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LCW MTSG 1 Version 1.2 | 2020-11-02 Discontinued www.osram-os.com Applications LCW MTSG Mini TOPLED ® Small size high-flux LED for slim designs Cluster, Button Backlighting Electronic Equipment Transportation, Plane, Ship White Goods Features: Package: white SMT package, colored diffused silicone resin Chip technology: ThinGaN Typ. Radiation: 120° (Lambertian emitter) Color: Cx = 0.38, Cy = 0.38 acc. to CIE 1931 ( warm white) Corrosion Robustness Class: 3B Qualifications: AEC-Q102 Qualified Color temperature: 4000K CRI: 82 ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Page 1: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

LCW MTSG

1 Version 1.2 | 2020-11-02

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dProduktdatenblatt | Version 1.1 www.osram-os.com

Applications

LCW MTSG

Mini TOPLED® Small size high-flux LED for slim designs

— Cluster, Button Backlighting

— Electronic Equipment

— Transportation, Plane, Ship

— White Goods

Features: — Package: white SMT package, colored diffused silicone resin

— Chip technology: ThinGaN

— Typ. Radiation: 120° (Lambertian emitter)

— Color: Cx = 0.38, Cy = 0.38 acc. to CIE 1931 (● warm white)

— Corrosion Robustness Class: 3B

— Qualifications: AEC-Q102 Qualified

— Color temperature: 4000K

— CRI: 82

— ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

Page 2: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Ordering Information

Type Color temperature Luminous Intensity 1) Ordering CodeIF = 10 mAIv

LCW MTSG-U2V2-4L8N 4000 K 560 ... 1120 mcd Q65111A2101

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Maximum RatingsParameter Symbol Values

Operating Temperature Top min. max.

-40 °C 110 °C

Storage Temperature Tstg min. max.

-40 °C 110 °C

Junction Temperature Tj max. 125 °C

Forward Current TS = 25 °C

IF min. max.

3 mA 30 mA

Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C

IFS max. 300 mA

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

VESD 8 kV

Reverse current 2) IR max. 200 mA

Page 4: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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CharacteristicsIF = 10 mA; TS = 25 °C

Parameter Symbol Values

Chromaticity Coordinate 3) Cx Cy

typ. typ.

0.38 0.38

Viewing angle at 50% IV 2φ typ. 120 °

Forward Voltage 4) IF = 10 mA

VF min. typ. max.

2.75 V 3.00 V 3.45 V

Reverse voltage (ESD device) VR ESD min. 45 V

Reverse voltage 2) IR = 20 mA

VR max. 1.2 V

Color Rendering Index CRI typ. 82

Real thermal resistance junction/ambient 5)6) RthJA real max. 360 K / W

Real thermal resistance junction/solderpoint 5) RthJS real max. 130 K / W

Page 5: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Brightness Groups

Group Luminous Intensity 1) Luminous Intensity 1) Luminous Flux 7)

IF = 10 mA IF = 10 mA IF = 10 mAmin. max. typ.Iv Iv ΦV

U2 560 mcd 710 mcd 1910 mlm

V1 710 mcd 900 mcd 2420 mlm

V2 900 mcd 1120 mcd 3030 mlm

Page 6: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Chromaticity Coordinate Groups 3)

8L

7L

6L

5L

4L

8M

7M

6M

5M

4M

8N

7N

6N

5N

4N

0,29

0,31

0,33

0,35

0,37

0,39

0,41

0,43

0,33

0,35

0,37

0,39

0,41

0,43

Cx

Cy

450460470

480

490

500

510

520

530

540

550

560

570

580

590

600

610620630650

0,00

0,10

0,20

0,30

0,40

0,50

0,60

0,70

0,80

0,90

0,00

0,10

0,20

0,30

0,40

0,50

0,60

0,70

0,80

0,90

Cx

Cy

E

Chromaticity Coordinate Groups 3)

Group Cx Cy CCT

4L 0.3648 0.3479 4000

0.3670 0.3578 4000

0.3746 0.3624 4000

0.3719 0.3522 4000

4M 0.3719 0.3522 4000

0.3746 0.3624 4000

0.3822 0.3670 4000

0.3791 0.3564 4000

4N 0.3791 0.3564 4000

0.3822 0.3670 4000

0.3898 0.3716 4000

0.3862 0.3607 4000

5L 0.3670 0.3578 4000

0.3692 0.3677 4000

0.3773 0.3726 4000

0.3746 0.3624 4000

Group Cx Cy CCT

5M 0.3746 0.3624 4000

0.3773 0.3726 4000

0.3853 0.3776 4000

0.3822 0.3670 4000

5N 0.3822 0.3670 4000

0.3853 0.3776 4000

0.3934 0.3825 4000

0.3898 0.3716 4000

6L 0.3692 0.3677 4000

0.3714 0.3775 4000

0.3799 0.3828 4000

0.3773 0.3726 4000

6M 0.3773 0.3726 4000

0.3799 0.3828 4000

0.3885 0.3882 4000

0.3853 0.3776 4000

Group Cx Cy CCT

6N 0.3853 0.3776 4000

0.3885 0.3882 4000

0.3970 0.3935 4000

0.3934 0.3825 4000

7L 0.3714 0.3775 4000

0.3736 0.3874 4000

0.3826 0.3931 4000

0.3799 0.3828 4000

7M 0.3799 0.3828 4000

0.3826 0.3931 4000

0.3916 0.3987 4000

0.3885 0.3882 4000

7N 0.3885 0.3882 4000

0.3916 0.3987 4000

0.4006 0.4044 4000

0.3970 0.3935 4000

Page 7: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Group Cx Cy CCT

8L 0.3736 0.3874 4000

0.3758 0.3973 4000

0.3853 0.4033 4000

0.3826 0.3931 4000

Group Cx Cy CCT

8M 0.3826 0.3931 4000

0.3853 0.4033 4000

0.3947 0.4093 4000

0.3916 0.3987 4000

Group Cx Cy CCT

8N 0.3916 0.3987 4000

0.3947 0.4093 4000

0.4042 0.4153 4000

0.4006 0.4044 4000

Page 8: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Group Name on Label Example: U2-4LBrightness Color Chromaticity

U2 4L

Page 9: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Relative Spectral Emission 7)

Irel = f (λ); IF = 10 mA; TS = 25 °C

LCW MTSG

350 400 450 500 550 600 650 700 750 800

λ [nm]

0.0

0.2

0.4

0.6

0.8

1.0Irel

: Vλ

: warm white

Radiation Characteristics 7)

Irel = f (ϕ); TS = 25 °CLCW MTSG

-100°

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

ϕ [°]

0.0

0.2

0.4

0.6

0.8

1.0Irel

Page 10: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Forward current 7)

IF = f(VF); TS = 25 °CLCW MTSG

2.7 2.8 3.0 3.2 3.4

VF [V]

3

4

5

10

20

30IF [mA]

Relative Luminous Intensity 7), 8)

Iv/Iv(10 mA) = f(IF); TS = 25 °CLCW MTSG

5 6 7 8 9 10 20 30

IF [mA]

0,5

0,6

0,7

0,8

0,9

1

2

IVIV(10mA) : warm white

Chromaticity Coordinate Shift 7)

ΔCx, ΔCy = f(IF); TS = 25 °CLCW MTSG

3 5 10 15 20 25 30

IF [mA]

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03∆Cx∆Cy

: ∆ Cx: ∆ Cy

Page 11: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Forward Voltage 7)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 10 mALCW MTSG

-40 -20 0 20 40 60 80 100

Tj [°C]

-0.2

0.0

0.2

0.4∆VF [V]

Relative Luminous Intensity 7)

Iv/Iv(25 °C) = f(Tj); IF = 10 mALCW MTSG

-40 -20 0 20 40 60 80 100

Tj [°C]

0,0

0,2

0,4

0,6

0,8

1,0

1,2IvIv(25°C) : warm white

Relative Luminous Flux 7)

Iv/Iv(25 °C) = f(Tj); IF = 10 mALCW MTSG

-40 -20 0 20 40 60 80 100

Tj [°C]

0.0

0.2

0.4

0.6

0.8

1.0

1.2Φv

Φv(25°C)

Chromaticity Coordinate Shift 7)

ΔCx, ΔCy = f(Tj); IF = 10 mALCW MTSG

-40 -20 0 20 40 60 80 100

Tj [°C]

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03∆Cx∆Cy : Cx

: Cy

Page 12: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Max. Permissible Forward CurrentIF = f(T)

LCW MTSG

0 20 40 60 80 100

T [°C]

0

5

10

15

20

25

30

IF [mA]

Do not use below 3 mA

: Ta

: Ts

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle

10-5 10-4 10-3 0.01 0.1 1 10Duty Cycle [s]

0.1

0.2

0.3

IF [A]: D = 1,0: D = 0,5: D = 0,2: D = 0,1: D = 0,05: D = 0,02: D = 0,01: D = 0,005

Page 13: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Dimensional Drawing 9)

Further Information:

Approximate Weight: 9.0 mg

Package marking: Cathode

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.

Page 14: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Recommended Solder Pad 9)

OHLPY978

Paddesignfor improvedheat dissipation

Cu-area > 16 mmCu-Fläche > 16 mm

Wärmeableitung

Padgeometriefür verbesserte

LötstopplackSolder resist

0.8 (0.031)

2.8 (0.110)

1 (0

.039

)

2

2

2.8 (0.110)

0.8 (0.031)

1 (0

.039

)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.

Page 15: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)

TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 6 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Page 16: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Taping 9)

Page 17: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Tape and Reel 10)

Reel DimensionsA W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 3000

Page 18: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

cted to

infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

Page 19: LCW MTSG - Osram€¦ · LCWM TSG-100 °-90°-80°-70°-60 ... Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250

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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related information please visit www.osram-os.com/appnotes

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Disclaimer

Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.

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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char-acteristics or damage the LED.

3) Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to GUM with a coverage factor of k = 3).

4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.

9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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Revision HistoryVersion Date Change

1.2 2020-11-02 Discontinued

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