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21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
LeddarTech LeddarVu LiDARDescription of the systemSystem report by Sylvain Hallereau & Farid HamraniApril 2017
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 2
Table of Contents - LeddarTech LeddarVu LiDAR
Overview / Introduction 3
o Executive Summary
o Block Diagram
o Reverse Costing Methodology
Company Profile 7
o LeddarTEch
Physical Analysis 9
o Views and Dimensions of the System
o System Opening
o Mother Board
Top Side – Global view
Top Side – High definition photo
Top Side – PCB markings
Top Side – Main components markings
Top Side – Main components identification
Top Side – Other components markings
Top Side – Other components identification
Bottom Side – High definition photo
Bottom Side – Components identification
o Receiver Board
o Emitter Board
Cost Analysis 35
o Accessing the BOM
o PCB Cost
o BOM Cost – Mother Electronic Board
o Housing Parts – Estimation
o BOM Cost – System’sHousing
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Mother Board Manufacturing Flow
o Details of the Mother Electronic Board AV Cost
o Details of the Module Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Estimated Price Analysis 63
o Estimation of the Manufacturing Price
Company Services 66
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 3
Table of Contents - Hamamatsu Silicon PIN Photodiode
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 7
o Hamamatsu Technologies
Physical Analysis 10
o Synthesis of the Physical Analysis
o Package analysis
Package opening
Package Cross-Section
o Photodiode Die
Photodiode Die View & Dimensions
Photodiode Die
Photodiode Die Cross-Section #1
Photodiode Die Cross-Section #2
Photodiode Die Process Characteristic
Photodiode Manufacturing Process 29
o Photodiode Die Front-End Process
o Photodiode Die Fabrication Unit
o Packaging Fabrication unit
Cost Analysis 33
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o Photodiode die
Photodiode Die Front-End Cost
Photodiode Die Probe Test, Thinning & Dicing
Photodiode Die Cost
Wafer Cost Evolution
Packaging Cost
Packaging Step Cost
Component Cost
Component Cost Evolution
Price Analysis 45
o Estimation of selling price
Company services 48
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 4
Table of Contents - Excelitas TPGEW1S09H Laser Diode
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 7
o Excelitas Technologies
Physical Analysis 12
o Synthesis of the Physical Analysis
o Package analysis
Package opening
Package Cross-Section
o Laser diode Die
Laser diode Die View & Dimensions
Laser diode Die
Laser diode Die Cross-Section #1
InAlGaAs Epitaxy Cross-Section
Laser diode Die Cross-Section #2
High Reflective Coating – Cross-Section #2
Laser diode Die Process Characteristic
Laser diode Manufacturing Process 35
o Laser diode Die Front-End Process
o Laser diode Die Fabrication Unit
o Package Process flow
o Final Test & Packaging Fabrication unit
Cost Analysis 46
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o Laser diode die
Laser diode Die Front-End Cost
Laser diode Die Probe Test, Thinning & Dicing
Laser diode Die Wafer Cost
Laser diode Die Cost
Wafer Cost Evolution
Packaging Cost
Packaging Step Cost
Component Cost
Component Cost Evolution
Price Analysis 59
o Estimation of selling price
Company services 62
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 5
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Views and Dimensions
Side View of the System
12
mm
44
mm
64
mm
70mm
Receiver ModuleEmitter Module
Mother Board
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 6
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Receiver Board – Top Side Side – Main Components Markings
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
Housing parts – Estimation – Receiver Lenses
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 8
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package characteristics
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 9
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Cross-Section #1
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 10
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package characteristics
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Cross-Section #2
©2017 by System Plus Consulting | LeddarTech LeddarVu LiDAR 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
Material Cost Breakdown by Component Categories (Details)
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Cost Analysiso Accessing the BOMo PCB Costo Electronic BOM Costo Housing– Top Housingo Housing– Heatsinko Housing BOM Costo Material cost Breakdown
Manufacturing Process Flow
Selling Price Analysis
Related report
About System Plus
Electronic Board - B.O.M. Cost
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related report
About System Pluso Company serviceso Feedbackso Contacto Legal
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Related report
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Contact
Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi [email protected]
Mavis WANGGREATER [email protected]
NANTESHeadquarter
FRANKFURT/MAINEuropa Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
