

    3500

    1500

    Volts

    Total Device Dissipation (TC = 25C)

    Derate above 25_C

    PD

    125

    1.0

    45

    0.36

    Watts

    W/_C

    Operating and Storage Temperature

    TJ, Tstg

    65 to 150

    _C

    THERMAL CHARACTERISTICS

    Rating

    Symbol

    MJE18008

    MJF18008

    Unit

    Thermal Resistance Junction to Case

    Junction to Ambient

    RJCRJA

    1.0

    62.5

    2.78

    62.5

    _C/W

    Maximum Lead Temperature for Soldering

    Purposes: 1/8 from Case for 5 Seconds

    TL

    260

    _C

    Preferred devices are ON Semiconductor recommended choices for future use and best overall value.

    ON Semiconductor)

    Semiconductor Components Industries, LLC, 2002

    April, 2002 Rev. 41 Publication Order Number:

    MJE18008/D

    MJE18008

    MJF18008

    POWER TRANSISTOR8.0 AMPERES

    1000 VOLTS

    45 and 125 WATTS

    *ON Semiconductor Preferred Device

    *

    *

    CASE 221A09TO220ABMJE18008

    CASE 221D02ISOLATED TO220 TYPE

    UL RECOGNIZEDMJF18008

    STYLE 1:PIN 1 . B ASE

    2. COLLECTOR3. EMITTER4. COLLECTOR

    12

    3

    4

    1

    23

    STYLE 2:P IN 1. BASE

    2. COLLECTOR3 . EMITTE R

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    2

    ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise specified)

    Characteristic

    Symbol

    Min

    Typ

    Max

    Unit

    OFF CHARACTERISTICS

    CollectorEmitter Sustaining Voltage (IC = 100 mA, L = 25 mH)

    VCEO(sus)

    450

    Vdc

    Collector Cutoff Current (VCE = Rated VCEO, IB = 0)

    ICEO

    100

    Adc

    Collector Cutoff Current (VCE = Rated VCES, VEB = 0)

    (TC = 125_C)

    Collector Cutoff Current (VCE = 800 V, VEB = 0) (TC = 125_C)

    ICES

    100

    500

    100

    Adc

    Emitter Cutoff Current (VEB = 9.0 Vdc, IC = 0)

    IEBO

    100

    Adc

    ON CHARACTERISTICS

    BaseEmitter Saturation Voltage (IC = 2.0 Adc, IB = 0.2 Adc)

    BaseEmitter Saturation Voltage (IC = 4.5 Adc, IB = 0.9 Adc)

    VBE(sat)

    0.82

    0.92

    1.1

    1.25

    Vdc

    CollectorEmitter Saturation Voltage

    (IC = 2.0 Adc, IB = 0.2 Adc)

    (TC = 125_C)

    (IC = 4.5 Adc, IB = 0.9 Adc)

    (TC = 125_C)

    VCE(sat)

    0.3

    0.3

    0.35

    0.4

    0.6

    0.65

    0.7

    0.8

    Vdc

    DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc)

    (TC = 125_C)

    DC Current Gain (IC = 4.5 Adc, VCE = 1.0 Vdc)

    (TC = 125_C)DC Current Gain (IC = 2.0 Adc, VCE = 1.0 Vdc)

    (TC = 125_C)

    DC Current Gain (IC = 10 mAdc, VCE = 5.0 Vdc)

    hFE

    14

    6.0

    5.011

    11

    10

    28

    9.0

    8.015

    16

    20

    34

    (1) Pulse Test: Pulse Width = 5.0 ms, Duty Cyclev 10%. (continued)

    (2) Proper strike and creepage distance must be provided.

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    Characteristic

    Symbol

    Min

    Typ

    Max

    Unit

    DYNAMIC CHARACTERISTICS

    Current Gain Bandwidth (IC = 0.5 Adc, VCE = 10 Vdc, f = 1.0 MHz)

    fT

    13

    MHz

    Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)

    Cob

    100

    150

    pF

    Input Capacitance (VEB = 8.0 V)

    Cib

    1750

    2500

    pF

    Dynamic Saturation Voltage:

    (IC = 2.0 Adc

    1.0 s

    (TC = 125C)

    VCE(dsat)

    5.5

    11.5

    Vdc

    Determined 1.0 s and

    3.0 s respectively after

    rising IB1 reaches 90% of

    IB1 = 200 mAdcVCC = 300 V)

    3.0 s

    (TC = 125C)

    3.5

    6.5

    final IB1(see Figure 18)

    (IC = 5.0 Adc

    1.0 s

    (TC = 125C)

    11.5

    14.5

    IB1 = 1.0 Adc

    VCC = 300 V)

    3.0 s

    (TC = 125C)

    2.4

    9.0

    SWITCHING CHARACTERISTICS: Resistive Load (D.C.v 10%, Pulse Width = 20 s)

    TurnOn Time

    (IC = 2.0 Adc, IB1 = 0.2 Adc,

    IB2 = 1.0 Adc, VCC = 300 V)

    (TC = 125C)

    ton

    200

    190

    300

    ns

    TurnOff Time

    (TC = 125C)

    toff

    1.2

    1.5

    2.5

    s

    TurnOn Time

    (IC = 4.5 Adc, IB1 = 0.9 Adc,IB2 = 2.25 Adc, VCC = 300 V)

    (TC = 125C)

    ton

    100250

    180

    ns

    TurnOff Time

    (TC = 125C)

    toff

    1.6

    2.0

    2.5

    s

    SWITCHING CHARACTERISTICS: Inductive Load (Vclamp = 300 V, VCC = 15 V, L = 200 H)

    Fall Time

    (IC = 2.0 Adc, IB1 = 0.2 Adc,

    IB2 = 1.0 Adc)

    (TC = 125C)

    tfi

    100

    120

    180

    ns

    Storage Time

    (TC = 125C)

    tsi

    1.5

    1.9

    2.75

    s

    Crossover Time

    (TC = 125C)

    tc

    250

    230

    350

    ns

    Fall Time

    (IC = 4.5 Adc, IB1 = 0.9 Adc,

    IB2 = 2.25 Adc)

    (TC = 125C)

    tfi

    85

    135

    150

    ns

    Storage Time

    (TC = 125C)

    tsi

    2.0

    2.6

    3.2

    s

    Crossover Time

    (TC = 125C)

    tc

    210

    250

    300

    ns

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    hFE,

    DCCURR

    ENTGAIN

    IC, COLLECTOR CURRENT (AMPS)

    TJ = 125C

    C,

    CAPACITANCE(pF)

    0.01

    100

    IC, COLLECTOR CURRENT (AMPS)

    Figure 1. DC Current Gain @ 1 Volt

    hFE,

    DCCURR

    ENTGAIN

    Figure 2. DC Current Gain @ 5 Volts

    VCE,

    VOLTAGE(VOLTS)

    Figure 3. Collector Saturation Region Figure 4. CollectorEmitter Saturation Voltage

    Figure 5. BaseEmitter Saturation Region Figure 6. Capacitance

    10

    11 10

    100

    10

    10.01 0.1 1 10

    2

    0.01

    IB, BASE CURRENT (AMPS)

    10

    1

    0.010.01

    IC COLLECTOR CURRENT (AMPS)

    0.1

    1.3

    1

    0.8

    0.40.01

    IC, COLLECTOR CURRENT (AMPS)

    0.1 1 10

    1000

    100

    1

    VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

    1 1000

    1

    0

    0.1

    1 10

    10000

    10

    0.1

    0.1 1 10

    10

    TJ = 25C

    TJ = -20C

    TJ = 125C

    TJ = 25C

    VCE,

    VOLTAGE(VOLTS)

    IC/IB = 10

    IC/IB = 5

    VBE,V

    OLTAGE(VOLTS) 1.1

    0.9

    0.6

    0.5

    0.5

    1.5

    1.2

    TJ = 25C

    3 A 5 A 8 A 10 A

    TJ = 25C

    TJ = 125C

    TJ = 25C

    TJ = 125CIC/IB = 5

    IC/IB = 10

    TJ = -20C

    IC = 1 A

    0.7

    Cob

    100

    Cib

    TYPICAL STATIC CHARACTERISTICS

    VCE = 1 V VCE = 5 V

    TJ = 25C

    f = 1 MHz

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    Figure 7. Resistive Switching, ton Figure 8. Resistive Switching, toff

    IC, COLLECTOR CURRENT (AMPS)

    IC COLLECTOR CURRENT (AMPS)

    IC, COLLECTOR CURRENT (AMPS)

    0

    1500

    IC, COLLECTOR CURRENT (AMPS)

    t,TIME(ns)

    Figure 9. Inductive Storage Time, tsi Figure 10. Inductive Storage Time, tsi(hFE)

    Figure 11. Inductive Switching, tc and tfiIC/IB = 5

    Figure 12. Inductive Switching, tc and tfiIC/IB = 10

    1000

    04 8

    2000

    0

    3500

    3

    hFE, FORCED GAIN

    6

    400

    50

    0

    IC, COLLECTOR CURRENT (AMPS)

    4 8

    250

    200

    50

    2000

    012 15

    300

    150

    2

    2 5 8

    IC/IB = 5

    tsi,STORAGETIME(ns)

    200

    150

    100

    6

    500

    IC/IB = 10

    4 82 6

    500

    1000

    1500

    2500

    3000

    3500

    t,TIME(ns)

    t,TIME(ns)

    1 3 4 6 7

    1000

    1500

    2500

    9

    5000

    2000

    0

    500

    1000

    1500

    2500

    3000

    3500

    1 2 3 5

    t,TIM

    E(ns)

    4 7 81 2 3 5 6

    t,TIM

    E(ns)

    1 3 5 7 1 3 5 7

    500

    3000

    4 5 7 8 10 11 13 14

    250

    100

    IC/IB = 10

    IB(off) = IC/2

    VCC = 15 V

    VZ = 300 V

    LC = 200 H

    4000

    4500

    300

    350

    IB(off) = IC/2

    VCC = 300 V

    PW = 20 s

    IC/IB = 5

    IC/IB = 10

    TJ = 125C

    TJ = 25C

    4500

    4000

    IC/IB = 5

    IB(off) = IC/2

    VCC = 15 V

    VZ = 300 V

    LC = 200 H

    IC = 2 A

    IB(off) = IC/2

    VCC = 15 V

    VZ = 300 V

    LC = 200 H

    6 7

    tfi

    tc

    tfi

    tc

    TJ = 25C

    TJ = 125C

    TYPICAL SWITCHING CHARACTERISTICS(IB2 = IC/2 for all switching)

    IC = 4.5 A

    IB(off) = IC/2

    VCC = 15 V

    VZ = 300 V

    LC = 200 H

    IB(off) = IC/2

    VCC = 300 V

    PW = 20 s

    TJ = 25C

    TJ = 125C

    TJ = 25C

    TJ = 125C

    TJ = 25C

    TJ = 125C

    TJ = 25C

    TJ = 125C

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    hFE, FORCED GAIN

    TC,

    CROSSOV

    ERTIME(ns)

    3

    160

    hFE, FORCED GAIN

    Figure 13. Inductive Fall Time

    tfi,FALLTIM

    E(ns)

    Figure 14. Inductive Crossover Time

    605 15

    400

    200

    50

    4 6 7 8 9 10 11 12 13 14

    70

    80

    140

    3 5 154 6 7 8 9 10 11 12 13 14

    300

    100

    IC = 2 A

    IC = 4.5 A

    TJ = 25C

    TJ = 125C

    100

    120

    350IB(off) = IC/2

    VCC = 15 V

    VZ = 300 V

    LC = 200 H

    150

    130

    110

    90150

    250

    IB(off) = IC/2

    VCC = 15 V

    VZ = 300 V

    LC = 200 H

    IC = 2 A

    IC = 4.5 A

    TYPICAL SWITCHING CHARACTERISTICS(IB2 = IC/2 for all switching)

    TJ = 25C

    TJ = 125C

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    IC,

    COLLECTORCURRENT(AMPS)

    VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

    IC,

    COLLECTORCURRENT(AMPS)

    Figure 15. Forward Bias Safe Operating Area Figure 16. Reverse Bias Switching Safe

    Operating Area

    Figure 17. Forward Bias Power Derating

    100

    10

    VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

    9

    6

    00 200

    1,0

    0,8

    0,2

    0,020

    TC, CASE TEMPERATURE (C)

    80 140 160

    1

    0.01

    3

    600 1000100 1000

    DC (MJE18008)

    5 ms

    POWERDERATINGFACTOR

    0,6

    0,4

    10

    0.1

    EXTENDED

    SOA

    1 ms 10 s 1 s

    400

    2

    1

    4

    5

    40 60 100 120

    SECOND BREAKDOWN

    DERATING

    DC (MJF18008)

    7

    8

    There are two limitations on the power handling ability of

    a transistor: average junction temperature and second break-

    down. Safe operating area curves indicate IC VCE limits of

    the transistor that must be observed for reliable operation; i.e.,

    the transistor must not be subjected to greater dissipation than

    the curves indicate. The data of Figure 15 is based on TC =

    25C; TJ(pk) is variable depending on power level. Second

    breakdown pulse limits are valid for duty cycles to 10% but

    must be derated when TC > 25C. Second breakdown limita-

    tions do not derate the same as thermal limitations. Allowable

    current at the voltages shown in Figure 15 may be found at any

    case temperature by using the appropriate curve on Figure 17.

    TJ(pk) may be calculated from the data in Figure 20 and 21. Atany case temperatures, thermal limitations will reduce the

    power that can be handled to values less than the limitations

    imposed by second breakdown. For inductive loads, high volt-

    age and current must be sustained simultaneously during turn

    off with the basetoemitter junction reversebiased. The safe

    level is specified as a reversebiased safe operating area (Fig-

    ure 16). This rating is verified under clamped conditions so

    that the device is never subjected to an avalanche mode.

    800

    -1, 5 V

    -5 V

    TC 125C

    IC/IB 4

    LC = 500 H

    GUARANTEED SAFE OPERATING AREA INFORMATION

    THERMAL DERATING

    VBE(off) = 0 V

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    -5

    -4

    -3

    -2

    -1

    0

    1

    2

    3

    4

    5

    0 1 2 3 4 5 6 7 8

    Figure 18. Dynamic Saturation Voltage Measurements

    TIME

    VCE

    VOLTS

    IB

    Figure 19. Inductive Switching Measurements

    1 s

    3 s

    90% IB

    dyn 1 s

    dyn 3 s

    10

    9

    8

    7

    6

    5

    4

    3

    2

    1

    00 1 2 3 4 5 6 7 8

    TIME

    IB

    IC

    tsi

    VCLAMP 10% VCLAMP

    90% IB1

    10% ICtc

    90% ICtfi

    Table 1. Inductive Load Switching Drive Circuit

    +15 V

    1 F150

    3 W

    100

    3 W

    MPF930

    +10 V

    50

    COMMON

    -Voff

    500 F

    MPF930

    MTP8P10

    MUR105

    MJE210

    MTP12N10

    MTP8P10

    150

    3 W

    100 F

    Iout

    A

    1 F

    IC PEAK

    VCE PEAK

    VCE

    IB

    IB1

    IB2

    V(BR)CEO(sus)

    L = 10mH

    RB2 =

    VCC = 20 VOLTS

    IC(pk) = 100 mA

    INDUCTIVE SWITCHING

    L = 200 H

    RB2 = 0

    VCC = 15 VOLTS

    RB1 SELECTED FOR

    DESIRED IB1

    RBSOA

    L = 500 H

    RB2 = 0

    VCC = 15 VOLTS

    RB1 SELECTED

    FOR DESIRED IB1

    RB2

    RB1

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    0.01

    t, TIME (ms)

    Figure 20. Typical Thermal Response (ZJC(t)) for MJE18008

    r(t),

    TRANSIENTTHERMA

    LRESISTANCE

    (NORMALIZE

    D)

    RJC(t) = r(t) RJCRJC = 1.0C/W MAX

    D CURVES APPLY FOR POWER

    PULSE TRAIN SHOWN

    READ TIME AT t1TJ(pk) - TC = P(pk) RJC(t)

    P(pk)

    t1t2

    DUTY CYCLE, D = t1/t2

    0.2

    0.02

    0.1

    D = 0.5

    SINGLE PULSE

    0.01 0.1 1 10 100 1000

    0.1

    1

    0.01

    Figure 21. Typical Thermal Response (ZJC(t)) for MJF18008

    r(t),

    TRANSIENTTHERMALRESISTANCE

    (NORMALIZED)

    RJC(t) = r(t) RJCRJC = 2.78C/W MAX

    D CURVES APPLY FOR POWER

    PULSE TRAIN SHOWN

    READ TIME AT t1TJ(pk) - TC = P(pk) RJC(t)

    P(pk)

    t1t2

    DUTY CYCLE, D = t1/t2

    0.2

    0.02

    0.1

    SINGLE PULSE

    0.01 0.1 1 10 100 100000

    0.1

    1

    1000 10000

    0.05

    0.05

    D = 0.5

    TYPICAL THERMAL RESPONSE

    t, TIME (ms)

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    10

    MOUNTED

    FULLY ISOLATED

    PACKAGE

    LEADS

    HEATSINK

    0.110MIN

    Figure 22a. Screw or Clip Mounting Position

    for Isolation Test Number 1

    *Measurement made between leads and heatsink with all leads shorted together

    CLIP

    MOUNTED

    FULLY ISOLATED

    PACKAGE

    LEADS

    HEATSINK

    CLIP 0.107MIN

    MOUNTED

    FULLY ISOLATED

    PACKAGE

    LEADS

    HEATSINK

    0.107MIN

    Figure 22b. Clip Mounting Position

    for Isolation Test Number 2

    Figure 22c. Screw Mounting Position

    for Isolation Test Number 3

    TEST CONDITIONS FOR ISOLATION TESTS*

    4-40 SCREW

    PLAIN WASHER

    HEATSINK

    COMPRESSION WASHER

    NUT

    CLIP

    HEATSINK

    Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting

    technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compres-

    sion washer helps to maintain a constant pressure on the package over time and during large temperature excursions.Destructive laboratory tests show that using a hex head 440 screw, without washers, and applying a torque in excess

    of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.

    Additional tests on slotted 440 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely

    affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semi-

    conductor does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions.

    Figure 23. Typical Mounting Techniques

    for Isolated Package

    Figure 23a. ScrewMounted Figure 23b. ClipMounted

    MOUNTING INFORMATION**

    **For more information about mounting power semiconductors see Application Note AN1040.

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    11

    PACKAGE DIMENSIONS

    NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

    Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.

    STYLE 2:PIN 1 . BASE

    2. COLLECTOR3. EMITTER

    DIM

    A

    MIN MAX MIN MAX

    MILLIMETERS

    0.621 0.629 15.78 15.97

    INCHES

    B 0.394 0.402 10.01 10.21C 0.181 0.189 4.60 4.80D 0.026 0.034 0.67 0.86F 0.121 0.129 3.08 3.27G 0.100 BSC 2.54 BSC

    H 0.123 0.129 3.13 3.27J 0.018 0.025 0.46 0.64K 0.500 0.562 12.70 14.27L 0.045 0.060 1.14 1.52N 0.200 BSC 5.08 BSCQ 0.126 0.134 3.21 3.40R 0.107 0.111 2.72 2.81S 0.096 0.104 2.44 2.64U 0.259 0.267 6.58 6.78

    B

    Y

    GN

    D

    L

    K

    H

    A

    F

    Q

    3 PL

    1 2 3

    MBM0.25 (0.010) Y

    SEATINGPLANE

    T

    U

    C

    S

    J

    R

    CASE 221D02(ISOLATED TO220 TYPE)

    UL RECOGNIZED: FILE #E69369ISSUE D

    CASE 221A09ISSUE AA

    TO220AB

    NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

    Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION Z DEFINES A ZONE WHERE ALL

    BODY AND LEAD IRREGULARITIES AREALLOWED.

    DIM MIN MAX MIN MAX

    MILLIMETERSINCHES

    A 0.570 0.620 14.48 15.75

    B 0.380 0.405 9.66 10.28C 0.160 0.190 4.07 4.82D 0.025 0.035 0.64 0.88F 0.142 0.147 3.61 3.73G 0.095 0.105 2.42 2.66H 0.110 0.155 2.80 3.93J 0.018 0.025 0.46 0.64K 0.500 0.562 12.70 14.27L 0.045 0.060 1.15 1.52N 0.190 0.210 4.83 5.33Q 0.100 0.120 2.54 3.04R 0.080 0.110 2.04 2.79S 0.045 0.055 1.15 1.39T 0.235 0.255 5.97 6.47U 0.000 0.050 0.00 1.27V 0.045 --- 1.15 ---Z --- 0.080 --- 2.04

    B

    Q

    H

    Z

    L

    V

    G

    N

    A

    K

    F

    1 2 3

    4

    D

    SEATING

    PLANET

    C

    ST

    U

    R

    J

    STYLE 1:PIN 1 . BASE

    2. COLLECTOR3. EMITTER4. COLLECTOR

  • 7/27/2019 MJF18008 Data Sheets

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  • 7/27/2019 MJF18008 Data Sheets

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    This datasheet has been download from:

    www.datasheetcatalog.com

    Datasheets for electronics components.

    http://www.datasheetcatalog.com/http://www.datasheetcatalog.com/http://www.datasheetcatalog.com/http://www.datasheetcatalog.com/