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S’Tile - Pôle des Éco-industries - 3, rue Raoul Follereau F-86000 - Poitiers – France
Low cost production of monocrystalline equivalent silicon wafers for PV cells Alain Straboni, CEO Ecosummit – Düsseldorf November 15, 2012
⁄ Founded in 2007 - Highly Experienced Team
⁄ 4.5 M€ Seed and A rounds & R&D Grants
⁄ Proprietary “Silicon Tile” Technology – Silicon film on Sintered silicon wafers : 2 exclusive licenses from CNRS – 6 PCT Patents (pending and granted)
⁄ Located in Poitiers - West of France
⁄ 11 employees
ABOUT S’TILE
Shareholders ⁄ Alain Straboni and S’tile’s key people ⁄ Emertec Gestion ⁄ PCI (local venture capital) ⁄ Poitou-Charentes region
BOARD OF DIRECTORS AND SUPERVISORY BOARD
DR. JEAN-PHILIPPE STEFANINI General Partner Emertec 20 years R&D in aeronautical industry
DR. VOLKER HOFFMANN R&D manager at Q-Cells from 2001 to 2009 Consulting expertise in photovoltaics
Prof. ALAIN STRABONI / CEO and Founder
Prof. in material physics. more than 25 years of experience in microelectronics & photovoltaics 80 scientific papers- 25 patents
FLORENT DUPONT / R&D Manager ENSMA/EUREC Engineer 3 years in PV industry
JEAN-BAPTISTE BRETTE / Head of Industrialization ESIM/EUREC Engineer 5 years in automotive industry 3 years solar industry
EMMANUEL TURLOT 20 years in photovoltaics and semiconductors CEO at Thompson Multimedia CEO at Unaxis-Nextal
SOLAR PHOTOVOLTAIC MARKET
⁄ Even if Chaotic, total world’s installed capacity increased by 13GW in H2 2012 growing by 35% compared to 2011*,
⁄ Germany adding 4.4 GW
.
* www.imsresearch.com 2012
Photovoltaics : Give me a reason to invest in PV ? One : the market s6ll increases.
Second : some big players leaving : free places to keep
⁄ In module cost, wafer is 50% mainly due to materials : Pure silicon and sawing consumables
⁄ In addition capital costs* for wafering and pure silicon, even in China is 1.5 times greater than in the Cell
Ingot 4 %
Wafer 52 %
Cell 24 %
Module 24 %
Pure Si 24 %
Sawing 24 %
COST STRUCTURE OF CRYSTALLINE MODULES
* Taiwanese polysilicon - Pv Magazine p.80 -Sept 2012
⁄ Silicon wafers 90% of market • High efficiency 16 - 20% • Lifetime 25 years
BUT …
WHY USING A SO THICK WAFER as PHOTONS ARE CONVERTED into ELECTRONS IN THE FIRST TENS MICRONS ?
STANDARD MONOCRYSTALLINE WAFER
200 µm
And 200 µm lost during sawing
⁄ Sawing less than 150 µm is
impossible : too much breakage during sawing and cell fabrication.
⁄ Solution : Peel the mono ⁄ Wafer and transfer it on a low cost
substrate.
Our solution : A wafer pressed/ sintered from MG powders with a monocrystalline film on top
⁄ No Silicon purification & no sawing =
Low production cost ⁄ And Low Capex
⁄ With Advantages of Silicon of High
efficiencies & Lifetime
S’Tile Cell
Seed layer
Sintered metallurgical silicon substrate
Crystalline pure Si active layer 15 to 25 µm thick
A NEW CONCEPT OF MONO Equivalent WAFER
THE PROCESS
Grinding chunks or direct supply of low cost silicon powder (3 – 5 €/kg)
Sintering of silicon bed powder to form a wafer
Transferring a mono crystalline silicon seed film on top of the sintered substrate
Step 1 Silicon grinding
Step 2 Press/Sintering
Step 3 Seed Layer
Step 4 Epitraxy CVD
Step 5 Standard Cell
A 25 µm thick mono crystalline layer is deposited by CVD (process developed by Fraunhofer ISE)
At this stage, a standard crystalline silicon cell production process can be carried-out
A NEW CONCEPT OF PV MONO Equivalent WAFER
Reducing Both COST and CAPEX
Standard Monocrystalline Wafer
S’Tile Mono Equivalent Wafer
Silicon 11 (Solar Grade) 2,5 (Metal. Grade) Substrate - 5
Wafering / Epi 15 7.5
Total Cost (c€/W) 26* 15
Total Capex (c€/W) 84 - 93** 46 * Centrotherm Data in Photon Magazine August 2012 ** HSBC Global Research company report (sept 2011) + internal data
KERFLESS WAFERING COMPETITORS
/ SiEpitaxial layer on Substrate is recognized as the most promizing market size together with the highest impact on the cost reduction : Lux research report 2012
Technology Leader Advantages Limits/risks
Peeling No epitaxy Peeling with metal AstrowaP Simple process, low cost High risk of metal contamina6ons
Ion implanta6on Twin Creeks, SiGen
High efficiency poten6al Very high Capex : High flux implantor
Peeling and epitaxy Film transfered on foreign substrate (glass or plas6cs)
Crystal Solar, Solexcell
Low cost produc6on, low capex High risk of breakage Non standard Cell/module processes
ROUND B FUND RAISING
k€ 2013 2014 2015 2016 Total cost
Total With revenues
2 000
3 500 (40)
7 000 350
5 500 450
18 000
R&D/Pilot design Running Pilot Start new lines
The 2013-2014 phase is financed by 3.5 M€ of public funds, mainly OSEO, credit tax and 3 FP7 European programs. We look for 2 M€ increase capital.
A second fundraising of 3 M€ is planned at Q3 2014 with also a large public support.
• Reinforce the management, • Experts to install the pilot line, capacity 15 MW • Budget to Finance the line
⁄ With the Mono Equivalent wafer disruptive technology S’Tile would be able to reduce significantly production and capital costs
⁄ Thanks to EU and French OSEO subsidies, VC’s and industrial investors, this round B will finance a pilot of 15 MW capacity starting its production H2 2014.
Thank you for your attention
CONCLUSIONS