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LCW MTSG
1 Version 1.2 | 2020-11-02
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dProduktdatenblatt | Version 1.1 www.osram-os.com
Applications
LCW MTSG
Mini TOPLED® Small size high-flux LED for slim designs
— Cluster, Button Backlighting
— Electronic Equipment
— Transportation, Plane, Ship
— White Goods
Features: — Package: white SMT package, colored diffused silicone resin
— Chip technology: ThinGaN
— Typ. Radiation: 120° (Lambertian emitter)
— Color: Cx = 0.38, Cy = 0.38 acc. to CIE 1931 (● warm white)
— Corrosion Robustness Class: 3B
— Qualifications: AEC-Q102 Qualified
— Color temperature: 4000K
— CRI: 82
— ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
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Ordering Information
Type Color temperature Luminous Intensity 1) Ordering CodeIF = 10 mAIv
LCW MTSG-U2V2-4L8N 4000 K 560 ... 1120 mcd Q65111A2101
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Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C 110 °C
Storage Temperature Tstg min. max.
-40 °C 110 °C
Junction Temperature Tj max. 125 °C
Forward Current TS = 25 °C
IF min. max.
3 mA 30 mA
Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS max. 300 mA
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
VESD 8 kV
Reverse current 2) IR max. 200 mA
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CharacteristicsIF = 10 mA; TS = 25 °C
Parameter Symbol Values
Chromaticity Coordinate 3) Cx Cy
typ. typ.
0.38 0.38
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) IF = 10 mA
VF min. typ. max.
2.75 V 3.00 V 3.45 V
Reverse voltage (ESD device) VR ESD min. 45 V
Reverse voltage 2) IR = 20 mA
VR max. 1.2 V
Color Rendering Index CRI typ. 82
Real thermal resistance junction/ambient 5)6) RthJA real max. 360 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 130 K / W
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Brightness Groups
Group Luminous Intensity 1) Luminous Intensity 1) Luminous Flux 7)
IF = 10 mA IF = 10 mA IF = 10 mAmin. max. typ.Iv Iv ΦV
U2 560 mcd 710 mcd 1910 mlm
V1 710 mcd 900 mcd 2420 mlm
V2 900 mcd 1120 mcd 3030 mlm
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Chromaticity Coordinate Groups 3)
8L
7L
6L
5L
4L
8M
7M
6M
5M
4M
8N
7N
6N
5N
4N
0,29
0,31
0,33
0,35
0,37
0,39
0,41
0,43
0,33
0,35
0,37
0,39
0,41
0,43
Cx
Cy
450460470
480
490
500
510
520
530
540
550
560
570
580
590
600
610620630650
0,00
0,10
0,20
0,30
0,40
0,50
0,60
0,70
0,80
0,90
0,00
0,10
0,20
0,30
0,40
0,50
0,60
0,70
0,80
0,90
Cx
Cy
E
Chromaticity Coordinate Groups 3)
Group Cx Cy CCT
4L 0.3648 0.3479 4000
0.3670 0.3578 4000
0.3746 0.3624 4000
0.3719 0.3522 4000
4M 0.3719 0.3522 4000
0.3746 0.3624 4000
0.3822 0.3670 4000
0.3791 0.3564 4000
4N 0.3791 0.3564 4000
0.3822 0.3670 4000
0.3898 0.3716 4000
0.3862 0.3607 4000
5L 0.3670 0.3578 4000
0.3692 0.3677 4000
0.3773 0.3726 4000
0.3746 0.3624 4000
Group Cx Cy CCT
5M 0.3746 0.3624 4000
0.3773 0.3726 4000
0.3853 0.3776 4000
0.3822 0.3670 4000
5N 0.3822 0.3670 4000
0.3853 0.3776 4000
0.3934 0.3825 4000
0.3898 0.3716 4000
6L 0.3692 0.3677 4000
0.3714 0.3775 4000
0.3799 0.3828 4000
0.3773 0.3726 4000
6M 0.3773 0.3726 4000
0.3799 0.3828 4000
0.3885 0.3882 4000
0.3853 0.3776 4000
Group Cx Cy CCT
6N 0.3853 0.3776 4000
0.3885 0.3882 4000
0.3970 0.3935 4000
0.3934 0.3825 4000
7L 0.3714 0.3775 4000
0.3736 0.3874 4000
0.3826 0.3931 4000
0.3799 0.3828 4000
7M 0.3799 0.3828 4000
0.3826 0.3931 4000
0.3916 0.3987 4000
0.3885 0.3882 4000
7N 0.3885 0.3882 4000
0.3916 0.3987 4000
0.4006 0.4044 4000
0.3970 0.3935 4000
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Group Cx Cy CCT
8L 0.3736 0.3874 4000
0.3758 0.3973 4000
0.3853 0.4033 4000
0.3826 0.3931 4000
Group Cx Cy CCT
8M 0.3826 0.3931 4000
0.3853 0.4033 4000
0.3947 0.4093 4000
0.3916 0.3987 4000
Group Cx Cy CCT
8N 0.3916 0.3987 4000
0.3947 0.4093 4000
0.4042 0.4153 4000
0.4006 0.4044 4000
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Group Name on Label Example: U2-4LBrightness Color Chromaticity
U2 4L
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Relative Spectral Emission 7)
Irel = f (λ); IF = 10 mA; TS = 25 °C
LCW MTSG
350 400 450 500 550 600 650 700 750 800
λ [nm]
0.0
0.2
0.4
0.6
0.8
1.0Irel
: Vλ
: warm white
Radiation Characteristics 7)
Irel = f (ϕ); TS = 25 °CLCW MTSG
-100°
-90°
-80°
-70°
-60°
-50°
-40°
-30°
-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
ϕ [°]
0.0
0.2
0.4
0.6
0.8
1.0Irel
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Forward current 7)
IF = f(VF); TS = 25 °CLCW MTSG
2.7 2.8 3.0 3.2 3.4
VF [V]
3
4
5
10
20
30IF [mA]
Relative Luminous Intensity 7), 8)
Iv/Iv(10 mA) = f(IF); TS = 25 °CLCW MTSG
5 6 7 8 9 10 20 30
IF [mA]
0,5
0,6
0,7
0,8
0,9
1
2
IVIV(10mA) : warm white
Chromaticity Coordinate Shift 7)
ΔCx, ΔCy = f(IF); TS = 25 °CLCW MTSG
3 5 10 15 20 25 30
IF [mA]
-0.03
-0.02
-0.01
0.00
0.01
0.02
0.03∆Cx∆Cy
: ∆ Cx: ∆ Cy
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Forward Voltage 7)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 10 mALCW MTSG
-40 -20 0 20 40 60 80 100
Tj [°C]
-0.2
0.0
0.2
0.4∆VF [V]
Relative Luminous Intensity 7)
Iv/Iv(25 °C) = f(Tj); IF = 10 mALCW MTSG
-40 -20 0 20 40 60 80 100
Tj [°C]
0,0
0,2
0,4
0,6
0,8
1,0
1,2IvIv(25°C) : warm white
Relative Luminous Flux 7)
Iv/Iv(25 °C) = f(Tj); IF = 10 mALCW MTSG
-40 -20 0 20 40 60 80 100
Tj [°C]
0.0
0.2
0.4
0.6
0.8
1.0
1.2Φv
Φv(25°C)
Chromaticity Coordinate Shift 7)
ΔCx, ΔCy = f(Tj); IF = 10 mALCW MTSG
-40 -20 0 20 40 60 80 100
Tj [°C]
-0.03
-0.02
-0.01
0.00
0.01
0.02
0.03∆Cx∆Cy : Cx
: Cy
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Max. Permissible Forward CurrentIF = f(T)
LCW MTSG
0 20 40 60 80 100
T [°C]
0
5
10
15
20
25
30
IF [mA]
Do not use below 3 mA
: Ta
: Ts
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle
10-5 10-4 10-3 0.01 0.1 1 10Duty Cycle [s]
0.1
0.2
0.3
IF [A]: D = 1,0: D = 0,5: D = 0,2: D = 0,1: D = 0,05: D = 0,02: D = 0,01: D = 0,005
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Dimensional Drawing 9)
Further Information:
Approximate Weight: 9.0 mg
Package marking: Cathode
Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.
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Recommended Solder Pad 9)
OHLPY978
Paddesignfor improvedheat dissipation
Cu-area > 16 mmCu-Fläche > 16 mm
Wärmeableitung
Padgeometriefür verbesserte
LötstopplackSolder resist
0.8 (0.031)
2.8 (0.110)
1 (0
.039
)
2
2
2.8 (0.110)
0.8 (0.031)
1 (0
.039
)
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.
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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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Taping 9)
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Tape and Reel 10)
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 3000
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18 Version 1.2 | 2020-11-02
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Barcode-Product-Label (BPL)
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
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Disclaimer
Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.
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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).
2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char-acteristics or damage the LED.
3) Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to GUM with a coverage factor of k = 3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.
10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision HistoryVersion Date Change
1.2 2020-11-02 Discontinued
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.