Leading Indicator Program

Overview

Sampled material

All other production material

MANUFACTURING INTERACTIONS

Leading Indicator Description

A continuous improvement program based

on statistical limits for both material and

equipment through the approach of zero

defects, process results, close loop controls,

maverick material analysis and improvement,

equipment utilization /uptime analysis and

real time controls/analysis. It includes three

type indicators – process, equipment, and

electrical leading indicators. The system

identifies any maverick processed material

prior to leaving the manufacturing site.

A multiple faceted approach to manufacturing

Zero defect approach

Process results; closed loop controls

Equipment utilization/uptime analysis

Real time controls/analysis

Continuous improvement based on statistical limits for both material and equipment

Key Elements of Leading Indicators

Leading Indicator Program Features

Event based analysis

Known as Leading indicators

Based on location; machine, process, or electrical leading indicators

By package family ( SOIC, P-Dip, DFN, BGA )

Limits are derived by statistical analysis

Analysis is real time

Each nonconforming event will define action to be taken

OCAP’s, ( out of control action plans )

Failure analysis

Material disposition

Line requalification

Leading Indicator Program Features

Data is generated real time

OCAP’s ( Out of control action plan ) are required for each operation

Closed loop analysis, maverick data requires F.A. ( Failure Analysis ) and C.A. ( Corrective action) on each event

Pareto charts defines major issues which need to be worked

Data to be sent to WEB or FTP site for continuous monitoring of controls and improvements

Assembly Continuous Improvement • Definition of defects

– Goal of assembly is continuous drive to zero defects

– Definition of different types of defects

– Systemic

More than one incident with identical failure

Requires OCAP ( out of control action plan ) if 3 incidents in a 2 week period line shutdown until problem/problems are solved

– Maverick

Random defects

Outliers

Difficult to predictMaverick point

Leading Indicator Process Driven

Program

List of current Process Leading Indicators used in manufacturing

Assembly yields by operation ( .2% yield loss notification limit )

Wetting angle (post D/A cure)

W/B ( Wire Bond ) work holder cratering test by bond site

C-Sam monitoring ( post mold IR reflowed and analysis )

FVI ( final visual inspection)

Final Test Parametric Analysis

Tape and reel

Process Leading Indicator (actual data)

Process Leading Indicator Tape and Reel

yields (actual data)

Equipment Leading Indicator Tape

and ReelOperator will inspect all rejects > .2% , separating rejects by

category for engineers to define R/C

Lead Scan

Good

Mark

Analysis

Lead

AnalysisR track

Reject

Rescreen

Next station

Good

Lead Scan

Basic Process Flow

Closed loop analysis

to determine R/C

Equipment Leading Indicators

Each piece of equipment will be under ELI’s ( EquipmentLeading Indicators )

Each piece of equipment will be divided into sub-systems for analysis

Data will be generated on assist and failures

Statistical control on assist and machine failures

OCAP ( Out of Control Action Plan ) limits to be set for assist and hard failures

Paytner and pareto charts will be generated to identify weak sub-systems

Equipment Leading Indicator

SOIC 8LDS HDLF WIREBOND MACHINE LEADING INDICATOR (Actual data)

Corrective Actions for Wire Bonders

Corrective actions are based on assist by

subsystem

Electrical Leading IndicatorsParametric Maverick lot trend analysis

A statistical approach to maverick lot analysis

Parametric yields ( .3% per failure mode or .4% overall parametric yield limit)

Analysis based on parametric yields

Limits based on a statistical mean and

Std Dev. ( Standard Deviation )

Opens, shorts, Isb (standby current ) and pin leakage

F.A. training required to understand failure mechanism

All lots which fail, require F.A. to determine R/C

F.A. flow defined to prevent destroying critical information in determining R/C

Maverick lot trend Parametric failures

(Actual Data)

Parametric Failure Analysis F.A. flow for

Electrical Failures Parametric leading indicators

Close loop analysis – Assembly, test and F.A. work together to solve root cause of maverick lots

All lots which fail maverick lot limits are analyzed for root cause and C/A ( Corrective Actions ) are implemented in assembly to prevent reoccurrence of problem.

Leading Indicators

Conclusion

Program identifies any maverick processed material prior to leaving the manufacturing siteZero defect program

Continuous improvement through statistically based analysis

Program is both equipment and process focused

Real time monitoring and analysis

Predicts potential equipment mis-processing before it happens