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    1/51 Digital Integrated Circuits2nd Inverter

    POWER

    Introduction to Low P

    VLSI Design

    Dr Anu Mehra

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    2/51 Digital Integrated Circuits2nd Inverter

    Where Does Power Go in C

    Dynamic Power Consumption

    Short Circuit Currents

    Leakage

    Charging and Discharging Capacitors

    Short Circuit Path between Supply Rails during Sw

    Leaking diodes and transistors

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    Power dissipation can be

    dynamic

    due to capacitive switching

    short circuit power due to crowbar curr

    Glitches in output waveform

    Static

    leakage currents

    sub threshold current + reverse bias

    standby current pseudo nmos

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    Dynamic Power

    Charging and discharging o

    capacitors due to logic

    switching event

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    Each time the input switches fro

    or 1 to 0 power is consumed.

    PART IS DISSPATED in charging adischarging the capacitor

    PART IS STORED in the load capaci

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    Dynamic Power Dissipat

    Energy/transition = CL* V

    dd

    2

    Power = Energy/transition *f = CL* V

    dd

    2* f

    0 to1 or 1 to 0

    Need to reduce CL, V

    dd, andfto reduce power.

    Vin Vout

    CL

    Vdd

    Not a function of transistor sizes!

    iVDD

    f0 to1 or 1 to 0is the frequency of transition

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    2

    000

    )(DDL

    VDD

    outDDL

    out

    LDDDDVDDVDD VCdvVCdt

    dt

    dvCVdtVtiE

    2

    )(

    2

    000

    DDL

    VDD

    outoutLout

    out

    LoutVDDC

    VCdvvCdtv

    dt

    dvCdtvtiE

    Half the energy stored in the Capacito

    the other half is lost !

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    Node Transition Activ

    Consider switching a CMOS gate forN clock cycles

    EN

    CL Vdd

    2n N =

    n(N ): the number of 0->1 transition inN clock cycles

    EN: the energy consumed forN clock cycles

    Pavg

    N

    lim

    EN

    N-------- f

    clk=

    n N

    N------------

    N

    lim

    C

    L

    Vdd

    2fclk

    =

    0 1

    n N

    N------------

    N

    lim=

    Pavg

    = 0 1

    CL

    Vdd

    2fclk

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    Transistor Sizing for

    A quick review of delay

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    Delay Formula

    Cint= gCginwithg 1

    f= Cext/Cgin- effective fanoutCext=fC

    gin

    R = Runit/W ; C

    int=WC

    unit

    tp 0= 0.69R

    unitCunit

    Let tp=0.69 Req(Cint+Cext)

    =0.69 ReqCint(1+Cext/Cint)

    =tp0(1+Cext/Cint)

    =tp0(1+f/g)

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    Transistor Sizing fo

    Energy

    Goal: Minimize Energy of wholDesign parameters:fandV

    DD

    tp tpref of circuit withf=1 andVDD=V

    ref

    1Cg1

    In

    fCext

    Out

    TEDD

    DD

    p

    pp

    VV

    Vt

    fFftt

    0

    0 11gg

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    Delay as a function of VDD

    0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4

    1

    1.5

    2

    2.5

    3

    3.5

    4

    4.5

    5

    5.5

    VDD(V)

    tp

    (norm

    alized)

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    Digital Integrated Circuits2nd Inverter

    Total Capacitance of inverter c

    Cg1+Cint1+Cext1+Cint2+Cext2

    =Cg1+gCg1+fCg1+fgCg1+FCg1

    =Cg1(1+g ffg F)

    E=VDD

    2(totalcapacitance)

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    Digital Integrated Circuits2nd Inverter

    Transistor Sizing (2

    Performance Constraint (g=1)

    Energy for single Transition

    1

    3

    2

    3

    2

    0

    0

    F

    f

    Ff

    VV

    VV

    V

    V

    F

    f

    Ff

    t

    t

    t

    t

    TEDD

    TEref

    ref

    DD

    refp

    p

    pref

    p

    F

    Ff

    V

    V

    E

    E

    FfCVE

    ref

    DD

    ref

    gDD

    4

    22

    11

    2

    1

    2

    g

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    Digital Integrated Circuits2nd Inverter

    ref

    DD

    TEDD

    TEref

    TEref

    ref

    TEDD

    DD

    V

    V

    VV

    VV

    reftp

    tp

    VV

    V

    reftp

    VV

    V

    tp

    Freftp

    f

    Fftp

    tpref

    tp

    Freftptpref

    0

    0

    0

    0

    30

    20

    30

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    Digital Integrated Circuits2nd Inverter

    1 2 3 4 5 6 7

    0

    0.5

    1

    1.5

    2

    2.5

    3

    3.5

    4

    f

    vdd

    (V

    )

    1 2 3 4 5 6 7

    0

    0.5

    1

    1.5

    f

    norm

    alized

    energy

    Transistor Sizing (3

    F=1

    2

    5

    10

    20

    VDD=f(f) E/Eref=f(f)

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    Digital Integrated Circuits2nd Inverter

    Short Circuit Curren- another ap

    Rise/Fall time of input wave is greater than 0, so short

    circuit current will flow

    Let VTn=VTp=VT

    Consider 0 to 1 transition. Initially when Vin was 0,

    pmos was on and nmos was off

    As point 1 approaches nmos is turned on as Vin =VT.

    pmos is still on

    Short circuit current flows from VDD to GND

    Current increases to maximum when both devices

    enter saturation

    As point 2 approaches, pmos shuts down, crowbar

    current stops flowing

    VT

    VDD-VT

    1 2 time

    voltage

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    Digital Integrated Circuits2nd Inverter

    Direct Path currents con

    Area of an equilateral triangle is

    1/2base. perpendicularP=VI, E=Pt

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    Digital Integrated Circuits2nd Inverter

    How to minimize crowbar

    Consider a CMOS inverter with a 0 to 1 transition at the input

    Let C Lbe very large

    Thus, output will make a a 1 to 0 transition t f=0.69R

    NCL

    This delay will also be large

    Assume that input rise time is very small

    Input will change through transition before output changes

    Vs of pmos is at VDD

    VD of pmos will be approximately at VDD

    Thus VDS of pmos is approx 0

    Device shuts off before delivering any current

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    Digital Integrated Circuits2nd Inverter

    How to minimize crowbar

    Consider again a CMOS inverter with a 0 to 1 transition at theinput

    Let C Lbe very small

    Thus, output will make a a 1 to 0 transition t f=0.69R

    NCL

    This delay will also be small

    Assume that input rise time is very large

    Input will change through transition slowly

    Vs of pmos is at VDD

    VD of pmos will be approximately at 0

    Thus VDS of pmos is approx VDD

    Maximum short circuit current is

    delivered

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    Digital Integrated Circuits2nd Inverter

    Short Circuit Curren

    Vin Vout

    CL

    Vdd

    IVD

    D

    (m

    A

    )

    0.15

    0.10

    0.05

    Vin(V)

    5.04.03.02.01.00.0

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    Digital Integrated Circuits2nd Inverter

    How to keep Short-Circuit Cur

    Short circuit current goes to zero if tfall>> t

    rise,

    but can t do this for cascade logic, so ..

    Input

    slope isfixed

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    Digital Integrated Circuits2nd Inverter

    Conclusion

    Large CLmay mean less short circuit power, but it

    will also mean longer delays

    Will lead to short circuit currents in fan out gate as

    their tin will be slow!!

    Local Optimization pointless!

    To minimize power consumption in a global way

    Match rise/fall times of input and

    output waveforms

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    Digital Integrated Circuits2nd Inverter

    Minimizing Short-Cir

    0 1 2 3 4 5

    0

    1

    2

    3

    4

    5

    6

    7

    8

    tsin/tsout

    Pnorm

    Vdd =1.5

    Vdd =2.5

    Vdd =3.3

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    Digital Integrated Circuits2nd Inverter

    Dynamic Power -GlitchesGlitches are caused by arrival time oftwo separate input signals. If a given

    input signal arrives first and causes the output to switch, later another

    signal arrives and causes the output to switch back to original value.

    Undesired Power dissipation ! Glitches propagate thought the fanout ga

    cause further unintended transitions

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    Digital Integrated Circuits2nd Inverter

    Static Power Consumptio

    Caused by leakage currents due to

    Reverse biased Source and drain jun

    Subthreshold currents and ie curre

    flow when VGS is less than VT

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    Digital Integrated Circuits2nd Inverter

    Leakage

    Vout

    Vdd

    Sub-Threshold

    Current

    Drain Junction

    Leakage

    Sub-threshold current one of most co

    in low-energy circuit design!

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    Digital Integrated Circuits2nd Inverter

    Reverse-Biased Diode Lea

    Np+ p

    +

    Reverse Leakage Current

    +

    -

    Vdd

    GATE

    IDL = JS A

    JS = 10-100 pA/m2 at 25 deg C for 0.25m CMOS

    JSdoubles for every 9 deg C!

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    Digital Integrated Circuits2nd Inverter

    Subthreshold Leakage Com

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    Digital Integrated Circuits2nd Inverter

    Delay as a function of VDD

    0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4

    1

    1.5

    2

    2.5

    3

    3.5

    4

    4.5

    5

    5.5

    VDD(V)

    tp

    (norm

    alized)

    VT=0.5V

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    Digital Integrated Circuits2nd Inverter

    Static Power Consumptio

    Vin=5V

    Vout

    CL

    Vdd

    Istat

    Pstat= P (In=1).Vdd. Istat

    Wasted energy

    Should be avoided in almost all cases,

    but could help reducing energy in other

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    Digital Integrated Circuits2nd Inverter

    Principles for Power R

    Prime choice: Reduce voltage!

    Recent years have seen an accelera

    supply voltage reduction

    Design at very low voltages stillquestion (0.6 0.9 V by 2010!)

    Reduce switching activity

    Reduce physical capacitanceDevice Sizing: forF=20

    fopt(energy)=3.53,f

    opt(performance)=4.47

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    Digital Integrated Circuits2nd Inverter

    Modification for Circuits with

    CL

    Vdd

    Vdd

    Vdd-V

    t

    E0 1

    CL Vdd

    Vdd

    Vt

    =

    Can exploit reduced swing to lower p

    (e.g., reduced bit-line swing in me

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    Digital Integrated Circuits2nd Inverter

    POWER DELAY TRADE OFF

    We want low power and small delay. Why not minimize th

    Pavgis average Power consum

    tpis average delay

    Only dominant term

    in Power Equation

    Assume Gate switches at

    maximum possible rate so rise

    and fall

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    Digital Integrated Circuits2nd Inverter

    To Reduce PDP

    Reduce Load Capacitance

    Reduce Supply Voltage

    PDP does not capture the fact that reducing

    Supply Voltage lowers Power consumption,

    but increases delay

    New metric Energy Delay Product is defined

    (EDP)

    EDP=PDP tp

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    Digital Integrated Circuits2nd Inverter

    Differentiating EDp w.r.t. VDDand

    putting the result equal to 0

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    S S SS T

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    Digital Integrated Circuits2nd Inverter

    LPVD Lecture-1

    Three com ponents :

    Dynamic Capacitive (Switching) Power:

    - Charging and Discharging the capacitan

    - Still dominant component in current t

    Short-circuit Power:

    - Due to current flow from Vdd to GND.

    - Worst in case of slow transition.

    Leakage Current:

    - Diodes L eakage around transistor and N-

    - Increases 20 times for each new technolo

    - Becoming insignificant to the domina.

    SOURCES OF POWER DISSIPATI

    R R S

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    Digital Integrated Circuits2nd Inverter

    LPVD Lecture-1

    Reduced switching voltage:

    - P=CfV2Saving in power but p erformance is l

    - Transistors become slow due to low V t, leakage

    current increases. Noise margins prob

    Reduced leakage and Static Current:

    - Can be reduce by transistor sizing, layou

    and careful circuit design.

    - Circuit models can be turned off if not in

    Use Standby Mode :

    - Clock disabling and power-off of selectblocks.

    LOW POWER APPROACHES

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