MEMS AND NANOTECHNOLOGY 2.ppt

7/27/2019 MEMS AND NANOTECHNOLOGY 2.ppt

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MEMS NDN NOTECHNOLOGY

PRESENTED BY

K.S.N.SANDEEP

M.RAMPRASAD

M.SIDDHARTHA


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CONTENTS:

Introduction

MEMS & NANOTECHOLOGY

General methods of FABRICATION of MEMS Devices

BASIC PROCESSES

FUTURE APPLICATIONS

ADVANTAGES

Conclusion!


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MEMS is an enabling technology allowing the development of smart

products, augmenting the computational ability of microelectronics with theperception and control capabilities of microsensors and microactuators andexpanding the space of possible designs and applications. In this paper wehave discussed some of the fabrication techniques and packaging. Some ofthe obstacles preventing its wider adoption are: Limited Options,Fabrication and Packaging. The MEMS and Nanotechnology Exchange

provides services that can help with some of these problems .

INTRODUCTION :


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What is MEMS Technology ?

Micro-Electro-Mechanical Systems (MEMS) is the integration ofmechanical elements, sensors, actuators, and electronics on a commonsilicon substrate through microfabrication technology. While the electronicsare fabricated using integrated circuit (IC) process sequences (e.g., CMOS,

Bipolar, or BICMOS processes), the micromechanical components arefabricated using compatible "micromachining" processes that selectively etchaway parts of the silicon wafer or add new structural layers to form themechanical and electromechanical devices.

MEMS promises to revolutionize nearly every product category by

bringing together silicon-based microelectronics with micromachiningtechnology, making possible the realization of complete systems-on-a-chip.


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MEMS and ICs: two of a kind

MEMS microstructures are manufactured in batch methodologiessimilar to computer microchips. The photolithographic techniques that

mass-produce millions of complex microchips can also be usedsimultaneously to develop and produce mechanical sensors and actuatorsintegrated with electronic circuitry. Most MEMS devices are built on wafersof silicon, adopting micromachining technologies from integrated circuit(IC) manufacturing and batch fabrication techniques.


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The fabrication process is usually a structured sequence of THREE BASIC PROCESSES:

1. DepositionDeposition is a key building block in that it is the ability to deposit thin films of material (for subsequent

local etching). MEMS deposition technology is classified in two groups:

Depositions resulting from chemical reactions: chemical vapor deposition, electrodeposition, epitaxy, andthemal oxidation. Depositions resulting from physical reaction: physical vapor deposition, casting. The materialdeposited is physically moved on to the substrate (a chemical byproduct is not created).

2. EtchingIn order to form a functional MEMS structure on a substrate it is necessary to etch the thin films

previously deposited and/or the substrate itself. In general, there are two classes of etching processes:Wet etchng: the material is dissolved when immersed in a chemical solutionDry etching: the material is sputtered or dissolved using reactive ions or a vapor phase etchant.

3. LithographyLithography in the MEMS context is typically the transfer of a pattern to a photosensitive material by selectiveexposure to a radiation source such as light. When a photosensitive material is selectively exposed toradiation (e.g. by masking some of the radiation), the radiation pattern on the material is transferred to thematerial exposed (the properties of the exposed and unexposed regions differ).


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MEMS Applications:

Automotive: The first high volume application

After spending about 25 years in the lab, however, it was theautomotive industry which first commercially embraced MEMS devicesin the '90's as airbag accelerometers, recognizing the benefits of MEMSdevices' small size, relative low cost and high degree of sensitivity .

There are many other automotive applications for MEMSeither in use now or coming soon, including fuel pressure sensors, airflow sensors, tire pressure sensors with automatic built-in tire pumps,smart sensors for collision avoidance and skid detection, smartsuspension for sport utility vehicles to reduce rollover risk, automaticseatbelt restraint and door locking, vehicle security, headlight leveling,

and navigation.


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MEMS in Wireless :

More functionality but more componentsWireless system manufacturers compete to add more functionality to equipment.

A 3G smartphone, PDA, or base station, for example, will require the functionality of as

many as five radios for TDMA, CDMA, 3G, Bluetooth and GSM operation.

Towards a single-chip RF circuit

A solution with tighter and cost-effective integration is clearly needed. IntegratingMEMS devices directly on the RF chip itself or within a module, can enable the replacementof numerous discrete components while offering such competitive benefits as higherperformance and reliability, smaller form factors, and lower cost as a result of high-volume,high-yield IC-compatible processes.

Higher performance, reliability, lower cost per unitHigher speed and reliability are other likely improvements. Having components on-chip means they are more tightly integrated and can communicate faster with the IC. Andbecause lighter MEMS components are really part of the chip and not attached to the board,they are less likely to be damaged if a phone is dropped.


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MEMS and Nanotechnology Applications

BIOTECHNOLOGY :

MEMS and Nanotechnology is enabling new discoveries in science and engineering such as thePolymerase Chain Reaction (PCR) microsystems for DNA amplification and identification,micromachined Scanning Tunneling Microscopes (STMs), biochips for detection of hazardous chemical

and biological agents, and microsystems for high-throughput drug screening and selection.

COMMUNICATIONS :

High frequency circuits will benefit considerably from the advent of the RF-MEMS

technology. Electrical components such as inductors and tunable capacitors can beimproved significantly compared to their integrated counterparts if they are made usingMEMS and Nanotechnology.

Reliability and packaging of RF-MEMS components seem to be the two critical issuesthat need to be solved before they receive wider acceptance by the market.

ACCELEROMETERS :

MEMS accelerometers are quickly replacing conventional accelerometers for crashair-bag deployment systems in automobiles. The conventional approach uses several bulkyaccelerometers made of discrete components mounted in the front of the car with separateelectronics near the air-bag; this approach costs over $50 per automobile.


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Advantages of MEMS and Nano Manufacturing

MEMS and Nanotechnology are extremely diverse technologies that could

significantly affect every category of commercial and military product.

MEMS and Nanotechnology blurs the distinction between complex

mechanical systems and integrated circuit electronics.


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CONCLUSION:

Prospects of MEMS and Nanotechnology are discussed.The first

thing that matters most is the cost, and then matters the rest of the things.Using MEMS and Nanotechnology, the cost of electronic things and otherequipments decreases drastically, because of its very led equipment, lightin weight and way of manufacture. So these devices are expected to bemore used in practice in the future.


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MEMS AND NANOTECHNOLOGY 2.ppt