Liquid Cooled Cabinets

8/18/2019 Liquid Cooled Cabinets

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www.coolitsystems.com T: 403.235.4895 Toll Free: 1.866.621.2665

Product Guide

Direct Contact Liquid Cooling (DCLC)Industry leading data center solutions for

HPC, Cloud and Enterprise markets.


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© 2015, CoolIT Systems, Inc. All Rights Reserved

Leadership, Collaboration & ExpertiseCooIIT Systems Innovates and Delivers

“We strive to deliver

the highest level of

product and service so

that when customerschoose CoolIT, they

know they are getting

the best.”

Geoff Lyon, CEO/CTO CoolIT

Technology Partners Solution Partners

CoolIT Systems is a world leader in Direct Contact Liquid Cooling for the Data Center,

Server and Desktop markets. CoolIT has been dedicated to the invention and design of

safe and reliable liquid cooling technology since 2001. As an experienced innovator with

50 patents and more than 2 million liquid cooling units deployed in desktop computers,

servers and data centers around the world, CoolIT’s Rack DCLC™ technology is the top

choice for many OEMs and system integrators.

Proven Technology

Selling 30-40K DCLC units/month

>2M units sold worldwide

99.998% leak free and improving

50 issued patents

Achievements

CoolIT named Gartner 2015 Cool Vendor for Data Center Power & Cooling

Geoff Lyon elected as Chair of The Green Grid Liquid Cooling Work Group

Profit500 2014– #34 in Canada (1780% 5-year growth rate)

Deloitte 2014 Technology Fast 50 Canada - ranked #23

Global Installations


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Focused on Your Cooling ChallengesDirect Contact Liquid Cooling (DCLC)

Direct Contact Liquid Cooling (DCLC) uses the exceptional thermal conductivity of liquid to provide dense, concentrated cooling

to targeted surface areas. By using DCLC, the dependence on fans and expensive air conditioning and air handling systems is

drastically reduced. This enables extremely high rack densities, reduced power use and access to significantly higher performance

potential.

Immediate CAPEX & OPEX Benefits

Traditional data centers employ chiller-based air cooling systems

that consume 50% of all data center power. ASHRAE W3-W5

warm liquid cooling eliminates the need for chilled water supply and

delivers a rapid ROI. Integrating liquid cooling initially increases the

basic server cost; however, this increase is quickly offset by several

factors:

• High density solutions require less data center equipment

(racks, switches, raised floor, etc) lowering overall CAPEX

• 22% decrease in OPEX thanks to reduced chilled water

requirements when using warm liquid cooling

li li

Total IT Power

Total Data Center Power*Including Cooling IT UPS & AUX

# of Racks Required

IT Density

1.5 MW

2.7 MW

100

15kW/rack

1.5 MW

1.8 MW

55

27.7kW/rack

* Using Koomey’s data center costing methods

“Trust is a huge factor when putting

liquids in close proximity to critical

electronics. CoolIT’s technologyoutfitted with Stäubli’s non-drip

connectors works flawlessly.

Skeptics become converts.”

Rusty Robertson, Aerospace/Defense Application Specialist

Stäubli Corporation

DCLC Gives You The Advantage

Facilitates peak performance for

higher powered or overclocked

processors.

Provides a significant reduction

in total data center energy

consumed.

Enables 100% utilization of rack &

data center spaces.

Performance Efficiency Density

With options for data centers with or without facility water hook up, any server in any rack can be liquid cooled with CoolIT’s

hardware, and benefit from immediate and measurable CAPEX and OPEX benefits.

CAPEX(annualized)

OPEX(annualized)

Rack Density

Data Center PUE


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Rack DCLC utilizes a three module approach (Server Module, Manifold Module and Heat Exchanger Module) that allows for a

tremendous amount of product flexibility when integrating liquid cooling. Rack DCLC Modules are designed for a flexible fit to various

compute environments. While Server Modules and Manifold Modules are installed with each system and are local to the rack, the

appropriate heat rejection method may vary. Rack DCLC offers a variety of heat exchanging modules depending on load requirements

and availability of facility water.

Server Module

CoolIT’s Server Modules can cool any combination of CPU, GPU, Xeon Phi and Memory components, with customization available

for VR, ASIC, FPGA, and other devices. A server installed with CoolIT Systems Rack DCLC technology remains hot-swappable and

simple to service.

CoolIT’s patented V-groove

Micro-channel Cold Plate is a

solid copper component that

maximizes performance for

today’s high thermal density

applications. This designdirects the coolest liquid to

the warmest region of the

processor first.

The R4 is a passive cold plate

technology employed by

CoolIT in centralized pumping

architectures. The R4 system

is purpose-designed to

accommodate lower profilefootprints such as blades and

other custom chassis and is

guaranteed to withstand over

200 PSI.

CoolIT employs Fluorinated

Ethylene Propylene (FEP)

tubing for ultra-high reliability

applications. The design of

this tube consists of both

CVT (Corrugated Tube) andstraight wall sections. FEP is

durable, compact, and offers

low water vapor transmission.

CoolIT offers an effective, low

cost, patented Leak Detection

System that can be deployed

at the server level. This leak

detection cable can be placed

nearly anywhere inside thechassis.

CPU GPU Memory

Modular ComponentsRetrofitable Cooling Solutions for All IT Demands

V-groove Micro-channel

Cold Plate

R4 Passive Head Unit FEP Tubing Leak Detection Cable


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Server Module

Manifold Module

CHx650 Module

CHx40 Module

AHx35 Module

Modules

Requires Facility Water No Facility Water

AHx20 Module

CHx and AHx solutions support all sizes

of racks. Various sizing and designs areavailable depending on customer needs

and environmental factors.

Your choice of Liquid-to-Liquid or Liquid-to-Air centralized pumping Heat Exchanger Module:

Manifold Module

The Manifold Module is the system that transports liquid between the Heat Exchanger Modules and any number of Server Modules. The

Manifold Module can be customized to suit any server or rack environment. Utilizing a stainless steel body and non-drip quick connects

makes CoolIT’s Manifold Modules incredibly safe and robust.

Heat Exchanger Module

CHx (Liquid-to-Liquid) AHx (Liquid-to-Air)

Employed in all Rack and Chassis

Manifolds, Stäubli is CoolIT’s expert

choice for quick connect technology.

Stäubli product has industry leading

reliability, is simple to use, and is

100% drip-free.

CoolIT’s Rack Manifolds are made

of reliable stainless steel, dry-break

dripless quick connects, and are

organized for a manual connection at

the front or back of the rack. Manifolds

are flexible and can be arranged

vertically or horizontally within a rack.

CoolIT’s Chassis Manifolds are

integrated into blade style chassis and

use blind-mate quick connects that are

designed to accept a small misalignment

between the server and chassis manifold.

These blind-mate systems are the a

reliable and user-friendly way to liquid

cool servers.

Rack Manifold Stäubli Quick ConnectsChassis Manifold


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Liquid-to-Liquid heat exchanger that manages a network of IT cabinets.

C a p a c i t y ( k W )

1000

750

500

250

0

10 20 30 40 50

Facility Input Temperature ( °C )

Maximum Cooling Load (kW) vs. Facility Liquid Input Temperature (°C)

CHx650 Cooling Capacity

Key Features

Key Benefits

• Manages 650kW of IT load

• W3-W5 warm water cooling

• Redundant centralized pumps

• Full control system

• Significantly reduces energy costs

• Dramatically increase CPU/GPU density

• Eliminates the need for chillers and CRACs

• Servers remain hot-swappable and easy to service

• Monitor system health remotely

The CHx650 Module can be customized to fit various

data center environments. Standard equipment groups

offer N+1 redundancy and when used in tandem can

provide tier 4 resiliency.

Cooling Capacity

(@ 30 °C facility liquid)

Power Consumption

(Max)

Racks Per Solution

ROI (months)

Facility Liquid Integration

650kW

4.2kW

5-20

1-6

Yes

CHx650 Module Cooling CapacityMaximum Cooling Load (kW) vs. Facility Liquid Input Temperature (C)

Rack DCLC CHx650 solution is designed to manage the

distribution of clean, treated coolant to and from a network

of IT cabinets.

This CHx accepts ASHRAE W3-W5 (2°C - 45°C) warmfacility water and can manage 650kW of processor load

per network.


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Liquid-to-Liquid heat exchanger that manages a single IT cabinet.

Rack DCLC CHx40 solution is designed to manage the dis-

tribution of clean, treated coolant within a single IT cabinet.

This 2U CHx accepts ASHRAE W3-W5 (2°C - 45°C) warm

facility water and can manage 40kW+ of processor load per

rack.

CHx40 Cooling Capacity

C o o l i n g C a p a c i t y ( k

W ) 60

50

40

30

20

10

010 20 30 40

Facility Flow Rate (L/min)

20°C

30°C

40°C

Facility water temperature

Key Features

Key Benefits


• Eliminates the need for chillers and CRACs



• Supports 40kW+ cooling capacity per rack

• W3-W5 warm water cooling


• 2U form factor

• Leak detection and mitigation system


Cooling Capacity

(@ 30 °C facility water)

Power Consumption

(Max)

Racks Per Solution

ROI (months)

Facility Water Integration

40kW

110-120 Watts

1

1-6

Yes

CHx40 Module Cooling Capacity


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• No facility water required




The AHx35 Module is a unique top-of-rack solution that

can manage 35kW+ of processor load without the need

of facility water.

The AHx35 Module dissipates heat to the surrounding

environment via a liquid-to-air heat exchanger.

AHx35 Module - various designs available

(hot aisle, cold aisle, chimney, or other )

Liquid-to-Air heat exchanger for faster, more powerful clusters in less space.

AHx35 Cooling Capacity

C o o l i n g C a p a c i t y ( k W )

10

60

50

40

30

20

10

020 30 40 50

Facility Air Inlet Temperature (°C)

*Cherry Creek AHx

Key Features

Key Benefits


• Stand alone rack-based liquid cooling



• Easily upgradable to CHx Module

Cooling Capacity

(@ 25°C air)

Power Consumption

(Max)

Racks Per Solution

ROI (months)


35kW

795 Watts

1

1-12

No

AHx35 Module Cooling Capacity



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The AHx20 Module packs an incredible amount of heat

load management into a small form factor. This top-of-rack

solution provides superior processor performance and very

high densities.

The AHx20 Module is perfect for compute environments

that are short on space, big on compute, and don’t have

access to facility water.

Liquid-to-Air heat exchanger for powerful clusters in limited space.


• No facility water required




Key Features

Key Benefits

C a p a c i t y ( k W )

30

22.5

15

7.5

0

10 20 30 40 50

Facility Input Temperature ( °C )

Cooling Capacity

(@ 25°C facility water)

Power Consumption

(Max)

Racks Per Solution

ROI (months)


20kW

300 Watts

1

1-12

No


• Stand alone rack-based liquid cooling



• Easily upgradable to CHx Module

AHx20 Module Cooling CapacityMaximum Cooling Load (W) vs. Facility Air Inlet Temperature (°C)



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CoolIT Deploys Rack DCLC Solution to Poznan Supercomputing & Networking

Center in Partnership with Huawei and Itprojekt

The Challenge

Poznan Supercomputing & Networking Center (PSNC) was looking for

a safe and reliable way to increase HPC compute density while lowering

overall operating costs. In addition, PSNC wanted to leverage the

lower operating temperatures from liquid cooling to increase processor

performance.

• CoolIT Systems Rack DCLC™ CHx40

• CPU and Memory cooled by liquid

• Huawei E9000 chassis

• Huawei CH121 server

• Intel® Xeon® Processor E5-2697 v3

• Memory: DDR4 8GB

• 128 servers in 3 racks

HPC Setup Results

• 80% of total IT load managed by liquid cooling

• 75% fan speed reduction

• 30kW per rack

• 910 GFLOPS per node (116 TFLOPS total)

• 40°C primary fluid supply temperature

• First ever Huawei liquid cooled cluster

Case Study

“Reducing energy usage and lowering

operating costs are permanently on

our check-list when planning for new

high performance computing clusters.Liquid cooling is the most efficient way

to achieve our objectives and we are

seeing excellent results and reliability

from the combined Huawei and CoolIT

Systems cluster.”

Radoslaw Januszewski, IT Specialist

PSNC

The Solution

The PSNC solution combines Huawei CH121 blade servers in the E9000

chassis with CoolIT Systems Rack DCLC™ CHx40 centralized pumping

solution to manage 100% of CPU and memory thermal load. Dual left

and right Manifold Modules were positioned on the front of the rack

to manage the front i/o server architecture and ensure easy and quick

service access to the blades. The cluster, delivered by Warsaw based

systems integrator Itprojekt, is an extremely efficient solution that utilizes

inlet water temperatures of 40°C and beyond.


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• CoolIT Systems Rack DCLC™ CHx40

• Dual CPU liquid cooled server modules

• HP ProLiant DL560 Gen8 servers

• Intel® Xeon® Processor E5 4600v2 130Watt CPU’s

• Modular data center

• 40°C primary fluid supply temperature

CASE STUDY: Cooling a SupercomputerLiquid Cooling for Heat Reuse: Center of Biological Sequence Analysis at the

Technical University of Denmark

The Challenge

The Center for Biological Sequence Analysis (CBS) at the Technical

University of Denmark is striving towards C02 neutrality in its High

Performance Computing (HPC) facility known as ‘Computerome’. An equally

important goal is provisioning these computational resources as efficiently

as possible within a modular data center environment. CoolIT Systems

accepted the challenge to deliver a liquid cooled system that dramatically

lowers energy consumed for cooling and provides a workable system to

recycle the waste heat from the servers.

HPC Setup Results

• 72% of total IT load managed by liquid cooling

• 14kW total rack load (130watt CPU’s x 108)

• 563 GFLOPS per server (at peak performance)

• Further results will be published after testing

Case Study

“An important goal was provisioning these

computational resources as efficiently as

possible. CoolIT delivered a liquid cooled

system that lowers the energy consumed

for cooling and provides opportunities to

reuse the waste heat from the servers.”

Peter Løngreen, Head of HPC

CBS-DTU

The Solution

CoolIT Systems is addressing CBS’s need to be CO2 neutral in the university’s HPC facility by replacing traditional air

cooling with highly efficient liquid. The CBS solution combines rack mounted HP ProLiant DL560 Gen8 servers with

CoolIT Systems direct contact liquid cooling and Rack DCLC™ CHx40 centralized pumping solution, to manage the

dual CPU thermal load. The liquid is distributed directly to the processors through stainless steel manifolds that utilize all

metal, dry-break quick connects for hot-swappable servicing of any single server. With 16,000+ cores and 92 TB memory,

Computerome is now ranked 121 of the Top500 supercomputers in the world. The cluster, delivered by Go Virtual, accepts

an inlet water temperature of 40°C and beyond to gain maximum efficiency. CBS enables waste heat recovery by routing

the high temperature liquid from the servers to provide heat for the adjacent buildings and nearby town of Roskilde.


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[email protected]

www.coolitsystems.com

@coolitsystems

Bay 10, 2928 Sunridge Way N.E., Calgary, AB, T1Y 7H9, CANADA

T: +1 403.235.4895

Toll Free: 1.866.621.2665

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Liquid Cooled Cabinets