M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Ann Arbor, MI January, 2001 Michael

M. McCorquodale University of Michigan Electrical Engineering & Computer Science

Mobius Integrated Systems Corporation

Ann Arbor, MI January, 2001

Michael McCorquodaleGeneral Manager and Manager of MEMS DevelopmentSolid State Electronics LaboratoryCenter for Wireless Integrated MicrosystemsDepartment of Electrical Engineering and Computer ScienceUniversity of MichiganAnn Arbor, Michigan [email protected](313) 205-3489



The Purpose of Mobius

Mobius Integrated Systems Utilizes Emerging and Available Technology to Deliver True System-On-A-Chip Solutions to the Embedded Systems Market

The Automobile Instrumentation Cluster (AIC) is an example of an embedded system:

Inside the car, a system senses speed, rpms, etc. and then actuates gauges depending on specificcalculations made on the acquired data

What is an embedded system?



Components of Embedded Systems and Current Implementation

So what’s the problem? Packaging costs high Power too high Size too large Engineering resources

spent designing board Functionality low Applications limited

Antenna

MicroprocessorWirelessInterface

Frequency Reference

Sensor/Actuator Interface

Sensor

Actuator

Quartz Crystal Resonator(Frequency Reference)


WirelessInterface

Board Level Implementation

Microprocessor

Sensors/Actuators



The Mobius Solution

Single Chip Implementation

(SOC)

Mobius

Antenna

MicroprocessorWirelessInterface

Frequency Reference


Sensor

Actuator

Quartz Crystal Resonator(Frequency Reference)


WirelessInterface

Board Level Implementation

Microprocessor

Sensors/Actuators



Realizing The Mobius Solution

SOC Implementation Packaging costs reduced: Fewer Circuits Power reduced: Less Input/Output Size Reduced: Fewer Circuits, Fewer Pins Less Engineering resources on board: Simpler System Possibilities for increased functionality Possibilities for new applications

Single Chip Implementation or System-On-a-Chip

(SOC)

How is it Done? Integrating existing technology: RF + Analog + Digital New application in existing technology: Si Wireless Utilizing emerging technology: MEMS Support Emerging Standards: Bluetooth Vision: SOC solutions require competency in all

technologies

True-System-On-a-Chip

Recognizing MEMS as an enabling

technology



SOC Market

System-On-A-Chip (SOC) Market: – Total Available Market: Currently $5 Billion– Projected to be $17 Billion by 2002– Currently SOC 30% of Integrated Circuit (IC) Market– Projected to be 70% of IC Market by 2003

Potential Markets– Initial Target Segment: Automotive Electronics– Scaling in Additional Markets: biomedical, environmental

monitoring, industrial, manufacturing, communications, wireless, instrumentation, and testing



The Mobius Team

FoundersMichael McCorquodale–General Manager and Manager of MEMS Development–PhD Candidate: Wireless IC and MEMS Research–ASIC Development with Hughes Space and Communications

Matt Guthaus–Manager of Digital Circuit Development–PhD Candidate: Low-Power Microarchitecture Research–Microcontroller Development with National Semiconductor

Keith Kraver–Manager of Analog Circuit Development–PhD Candidate: Low-Power, Low-Voltage, Mixed-Signal IC Research–Analog Circuit Development with National Semiconductor

Dr. Richard Brown–Technical Advisor–Associate Chair Electrical Engineering Division, University of Michigan



Strengths and Weaknesses

Strengths• Strong Technical Foundation

• Top PhD Students, Top Faculty, Top Institutions, Top Research

• Interdisciplinary Group and Innovative Approach to TSOC Development

• Vision: Recognizing Emerging Technology, Leveraging Knowledge of Existing Technology

• Hustle: Young, Motivated, Experienced Team, Well Recognized

Weaknesses • Formal Business Experience

Solution: Recruited 6 Top Michigan MBA Students for Business Plan Development This Term

• Strong Competitors: Established Semiconductor CompaniesSolution: Competitors Must Retool, Competitors Must Combine Disparate Resources, New Org Structure for TSOC Development



Funding and Timeline

Capital Sought• $10MM First Round for Initial Product Delivery

Expenditures• Core Development, Management, Sales Team• Office Space, Computer Hardware, Software, CAD Tools• Manufacturing and Testing

Development Phases• 1st Six Months: Specification and System Analysis,

Establish Relationships with Embedded System Companies

• Next Year: Product Development, ASIC Electronic Designs Become Available, MARKETING & SALES

• Next Six Months: Product Fabrication, Test, Initial Offering



Why Invest in Mobius?

Why Invest in Mobius? Strong, Scalable, Needed Technology with Significant Added Value Motivated, Experienced, Talented Team Tremendously Expanding Market Applications in Broad Spectrum of Markets Opportunity to Capitalize on Emerging Applications First Mover Opportunity

Current Strategy Full Business Plan Development in Progress: Due Diligence Seeking Start-Up Capital From Angel Investors and Venture Capitalists Looking for Investors to Fill Gaps: Management, Partnerships, etc. Assembling Advisory Board Specifying Initial Product Offerings

Documents

M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Ann Arbor, MI January, 2001 Michael