PUBLIC

PABLO FUENTES

JULY 2019

MIGRATION TO EMVCO 3.0NFC TECHNICAL III

1

Agenda

• Introduction

• Test equipment

• EMV L1 Analog tests

• Interoperability tests

• NXP Debugging support

• NXP product portfolio

2

Introduction

3

IntroductionWhy EMV v3.0?

• With the appearance of contactless payments and

card digitization, manufacturers enable new payment

devices in a wide variety of form factors.

• In their v3.0, EMVCo updates their contactless

specifications for POS terminals (PCD) to guarantee

the correct operation with new devices in the market.

• POS terminals are now tested using 3 different

reference antennas to verify the performance against

different antenna sizes.

• Interoperability tests with several phones on the

market were added and made mandatory from

2019Q1.

4

Introduction

Schedule for the migration to EMV v3.0

EMV v3.0 Timeline

April

• Specifications public

• Test case development

• Final validation of tests casesJanuary

• First test tools validated

• Interoperability tests mandatory

for EMV v2.6

April

• Test tools qualified

• First certification possible

January

• EMV 3.0 Mandatory

EMV 2.6b certification submission possible until Dec 31st 2019

(needs to be completed before Q2 2020)

5

• Identifies the interface area where the user should tap his card.

• Contactless symbol marks the center of the landing plane.

• Minimum size: 13mm height x 22 mm width.

• Aspect ratio should be kept.

IntroductionContactless Symbol

6

• Contactless Symbol is used to define an operating

volume for the tests.

• Positions are expressed with the format (z, r, φ)

IntroductionOperating volume

z Height

0 0 mm

1 10 mm

2 20 mm

3 30 mm

4 40 mm

r Radius

0 0 mm

1 15 mm

2 25 mm

φ Angle

0 0

3 π / 2

6 π

9 3π / 2

7

IntroductionTestPICC Positioning

• TestPICC should attack from the right side

8

Test equipment

9

Test equipmentTest PICCs

EMV v2.6 EMV v3.0

PICC1Class 1

16.1MHz

PICC2

Class 1

13.56MHz

PICC3

Class 3

13.56MHz

Ref PICC

• For 3.0 tests are performed using 3

different PICCs instead of only 1

• New PICCs are tuned to 13.56 MHz

• Included a PICC Class 3 antenna

10

Test equipmentLoad settings

EMV v2.6 EMV v3.0

Linear Load

Wave Shape Tests

Non-Linear Load

Power and LMA testsHLZ

Wave Shape

LLZ

Wave ShapeNLZ

Power and

LMA tests

11

EMV L1 Analog Tests

12

Power transfer testsDifferences – v2.6 vs v3.0

EMV

v2.6

EMV v3.0

TP1 TP2 TP3

2.55 3.84 4.6 3.23

2.775 4.02 4.6 3.47

3 4.2 4.6 3.71

3.05 4.25 4.6 3.91

3.1 4.3 4.6 4.11

EMV

v2.6

EMV v3.0

TP1 TP2 TP3

8.1 7.35 6.95 8.75

Minimum (V)

z = 4cm

z = 3cm

z = 2cm

z = 1cm

z = 0cm

Maximum (V)

TP = TestPICC

13

Power transfer testsEMV 2.6 vs 3.0 (TestPICC1 & 3)

z z00 Min Max

4 3.58 2.55 8.10

3 5.06 2.775 8.10

2 5.84 3.00 8.10

1 5.35 3.05 8.10

0 3.66 3.10 8.10

z z00 Min Max

4 4.46 3.84 7.35

3 5.37 4.02 7.35

2 5.86 4.20 7.35

1 5.62 4.25 7.35

0 4.54 4.30 7.35

EMV 2.6 EMV 3.0

TestPICC1

✓ Same device

✓ Same configuration

z z00 Min Max

4 4.07 3.23 8.75

3 5.39 3.47 8.75

2 6.16 3.71 8.75

1 5.90 3.91 8.75

0 6.44 4.11 8.75

EMV 3.0

TestPICC3

14

Power transfer tests

z z00 Min Max

4 3.58 2.55 8.10

3 5.06 2.775 8.10

2 5.84 3.00 8.10

1 5.35 3.05 8.10

0 3.66 3.10 8.10

z z00 Min Max

4 5.18 4.60 6.95

3 5.47 4.60 6.95

2 5.44 4.60 6.95

1 5.45 4.60 6.95

0 4.24 4.60 6.95

EMV 2.6 EMV 3.0

TestPICC2

z z00 Min Max

4 5.18 4.60 6.95

3 5.47 4.60 6.95

2 5.44 4.60 6.95

1 5.45 4.60 6.95

0 4.88 4.60 6.95

EMV 3.0

TestPICC2

New DPC

calibration

EMV 2.6 vs 3.0 (TestPICC2)

15

Power transfer testsConsiderations

• Although voltage limits change in v3.0, different loads

cause different measurements of voltage levels for the

same RF power transmitted.

• Overall, new power transfer requirements are similar for

TESTPICC1 and TESTPICC3. For TESTPICC2, device

might require more power in positions at close distance.

• For migrations from EMV v2.6 to v3.0, it might be

possible to fit new power transfer requirements just by

changing DPC configuration (if supported).

16

Wave shape tests

• Same test cases as for EMV v2.6. Limits are the same, with slight

changes in ringing, overshoot and undershoot test cases.

• In v3.0, all tests must be passed with the 2 different loadings (HLZ & LLZ)

for all TESTPICCs. These two configurations aim at simulating the

behavior of the reader against cards integrating chips with different load.

• Results show that EMV 3.0 specifications are more exigent in terms of

waveform shape, especially when measured with TESTPICC2.

• Short distance positions seem to be the most challenging as the new

TESTPICC loads present a low coupling with the PCD antenna in

comparison with Reference PICC from v2.6.

Differences – v2.6 vs v3.0

17

Measured Lower Limit Upper Limit Measured Lower Limit Upper Limit

Modulation Index [%] 12.8 9 14 12.8 9 14

tf 0.8 0 1.18 0.8 0 1.18

tr 0.64 0 1.18 0.65 0 1.18

Undershoot LLZ [%] 0.3 0 6.62 0.4 0 6.62

Undershoot HLZ [%] 0.3 0 6.62 0.4 0 6.62

Overshoot LLZ [%] 1.8 0 6.62 2.2 0 6.62

Overshoot HLZ [%] 1.8 0 6.62 2.2 0 6.62

Monotony falling Pass Pass

Monotony rising Pass Pass

Measured Lower Limit Upper Limit Measured Lower Limit Upper Limit

t1 2.52 2.06 2.99 2.52 2.06 2.99

t2 1.41 0.52 2.52 1.45 0.52 2.52

t3 0.74 0 1.18 0.71 0 1.18

t4 0.35 0 0.44 0.37 0 0.44

Overshoot LLZ [%] 0 0 6.84 0 0 6.97

Overshoot HLZ [%] 0 0 6.84 0 0 6.97

Undershoot LLZ [%] 0 0 6.84 0 0 6.97

Undershoot HLZ [%] 0 0 6.84 0 0 6.97

ASK Mod. Depth [%] 99.37 95 100 99.46 95 100

Monotony Pass Pass

Ringing Pass Pass

Wave shape testsResults with PNEV5180B (TestPICC 1)

LLZHLZ

LLZHLZ

Type A

Type B

z = 1cm

z = 4cm

18

Wave shape testsResults with PNEV5180B TESTPICC LETI Coil

External Sniffer

Possible issues:

• At close distances like 0 and 1 cm, the pick-up coil does

not capture enough signal due to the low coupling with

PCD antenna. This issue was already present in previous

versions of the specifications, but it is accentuated with

the tuning frequency and shape of the new antenas for

v3.0.

• It is solved by using an external sniffer instead of the LETI

Coil output of the TESTPICC antennas.

• Is important to notice that this issue is due to a

measurement error, so any compensation to fit

requirements under these conditions may lead to a bad

behavior of the terminal in the field.

* TESTPICC2, HLZ, Type A, 0 cm

Measured Lower Limit Upper Limit

t1 2.89 2.06 2.99

t2 2.54 0.52 2.89

t3 0.18 0 1.18

t4 0.14 0 0.12

Overshoot LLZ [%] 17.74 0 9.25

Overshoot HLZ [%] 17.74 0 15.22

Undershoot LLZ [%] 0 0 9.25

Undershoot HLZ [%] 0 0 15.22

ASK Mod. Depth [%] 99.34 95 100

Monotony Pass

Ringing Pass

Measured Lower Limit Upper Limit

t1 2.88 2.06 2.99

t2 2.61 0.52 2.88

t3 0.29 0 1.18

t4 0.16 0 0.19

Overshoot LLZ [%] 5.17 0 8.77

Overshoot HLZ [%] 5.17 0 12.2

Undershoot LLZ [%] 0.59 0 8.77

Undershoot HLZ [%] 0.59 0 12.2

ASK Mod. Depth [%] 98.2 95 100

Monotony Pass

Ringing Pass

*

19

LMA testsDifferences – v2.6 vs v3.0

• For v3.0, LMA limits for minimum modulation are more ‘relaxed’ than for v2.6. However, limits for

maximum modulation are slightly more restrictive.

• LMA limits remain the same for TestPICCs 1 and 2.

• For TestPICC 3 limits are less restrictive.

20

Interoperability tests

21

Interoperability testsTest positions and orientation

• New tests included to verify performance against 8 different phones at L1 level.

• Applicable for 2.6b since Q1 of 2019.

• Testing positions:

θ = 0θ = 3π/2

22

Interoperability tests

• Tested with 8 different phones

• Motion requirements

• Phone in testing position for 1.5 seconds to pass the test

• 37 positions for each orientation (74 positions in total)

• For every smartphone it must achieve:

• > 50% successful transactions in z=0

• > 83% successful transactions for all positions (including z=0)

• The average score is weighted depending on how close the

testing position is to plane z=0.

Summary

23

NXP Optimization support

24

NXP Optimization supportAdvantages

NXP offers a set of SW tools integrated in NXP NFC Cockpit to help

debugging and optimizing terminal configuration for EMV L1 Analog test cases

• Intuitive GUI to configure and adapt IC settings

• Rx Matrix → Tool to test different receiver settings and find optimum

values.

• AWG Control → To control and automatize Waveform Generator used

for tests.

• SW to control mechanical TESTPICC positioning, using economic

robot.

This provides semi-automatic register optimization for compatible NXP ICs

25

NXP Optimization supportNFC Cockpit

Menu to control

Waveform Generator

device

Menu to configure

DPC settings:

• Correlation

• Calibration

Configure Rx Matrix

tool to find optimum

settings for receiver

parameters

Read/Write EEPROM

and registers from the

chip

26

NXP Optimization supportNFC Cockpit

Cockpit includes

scripts for all

necessary EMV

testing applications

27

NXP Optimization supportDOBOT Magician

NXP FireArm Positioner to control DOBOT

28

NXP Optimization supportNXP Solution

Oscilloscope

POS

• NFC Cockpit

• Firearm Position.

TESTPICC

AWG

Control robot with NXP

FireArm Positioner to

automate tests in

different positions

Control AWG to load

responses for every

command in the loop

Configure DPC and

register settings.

Including Rx Matrix to find

optimum configuration.

29

NXP Optimization supportNXP Solution

TESTPICCs

AWG

ROBOT

Provided by NXP

NXP NFC Cockpit:• Drives PN5180, PN7462 or CLRC663 (+ derivatives)

• AWG

• RxMatrix

NXP Firearm Positioner:• Allows to automate the EMV positions for testing

• Compatible with ‘Dobot’ (~2k€)

Additional tools needed

AWG

TestPICCs

Dobot

Total

2000€

4000€

2000€

8000€

30

NXP Product Portfolio

for EMV

31

NXP Product Portfolio for EMVPN5180 – Key Features

32

Dynamic Power Control enables up to 30% increase

of the nominal driver current at same max driver spec

Transmitter current for detuning compensation

H-Field within the operating volume

Modulation index and rise/fall times

Dynamic Regulation of…

EMVCo analog compliancy -

too high power in close distance (clipping)

PN5180… without DPC

PN5180… with DPC theoretical optimum -

getting the best long range power and avoiding

close coupling power impacts

PN5180… with DPC typical example -

reaching long range requirements and

optimising current consumptionEMVCo analog compliancy -

high power required in far distance to reach

minimum levels (comm distance)

NXP Product Portfolio for EMVPN5180 – DPC in detail

33

NXP Product Portfolio for EMVPN5180 – ARC and AWC

• Adaptative Waveform Control (AWC) and Adaptative Receiver Control (ARC) allows you to dynamically

configure and adjust parameters involved in waveform generation and reception.

• Using the different gears defined in the DPC, a correction can be applied to several parameters

depending on the gear used.

34

NXP Product Portfolio for EMVPN7462 – Key Features

35

NXP Product Portfolio for EMVCLRC663 plus – Key Features

36

NXP Product Portfolio for EMV

• NXP plans to have qualified their family of NFC chips for payment by 2020

PN5180 → Already qualified for EMV v3.0!

PN7462 → In process

CLRC66303 → In process

• New PN5190 designed specifically to meet EMV 3.0 requirements;

Samples to be available before end of year

• Digital compliance is done.

• NFC Library is upgraded to support EMV 3.0 (From v05.19.00)

Summary

37

More support

38

NXPRelevant resources regarding POS

Certification NXP support End customer

EMVCo L1 contact analog

Application notes; demo board;

Report from test house

Customer schematic validation

Final device needs to be tested at a

certified lab

EMVCo L1 contact digital

Application note; source code; ICS example;

internal test report

Support on NXP stack integration

Support on EMV test suite errors

Final device needs to be tested at a

certified lab

EMVCo L2 contactLink to partners for stack ;

Pre integration support if NXP L1 stack is used

Final device needs to be tested at a

certified lab

Certification NXP support End customer

EMVCo L1 contactless analog

Antenna design guide, loop back example; internal

test report; demo board

Antenna design support & RF support from CAS

team

Final device needs to be tested at a

certified lab

EMVCo L1 contactless digital

Source code; application note ICS example;

internal test report

Support on NXP stack integration

Support on EMV test suite errors

Final device needs to be tested at a

certified lab

EMVCo L2 contactlessLink to partners for stack ;

Pre integration support if NXP L1 stack is used

Final device needs to be tested at a

certified lab

39

MobileKnowledge

We are your ideal Engineering consultant for any specific support

in connection with your EMV L1 approval process.

If you want to:

• Design a PCD L1, Mobile/Wearable L1 compliant device

• Design and optimize the performance of your contactless antenna

• Debug your device to make sure it is EMV L1 compliant

• Accelerate your time to market and avoid never-ending test processes

We have the tools and expertise to help you achieve EMV 3.0 compliance

Contact

contact@themobileknowledge.com

themobileknowledge.com

Your trusted partner and expert design

house for NFC technology

40

Time for

Q & A

Pablo Fuentes (Speaker)

Angela Gemio (Host)

Get ahead with NXP’s PN5180

Frontend - Design your POS

terminal with EMVCo (L1)

certification

41

Thank you for your kind attention!

Please remember to fill out our evaluation survey (pop-up)

Check your email for material download and on-demand video

addresses

Please check NXP and MobileKnowledge websites for upcoming

webinars and training sessions

http://www.nxp.com/support/classroom-training-events:CLASSROOM-TRAINING-EVENTS

www.themobileknowledge.com/content/knowledge-catalog-0

Get ahead with NXP’s PN5180

Frontend - Design your POS

terminal with EMVCo (L1)

certification

42

MobileKnowledge

MobileKnowledge is a team of HW, SW and system engineers, experts in smart, connected and

secure technologies for the IoT world. We are your ideal engineering consultant for any specific

support in connection with your IoT and NFC developments. We design and develop secure HW

systems, embedded FW, mobile phone and secure cloud applications.

Our services include:

▪ Secure hardware design

▪ Embedded software development

▪ NFC antenna design and evaluation

▪ NFC Wearable

▪ EMV L1 pre-certification support

▪ Mobile and cloud application development

▪ Secure e2e system design

We help companies leverage

the secure IoT revolution www.themobileknowledge.com

mk@themobileknowledge.com