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8/13/2019 Middendorf Brasilien 2011
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© Fraunhofer IZM
Dr.-Ing. Andreas Middendorf
Environmental and Resource Aspects ofMicrosystems
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Fraunhofer Research60 years Fraunhofer Gesellschaft 1949-
200961 research institutes with over 40 locations
15.000 employees
1.4 billion Euro turnover annually
Applied research in 7 strategic technology areas:
Life sciences, new materials, production technologies,surface technologies, photonics, ICT, microelectronics
Funding by:
Industry contracts (50%)
Public projects (30%) Basic funding (20%)
World-wide operations
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Fraunhofer IZMInstitute for Reliability and
MicrointegrationFounded in 1993 (in collaboration with the Research
Center for Microperipheric Technologies of TUB)
320 employees (186 full time, 134 PhD, trainees)
23 Million Euro turnover (2010)
Applied research in the field of:
Microelectronics packaging technology
Hetero systems integration
Reliability testing and simulation
800 m² clean room, specialized labs
Industry grade equipment, 200/300mm wafer processes
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Main Requirements for Electronic Systems
Form FactorReliability
Functionality
Cost
ApplicationTrends
Material, Energy,Processing, Auxiliaries
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Design
Reliabilityand Test
Wiring
Smart Sensor Development and Integration Technologies
FunctionalStructures
MiniaturizedComponents
Thinned ICs Sensors Embedded A&P
Wave guides
Advanced
SystemAssembly
System on BoardSystem in Package
Package on PackageSystem on Chip
Technology
Interconnects
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Thinchip Integration on MEMS
Example Wafer Level : AMR Sensor-ASIC-Stack
ESTLES
Baumgartner, Klein, Lutz, Röder, von Suchodoletz, Töpper
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BCB / PBO + Cu Pillar on top
Baumgartner / Lopper / Töpper
Waferlevel System Device
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All Test passed (except one)Example: Reliability: 3000 cycles passed (-40°C/+150°C)
First Failures after 300 cycles: +150°C Iced Water
System Test with Automotive Standards
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3D Roadmap
Source: Yole
Automotive
Logistic,Communication
µP Modules
Security
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• toxicity -> legislation, governments, industrial associations, company
• rebound effect -> consumer behavior
• criticality -> governments, industrial associations
• material lost, ubiquitary allocation-> ? , recycling companies, governments
• leverage effect -> governmental and industrial incentives
• energy consumption, water consumption
Environmental and Resource Aspects
energy and toxicity materials and energy
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“New kid on the block": Product Carbon Footprint
ESPRIMO E9900
Intel® CoreTMi5-670 Processor
2 x 2 GB DDR3 Memory
250 GB Hard Disc
Optical Drive Supermulti
Nvidia® Geforce® 9500 GS Graphics Card
Operating System
Keyboard
Mouse
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Product Carbon Footprint
Analysis for Desktop PC ESPRIMO E9900 / 5 years (Germany)
k g
C O 2
e q u i v a l e n t s
Use Phase 373 kg CO2e
Transport/Distribution 34 kg CO2e
Assembly 3 kg CO2
e
Raw Materials 302 kg CO2e
Mainboard 90 kg CO2e
2 Memory 72 kg CO2e
Graphic card 36 kg CO2e
Power Supply Unit 32 kg CO2e
Credit Recycling -7 kg CO2e
NET RESULT 705 kg CO2e
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Results
LCI Data Set - Summary
Data referring to a waferprocessed by an average number of mask layers
3.9 m³
waste water
1.2 kgorganic chemicals
1.8 kgother technical gases
59 kgnitrogen
1.06 kginorganic chemicals
1.67 kginorganic acids
3.9 m³water
215 kWhenergy
2.8 kgwaste
14 gVOC emissions
0.8 g
acidic emissions
0.44 kgcarbon dioxide
Process Assessments – Motorola Fab case study
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Wafer
Energy
Water
Chemicals(fluid / solid)
Gases
Processed Wafer
centralplant
processcooling water
compresseddry air
recirculatingair
exhaust
Air
Waste water
Exhaust air
Waste
make up air
thermal
thin films
dry etch
ion implant
watertreatment
MaterialRevalorisation
Reuse
Recycling
EnergyRevalorisation
Incineration
CMP / backend
Wet benches /
cleaning
patterning
Results
Mass Flows - Example: Chemicals and Waste
ultrapurewater
Process Assessments – Motorola Fab case study
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Fresh water usage of developing and
developed industrialized countries
0
20
40
60
80
100
Developing Countries Developed Countries s h a r e o n f r e s h w a t e r u s a g e i n %
Agriculture
Industry
Households
• about 335 Million people 1991 live in countries with a lag of fresh
water
• up to 3,3 Bill. people 2005 live in countries with a lag of fresh water
• up to 50 of the water used by industry is not able to be used again.
Challenge Fresh Water
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Input Output
Product
Waste
PreliminaryProduct(s)
Auxiliaries Emissions (Water)
Process(es)
Product part (%)
Sy s te m ounda r ie s
Emissions (Exhaust)
Calculation of process-related TPI value (either focusing on inputs, outputs, orboth)
Assess Process Toxicity – ProTox (Process ToxicityIndicator)
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New Base MaterialsIn reaction to diminishing fossil fuel supplies and oil price fluctuations newmaterial sources become viable.
Efficient renewable materials have a better CO2 balance.
Not all renewable materials will be “greener”.
Developments center on best technical properties with the lowestenvironmental overhead.
From “low end materials” to “customized materials” in electronic applications
Pure material recycling or bio-recycling secondary to compatibility with EEE-waste streams (i.e. shredder mix or directly to metal recovery)
Low cost potential (for unmodified polymers)
Electronics from Renewable Materials
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TVs to be labelled from Nov 2011 onwards
Televisions: Energy Efficiency Labelling
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N u m b e r o f u n i t s
s o l d
Environmental performance, e.g. energy efficiency
EuP minimumperformance
standard
Before
EuP
with EuPminimum
performancestandard
with EuP minimumperformance standard
and labelling
class G class F class E class D class C class B class A
Effect ofMinimum Requirements + Energy Efficiency Labelling
Nissen, Schischke, Stobbe
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Prepared by The Basel Action Network (BAN)
Silicon Valley Toxics Coalition (SVTC)
(Original Report 2001/2002)
With Contributions by Toxics Link India SCOPE (Pakistan)
Greenpeace China
Looking back 10 years:More awareness; some progress (legislation and enforcement)But essentially electronic waste sites are still growing in Africa and Asia
The High-Tech Trashing of Asia
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Bloom laptop, Prototype for„recyclable“ laptops; Stanford /Aalto
Ecodesign trends
Solar-LaptopDesign study Nikoladesign
LG Electronics,Concept study, 2006,fuel cell and OLED
display
Bamboo laptop parts,source: Asus
13-inch MacBook Air
weight: 1,3 kg
• Mercury-free display• Arsenic-free display glass• BFR-free• Polyvinyl chloride (PVC)–free internal
cables and power adapter DC cable
source: Apple
One Laptop Per Child,MIT
Schischke
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Eco-Design Directive
EuP (alt):Directive 2005/32/EC of 6 July 2005 establishing a framework for thesetting of ecodesign requirements for energy-using products
ErP (recast):Directive 2009/125/EC of 21 October 2009 establishing a framework for the
setting of ecodesign requirements for energy-related products
http://ec.europa.eu/energy/efficiency/ecodesign/eco_design_en.htm
Legislation trends – a little bit eco for the Design
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Trade-offs
D4R =
Design for minimised production waste
Design for production waste recycling /downcycling
Design for lifetime extension
Design for reuse
Design for repair
Design for disassembly
Design for depollution
Design for material recycling Design in recycled materials
Middendorf, Schischke, Marwede, Schlösser
Always „Re-Invent“ Design for Recycling
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S t a n d a r d i s a t i o n
M a n d a t e
( C E N E L E C )
EuP Preparatory Studies
Least LifeCycle Costs
ImprovementPotential
Significant
EnvironmentalImpacts
Measurement /
StandardisationRequirements
EuPImplementing Measures
rP
GenericRequirements
SpecificRequirements
EUEco-Label
EU EnergyEfficiency Label
voluntary mandatorymandatory
VoluntaryAgreements
Whenambitiouscomparedwith businessasusual andsignificantshare of themarket
or
Revision 5-10 years depending on product group and progress of technology but staged requirements possible Dynamic but predictable to encourage improvement products while providing clarity on investments for Industry Consistent - Thresholds to be maintained (A becomes D etc.)
- Reward Development of ‘good’ products, compatibility of incentives
Nissen, Schischke, Stobbe
Synergies of EU Policies
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Energy Harvesting for Condition Monitoring Systems
Workflow – From ambient energy profiles to sustainable energy harvesting solution
Feasibility study:Concept forenergy supply
1st prototype:Field test andevaluation
Final
demonstrator:Integration andoptimization
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Analysis of housing concepts
M1
M2
M3M4
0
500
1000
1500
2000
2500
0 0,2 0,5 1
A v e r a
g e p o w e r g e n e r a t e d [ µ W ]
Velocity of air [m/s]
Module Design
M1
M2
M3
M4
CFD simulation oftemperature distribution for
various housing concepts Varying size of
thermoelectric device andcooler
Comparison of housingmaterials
Varying ambient conditions(flow of surrounding air)
Simulation of net poweravailable after voltageconversion and buffering
Optimum design dependingon ambient conditions
Benecke, S.1, Rueckschloss, J. 1, Middendorf, A.1, Nissen, N. F.2, Lang, K.-D.1,2: Energy Harvesting for Distributed Microsystems – The Link betweenEnvironmental Performance and Availability of Power Supply, in Proceedings of ECODESIGN 2011, Kyoto, Japan, Springer Publishing 2011
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Availability of Power vs. Resource Criticality
RARI 2011:
Requirement for innovation,evaluating the statisticalrange of coverage
Origin, evaluatingconcentration (andtherefore possible
monopolies) on countries Origin, evaluating the
political stability ofproducing countries
0% 100% 200%
M1
M2M3
M4
0% 100% 200%
M1
M2
M3
M4
0% 100% 200%
M1
M2
M3
M4
0% 100% 200%
M1
M2
M3
M4
Increase of environmental indicator (RARI2011)
Average power generated
Natural convection
v=0,2m/s
v=0,5m/s
v=1,0m/s
RARI evaluation:
Hotspot active materials(esp. bismuth) and solder(tin) due to limitation tofew local concentrations
Reduction of dissipativeactive materials through
large scale usage of passivematerials for cooling - ifmetal recycling is an option
Trade-off solution for‘mount-and-forget’ systems
Application-oriented designfor minimization of
environmental impacts
Benecke, S.1, Rueckschloss, J. 1, Middendorf, A.1, Nissen, N. F.2, Lang, K.-D.1,2: Energy Harvesting for Distributed Microsystems – The Link betweenEnvironmental Performance and Availability of Power Supply, in Proceedings of ECODESIGN 2011, Kyoto, Japan, Springer Publishing 2011
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Joint International Congress and Exhibition
A Co-Operation of theWorld‘s Leading Conferences
Program Overview
Sun Sept. 9th Tutorials, Get Together
Sept. 10th -12th Conference and Exhibition
Thu Sept. 13th Technical Tours
Location the Dahlem Cube / Seminaris CampusHotel, Berlin
Chairman Prof. Dr. Klaus-Dieter Lang
organized by
Taking Green to the Next Level
September 9 – 13, 2012 · Berlin, Germany
Thank You for Your Attention!