Leading Manufacturer of (G)MR Head Test Equipment Since 1995

3000 Olcott St.

Santa Clara, CA 95131

Tel: 408 941-8300

E-Mail: sales@us-isi.com

Web: www.us-isi.com

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Topics Introduction to ISI

ISI Technology and Test Capabilities

Product Suite

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Corporate Headquarters

Santa Clara, California17,500 Sq.Ft. Total7,500 Sq.Ft R&D

10,000 Sq.Ft. Manufacturing

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MMI Systems PTE LTD in Singapore is ISI’s Manufacturing Partner

The MMI Group is a publicly-held company in Singapore providing Contract Manufacturing Services in the form of Precision Engineering Components, Factory Automation Equipment, Electronics (PCB Assembly), Electro-mechanical assembly of Intermediate and Finished products.

Industries covered includes Data Storage, Telecommunications, Computer Peripherals, Optics, Photonics and Semiconductor Equipment.

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Design Development / Prototype Area/ Assembly Areas

Components Precision Machining

Main Office/ Assembly Areas

370+ Personnel

100 000 sq.ft.

Dedicated to Equipment CM and Automation

MMI Systems: Kaki Bukit, Singapore

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MMI Class 10K Assembly Area

ISI Assembly Final Test Area

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ISI Customers Fujitsu Hitachi GST HnT Samsung Headway Teleplan

Western Digital Seagate SFIT TDK/SAE Toshiba Sony Sun Microsystems

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ISI Production Installed Base

OVER 600+ QST-2002 HSA Production TestersOVER 250+ Blazer-X5B Row Production TestersMultiple Engineering F/A and Reliability Systems

Major Customer A Major Customer B

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World Wide Support

USA – Integral Solutions Int’l Malaysia – Integral Solutions Int’l Thailand – Integral Solutions Int’l Philippines – Integral Solutions Int’l Japan – Xyratex Japan Singapore – WesTech China – WesTech Korea – Bay Solutions

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ISI QST Tester in a NutshellQST test equipment for Wafer, Row, Slider, HGA, HSA, and HDD test applications, using a common electronics/software platform:

Static Tests Voice coil, Shorts, Fault Detection, ...

Low Frequency Measurements

Transfer Curve, Amplitude, Resistance, ...High Frequency Measurements

SMAN, SMAN II, AC Noise, Popcorn, FFT, ...

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Low Frequency MeasurementsMeasures head resistance change versus an externally applied magnetic field through a low frequency channel. The following Low Frequency tests can be performed.

Resistance Transfer curve Stability Bias angle Asymmetry sweep Resistance delta

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Transverse Transfer Curve

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Static Tests (HSA / HDA)

As an optional plug-in board for HSA/HDA test applications, verification of the Preamp Chip, Flex, and Voice Coil assembly can be performed. Voice coil measurements Fault detection Current consumption Pin-Pin and Pin-Ground shorts Temperature Sensor control Passive component measurements RDX / RDY offset voltage

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High Frequency MeasurementsMeasures high frequency read sensor noise as influenced by write, field, temperature, ESD stress, or combinations of those stresses. The following High Frequency tests can be performed

SMAN and SMAN II FFT Frequency Response Glitch After Write (Popcorn /w digitizer) and

simultaneous field sweep AC Noise Test W/R Recovery (/w digitizer)

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High Frequency Channel Technology 200 Mhz Analog Bandwidth 160 Mhz 10-bit digitizer Real-Time 250 uS Memory per cycle /w pre-trigger Simulates HDD HF Channel (measures from Rdx/Rdy) Smart Threshold Trigger for Digitizer Very Low Noise Channel W/R Recovery < 500 ns 12.5 – 400 Mhz Write Frequency Programmable Last Edge Polarity 2 User Selectable Filters (High-Pass freq defined by customer) Low Cut-Off Frequency 1-3 Mhz (defined by customer)

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Field Induced InstabilitySoft Kink at 160 Oe

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Field Induced Instability @ 150 Oe

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Field Induced Instability @160 Oe

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Field Induced Instability @ 170 Oe

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Spectral Maximum Amplitude Noise (SMAN) Test

Patent: US6943545

Soft Kink at 160 Oe

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Digitizer is The Key to S.M.A.N. Qualifies Three Types of Instability

Events in One Second Test

RMS Noise for broadband noiseMax Amp for rare events such as

Barkh. Jumps and Write Induced Instability

Amp Noise for high probability noise

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Popcorn/AC Noise tests vs. SMAN

Popcorn/AC noise set a threshold and count pulses exceeding the threshold

Result is a count i.e. 10 or 10,000 Not enough information and not repeatable enough for pass/fail

SMAN digitizes all pulses and gets noise amplitude in uV. Results are repeatable within 15% Allows prediction of drive level performance. Screens out heads that will cause high BER or loss of servo.

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Spectrum Analysis

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Product Suite

SLIDER FAB HEAD FAB RELIABILITY ESD

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Slider Fab Testers

Blazer-X5B Row/Bar Level Blazer-X5S Slider Level DSI-3000 Device Sorter Inspection

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Blazer-X5B Row/Bar Level Analyzer

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Blazer-X5S Slider Level Analyzer

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Blazer-X5 Platform Electronics Uses QST-2002E for all measurements Dual LF simultaneous measurement channels Pad miss-contact detection Four point resistance measurement Up/Down slider selection with single Probe Card Writer resistance measurement Contacts grounded during probing Selectable gain channels Programmable diode clamping High Field Intensity +/- 1350 Oe Field Resolution 0.165 Oe L-Field < 2% Field Uniformity 2%

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Blazer-X5 System Features Supports Pico and Femto devices Compact footprint Automated device handling Uses process trays as test trays Bar Sizes 30-100 mm Minimum Pad Size 80uM Missing device detection Compact Probe Card (2”x3”) 8 Point Probe Card, 2 sets Probe contacts both writer and reader Simple Probe Card Alignment without tools Active slider pickup nozzle OCR option

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DSI-3000 Device Sorter Inspection

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DSI-3000 Features Input: Up to 2 user defined de-bond trays or 10 standard 2x2 Waffle Trays* Output: Up to 20 standard 2x2” Waffle Trays* Slider not flat in output tray:...............<0.5% Unable to pick up slider:....................<0.5% Sliders dropped:.................................<0.01% Sliders lost:.........................................0% Uptime:...............................................>98% Semi-Auto Nozzle Verification:...........Yes Semi-Auto Nozzle Calibration:...........Yes 1, 4 or 9 Point tray calibration:...........Yes ESD Safe:...........................................Yes Application Dependent* UPH (Femto/Pemto w/ OCR):............2500 Unread OCR:......................................<0.1% Mis-Read OCR:..................................<0.05%

*Note: Input/Output side is user defined

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Head Fab Products

QST-2002 table top unit Universal tooling interface Available toolings for HGAs, HSAs, HDAs Optional magnet configurations QST-2002HF

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QST-2002 SYSTEM

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QST-2002 Toolings

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Optional Magnet Configurations

High Field Magnet

Side Field Magnet

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QST-2002 Technical Features

Low Noise < 20 uV Pk-Pk Dual DC Channel High Accuracy/Repeatability Adjustable Field Angle 360° High Field Intensity +/- 1000 Oe Uniform Field < 1% High Write Current Open Architecture Software

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QST-2002HF High Field QST System

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QST-2002HF Technical Features

+/- 15,000 Oe Field Blazer-X5 Platform Air Cooled Magnet Support standard AC Channel Analysis 0-90 Deg Rotation Standard 2x HGA Tooling Support

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Sample Test Plots

Transverse Transfer Curve

Longitudinal Transfer Curve

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Thermal Reliability Products

Blazer-X5L Row/Bar Level Lifecycle tester QST-2002 /w 8x Temperature Control

Module QST-2002RT /w 12x Temperature Control

Module

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Blazer-X5L Row/Bar Lifecycle Tester

Patent: US6943546

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Blazer-X5L Electrical Features

Temperature up to 100° C with <1° C Accuracy Bias Current/Voltage selectable Tests up to 96 elements at a time Writer Stress capable 200 Mhz AC Channel capable Uses QST-2002E for all measurements

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QST-2002 with 8x Tooling

QST-2002 /w 1x and 8x Temp Control Module

QST-2002 with 1x Tooling

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QST-2002 /w Temp. Control Module

Unique 1x and 8x Head Hot Plate Design Max Temperature 250° C 1° C Temperature Accuracy .01° C Temperature Stability 8x Cartridge Design Independent Bias current/voltage control for all

heads

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1x and 8x Hot/Cold Test System

1x Hot Cold Plate on Gen2 2x Platform

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QST-2002 with Hot/Cold Module

Unique 1x and 8x Head Hot Plate Design Temperature 5-120° C 1° C Temperature Accuracy Cartridge Design Independent Bias current/voltage control for all

heads

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QST-2002RT /w 12x Temp Control Module

Hot/Cold Option /w Humidity Control

Hot Only Option

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QST-2002RT Temp Range (Hot-Only):......ambient to 250° C Temp Range (Hot/Cold):..............-20° to 80° C Humidity Control:................Yes (Hot/Cold only) Accuracy:......................................................5% Stability:..................................................0.25° C Control:...........................................Closed Loop Gen3 2xBar Electronics Front-end Dual 6xHGA Cartridges HGA Cartridges customizable for different head types and configurations Offline HGA mounting Simultaneous Electrical Stress with Temperature Electrical Stress includes any combination of Bias, Bias Pulsing, Write,

DFH, or Field Stress Full LF and HF measurement capability with short interconnections

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Temperature Test

Transfer Curve

QST-2002 /w Temp. Control Test Results

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Accelerated Life Test @ 5.5 Days

Resistance and Amplitude Deteriorating after 5.5 Days of elevated temperature (100C) and elevated VBias

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ESD Products

EPS-100 ESD/CDM Pulse System ESD Waveform Modules

D-CDM (Direct Charged Device Model) HBM (Human Body Model) MM (Machine Model)

EPS-100 ESD/CDM /w Blazer-X5B

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ESD/CDM Pulse System /w D-CDM Cartridge

Patent Pending

EPS-100 ESD/CDM TESTER

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EPS-100 ESD/CDM Tester /w Blazer-X5B

DCDM Module on Blazer-X5B

EPS-100 on Blazer-X5B

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EPS-100 Available Waveforms

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EPS-100 ESD/CDM Pulse System

Bipolar Voltage +/- 100 V High Resolution < 3 mV In-Situ Measurement Built-in CT-6 Waveform Monitor (D-CDM) Simple conversion between Waveform Modules Easy conversion between HGA products

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Direct-CDM Sweep

50010001500

40

50

60

0.5

1.0

40

50

60

80

100

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0

E SD P ro file C u rveB ia s : 5 .0 P a r t ID : H e a d : F a rH d 0

Amp

At T

est (

µV)A

VGR

es

ista

nc

e (

Oh

ms

)AV

GP

opco

rnA

VG

Noi

se A

mp

(µV)

MAX

Ma

x N

ois

e A

mp

(µ

V)M

AX

E P S -DCDM E S D (V )

P OS NE G

-2500

-2000

-1500

-1000

-500

0

500

1000

1500

-150 -100 -50 0 50 100 150

Transverse Transfer C u rveB ia s : 5 .0 P a r t ID : P a r tID H e a d : F a rH d 0

Am

plit

ud

e (

uV

)

M agnetic F ield (O e)

Reverse

-1000

-750

-500

-250

0

250

500

750

1000

0.0 2.5 5.0 7.5 10.0 12.5 15.0

P o pco rn P u lsesS ub T itle

Am

plit

ud

e (

uV

)

Tim e (uS )

519-1 520-1 523-3 524-2 525-2 526-1 527-1

528-4 530-2 531-1 532-3 533-4 534-4 535-6

25

50

75

100

125

150

175

-150 -100 -50 0 50 100 150

Spectral M axim u m Am plitu de N o ise P lo tP a r t ID : P a r tID H e a d : 0

No

ise

Am

plit

ud

e (

µV

)

F ield (Oe)

Noise A m p M ax Noise A m p

CDM Failure Threshold at 3.5V 25% lower than Amp

Failure at 5V

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Summary

Common test capability from Bar/Slider to Drive Most Universal QST Tester available Field-proven in Engineering, Manufacturing and

Failure Analysis Open modular-design system Low cost, high throughput Manufacturing

solution Most advanced High Frequency Channel

capability available