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J~ META~06RAPH"'i EUROPE
TABLE OF CONTENTS
CHAPTER
3 day programme layout
1
Microstructure & Sectioning 2
Encapsulation
3
Single Point Tools
4
Surface
reparation to Integrity 5
6
hin Film Measurement
Traceability to ISO 9000
7
Microscopy & Photomicrography
8
Group Questionnaire
9
Material Classification & Preparation
Methods
10
Own Preparation Method
11
Company Standard to ISO 9000 12
Much of this mataial basbea1 aken ItBD he boot 'Surface~~-aDOO &; Mia~ of MaItJiaIs'
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B. BOUSFIELD, Buehler Europe Ltd. Coventry, UK
The first of its kind, this book s d~icat~ to the systematic reparation f a
vast rangeof materialsurfaces,ooking n detail at the problemof
microstruCtUralraceability. Designedo be of practicaluse, he book hasbeen
written in two parts. In the first half, tile book systematically efines he
essential roceduresnvolv~ in surfacepreparation. Having establish~ how
to preparea sampleof integrity, the secondhalf of the book llustrates he best
useof microscopyby discussing,n depth. he different featureswhich
contribute o informativeanalysis.
Completewith over 100stunningcolour photo-micrographsnd ully illustrated
throughout, his book providesan essential eference or researchersnd
technicianswho requirea comprehensiveverviewof microstructural nalysis.
CONTENTS:
PART 1: SURFACE PREPARATION: Introduction; Sectioning; Mounting; Single Point Tools; The
New Concept; Grinding; Polishing; Grinding and Polishing LubricantS; Towards a Metallographic
Standard; Characterization: Auditing aOOTraceable Standards; Traditional Methods Only; Preparation
of Spray Coatings; Preparation of Composites; Preparation of Minerals; Preparation of PCB's aOO
Electronic ComponentS;Thin Film Measurement; Preparation of Soft Materials; Preparation of
Ceramics; Hardness; Training in Metallography; Supplementary Materials, TechniquesaOOMethods;
PART 2: APPLIED MICROSCOPY: The Microscope - A Resume; Microscope Types and
Nomenclature; Creating the Microscope Image; Objective Aberrations; Improving the Image;
MeasurementS; llumination System; EyepiecesaOOCondensers; ntroduction to Interference; Surface
Finish Interference; Contrast Interference; Video Imaging and Archiving; Polarizing Light Microsopy;
Fluorescence, Reflectance and Con-focal Microscopy; Photomicrography; Inverted Techniques;
Photomicrography in Practice
100.00/$164.00
471931810
356pp
1992
ORDER FORM
Y I
IMPORTANT
-
EC Countries please c:ootplcIC details below.
( J I am reg~ for VAT. my VAT regislnoon number s
Please
sendme copy(ies)of:
BOUSFIELDIMirosuPJ
0411931110 I~.IOISIU.DO
Please add IXIsta&eof 2.001$5.00 or single oniers. Multiple orders
a~ POST FREE.
[J I enclose a cheque/bank dRft for
- --.
(paJQbl~ to John Wil~ 40 SolIS LId'
[ ) Please charge my c~iI ani ~JI(
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~
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If reciSleraS for VAT. please quOIe your VAT IaImber above. For
~isteted CUSIO~rs. .. may be IIeCessaIYm add VAT ~ your
order.
N_: (PLEASE PRINT)
Address:
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[ J PleAse SCltd 1Ie 11l1voice
[ ) I dt, nuc WWI It. receive mailil1ls rrom ocher Companies
You I1\aY elepl\(l1~ our Custon~r Service Dcpl with your onter
by diMlling +44 (0) 243829121 or linkline number 0800 243407
(UK only).
\~ will mUlod your "'Yale.- wiI'-t lIusluR Ir yvu rot aDY a_-cd
I.-k '0 ..18 ~c ~- wiI- )8daJS.
YOlir ..rdel will be ~ PRM..y boA picuc allow 21 days ror
dcl;wcry. All pricd correa al lime ar ~ni~ \0 prcu bul subja:t ~
cllangc
SicnaQlre
.- -
~ Dare
Reaum 0:Nicky DouClas:Pbys. Sci/A4. JohnWiley a. s- 1..81..
BaffmsLaM. ChidleSlcr.~ Su~. POI9IUD. UK
RF.
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J"i.
METALL06RAPH:'/ EUROPE
CHAPTER 1
DA"'lONE TUTOIUALS
roTORIAL
MET ALLOG RAPHY AND THE
W CROSTRUCfURFJSECn 0 NIN G
DISCUSSION SEcrIONlNG OPTIONS
nJTORIAL
ENCAPSULA TI 0 N ISING LE PO)NT TOOLS
DISCUSSION
ENCAPSULAnON OPnONS
TUTORIAL
SURFACEPREPARAnON TO INTEGRITY
DISCUSSION GRINDING POLISHINGOPriONS
TUTORIAL THIN Fn.M MEASUREMENT I HA RDNESS
IMA G N G AND A RCIDVIN G
SLmE
P~ENTATION
PREPARAnON ARTEFAcrs
roTORIAL
MICROSCOPYAND PHOTOMICROGRAPHY
SLIDE
P~ENTATION
EXAMPL~ OF WELL PREPA RED SAMPLES,
EXPLOITING THE OPTICAL MICROSCOPE
1.1
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DAY TWO / DA YTBR -PRACTlCALS
INSTRUCTOR DEMONSTRAT10NS
AM PM
8.30 DELEGATES SPLIT INTO 3 GROUPS A.B.C. 1.00 STAY IN SAME 3 GROUPS
DAY TWO
W""IA~ I I..
11.10
, 11~.
111~
I
1
11.-.
12M
~
~TA~
1"-'
Is..
-
~~~~
~~ -'8 '
1
I ~
DEIIoNS1RAmNC'~PLETE PAEPARAmN
.30 to 1.00 am
DEIIoNS1RAOON ~ ~PLETE PREPAAA 1ON
.00 to 3.30 pm
4.30 to 5.00 pm
REVEW IN NA iVE LANGUAGE
Otherperloda
D8cuSSlON ~ 11NGTO PAEPARA TIOH UUG A FLOW CHART WITH
OPTIONS
DELEGATES OWN PREPARATION
DAY 3
Delegates split into 2 groups X I: Y
lAM IPM I
I 1.31 I 1.18 I
4.50
COURSE DIRECTORS OVERVIEW OF COMPLETED COURSEWORK
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MET ALLOGRAPH\' EUROPE
CHAPTER
MlCROSTRUC11JRE. SEtnONlN6
Metallography is both an understanding of 'material
sU"Uctures' nd the 'scienceof revealing hose suucwres'.
The sttuctures of materials can be 'macro' (low
magnifICation large field of view) or 'micro' (higher
magnifications
-
small field of view). The material
microstrucblre is the 'rmgerprint' of metallurgy Le. the
microstrucblre is directly related to the performanceof
that material. The materialstructure has a relationship o
the physicalandmechanical ropertiesof the material.
MICROSTRUCTURE
H the microstruCnlre is to be correctly interpreted it
follows that the microstrucblre must be a true and faithful
representation. Since most methods for the surface
preparation of materials involve mechanical working
(stress dislocation) which induce damage into the material
care must be exercised in conn-oIling this damage to a
minimum.
MACROSTRUCTURE
MacrostructUres are often visible to the naked eye, but in
general are aided by the use of magnifying lens,
stereoscopic micr~ope (double image) or the single axis
macroscope. Surface preparation for the analysis of
macroStIUCturess generally confmed to fine silicon carbide
papers.
A macrostructure ould be used o defme:
. FracttJremorphologyand grains
. Dendrites n castings
. Welding ntegrity
. Porosity
. Cracks
.
Exterior swface condition
MICROSTRUCTURES
Microstructures would be observed using a compound
optical microscopewith fields of view as low as O.18mm
and resolution of O.25Jjm. When resolution less than
. O.25Jjm s required it is necessary o use the electron
- microscope. The two basic ypes of electron microscope
being he scanning for morphology) and the transmission
(internal structure). Surface preparation can be
mechanical,chemical (electrolytic) or chemomechanical
(chemicals sed n con.unctionwith the rindin action.
Copyright 1994 BUEHLER Ltd
2.1
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MET 06RAPH"/ EUROPE
FA 1THFm. REPROOucnON
Brief mentionbas beenmade o the n~ for samples hat
are a faithful reproductionof the original material prior to
~bani~-ti woIting. Sampleshat are a true and faithful
reproductionare often referred o as 'sampleof integrity'.
So what can 'go wrong' as we mechanicallyprepare
material specimens for microstructural analysis?
Elements anbe:-
.
Fractwed
. Pulledout
.
Washed out
.
Etched
.
Smeared
. Distorted
.
Enlarged
.
Transformed
Elements can also be affected by:-
- Heat
-Pressure
- Surfaceriction
- Force irection
Artefactsoccurby incorrect:-
. Abrasive ype/size
.
Abrasive akeangle
.
Abrasivebacking
. Abrasive unction
.
Lubricant
.
Surface peed
.
Grindingsurface
.
Polishing urface
Resultsareaffectedby:-
.
Blunt abrasives
.
Prolonged insufficientpreparationimes
.
Chemicalattack
. Cl~JiQess (lack of)
.
Incorrectencapsulation
. Resincontraction
. Incorrectsectioning
From he our ~ abovet canbe seen ow an ncorrect
approacho surfacepreparation an inttoduce esidual
damage eading to an erroneousanalysis.
2.3
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METALL06RAPIrl EUROPE
SEC"nON1N6
Before any sectioning akes place the need to carefully
selecta representative reacannotbe over stressed. The
microstrucmreover the entire component may not be
unifoml, therefore,decide beforehandwhat the object of
any section s for and wherebest his can be ocated.
Figure 2.3 Sampling Identity
Figure 2.3 is used to illustrate a simple fonnat for
designatinghe samplingposition and the swface of
interest ithin hesample.
Figure2.4 Sample SpecimenDefmition
The word sampleand specimens often used to describe
the same hing, with the conventionas shown n figme 2.4
this shouldnow be overcome.
Sectioning s considered o be one of the most imponant
steps in the preparationof surfaces or microstructural
analysisand before one can proceed rom this point it is
wise to havesome dea of the depthof damage esidual n
the sample esulting rom the sectioning tage.
Copyright 1994BUEHLER Ltd
2.4
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MET ALL06RAPH'/ EUROPE
FIgure2.5 Depth of sectioning amage
This Z axis infonnation is derived by resectioningand
preparing o integrity the surfaceadjacent o the original
cut (figure 2.5)
WHEEL
TRA VERSE
RATE
Slow
Fat
DEPfH OF
DAMAGE (fUD)
10
45
Soft Bond
Alumina Grit
Bard Bond
Alumina Grit
Slow
Fast
20
900
Hacksaw
Normal
70 + 200
Figure 2.6 Sectioningdeformation .37% C Steel
Figure 2.6 gives the results from a series of different
sectionson a pieceof 0.37%CarbonSteel,notice how the
resultant deformation or structural damage varies from
10JUDo
9O0Jl1U.Without this nformation t is impossible
to 'tailor' the most appropriatesubsequentpreparation
steps. To put the 9O0JUDamagento perspective
(A) 3 samples f 0.37%C Steel,diameter 5mm,when
usedon 8" diameter180 grit silicon carbidepaper, or the
life of the paper,would remove100JJIn.e. 9 sheets f 180
grit paper would be required to remove the 900J1m
damage.
(B) 3 samples f ~ C Steelunder the sameconditions
would require 18 sheetsof 180 grit silicon carbidepaper,
Le. 50~ per sheet (These igmes are basedon optimum
cuttingconditions;silicon carbidepaperswill remove wice
the amount quoted but this extra material removal will
induce ntolerable evelsof residualdamage).
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METALLOORAPm' EUROPE
WHEEL
SPEED
IpD
100
DEPnf OF
DAMAGE (JDD)
TIME
MINUTES
METAL
BONDED
DIAMOND
10
~
METAL
BONDED
CBN
100
.
IS
11m
so
~
RaIN BONDED
sn.ICON
CARDa
lUX)
9
2
2(XX)
7
Figure2.7 Sectioning amage luminium Alloy.
The resultant tructuraldamage hown n figure 2.7 is used
to illusttate the relationship hat exis~ between abrasive
type, bond, operating speed. cutting time and residual
damage.Take the diamondwheel n comparisonwith the
cubic boron nitride (CBN) wheel operating at the same
speed. The CBN wheel manifestsa reduced depth of
damage ndcuts n less ime. When he CBN wheel speed
is increased o does the damagedepth and cutting time.
Ftnally the abradable esin bonded silicon carbide wheel
reducescutting times dramaticallywithout an increase n
damagewhen he speed s high. This chart indicates hat
there s (I) an optimum cutting speedand (2) an optimum
abrasiveresulting n (I) a minimum esidualdamageand
(2) a minimumcutting ime.
Figure 2.8 - Sectioning Characteristics.
Sectioning haracteristics ave beenbrought together n a
singlechart figure 2.8), llustrating he effectsof lubricant.
speed, abrasive size and type, abrasive concentration,
wheelbond,wheel hickness ndmechanicalactors.
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METALL06RAPH'{ EUROPE
Figure 2.9 Characteristics Metal Bonded diamond/CBN
wheels
This final chart s intended o give guide ines when dealing
specificallywith metal bondeddiamondor CBN sectioning
wheels. Speeds, lubricity, operating speeds, wheel
dressing,abrasive ize and concentration re all addressed.
2.7
opyright 1994BUEHLER Ltd
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SECTIONING OPTIONSGUIDE CHART
Reference the enclosed (reduced) Wall Chart. From this chart we are able to
select the most appropriate cut-off wheel to suit specific user needs. From
the 'legend' at the bottom of this chart, notice how abrasive concentration is
depicted by the number of abrasives (low and high). Abrasive bond strength
is related to the number of cross-lines i.e. single cross-line weak bond - multi-
cross line strong bond. When dealing with expensive abrasives such as
diamond or cubic boron nitride then the bond/abrasive will be attached to the
'rim' of a circular metal disc, this is depicted by an extra semi-circle. This 'rim'
can be a resin or metal matrix. When metal matrix, the bond is shown as a
square grid. The type of abrasive is also designated by shape viz square =
alumina, triangle = silicon carbide etc. When different size abrasives are
used then a numerical system is employed i.e. 5 = small, progressing to 20 =
large. The first five wheel types are all intended for ferrous materials of
different degrees of hardness, the wheel abrasive being alumina. Notice the
8th wheel on the list, this is also alumina but is a much thinner wheel than the
previous alumina wheels. Being a rubber bonded wheel (as opposed to
resin) it is less likely to fracture when slightly flexed. This wheel is intended
for delicate cutting, it also finds many applications which induced cutting
damage must be kept to a minimum, viz sectioning of plasma coated
materials.
Silicon carbide wheels (6th and 7th) are offered for sectioning non-ferrous
materials. they can however prove equally successful when sectioning
ferrous materials though wheel life would be very much reduced.
The rest of the wheels in the range are of the non abradable type
(diamond/CBN). Much development has gone into these wheels to make
them very specific to the hard and brittle fracture materials as shown under
'Materials Applications'.
Copyright 1994BUEHLER Ltd
2.8
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( )
BUEHLERPTIO~ 5
SfCTJO~JU~
GUIDE,
BLADE
iype-
.ABVAS'VE
SIZE
(-s
M.ATEQ'I~1.
App\.ICA,..OIJS
0UO
A"t U.
... ...
"
,
. .
10. ~
('-'i-I:)
~-enOl
t4MH
Aa~~~
t~..'
EXT~f)fELY ~A~ F'f22OU:' AJ. .OY",
WNn'e ~T 12OV, '.JI;aA~O (') """1 -~, ~O)
/)
10' J
('-"1-14)
-"- 8Ul7
\'NY TOU~II MKrerl.A1.5
HACDe1-~ 'TOOl. S'T'ef\..'. JJI~&. ~Au.D'r5
_H~
A~~~e-
-.es,."
..'.'.
. .
lo'j
(,-It-~
5- 61207
t4H
*J.DJ,&L~
Rn
t~..~
I -~tt5'
R':I 01.;;.'"
a..-T.AL
. 'lD L'
,
(. ,)
MAgO TOIIG ~lT :f'.".5. ~uCTII"('~1. C:f'.l~/C~ &OA.'
CAe&l~, &oe;,..;V-"'O(. 5'\.""; L'fT~U. .
.
-41&5
ElM ou. "(
ME'TAI.
10 ~
5'
C"7)
"~IM I. ~o.., c.efAIIC', tLfCTEWC PA(~(O~~.G..~..4I.U
GLA55 ~ Rf.I1'F"ORcn (~IT~'
~~~~
Vr ~'"
n-~:"5
5'
(3)
~ ~Ioi CEr.A~"~.FlA;f RfII:FoeC"'" L'~I~.
c..F't .~,",. CARS~ Ccal't)5CTiS . u=../c~"'" .~.
tu 0&.'1.'(
WET~I.
'5' Lc.
LE-qr)JD
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SECTION1N6
Wheels break for a variety ~ ~DS
and can be frightening whell they CUr.
Abrasive wheelswhen manufacturm are
car8:ully tested to emure safe operating
speem, these operating conditions mlm
be adherm to in use. Wheels can break
be(:aD-~ hey become ammed into the
workpiece, thk Is usually one ~ two
factors (a) the workpi~ (Spedmen)~
moved, or (b) the whee) ~ wandered
(movedoff uis.)
FAULT: WgF:F:I.BRAKA6E
~...
,.
;.-~ sontR
: Wt[L
.
1-_"
SAWPL
To overcome (a) It win be ~ry to
attribute the ca~ of any movement, '
it is s~ caused by dampiug then
siugle pcXntdamps will be necessary. f
the s~ Is within the workpi~ and ~
releasedas the cut tak~ place then the
workpi~ shcx1ldbe 5treG relieved or
incremental cutting adopted.
REf.
ONLY
~a.NAP
ALTERNATIVE
STRESS REUEVE
REDUCE COOLANT FLOW
REDUCE CUTTING FORCE
o oven:c:Mneb) a softer wheel is often
all that is required
FAULT: BURNIN6
Although burning can readily be
o~rved on the cut surface, what is I~
obvious is the depth to whim the
burning hM affected the micr~cture.
This depth for example an vary fnMn
2Oprn to 25OJIIDwithout a dramatic
change in the top surface burned
appearance. Some materials are
adversely affected by thama1 shocking
whel'e It is not ~arlly the
temperature mange but the Iocalised
shock hat occurs through im11ftJdent r
poorly directed coolanL Burning can
very ~ be overcome, ~ng the
coolant k appropriate, by reducing the
traverR rate. Softer wheels, although
the obvious molce, mU give a reduced
wheel ire.
~ ;~." ,
. " ..
",
.
W.
,
)---,
,
,
.
.
:_--~
~
~--,
-,-0
\
\
--I
: SOFTE
: WHEEL
..1
~
~
Al TERNATIVE
REDUCE RATE Of' TRAVERSE
CHANGE POSITION OF'
LUBRICATION
2.10
Copyright 1994BUEHLER Lm
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SECTIONING
FAULT: PICK-UP II. WHL 6LAZlN6
./
.
,
-'.., . sanER
.
.
WHEEL
: c . :
. -.I..1 .
Swarf pick-up is evideut wta merving
~ ~phery of cut off ~ after use.
This oolKlition s m
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SECTIONIN6
FAULT: CONTACTAREA
The contact
area is a vitally imJX>nant
factor in the ability to successfully section
any workpiece or comJX>~nl The
number of abrasives in contact relating to
the generated fttCes ~cessary. With this
in miOO it is always wise with abrasive
sectioning to take ~ least contact area
possible. This is oot always JX>SSible ith
a workpiece that changes the area in
contact as the cut ~ (circle), on
these occasions either iocremenW cutting
a: the oscillating headsystem will improve
cutting performance. S~en rotation is
another m~ of ~~- 1g a constant
contact area, d1is facility also helps to
ensure paralleledi~
romJK>nCn1.e.
it reduces any ~ for the ~ to
drift.
.t'
REDUCE
ONTACT
AREA
~J
,
.~
~
At TERNA TIVE
WHEELsc~nON
INCRE~AL CU1TING
SPECIMEN ROTAnON
FAULT: RSWUAL DAMA6/
WHEEL WEAR
s~ or workpiece
esidual damage s
a factor often ovedooked yet in our field
of miaostroCb1ral analysis we must 00
more dIaD u.\1 section ~ COInIX>nent, e
must adlieve a sample widt ~ least
residual damage. Wtae d1is s a JX'ob1em
a thiDOC'blade (X' ~ wiD often suffice.
These d1in blades are often robber ~
and are also re~ficia1 f(X' sectioning the
more delicate comJX)~nt. Reducing d)e
abrasive particulate size wiD also reduce
defonnation (residua] damage).
FAULT-SPECIMEN RESIDUAL DAMAGE
HIGH DEFORMATION LOW DEFORMATION
f{
~1
\\
0
)
USE THIN
.
WHEEL
ALTERNATIVE
REDUCE ABRASIVE ",
SIZE
f"AULT-RAPIf') WHF"F"I WfAR
Having selected~ 'best' abr3sive/0000
combination axupatible with efficient
sectioning of a particular material ~n
operating fcxcesmust be ~red to. To
use the ~ urm higrer than the
optimized pressurewill certainly reduce
the sectioning ime resulting n rapid wheel
wear, naeaseddefcrmation nd ncreased
generatedheal To inaease the matrix
bond strength of the wheel would also
reducewheel wear.
. " . .
"'"
""'~
"'"
po
"v
,
- - -:
HARDER
. HEEL
.
1'--
~
.
-.
,
ALTERNATIVE
RCOUCEPRESSURE
2.12
Copyright 1994BUEHLER Lm
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SECTlONIN6
FAULT: SAMPLE BURN1N6
This ackIitional section 00 bIrDing is to
draw attention to ~ lubricant or c(Xjant
which infiuelx:es ~ eflideu;y of any
sectioning ~tion. Cutting wheels wiD
~te differeDtly as ~ tem~
affects ~ resin 1xmd Some wheels fcr
example are designOOo ~te dry aIJd
~ ~te efficiently when ~ ~
temperamre rises. ~ wheels we are
ma:e familiar with are dX)5e which are
'jetted' with coolant to keep ~ sample
(XX)}or ~ totaDY ~ in axiant
avoiding thermal shocking. It is important
with these ~ to target, wIae
possible, ~ jet of coolant into ~ an aDd
arowK1 ~ sample and WOIkpi~
Targeting ~ coolant onto ~ ~
thereby keeping it (XX)}wiD iIKhlce sample
OOming by effectively hardening ~
wheel. Heat must be g~ted wbe:n
'working' any mIface. On this occasion t
is wise to cxmfiDebeat, where possible, to
the swarf and blade.
_R~~
I
~-1--r-;;TTR
.~
~~;;,
--~~~~
-~T---
AMPLE
; ;jATR
WHEEL BONO TOO STRONG
SAMPLE BURMNC
I
~EJtE~~
AlTERNATIVE
USE SOntR BONO WHEEL
TRY LESS LU8R CANT
TRY DRY CUT SLOWER TRAVERSE
FA UL T: WHEL P R OFIL - IN CORR CT
USE
When coolant is used. even when taking
into consideration ~ {X)ints rdised atx>ve.
it will be l~~ to wet ~~. ~
Bow onto ~ ~ must re equal 00d1
sides if unifcml ~ wear is to take
place. ~ ~ pofile can also re a
clue to correct matrix tKmd as sIK>wn n
thesketdl.
'" WHEEL
,
,
"
~
~
POINTED
~
"
/""""""""'~~SUR COOlANT
BOTH SIDES or WHEEL
-
/
CHISEl.
ALTERNATIVE
KEEP COOLANT FLOW
AWA"" FROM SlOES or
WHEEL
Copyright 1994BUEHLER Lm
2.13
USE
SOFTER
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SECTIONIN6
FAULT: POORSCRATCHPA nRN
It bas been kIXJwn for ~ reflectivity c:t:
~ sediooed surface to re used as a guide
to ~famation free cutting aDd fcx the
weD ~tdl~ surface to re rejected. This
in fact is an ~ assumption since it
is ~ OOrnisbing CX fXX'C cutting blunt
abrasive that causes ~ shiny roOOition.
Efficient cutting takes place ~ using
sharp abrasives and sharp efficient
abrasives leave wen defined saatches. It
is impcxtant thc'efore to recognise a gocx1
saatdl pattern sinre this wiD often JXOve
to re t1M::ime emcient mettxx1, but above
all t1M:: etIxx1 hat least alters ~ material
structure i.e. d1emost faithful.
~
~
- ,
~
RUL(CTMTY HIGI
SOF"TER
WHEr-L
~..,:-
1fA~
YLl
~~~~~ RE~ LOW
FAULT: STRUC11JRAL AMA6
SECTIONING
~
This sketd1 is used to reinforce ~
importance of m~1cing he sectioning stage
~ most imP
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-
SECTIONING
When sectioning coated layers such as plasma
coatings or materials with a friable surface it is wise
to direct the cutting force, first through the coating,
followed by the substrate, failure to do this can result
in delamination as shown. When dealing with a
friable material or a porous coating it is wise to
vacuum impregnate prior to sectioning. The vacuum
necessary will be dictated to a large extent by the
size of interconnecting paths between the pores.
When the specimen has been totally immersed it is
possible to use isostatic pressure to increase resin
penetration. A lower viscosity resin will also improve
resin ingress. Irrespective of any protection
provided it is still wise to direct all forces in the
direction of resin -coating -matrix. Notice from the
sketch how not all pores are 'open pores'.
SEcnONlN6
FAULT: SAMPLE ORIENTATION
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MET AlJ.06RAPH\' EUROPE
ENCAPSULA110N
HAPTERS
NCAPSULATlON
Specimens
remounted r encapsulatedo (a) protect he
sample material. (b) produce a uniform dimensionally
stable size for subsequentautomatic machine operation or
(c) assist handling for subsequent band operated
procedures. The 2-types of mounting techniques available
are compression hot mounting and castable cold mounting.
Additionally there are two basic types of resins. those that
once set will remain rigid even when subjected to heat
(Thermosetting) and others which once set can be
rendered plastic when subjected o heat (Thermoplastic).
Castable cold mounting resins set after reaching the
exotherm temperature and can be thermoplastic or
thermosetting. These resins do not require pressure to set
and are simply poured into appropriately shaped cups.
Compression hot mountings are also available as
thermoplastic or thermosetting. This powder mixture is
encasedwithin a pressure chamber and requires a specific
temperature relative to pressure to set the resin.
Thermosetting resins 'set' at the hot curing temperature and
as such can be ejected from the mould chamber when hot if
necessary. Thermoplastic 'set' below the peak temperamre
and must therefore he ejected when cool.
Furin~
eatIng
Cooling
~
"
~
f
~
t'
~
Solid
THERMOSETTING
Liquid
k
e
i-
f. '
Heating
CoolIng
Eject
THERMOPLASTIC
Fig 3.1 -CompressionMoulding Conditions
Fig 3.1 llustrates he heating curingconditions or both
the Thennoplastic ndThennosetting ot mounting esins.
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METALL06RAPHi EUROPE
RESIN REQUIREMENTS
Ideally we would like a resin to have nil contraction, to
adhere to the sample, to have an identical abrasion
characteristic to the sample and be easy to Pombo
Unfortunately this is rarely, if ever, possible to achieve
therefore he object s to define he 'prime' requirementsand
relate hese o the resin. From the point of view of a4hesion,
only Epoxy resins fully satisfy this requirement with the
Phenolics eing he eastaccommodating.With castable old
mounting esinscontraction s an important factor. With hot
compressionmounting the different coefficient of tbennal
expansion etween esin and mount also becomes mportant
As an example he coefficient of lbennal Expansion crE)
for some esinsare as ollows:-
Phenolic3/4.5 x 10"
Acrylic 5/9 x 10"
Epoxy 4n X 10"
Metals 1/3 x 10-'
.
.
.
.
From these igures t is easy o seehow the resins would be
shnmk onto a round samplewhen cooled.
Figure 3.2-Reducing Contraction
Grinding relief betweenmounting esin and sample s to be
avoidedwhenedgeanalysis s to be carried out To avoid
this sitUation he abrasion atesbetween ampleand resin
must be considered.
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METAu.06RAPH"l EUROPE
ABRASION CONSTANT/If'AT
LASS MATERIAL
Hd.M~
Prek8d 1m-
~
M-.iaII
~
~"-baIaIe
~yRaa
Aaytie
Ccid Mmmtiq
f.paIy
AayIic
~yeIt
AayIio+AV
170
1040
1100
m
M~
Cq.-ADoy
SIerJ(O.37)
A l i.iIaII ADoy
35
12.5
142
Figure 3.3 -Abrasion rates grinding
Figure 3.3 gives comparison rates betWeenvarious materials.
Two important points relating to this chart are (1) the
reduced abrasion rates on compression mounting when
compared to castable resins and (2) the reduced abrasion
rates of metals relative to the resins.
,
S
I Carbon/carbon
" tee I /
henolic
Epoxy
(b)
a)
(c)
Fig 3.4 - Relief Grinding
Figure 3.4 gives examples f positive and negativegrinding
relief. Additionally at (c) is the example of differential
interphase relief. This is vital when ~ing differential
interference ontrast, he heightdifferencehowevermust not
exceed he resolutionof the microscope bjective.
The following is a list of attractions or both compression nd
castablemoulds.
Copyright 1994 BUEHLER Ltd
3.3
(JDD/miD)
.160
440
130
SXJ
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NCAPSULA TION OPTIONS 6 UIDE CHART
-- -
Reference the enclosed (reduced) Wall Char1. From this char1 we are able to
see at a glance the variety of moulding materials available and the various
characteristics relating to each resin.
In the field of materialography, encapsulation is via hot compression moulding
or alternatively the so called 'cold' castable method. The word 'cold'
mounting is somewhat a misnomer since exotherm temperatures of 1202 C is
hardly cold'.
The least abrasive resins are the compression hot mounted variety which
also tend to be quicker setting and more dimensionally correct. From the
chart it can be seen how the various categories have been defined. The first
three are phenolics and are also available as pre-moulds. The abrasion
factor is important in trying to match, where possible, the abrasion of the
sample with the moulding material. This factor is related to micrometres per
minute under a given test parameter, this shows the difference between hot
and cold mounting.
In addition to the abrasive rate is the 'polishing ate'. From the legend at the
bottom of the chart it will be noticed how this has been designated by cross-
lines, ust one line for 'high' progressing o many or 'Iow'.
The hardness value (Hv) has also been quoted but at these low values they
must be for comparison purposes only. Note how the hardness value has no
relationship with the abrasion factor. The abrasion factor is the important
value. the hardness is of little importance and again is only quoted for
comparison.
With all these different resins it is important to address the question of
suitable specific applications, the columns starting from 'use' are intended to
help. The cleavage (gap between resin and sample on the inside of a
washer) and the relative grinding relief when comparing resin to steel (0.4%
C) are drawn schematically. .Take for example the black Epomet, this shows
no cleavage and nil relief; the black Edgemount on the other hand has very
slight cleavage still with nil relief. The major difference between the two resins
being cost. These two resins would be totally unsuitable when the sample
material is highly abrasive because on this occasion negative relief would be
created.
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ENCAPSULATION OPTIONS GUIDE CHART - COImHUED
Viscosity, the ability of the resin to flow into small areas, is very important in
particular when the sample is porous, when it may be necessary o vacuum
impregnate. Notice with the hot mountshow the Epometand the Transoptic
have been given a 'start' towards being viscous. With the castable resins
rated from high with one drop to low with a continuous low it is very easy to
match a specific resin o suit particularneeds.
Setting times have been generalisedbut as can be seen, vary from 5 minutes
to 12 hours. Thermosetting esins, hose that set with heat and cannot later
be softened, are shown by shading the upper triangle in the box.
Thermoplastic resins, those that can be softened later by introducing heat,
are shown by shading the lower triangle in the box. Thermoplastics are
usually difficult o polish scratch ree.
Finally we have the peak temperature column for compression mounting
resins, these figures are only valid with a given pressure. The thermoplastic
for example could require 20~ C if the pressure was to be halved. The
quoted peak temperature for the castable resins is the minimum temperature
during the exothermic reaction, it will if not controlled rise above this figure.
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FAULT: CONTRACTION
COMPRESSION MOUNTING
CASTABLE MOULDS.
SAMPl
COtfTRACTKIN I
INSERT
PARTCULAT[
AlTERNATIVE
COMPRESSION YOI.MINC - REDUCED COFFUHT or
THERMAL EXPANSOf RESW
CASTA&[ YOUlDS - LOWER RESIN COH1RACTOI
The gap that occurs betweensampleand
mould will always be a problem with
resins that exhibit a high degree of
contraction. This contraction will
inevitably,be higher on the inside of a
washer than the outside. With hot
compressionmounting t is the difference
in coefficient of thenna expansion
between moulding material and sample
that creates he greaterproblem.
With hot compressionmoulding it is the
inside of the washer only where a fissure
is likely to occur. If, as often is the case,
a gap is noticed on the outside of a
compression moWlt it signifies an uncured
mould.
To reduce the area of resin in close
proximity to the sample will reduce the
effect of contraction and coefficient
differentials. To do this an insen can be
introduced as shown or alternativelyuse
particulates of ceramic. Another
alternativewould be to section he washer
giving a 'C' shaped ubject
The useof epoxy castable esinswill
overcomemost problemsascan be seen
from the 'encaosulation otionse:uide'.
FAULT: MOULD CRACKlN6
COMPRESSION MOUNrJNG
CAST ABLE MOln..DS
~:.,
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@A MET ALLOORAPHY EUROPE
FAULT: MOUNT UNCURED
Thennosetting moulding material can
often ook quite good from the outsideyet
be partiBlly uncured on the inside. This
siblation can be confumed by cross
sectioning he moulded unit Specimens
exhibiting what looks like contraction
between esin and sampleoutside ace are
more often than not examples f partially
uncured moulds. When d1is internally
uncuredcondition increases,he specimen
when ejected from the mould unit, will
haveeither a burst on the opposite ace o
the sample or alternatively the sample
itself will stand proud of the mount This
condition is more prevalent when
thermosetting esins are ejectedhot ~
can be seen from the sketch it will be
necessaryo vary pressure,emperatt1rer
cure period as appropriate
CO~ION MOUN11NO.THERM~ RE.sIN
.,., ~
,
~ :-CRAHU~TO
I ~1\M(
~
""...:.:::-:...,
~ . f
~
~~
~~
t'_--'
. .
~
~
,
--:0-
~, I
aMEPERIOO
ALTERNAT1VE
USE THERMOPLASTICRESIN
FAULT:
MOURTURCURED
COMPRESSION MOUNTING
THERMOPLASTIC RESIN
Clear thermoplastic compressionmoul~
often exhibit what is called a cotton ball
effect, this can be in evidenceon ejection
from the mould or can occur as he mould
cools o ambient emperature.
There are two types of cotton ball effects
and they must be addressed ifferently f
the problem is to be overcome. Firstly
there is the misty effect just below the
sample, his can usually be overcomeby
reducing the rate of cooling, prolonging
the period.When the misty or cloud effect
is replacedwith a distinct combination f
smaIl bubbles then reducing the heating
period should suffice. There s a word of
warning however and that is, both of
theseconditions are temperature/pressure
related. i.e.,. lower the temperature-
increase he pressure.Having established
a good working combination t will be
necessary o retain a similar resin to
sample atio to avoid cloud e-emergence.
0
REDUCE
~~l
~"~5~
l- -
Of
...
\
-~lOUO [MISTY]
r SAMPLE
/
--~~--
Go
--~
CLOUD [SMALL BUBBLES)
AlTI~NA11V(
USE LESS RESIN
3.8
opyright 1994BUEHLER Ltd
REDUC(
I
HEATING PERIOD
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MET Au.06RAPH-{ EUROPE
FAULT: SAllPLEDISTOR110N
COMPRESSION MOUNTING
THERMOSETTING RESIN
elicate samp~ i~y should not be
subjected o compressionmounting, his
however s sometimes navoidable.Some
users surround the delicate component
with a metal ring thus confining pressure
to the longimdinal axis. If isostatic
pressure s to be used hen thermoplastic
resins are best employed; he mounting
press pre-load being used until the resin
has softened. Since thermoplastic esins
can be moulded at much lower pressure
than the thennosetting esins t is possible
to achieve satisfactory moulds at much
lower pressure han recommended y the
equipment supplier. It is important to
remember hat these moulding resins are
pressure temperature elatedand as such
any lowering of pressure must be
accompanied with a rise in moulding
temperature.
DRYOUT
MOULDING
POWDER
SAMPLE
\...
"
~
4
CIRCUMFERENTIAl
SPLIT
FAULT: MOUNT ADHESION
C~SSION MOUNTING
THERMOSffilNG RESIN
One of the most desirable eatures of
specimenmoWlting s to have he moWlt
material stick to the sample. This
condition is prevalent with epoxy type
resins and all other resins to a lesser
degree. Having established his very
desirable eature t is not surprising o find
the mount sticks to the metalwalls of the
moulding cylinder. Lubrican~ are
available o avoid cylinder wall sticking
andshould be usedat intervaJs ompatible
with the type of moulding resin in use.
Another type of sticking occurs m
compressionmoWlting and that is when
the moulding resin is squeezed etween
the ram and cylinder walls. to rectify this
condition it will be necessaryo replace
the worn out ram
FAULT
SAMPLE DISTORTION
- SAMPLE
r DISTORTION
,
:-i
CHANCE TO
,...:~~~'" THERMOPlASTIC
"-=-:'""~---" REDUCE RESSURE
INCREASE TEMPERATlIRf
"'--~~
ALTERNATIVE
$E CAS1A8LE RESIN
3.9
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METALL06RAPH"i EUROPE
FAULT: MOULD ADHESION
SPECMN AOttCSOC
Lubricantsare available o avoid cylinder
wall sticking and should be used at
intervw compatible with the type of
moulding esin n use.
I.~
-
~
SPEa..:Nl
--~j~a.
~
FAULT: POORDIMNSIONAL
STAS nnY
CASTABLE RESINS
~~-~
':'-~t REs..
l_J~ ,-
PHENOLIC
RING
FORM
SAMPLE
Most castable~ exhibit a degreeof
contraction. d1is contraction leads to an
irregular shaped mould dipping in the
centre and not too parallel on the outer
diameter. In addition to this poor shape
there is the Jack of dimensionalstability
attributed o varying contraction between
different resins. This problem can be
overcome by using an epoxy type ~
(low contraction, low viscosity) or.
alternatively mould the sample within a
'ring form' as shown n the sketch.
m 6H EX OTHRII
All castable ~ have a 'peat
temperature', this is the minimmn
exotherm emperature eeded o 'set' the
resin. (See encapsulating esin guide).
This exotherm temperature is ~lf
generatingand will if not controlled. far
exceed he peak emperamre. To control
the generated eat (1) reduce he volume
of resin (2) increase he samplesize (3)
blow the exotherm peat temperature
across he setting esin surface.
FAULT
HIGH (XOTHERM
/ 1 C
JO'c
74 METALL06RAPm' EUROPE
FAULT: EXPENSIVERESIN
Associated with improved resin
characteristics s usually a price penalty
Le. better resins are usually .more
expensive. To compensateor this price
increase t is possible o support he front
face of expensive resin with an
inexpensive resin such as standard
phenolicas backingmaterial.
COMPRESSION
MOUNTING
COST SAVING
INEXPENSIVE
RESIN
SAMPLE
EXPENSIVE RESIN
FAULT: POORLCTRICAL CONTACT
Good electrical contact between sample
and anode, for example in electrolytic
polishing/etching, s often required. The
approach an be one of two ways (a) drill
a hole through the resin until contact ~
made with the specimenafter which an
electrical contact can be made or (b)
mount the sample n a conducting esin.
Conducting resim can be metal filled as
used n electropolishingor graphite illed
for scanningelectronmicroscopy.
CONDUCTIVE MOUNTS
r
ETAL CONTACT
OR
METAL OR GRAPHITE
INCLUSION
SAMPLE
NON CONDUCTING RESIN
3.11
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E-1Jc.A~ULATIO).J
OPT'O~
gUIDE-
( )
BUEHLE~
COMPee-SSlO).1
Mo~L. 'D ItJG
-
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EEt'TIVf I
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D.5t:2rPT10,I
AMASlO'.'
I POL ISHiUG
~ACTO2 RATE-
CLEAVAGe-
26"" /STEEL.
\JSe.
""$(OS,"y ~~~ ~MD
-~A;~:
PUt:
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@4 METALLOORAPH'i EUROPE
CHAPTER 4-
SIN6L POINT TOOlS (STRESS APPUCA TORS)
Removal of material by
multiple singlepoint tools seems
strange subject to be included in a course of
metallography. In fact a knowledge of how the material
removaloccursand the subsequent amage esulting rom
this 'woIting' is vital to our knowledge f progressing he
surface o integrity is to be achieved Materials fall into
one of two groups i.e., (1) Ductile materials where
material is removed by 'slip plane dislocation', such
materialswould be steel, brass,aluminimnetc. (2) Brittle
materials where material is removed by brittle fracmre
m~hani.an; such materials would be ceramics, bricks.
mineralsetc.
RES\A.:S1t[l \ ~~
RES\A. CERAYIC\-rRAl
OEF~M4TION ANa
R[5C)UAI. STRESS
RtsIOUAl C~AC..-S
Figure 4.1 - Material Removal Phenomina
These wo groups of material emoval are shown n figure
4.1. Dislocationby slip plane mechanisms shown to nm
along the shearstressdirection, his results n a defo1'JDed
structureand a potentialresidualstress. When material~
removed by crack propogation the result is a residual
crackedStI'tlcture ith little if any residualstress. The idea
in materialographys to progress his residualdamage o a
theoretical zero by use of smaller sized abrasivesand
different support surfaces o absorb the cutting shock.
From figure 4.1 it should be noticed how the cutting tool
front face has a different angle (rake angle) for the two
materials. Ductile materials equire a positive rake angle
(see igure 4.2), brittle fracture materials equire a zero to
negative akeangle.
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.A MET ALLOORAPH"l EUROPE
~ t:~] a 0
Positive ow
deformation
Negative high
deformation
Figure4.2 OptimumRakeAngles
This rake anglevaries or different mate~ softer ductile
materialsneed a higher positive angle, harder materials a
lower positive angle. The resultant defomation can be
related o the rake cutting angle. Le. a low positive rake
angle will induce greater specimen esidual damage han
would the optimum arger rake angle. This cutting action
is an exampleof single stress applicators, n the field of
materialography e aremore nvolved with 'multiple stress
applicators'. One such example s silicon carbide paper,
this is shown n figure 4.3. The rake angle of the cutting
abrasivebaswhat s calleda 'critical angle'. Less than the
critical anglewill cut the workpiece (sample),greater han
this 'ploughs' and eventually ubs (to be explained ater).
Silicon carbide particles, as they are electrostatically
excited on the adhesive backing paper are randomly
orientated The result being a combination of different
rake anglespresentedo the approachingworkpiece.
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J~ METALL06RAPH'i EUROPE
Steel
[:::j ~
l~ ~=:J
Critical angle 900
< Cuts> ploughs/rubs
Steel
C:1
Figure 4.3 - Silicon Carbide Paper when new
~
~~~/
Positives become negatives
Figure 4.4 - Silicon Carbide Paper n Use
Figure 4.4 shows he effect of theseSiC particles as they
are used. The ideal positive anglessoon becomenegative
by breakingor shearing t an anglenonnal to the front face
sheardirection.
Cut
Ploughed
Fig;ure 4.5 - Scratch Patterns
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~4 METALL06RAPH"l EUROPE
Figure 4.5 shows the effect of using the various angled
abrasives.Sharppositive angleabrasives ive a clean cut.
sharpnegative ake anglestan to plough, causinga break-
up from the clean cut: This u often accompaniedby a
material build-up each side of the groove as shown.
Negative rake angleswhen used with ductile mataeriab
will soon~ome blunt, rom which point there s a greater
tendency o rub than there u to cul The visual effect of
this ast condition s to shineor b~ the surfacegiving a
brighter appearance hich to the untrained eye could be
interpreted as a better finish. Looking at the type of
scratch pattern is essential in u-~-~~g the residual
damage.Just aswith the surface inim after sectioning he
conditionshouldbe a unifoI1D eriesof cleanscratches.As
the scratches arkenso the cutting is lessefficient. beyond
d1is stage as the surface shines then residual damage
(deformation)can be gross. When assessinga scratch
pattern ollowing a grinding processwhere the workpiece
hasbeenorientated hen he scratches hould havea depth
Le. not all on the same plane, some going underneath
othersandat a different orientation.
Figure 4.6 - Degrading Abrasive and Deformation Chart
Figure 4.6 bas combined the relationship between the
cutting abrasive ngle n use and he resultingdefonnation.
The major point being, when using degrading abrasives
such as silicon carbide paper they should only be used
within the ime o~ (T1) period.
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@4 METALLOORAPH"{ UROPE
Figure 4.7 - Factors Affecting Material Removal Residual
Damage
There s an important material removal resultant damage
reJationshiphat occurs elative to a given factor. A list of
factorsaffecting inal resultshave beenshown n figure 4.7
COMPRESSEDCRYSTAL.
J
~~
SLIP P .\.t'Jf
DISLOCATIONS
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J,.\ MET ALLOGRAPH'l EUROPE
DEPTH OF DAMAGE
If we are to progress he preparation sequence owards
sample ntegrity it is important to have an appreciationof
the total defonned ayer (or heat affected zone) resulting
from a particularsectioning grinding or lapping process.
) RtSGuA STRESSARD METAL 2~~
son METAL 50.
-- - BRmL ~TU~ lOOK
~ ~To.
IrAl SPECMH
~RY--
.,:---
-
-~~~ -, TOTAl OEF'ORMATION
Sl.-tPI,AWS ..:::/
(PLASTIC
DlSLO~~,:E ...
F"RAGWENTO L.AY[~
~:I;;;;~~~::::.1 SIZ CO4T
~~~i~~~~~~~~~ ~Al~
PAP[R.c.c~ ... COAT
Figure 4.8 - Plastic Grinding Using Abrasive Particles
Figure 4.8 depicts he Stn1cnJralrtifacts esulting rom the
use of SiC or aluminagrinding papers. These papers are
produced with variable 'weights', heavy papers (thick)
offering more shock absorbing Oess defonnation).
Abrasivegrains adhere o the paper by the 'bond coat' as
shown. The working severity of the grinding paper ~
inf1~nced by the 'size coat'. The thin size coat being
intially more aggressive,hicker size coats ow in material
removaloffering a longeractive working life.
The metal specimen hown m figure 4.8 shows two areas
of slip plane dislocation causedby the abrasivegrinding
process, note the strain boundary and the visible
~fonnation depth. The visible ~fonnation is that which
would be optically revealed after cross sectioning the
ground surfaceand etching. This etched magewould not
~.re-.ssa.-rily
eveal these slip planes but will reveal a
distorted structure m comparisonwith the parent or true
structure. Additionally to the visible defonnation s the top
surface ragmented ayer. When using sharp, optimum to
critical angle abrasives his layer will be extremely small
(2JJ1ntoil). As d1ese rains chip and become runcatedso
the fragmented layer will mcrease as will the visible
~fonnation.
Copyright 1994BUEHLER LId 4.6
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PREFERENTIAL ET.CH AT
SLIP PLANE/STRAIN
BOUNDARY~
"
"
PLASTIC DISLOCATIONS
FROM GRINDING
,
-
METAl SPECIMEN
)
PLASTIC LAYER
ASSOCIATED WITH
POLISHING CLOTH
ABRASIVE PARTICLE_S/~-
/
\
I
DIRECTION
-""
--"
--.c--
\.:.
'""'\
'.:z:~~.-
CLOTH BACKING
ABRASIVE RESTRICTING SURFACE
CLOTH NAP
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.'
. -. .
. ,: -. '" ",.. '.. " . ; '
~"";;.": .A"-':'";-".'..~;;;,I;o""~_I~""",'::.'~'
. ...';.:.;~ j..-':.'~':"-:"-~';',,:,:~~"l'~-::';","~'.'.
,I.. c', .. '" ':',...'.~~:.r-,:,:-':
,:.
:
.:
AFTER
SAMPLE INTEGRITY STAGE
~m
POLISHING STAGE
MPRESSED GRITSWARF n
~INGER
I
ATER JET
...~~~~~~
~:::;;;~. W TE JET
SOAP
- ~~T~~~N~C{)-
CLEAN
~
t
~EJC1.H~ (if
requ red)
~~::~~~:::J::~=:::::~:~
HOT AIR
"""'",~ ALCOHOL
',:
, -
~
~
I'
OPTICAL
-~ ANAL YSIS
@)
SAMPLE
ENCAPSULATION RESIN
FIG
CLEANING
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During the material emoval process t is Hkely that slip
plane action has resulted n residualSttessbeing present
beyond he visible deformation ayer. In considering a
potential total ~formation layer the depth of residual
StreSSas o be taken nto account. Figure 4.8 indicates
the additional ncrements ecessaryo take this factor into
account.
Although this discussionbas been confiDed to plastic
grinding where material removal is by slip plane
dislocation. a dmilar adjustmenthas to be made when
material is removed by brittle fracture m~hani~
(ceramics. ricks. ocks. minerals tc). From the chart this
is shown o be 100% of the visible depth. not because f
residualstressbut ~ause fine cracksare areasof further
crack propagation.
Copyright 1994Bum n..ER Ltd
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CHAM"R 5
CONVlmONS
SURFACEPRPARATlOR 1'0 1RT6Rm'
In the surfacepreparationof materials or microS1rUcUal
analysiswords such as grinding. apping and polishing are
used. To avoid any confusion he following conventions
and definitions are used throughout the book. (these
conventions avebeenwell published ndestablished)
Sample
': :~::::~-
t::
Deformation
Fixedabrasive
Figure 5.1 - Grinding
This s the most aggressivematerial emoval echniq~ we
shall use. Although t is efficient at removing material t
does, as shown, manifest a relatively high level of
deformationwith a ductile material. This is due to the
resultant hear orces
RJ acting
on hesample.To reduce
this deformationwith a fixed grinding abrasive t will be
~-~~ to progressively educe he abrasivesize and/or
increasehe shockabsorbing haracteristics f the grinding
surface.Grinding s a quick operation.
~
ample
Impre.ssed("""",.~ ~
abrasve "" I
II / /, Deformation
~ Compressed grains
00 8~~~~o 000
Rollingabrasive
Figure5.2 . Lapping
..Do
,."p
sorT
&.,.
~
,..,~TE~'~ J
A.Wt1,"~J1 M.M,C)
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'Ibis techniq~ ,-mli5es flee rolling abrasiveand produces
a much reduced deformation ayer in comparison with
grinding. 'Ibis ~ in part due o the changed esultant orce
(R,) and the shock: absorbing action of the non-fixed
abrasive. Ibis technique~ highly favoured or its extreme
planarity and ~ relevant as a possible echniq~ for an
brittJe fracnJremateriah (not d~). If ~ technique
was to be used for soft metah then impressedgrinding
abrasives would occur as shown. Lapping ~ a slow
operation.
F
Polishing
(note the deformationl
plucked grains, smear and cloth nap)
FIgure 5.3 - Polishing
Po~g is the step used when scratches are to be
removed from the sample often resulting in a '~'.
Defonnatlon s relatively ow as shown (shouldbe nil) but
there s always he chanceof smearing he samplesurface
if prolonged imesor increased ressures applied
Figure 5.4 - Composite Surfaces
Grinding is quick, not so flat and leavesa relatively high
Sample
,...~"'4@\'"
"'.::.:"
i
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It bas been shown. using the charts, bow operating
parameters an be used to optimise a given preparation
procedure. It is aha shown in the 'options' cban for
grinding and polishing he grinding surfacesavailableand
the severity rating in relation to each other. What ~
~g from all this infonnation is a guide to the
appropriategrinding/polishing urfaces elative to specific
materials.
SAMPLE
PRPARATION
SPECIMEN
MATERIAL
SPECIFIC5.86 TO
5.42
The following chIns are intended o guide the user into
using the correct grindin1/polishing surfaces that are
specimen material specific. All too often a grinding
swface s selected becauset is available' and nowhere s
it stated in literature where these surfacesmust not be
used. Take for example he nickel coated diamond discs
(ULTRA-PREP), they are not intended as replacements
for silicon carbidepaper,nor are hey ntended or use with
very hard materials.These discs will 'clog' with swart' f
used with soft tough materials rendering them useless
within minutes. Thesecharts hereforewill indicate where
best o be usedand by definition shouldNOT re used with
other specimenmaterials.
The material groups have been generalised nd will
inevitablybe incomplete,hey will howevercover the
majorityof materiahikely to beencountered
The Material groupsare:-
.
Very bardmateriaJs
.
Brittle fracturematerials
.
Soft d~e materials
. Ductile materials
-
eneral
. Metal matrix composites
. GlassK::eramic atrix composites
.
Polymermatrix com~tes
Figure 5.36: This chart relates o the use of fixed diamond
grinding surfaces.~ is the area where ncorrect use of
grinding surfaces s most prevalent Very hard materia1s
obviously equirea hard abrasive uch as diamond n order
to abrade the specimen. This diamond must re well
protected against mpact damageotherwise the diamond
will becomedislodged rom its housing. It is for this
reason he resin matrix grinding wheel s used. To use the
nickel platedwheel or thesehard materialswould rendera
much reduced life due to impact damage (see figure
5.36A).
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As the brittle fracwre materialsbecome ofter so the useof
nickel bonded diamond grinding becomes~ (A)
The diamond s deposited nto circular Mesashaped orms
adhering via the nickel to a resin fibre support. The
protruding diamonds are also nickel plated to initiate
efficient cutting. There are a series of these surfaces
allowing progression o the second ntegrity stage. When
observing he scratchpattern rom nickel bondeddiamond
grinding a brittle fracture pattern should be observed. It
will be noticed rom figure 5.36 how the Ultra-Prep disc ~
iJx;luOOdor planar grinding of MMC ma1erials; ~ ~
only possible when the ceramic particulate has a high
concentration. The swart' from cutting the soft metal
matrix will want to weld to the diamondcutting face, t ~
the ceramicparticulate hat will act like a dressing tick as
it is being cut and therefore stop the diamond from
becoming logged.
This grinding surface can also be used for the planar
grinding of soft materialsw~ alternativemethods uchas
silicon carbide or allDDiDiumoxide papers manifest
impressed brasives.When t is used or soft materials he
grinding surfaceshouldbe waxed or oiled prior to use and
could additionally require regular dressing to keep the
diamond acesclean.
Metal mesh discs (UL'I'RA-PLAN) (C) are very much
confiDed o the brittle fracture materia]s, n comparison
with the two previous discs, hey induce ~ damagebut
are slower at removing material. ~~~u..~ the diamond s
'charged' onto the steel mesh,and requires the action of
the ~imen passingover to lodge the diamond nto the
mesh surface, ductile materialswould not be a candidate
for this grinding surface. This is confinned by reference
onceagain o figure 5.36.
Metiap Platens D) which are composites f metaJ/resin r
ceramic/resin equire a chargedabrasiveand as such have
restricteduse when materialductility ~ high. They induce
a restricted evel of defonnationor structural damageand
leaves he specimenn an extremely lat condition. There
are a seriesof platensoffering increased hock absorbing
characteristics or systematicprogression owards sample
integrity. Note how the use of thesehave been estricted
to the harder ductile and brittle fracture materials thus
avoiding any impressed diamond abrasives from soft
me~
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ULTRA-PREPdiscs E) havea very important role to play
in the brittle fractureseriesof materials.note bow they are
used n the final ntegrity stagese. 2 and 3. The diamond
abrasive s em~M~-rl into dome shaped esin spots on a
resin ibre support. When observing he scratchpattern it
will be noticedbow the previousstage racture mec~
has changed o what looks like a polished appearance.
1bis is due o the material emovalmed1aDismhanging o
a type of slip plane dislocation rom the previous brittle
fracture. This condition is in part shock absorbing
dependent swell asparticlesiu - ie.
20pm nickel plated mIra-Prep disc would induce
brittle fracnue - material removal by crack
propagation.
.
30J1Jn esin bond Ultra-Prep disc would induce a
polishedappearance material removal by slip plane
dis1
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Figure 5.38 - Grinding cloths are those fabric surfaces
charged with a diamond ~ve and suitable ubricant.
used n ~ grinding mode n the sample ntegrity stage. In
the past these cloths have reen called .polishing' cloths
since no distinction was ~ between grinding and
po~g. In order to carry out efficient grinding mese
surfaces ~d to havea reducedsurface ensionand this ~
achieved y the weaveof the cloth or the porosity within a
resin ngressedextile material. The diameterof the weave
and subsequentmesh denierby weight) dictates he ideal
grinding abrasive~. This s reflected n me selectionand
subsequent ositioningwithin the chart Finally at the last
integrity stage the choice is influenced by the specimen
material abrasion esistance, ard materialsusing Texmet
2000 (N), soft materia]susing he acetate ilk (Q).
Figure 5.39 - Polishingcloths areusedas the word implies
'to polish or shine he surface' n order o achievea scratch
free reflective surface. Those ~en materials hat are
most prone to scratches. hat ~ soft metals, should be
polishedwith a non-saarcbingabrasivesuch as Colloidal
Silica. The cloth equally should be soft and free from
abrasion uch as Mastertex. Notice from figure 5.39 how
tbi cloth ~ used for slWTy polishing (SP) and not
diamond
Specimens hat smear or are 'gummy' will require the
addition of either an acid or an alkaline solution to cause
specimen ~lution and in consequence allow the
abrasiveparticles o polish n a defonnation ree manner.
To ~ end the COOmomet loth for soft materials ~
designated'AK' for attack polish. For general ductile
materials he Clemomet, when used, would be for slurry
polishing SP).
Ceramic material, silicon wafer etc require a totally
different cloth hence he Polimet cr sluny polishing.
When dealing with general ductile materiab the use of
diamond polishing can abo be a choice, the Microcloth
(high nap) beingused or many
~~~c1I :-~.
This~ of cloth
could also be used on difficult MMC materiab where the
matrix requires an additiooal polish. Some ceramic
compositessuch as PODFA used in almninium casting
could require an attack or ~lution polish hence the
Cbemomet or AK.
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r
D AM 0 lm &RIND IN 6
CLOTHS
Through the adventof the B~bler DeWconcept n
specimenpreparationa greater emphasishas been
placed in what is the specific fmK:tion of
grinding/lappingand polishing surfaces,and when
best o ~ them. Additionally o this ~ the need o
~ the type of abrasivemost suitable for such
surfaces. Considering cloths for grinding tOOy
shouldbe without any nap and have some meansof
retaining the grinding abrasive. Le. considerations
suchas
.
.
.
.
p
have a varying size meshstructure to suit large
andsmall sizedabrasives
.
Surface o be porous
abrasiveso lodgebetween ibres
abrasiveso be orced nto polymer binder
Coths that are chemotexti1esuallyhavea graded
resin binder system based on hardness (usually
between 0 - 90 shoreA). When he resin volume
is high it is re~.ssary o 'buff' the cloth surface n
order to retain the diamondabrasiveand lubricating
medium.
Examples f diamond liDdin& cloths are:-
Utra-pad
Texmet
PeIforatedTexmet
Nyloo
mtra-pol
AcetateSilk (qA~)
Polimet
Although an explanation f which cloths to use for
specific ~ is given later in the text, it ~
thought prudent at this stage to introduce the
subject
Consider the grinding cloth selection at the final
integrity stage or the ollowing materia1s:-
. Very hard TungstenCarbide)
. Medium Hard (0.4% CarbonSteel)
. Very Soft (Aluminium)
.
Brittle Fracture Mineral)
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All these our materialscould be prepared using a
Texmet cloth at the final integrity stage, he results
howeverwould be compromised..e.
. Soft materials would be severely
saatcbed.
. Deformation would be higher as the
materialbecomes ofter.
. Surface obbing could cause phasepull
out
.
Integrity would be compromised.
Taking he soft materlaJsirst we ~d a cloth that ~
the leut abrasive soft to the touch), n this case he
acetate silk cloth would be suitable. This cloth
additionallyhasa cross-weave atternwhich helps n
removing surface tension during grinding. The
reduced smface tension by definition means less
surface ubbing which is an added advantagewhen
preparing riabJe~ (graphite n iron).
The mediumbard material
the previousexampleonly
~ to be more resilient
requirement
Hard materials n~d a hard wearing Oat surface
cloth. Cloth abrasion s not important at this stage.
High ~nsity laminAte loths that are fused together
under heat and pressurecould be ~d. The most
popular cloth throughout the world is the
cbemotextile Texmet', this cloth is not quite so
dense.Texmetmade rom absorbentibres n a ~
binOOr xhibitsporosity which is useful for trapping
grindingabrasive nd ubricant
Finally, what is required or brittJe racture mateJials
suchas mineraJs?Soft cloths are unsuitablebecause
of interphaseelief grinding and ~ffici~t material
removal rates. The Texmet cloth, although
marginally suitable, does suffer from robbing and
relief. The answer herefore s to have a fine weave
low weight denim cloth such as natural silt i.e.
mira-pol
These four examples serve to illustrate the
shortcomings n the traditional blinkered approach
with its 6JIIDTexmet and 1JIID Microcloth for an
materials.
;'
requiresa mm,larcloth to
this time the cross-weave
Nylon cloths satisfy this
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~
Sincepolishing s the stepd1at akesplaceafter
achieving ample ntegrity. ts function mustbe to
remove op surf~ scrau:bes.mprove reflectivity
and wherene~-~ry introducedie submicrometre
interphaseelief n~-~ for differential
interference ontrast.The cloth will be soft (non
abrasive) ndwill exhibit a short nap. One example
of diamond~llihin& cloths s Microcloth
D AM 0 NO PO 1JSHIN 6
CLOTHS
SLURR"'l POlJSHIN6 CLOTHS
J:
The requirement f a slurry polishing cloth is
different o d1at f a diamondpolishing cloth in that
it d~ not havea high densityvertical fibre nap.
Slurry polishingclothsarevery soft and ~ fibres
are non veI1ical. A goodexamplewould be the
Selvytcloth ~d for polishing brassand copper.
One mportant unction s the retentionof liquid and
to this end someclothsencompass foam
subsurface.AnotJr;rexampleof liquid absorbency
would be the felt type cloths. Absorbent ibres such
ascotton will be better or example han man made
fibres.
Examples f slurry ~~& cloths are:-
. Mastertex
. OM:momet
.
Polimet
Suitable lurrieswould be allImina magnesia
cerimnoxide colloidal silica.
SLURR~ &RINDIN& CLOTHS
The thoughtof usingan abrasivegrinding particle
as
small as O.OSJJIn
n a grinding modeat first seemsa
strange ombination. owever, f grinding is
~~-~~ry to achieventegrity hen suchsmall size
abrasiveswill be n~-~~ry. If for example he
sma]1p-~tlementor phasen the specimen o be
prepareds sayO.5JIIDhen a grinding abrasivemuch
~a11P:T
thanO.5JJ1nill be n~-~~ry.
The dangerwhenselecting he sluny grinding cloth
with suchsmall abrasiv~ s to ensure he abrasive
follows the convention or grinding and not
polishing. .e. the abrasivemust not ~ and all at
the point of cutting.
Exampl~ of slUII'Y liDdin& loths are:-
. Texmet
. Utra-pol
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VERY HARD MATERIALS
(tungsten carbide)
M
RnTLE
FRACTURE MATER~S
I
(ceramics/ minerals/ refractaries)
0
0
SOFT DUCTILE MATERIALS
(aluminium/tin/lead/ copper)
DUCTILEMATERIAlSGENERAL
(ferrous/non-ferrous)
M
METAL MATRIX COMPOSITE (MMC)
(high particulate concentration)
0
;0
0
GLASS MATRIX COMPOSITE
N
p
ERAMIC MATRIX COMPOSITE
LEGEND
(in order of severity)
HIGH M=ULTRA-PAD
hard woven cloth
: N=TEXMET 2000
chemotextile cloth
I O=NYLON soft woven ~Ioth
.
P=ULTRA-POL low denier silk cloth
lOW 0= RAM ocetate silk cloth
FIG
5.38
GRINDING
MATERIAL
CH,A.RGED
LOTHS-
SPECIFIC
DIAMOND
ALUMINA
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.
~:"J. ~..'
i.",,-;';~~
VERY HARD MATERIAlS
(tungsten carbide)
POLIMET/SP
RITTLE FRACTUREMATERIALS
(ceramics/ minerals/ refractaries)
ULTRA-POl/DP
CHEMOMET/SP
MASTERTEX/SP
OFT DUcnLE MATERIALS
(aluminium/tin/lead/ copper)
CHEMOMET/AK
MICROCLOTH/DP/SP
RAM/DP
CHEMOMET/SP
DuCTILE MATERIALSGENERAl
(ferrous/ non-ferrous)
MATRIX COMPOSITE (MMC)
POLIMET/SP
(high particulate concentration)
CHEUOMET /SP / At4 METAu.06RAPH'/ EUROPE
~
Figure 5.13 Selection
Figure 5.13 having addressed he question of abrasive
selection,bas concluded hat three of the steps could be
removed without re~~rily oompromLgng he total
procedme sample ntegrity n the shonest ime).
As bas beenshown n the sectioningpart of this manual,
the residual damage can vary from IOJllD to 9O0JllD.
Consider he materialused n figure S.II/ S.12/ S.13 now
to be sectioned under optimised controlled conditions
giving a Z axis damage epth.asshown n figure S.14
Figure 5.14 - Preparation Without Logic
To progress he sample hroughany of the previousstages
would be totally illogical. As shown rom the sketch he
240grit abrasive nduces rather than reduces he Z ~
dimension.
From this simplified explanation t can be seenhow vital
the sectioning tage s to any preparationprocedure. The
knowledgeof residual damage s the factor that dictateS
what the proceeding tepswill be.
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Figure S.lS - Preparation with Logic
figure 5.15 completes he procedure by baving a single
step only. The assumptionmack: n this discussion~ the
absence f anyplanargrinding equirements.
Z AXIS CURVES When 'working' a material here will be a given depth of
residual damage relative to a given grinding
surfaceJabrasiveize and shock absorbingcutting action.
'Ibis depth (z axis) will vary with different materials; an
exampJeor 0.37Steels shown n figure 5.16
Figure 5.16 - Database haIt for 0.37
comparison nly)
Steel
(for
Damage n micrometers s given for a whole series of
silicon carbick: papers and diamond polishing cloth
combinations.To selecta procedureusing silicon carbide
paper he choicewould dependnot on surface inish of the
sample o be prepared,but the estimatedor documented
residualdamage. On dJepolishingside t will be noticed
how the abrasive article size s followed by 'PS. then a
number 9JJ1nS2). PS s short or 'polishing surface. he
number ndicativeof the polishingseverity. 2 being ow in
polishing abrasive) 8 beinghigh n polishing (relief).
5.12
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3 SiI~ C8tIide p.,efS
1 PoIistW'D .
",--
Platen ~
surtaces \
~-, --- ~--:-'I
1 . -ow ', .
~ -- ~ r.uh
'~---' Time -.~ .
Time . Reducedime
greaww.egrttr
..
~
g
~
..
Figure 5.19 - Integrity ChaIt for Material MMC
A four step (3 SiC. 1 Polish) traditional method ~
comparedwith an alternative our step mediod utilising
composite platen surfaces and a grinding cloth. The
grinding cloth ~ a 'polishing ype' cloth used n a grinding
mode. These wo methodsare basedon the preparationof
a metal matrix composite. The important aspectof this
graphicdisplay s the nformation hat can be derived rom
it. Viz.
Dotted ine method according o the ~play)
.
Exhibitsgreaterntegrity
.
Takesessime o prepare, nd
. Doesnot degrade ith time
Continuousine method
Doesnot achieve he samedegree f integrity
Takes onger. and
De~ with time
.
.
.
When comparing he surface~ at the 'best position'
with both methods. hey were considered o be identical.
Figure 5.20 sumsup the two approachese. surface inim
V s residualdamage.
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: TRAomONAL
NEW
L
Lx-
SECT10NING
r;~;~G--
GRIND
lX_.uJ=~~
I ~ I ~ I ::::fTY --
I.:L.
~
"
SECTtONING
: MOUNTING
I
ROUGH
yRINDING
I FINE
GRINDING
cL
.
IHTEGRrrY IN THE SHORTEST TIME
I
ROUGH
IPOUSH
FINAL
'POUgH IX
. ,
HIGHLY POUSHED
Figure 5.20 - Surface Finish or Integrity
In comparing he two approachest will be noticed that a
change f terminologybas akenplace. The ~ of words
such as 'rough grinding' and 'rough polishing' are
mimomers m the new terminology. Since all samples
would be ground or Japped o integrity (i.e. we would
ne.Br polish a sample prior to achieving a faithful
structure) his group of stepshave been clA~fied as the
'sample ntegrity stage'. The only polishing that takes
place herefore s after achieving ample ntegrity, this is a
~ stepandmust be kept asshott as possible.
FIgure 5.21 The Concept in use.
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Figure 5.21 brings together all the be~fits of the ~w
Concept n surfacepreparation ncluding the terminology
of each stageand the appropriateabrasive or each stage.
Notice how the sample ntegrity stagebas been split into
three groupsas he sampleprogressedo integrity. Within
these hreegroups he ab~ve sizebasalso been ncluded.
A severity rating, from 5 the greatest o 1 the least, bas
been ntroduced or all grinding/iapping/polisbingurfaces
used. This rating will apply to planar grinding, the 3
groups in the sample ntegrity and the polishing stage.
(The sketch only shows he rating for the 3 groups n the
sample ntegrity stage). The choi~ of surfacesand its
effect on progressing the sample to integrity will be
~ussed later under preparation ptions'.
MA TR1AL REMaV AL
MECHANISM
The two modes of material removal are by slip plane
dislocation for ductile materlab as a result of the shear
force from the abrasive. The other mode of material
removal is by brittle fracture which is the result of
cracking. Thesecracks emanating rom the shearstress
point having a major crack nmning along the shear axis,
odlers of lesser severity at angles rom the major axis.
Figure 5.22 - Deformation StructuralDamage
Relationship or Brittle Fracture ndDuctile Materials
If we observe he reduction n defonnationwith the steel
samples s shown n figure 5.22, material emoval s totally
by plasticdislocation. The upperpart of this sketchshows
what happens as a ceramic material is progressed to
integrity. Firstly, material s removedby brittle fracture.
Towards completion of the preparationhowever, notice
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how ductile slip plane mechAni.clncccur until slip plane
disl
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Figure 5.24 - Effect of Lubricant IdenticalOath (Steel)
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Figure S.2S -
Effect of Lubricant I Identical Ooth
(Ceramic)
A cbemotextilegrinding cloth. dosed with a controlled
amount of 6J1Jn iamond at set intervab when grinding
steel and ceramic specimem,was checked for material
removal at intervaJs f 5 minutes. Figure 5.24 shows he
results from working steel- figure 5.25 the results from
working reactionbonded ilicon carbide. The first point of
interest rom these igures s the compatibility of the Water
baseddiamondsuspension ith both the steeland ceramic.
Copyright1994BU~R Ltd
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~ 10 1~ 20 25 RS
(mnutes) (restort)
-IO(UTICI.L.POlISH..c CLOTH T[x~ 2000)
-SAMPlE UATERIAl0.4%C STEtL
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the low figure and faIl off when using alcohol was
surprising. These results would abo show how the
reramic s more prone to surface ension as the specimen
surface SIDOOthes'. n the right hand side of both these
figmes is the restan (RS) dimension. his is the ma1erial
removal igure after 5 minuteswhen he specimen asbeen
reUJrned o its original ground condition. This restan
figure is what would be expected n real life use. From
these~ water is by far the most efficient with this
combination. t doesnot follow however hat these esults
would be identical f for examplea nylon weave grinding
cloth was o be used.
The 'smoother' and planar he grinding surface he greater
will be surface ension, igure 5.26 and 5.27 are examples
of material removal still using the steel and ceramic
samples,only this time using composite platen surfaces
(metal/resin).
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Figure 5.26 - Effect of Lubricant CompositeSurface
(Steel)
Copyright 1994Bt~R Ltd
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Figure 5.27 - Effect of Lubricant I Composite Surface
(Ceramic)
With both these igures here ~ a tendency o peak, after
which time material emoval decreases.his is thought to
be causedby surface ension. Alcohol ~ better for both
materials;attributed o surface ension break-down, here
are problemshoweverusing alcohol (Surfacepick-up and
vapour). Taking the first 5 min~ which ~ a real-life
figure then water ~ nearly as good for the ceramic. oil
beingslightly better or the steel
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Figure 5.28 - Use of Extender
Copyright 1994 BUEm..ER Ltd
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When using automatic abl3Sive dosing devi~ it ~
possible to monitor the dosing period and also the
economicdosingamount. t doesnot follow that the more
abrasive ispensed nto the grinding/po1ishingwface hat
an ~uiva1ent improvement n material removal will take
place. Increasedabrasivedosing can impede mate.ria1
removal. In general here s a point where unher dosing
of abrasivewill give little if any benefit, this is shown n
figure 5.28. From d1iseconomic dose the interval then
must be de~.d. It was found empirically that a loss of
effici~ was not encounteredf the abrasivesuspension
wasalternatedwith a compatible olution of lubricantonly.
thereby reducing consumable costs by half. The
explanationoffered for d1issiUJations the extenderwill
'clean' the abrasive urf~ extending ts useful ife.
DIFFRENT CLOTHS
The experimentsused to define lubricant efficiency was
also used to illustrate how different cloths give totally
different results. Seven different grinding cloths. an
recommendedor steel were tested for material removal
~~. From figure 5.29 t can be shown how 3 at the
bottom of the graph are so ;nPffi~P:Dt to be considered
W1Suitableor this ~~lication. The efficiencyof the other
four varies from 20JJlnSo 28~s (figures taken from
restartposition).
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