SILICONTEK CO., LTD.LCD Module Specification

PART NO. : STCE20400NRB

Table of Contents

1. COVER & TABLE OF CONTENTS 1

2. RECORD OF REVISION 2

3. GENERAL SPECIFICATIONS 3

4. ABSOLUTELY MAXIMUM RATINGS 4

5. ELECTRICAL CHARACTERISTICS 5

6. ELECTRO-OPTICAL CHARACTERISTIC 5

7. TIMING CHARACTERISTICS 7

8. PIN CONNECTIONS 9

9. POWER SUPPLY 9

10. BLOCK DIAGRAM 10

11. QUALITY ASSURANCE 17

12. LOT NUMBERING SYSTEM 21

13. LCM NUMBERING SYSTEM 21

14. PRECAUTIONS FOR USING LCM 22

15. OUTLINE DRAWING 23

Approved by Checked by Checked by Drawn by

Pro.Div. R & D.Div.Final Revision: Sheet Code: Issued Date: Total Page:

23

Tel : 86-769-83623728 Fax : 86-769-83630806 Mail elec@pub.dgnet.gd.cn

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2. RECORD OF REVISION

Rev Date Item Page Comment

1.0 2007/02/28 New Drawn

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3. GENERAL SPECIFICATIONS

Display Format: 20 characters (W) × 4 lines (H)

Character Size: 2.95 (W) × 4.75 (H) mm

Viewing Area: 76.0 (W) × 25.2(H) mm

General Dimensions: 98.0 (W) × 60.0 (H) × 10.5 (T) mm Max.

LCD Type: STN Gray STN Yellow FSTN TN

Polarizer mode: Reflective Transflective

Transmissive Negative

Viewing Angle: 6 O'clock 12 O'clock Others

Backlight: LED EL CCFL

Backlight Color: Yellow green Amber Blue

White Others

Controller / Driver: S6A0069X01-C0CX

Temperature Range: Normal

Operating 0 to 50 Storage -10 to 60

Wide temperature

Operating -20 to 70 Storage -30 to 80

Specified temperature

Operating -30 to 80 Storage -40 to 85

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4. ABSOLUTELY MAXIMUM RATINGS

4.1 ELECTRICAL ABSOLUTE MAXIMUM RATINGS

Vss=0V, Ta=25

Item Symbol Min. Max. Unit

Supply Voltage(Logic) VDD-VSS -0.3 7 V

Supply Voltage(LCD Driver) VDD-VEE 3 13 V

Input Voltage VI -0.3 VDD+0.3 V

Operating Temperature TOP 0 50

Storage Temperature TSTG -10 60

4.2 ENVIRONMENTAL ABSOLUTE MAXIMUM RATINGS

ItemOperating Storage

Comment(Min.) (Max.) (Min.) (Max.)

Ambient Temp 0 50 -10 60 Note (1)

Humidity Note (2) Note (2) Without Condensation

Vibration -- 4.9M/S2

(0.5G) -- 19.6M/S2

(2G) XYZ Direction

Shock -- 29.4M/S2

(3G) -- 49M/S2

(5G) XYZ Direction

Note(1): Ta AT-25 : 48RH Max. 60 : 168RH Max.

Note(2) Ta ≦ 40 : 90%RH Max. Ta ≧ 40 : Absolute humidity must be lower than the humidity

of 90% RH at 40.

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5. ELECTRICAL CHARACTERISTICS

Item Symbol Condition Min. TYP. Max. Unit

Supply Voltage(Logic)

VDD-VSS 4.75 5.0 5.25 V

Supply Voltage(LCD)

VDD-VEE

0 4.2 4.4 4.6

V25 4.0 4.2 4.4

50 3.8 4.0 4.2

Input VoltageVIH -- 0.7*VDD -- VDD

VVIL -- -0.3 -- 0.55

Logic SupplyCurrent

IDD VDD=3V -- 0.15 0.3 mA

6. ELECTRO-OPTICAL CHARACTERISTICS

Item Symbol Condition Min Typ. Max. Unit Ref.

Rise Time Tr0

--1100 1800

ns

Note(1)25 420 670

Fall Time Tf0

--210 340

ns25 100 300

Contrast CR 25 Note(3)

Viewing Angle θΦ

25&CR≧2

-10 -- 40Deg. Note(2)

-30 -- 30

Frame Frequency Ff 25 -- 64 -- HzNote (1)&(2): See next pageNote (3): Contrast ratio is defined under the following condition,

CR= Brightness of non-selected conditionBrightness of selected condition

(a). Temperature---------------25(b). Frame frequency----------64Hz(c). Viewing angle--------------θ=0°,φ=0°(d). Operating voltage---------4.2V

Intensity

Driving Voltage

B

Cr=B/A

Selected Dots

0%

Non-selected Dots

A

100%

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Note (1) Response time is measured as the shortest period of time possible between the change in state of an LCD segment as demonstrated below:

Condition:( a ) . Temperature------------25( b ) . Frame frequency------64Hz( c ) . Viewing Angle------------θ=0°, φ=0°( d ) . Operating voltage-----4.2V

Note(2) Definition of Viewing Angle

Definition of Angle θ&ф Definition of Viewing Angle θ1&θ2

10%

90%

OFFONOFF

Tr Tf

Voltage Wave Form

T

Luminance

Cr

2

θθ1 θ2

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7. TIMING CHARACTERISTICS

7.1 WRITE TIMING

Item Symbol Condition Min. Max. Unit

Enable cycle time tcycE

VDD=5.0V

500 --

ns

Enable pulse widthPWEH 230 --

(high level)

Enable rise/fall time tEr,tEf -- 20

Address set-up timetAS 40 --

(RS,R/W, to E)

Address hold time tAH 10 --

Data set-up time tDSW 80 --

Data hold time tH 10 --

VIH1

RS VIL1

tsu1

R/W th1

VIL1 VIL1

tw th1

tf

VIL1 VIH1 VIL1

Etr tsu2

th2

DB0 VIH1 VIH1

to valid Data

DB7 VIL1 VIL1

tc

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7.2 READ TIMING

Item Symbol Condition Min. Max. Unit

Enable cycle time tcycE

VDD=5.0V

500 --

ns

Enable pulse widthPWEH 230 --

(high level)

Enable rise/fall time tEr,tEf -- 20

Address set-up timetAS 40 --

(RS,R/W, to E)

Address hold time tAH 10 --

Data set-up time tDDR -- 120

Data hold time tDHR 5 --

VIH1

RS

VIL1 th

tsuR/W

VIH1 tw th VIH1

tr

VIL1 VIH1 VIL1

Etr

Tdh

DB0 tD VoH1 VoH1

to Valid data

DB7 VoL1 VoL1

tc

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8. PIN CONNECTIONS

No. Symbol Function1 VSS Ground, 0V 2 VDD Logic power supply, +5V3 VEE Voltage for LCD drive4 RS Data / Instruction register select5 R/W Read / Write6 E Enable signal, start data read/write7 DB0

Data Bus Line

8 DB19 DB210 DB311 DB412 DB513 DB614 DB715 A LED Anode, power supply "+"(DC +5V)16 K LED Cathode, power supply "-"

9. POWER SUPPLY

VDD

+5V

Vss

VR VEE

VR=10KΩ

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10. BLOCK DIAGRAM

LCD20 characters × 4 lines

VSS

ControlLSI

VDD Com 16

VO

RS

R/W

E Seg 40 Seg 80 Seg 80

DB0

DB7 LCDDriver

LCDDriver

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10.1 INSTRUCTIONS

InstructionCODE

DESCRIPTIONExecuted

Time(max)focs=250KHzRS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

Clear Display 0 0 0 0 0 0 0 0 0 1 Clear all display and returns the cursor 1.53mSto the home position(Address 0)

Cursor At Home 0 0 0 0 0 0 0 0 1 *

Returns the cursor to the home position

1.53mS(Address 0). Also returns te display being shifted to the original position DDRAM contents remain unchanged.

Entry Mode Set 0 0 0 0 0 0 0 1 I/D SSets the cursor move direction and

39uSspecifies or not to shift the display. These operations are performed during data write and read.

Display On/OffControl 0 0 0 0 0 0 1 D C B

Sets the ON/OFF of all display (d) 39uScursor ON/OFF©, and blink of cursor

position character(B).Cursor/Display 0 0 0 0 0 1 S/C R/L * *

Moves the cursor and shifts the display39uS

Shift without changing DDRAM contents.

Function Set 0 0 0 0 1 DL N F * * Sets interface data length (DL), number 39uSof display lines(N) and character font(F)

CGRAM Address 0 0 0 1 ACGSets the CGRAM, data is sent and

39uSSet received after this setting.

DDRAM Address 0 0 1 ADDSets the CGRAM,data is sent and

39uSSet received after this setting.

Busy Flag/ AddressRead 0 1 BF AC

Reads Busy flag (FB) indicating

0uSindicating internal operation is being performed and reads address counter contents.

CGRAM/DDRAM 1 0 WRITE DATAWrites data into DDRAM

43uSData Write or CGRAM

CGRAM/DDRAM 1 1 READ DATAReads data into DDRAM

43uSData Read or CGRAM

Code Description Executed Time(max.)I/D=1: Increment DL=0:4-bit DDRAM: Display Data RAM Fcp or focs=250kHzI/D=0: Decrement 1/16 duty CGRAM: Characfter Generator RAM However, when frequency S=1: With display shift 1/18 duty, 1/11 duty ACG: CGRAM Address changes, execution timeS/C=1: Display shift F=1:5x10 dots ADD: DDRAM Address also changesS/C=0: Cursor movement F=0:5x7 dots corresponds to cursor address ExampleR/L=1: Shift to the right BF=1: Internal Operation is being performed AC: Address Counter, used for both If fcp or focs is 270kHzR/L=0: Shift to the left BF=0: Instruction acceptable DDRAM and CGRAM

40 uS * 250 = 37 uSD/L=1: 8-bit *: Invalid 270

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0

10.2 8 - Bit Operation, 8 - Digit 2 - Line Display Example

Step InstructionNO RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1DB Display Operation1 Power supply on (the HD44780U is initialized by the Initialized. Nodisplay.

Internal reset circuit)2 Function set Sets to 8-bit operation and

0 0 0 0 1 DL N F -- -- selects 2-line display and5 8 dot character font.

3 Display on/off control Turns on display and cursor.

0 0 0 0 0 0 1 D C B All display is in space modebecause of initialization.

4 Entry mode set Sets mode to increment the

0 0 0 0 0 0 0 1 I/D SHaddress by one and to shift thecursor to the right at the timeof write to the DD/CGRAM.Display is not shifted.

5 Write data to CGRAM/DDRAM Writes H.DDRAM has already

1 0 0 1 0 0 1 0 0 0been selected by initialization

H when the power was turnedon. The cursor is incrementedby one and shifted to the right

6

7 Write data to CGRAM/DDRAM Writes I.

1 0 0 1 0 0 1 0 0 1 HITACHI

8 Set DDRAM address Sets DDRAM address so that

0 0 1 1 0 0 0 0 0 0 HITACHI The cursor is positioned at theHead of the second lime.

9 Write data to CGRAM/DDRAM HITACHI Writes M.

1 0 0 1 0 0 1 1 0 1 M

10

11 Write data to CGRAM/DDRAM HITACHI Writes O.

1 0 0 1 0 0 1 1 1 1 MICROCO

12 Entry mode set HITACHI Sets mode to shift display at

0 0 0 0 0 0 0 1 1 1 MICROCO the time of write.

13 Write data to CGRAM/DDRAM Writes M. Display is shifted

1 0 0 1 0 0 1 1 0 1 HITACHI to the left. The first and MICROCOM secondlines both shift at the

same time.

14

15 Return home HITACHI Returns both display and

0 0 0 0 0 0 0 0 1 0 MICROCOM cursor to the original position(address 0).

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10.3 Interfacing to the MPU The IC can send data in either two 4-bit operations, thus allowing interfacing with 4-bit or 8-bit MPUs.

For 4-bit interface data, only four bus lines (DB4 to DB7) are used for transfer. Bus lines DB0 to FB3 are disabled. The data transfer betweenthe IC and the MPU is completed after the 4-bit data has been transferredtwice. As for the order of data transfer, the four high order bits (for 8-bit operation, DB4 to DB7) are transferred before the four low order bits (for8-bit operation, DB0 to DB3)The busy flag must be checked (one instruction) after the 4- bit data hasbeen transferred twice. After two 4-bit operations then transfer the busyflag and address counter data.

Instruction register (IR) Busy flag (BF) and Data register (DR)write Address counter (AC) read

read4-Bit Transfer Example

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10.4 1-LINE Display

Displayposition 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

00 01 02 03 04 05 06 07 40 41 42 43 44 45 46 47DDRAMAddress(hexadecimal)

16 1- Line

2-LINE Display

Displayposition 1 2 3 4 5 . 8 . . . . . 16 . . . 20 . . . 24 . . . 39 40

00 01 02 03 04 26 27DDRAMAddress 40 41 42 43 44 66 67(hexadecimal)

8 2-Line

16 2-Line

20 2-Line

24 2-Line

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10.5 CGRAM

Relationship between CGRAM Addresses, Character Codes (DDRAM) andPatterns (CGRAM Data)

For 5X 8 dot character patterns

Character Codes CGRAM Address Character Patterns(DDRAM data) (CGRAM data)

7 6 5 4 3 2 1 0 5 4 3 2 1 0 7 6 5 4 3 2 1 0 High Low High Low High Low

0 0 0 0 0 0 0 0 0 0

0 0 0 1 1 1 1 00 0 1 1 0 0 0 10 1 0 1 0 0 0 1 Character0 1 1 1 1 1 1 0 Pattern(1)1 0 0 1 0 1 0 01 0 1 1 0 0 1 01 1 0 1 0 0 0 11 1 1 0 0 0 0 0 Cursor position

0 0 0 0 0 0 1 0 0 1

0 0 0 1 0 0 0 10 0 1 0 1 0 1 00 1 0 1 1 1 1 1 Character0 1 1 0 0 1 0 0 Pattern(2)1 0 0 1 1 1 1 11 0 1 0 0 1 0 01 1 0 0 0 1 0 01 1 1 0 0 0 0 0 Cursor position0 0 00 0 1

0 0 0 0 1 1 1 1 1 11 0 01 0 11 1 01 1 1

Notes : 1. Character code bits 0 to 2 correspond to CGRAM address bits 3 to 5 (3 bits: 8 type). 2. CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the

cursor position and its display is formed by a logical OR with the cursor. Maintain the 8th line data, corresponding to the cursor display position, at 0 as the cursor display. If the 8th line data is 1, 1bit will light up the 8th line regardless of the cursor presence.3. Character pattern row positions correspond to CGRAM data bits 0 to 4 (bit 4 being at the left).4. As shown Table 5, CGRAM character patterns are selected when character code bits 4 to 7 are all 0. However, since character code bit 3 has no effect, the R display example above can be selected by either character code 00H or 08H.5. 1 for CGRAM data corresponds to display selection and 0 to non-selection. Indicates no effect.

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10.6 Correspondence Between Character Codes

and Character Patterns (ROM Code : A00)

HLHH

HLLH

HHHH

HHHL

HHLH

HHLL

HLHH

HLHL

(8)

(7)

(6)

(4)

(5)

(3)

HLLL

LHHH

LHHL

LHLH

LHLL

LLHH

(2)

(1)

(8)

(7)

(6)

(5)

(4)

LLHL

LLLH

LLLL

Lower4bit

LLHLLLLHLLLL

(3)

(2)

CGRAM

(1)

Upper4bit LHHHLHHLLHLHLHLLLLHH HLHLHLLHHLLL HHHHHHHLHHLHHHLL

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11. QUALITY ASSURANCE

11.1 Test Condition

11.1.1 Temperature and Humidity(Ambient Temperature)Temperature : 25±2Humidity : 65±5%

11.1.2 Operation Unless specified otherwise, test will be conducted under function state.

11.1.3 ContainerUnless specified otherwise, vibration test will be conducted to the product itself without putting it in a container.

11.1.4 Test FrequencyFor destructive tests, such as shock test, will be conducted only once.

11.1.5 Test Method

No. Parameter conditions Regulations1 High Operating Temperature 50±2 Note 32 Low Operating Temperature 0±2 Note 33 High Storage Temperature 60±2 Note 34 Low Storage Temperature -10±2 Note 3

5

Vibration Test Total fixed amplitude : 1.5mm Note 3(Non-operation state) Vibration Frequency : 10 - 55Hz

One cycle 60 seconds to 3 directionsof X.Y.Z. for each 15 minutes

6 Damp Proof Test 40±2, 90 - 95%RH, 96h Note 1,2(Non-operation state)

7 Shock Test To be measured after drop from 60cm height Note 3(Non-operation state) to concrete surface in packaged stateNote 1: Returned to normal temperature and humidity for 4 hrs.Note 2: No dew condensation to be observed.Note 3: No change on display and in operation under the test condition

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11.2 Inspection Condition

11.2.1 Inspection conditions

The LCD shall be inspected under 40W white fluorescent light.The distance between the eyes and the sample shall be morethan 30cm. All directions for inspecting the sample should bewithin 45° against perpendicular line.

11.2.2 Definition of applicable Zones

11.2.2.1. COB

11.2.2.2. Heat Seal

11.2.2.3. TAB and COG

45

Metal (Platic) Frame

LCD Glass

Bottom Polarizer

Backlight

Upper Polarizer

Conductive Rubber

PCB

Foot (Frame) Coating Epoxy

PCB

Metal (Plastic) Frame

LCD

Gasket

LCD

Heat Seal

ITO Terminal Pad

IC

TAB COG

LCD Glass LCD Glass

IC

Pin

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11.2.2.3. Inspection Items and StandardsNo Item Criteria

1 Segment short, missing Not exist.

Contrast defect Refer to approved sample.

2 Outside defect, Positioning, Not exceed tolerance.Refer to approved sample.Color

3

Point defect, Point Acceptable

Black spot, dust Y Size

(incl. Polarizer) φ<0.10 Disregard

0.10<φ≤0.20 2

φ = (X+Y)/2 0.20<φ≤0.25 1

0.25<φ 0

Unit :mm

4

Line defectLine Acceptable Qty.

L W

--- 0.015≥W Disregard

3.0≥L 0.03≥W2

2.0≥L 0.05≥W

1.0≥L 0.1＞W 1

--- 0.05<W Applied as point defect

Unit: mm

5 Rainbow Not more than two color changes across the viewing area.

Background color should refer to approved sample.

6

Segment 1. Pin hole

pattern φ < 0.10mm is acceptable.

W = Segment width Width Acceptable of defect

W<0.4 φ≤1/2W

φ = (X+Y)/2 W≥0.4 φ≤1/3W and, φ≤0.25

Unit: mm

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No Item Criteria

φ = (X+Y)/2

2. Segment width acceptable.

A - B < 0.20 ;　 D≤0.2

C≤0.1 E≤0.15

3. Dot pattern

Size Acceptable Qty.

φ＜0.10 Disregard

0.10≤φ≤0.20 1

φ>0.20 0

C: Shall not touch adjacent dot.

Unit: mm

7 Polarizer air bubble

Size Acceptable Qty.

φ＜0.30 or B Zone Disregard

0.30≤φ≤0.50 2

0.50＜φ≤0.80 1

φ＞0.80 0

Unit: mm

8 Polarizer miss-placement

1. Not in excess of outside dimension of the LCD

unit (refer to mechanical drawing).

2. No miss-placement exposing the viewing

area. (V.A.)

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12. LOT NUMBERING SYSTEM

0 7 0 9

Production week number

Production year

13. LCM NUMBERING SYSTEM

STC E 20400 N R B

IC footprintB - COB footprint

Polarizer typeNil-TransflectiveR-ReflectiveM-Transmissive

LCD typeS - STN GrayS1- STN YellowN - TN

Series code 20400 - 20 characters×4lines; 00 the type

E - RoHS(LEAD-FREE)

Model typeSTC - Standard Character moduleSTG - Standard Graphic moduleSTCX - Custom character moduleSTGX - Custom graphic module

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14. PRECAUTION FOR USING LCM

1. LIQUID CRYSTAL DISPLAY (LCD)LCD is made up of glass, organic sealant, organic fluid, and (5). The normal static prevention measures should be Polymer based polarizers. The following precautions should observed for work clothes and working benches; for theBe taken when handing, latterconductive(rubber) mat is recommended.(1). Keep the temperature within range of use and storage. (6). Since dry air is inductive to static, a relative Excessive temperature and humidity could cause Polarization humidity of 50-60% is recommended.degredation, polarizer peel off or bubble.(2). Do not contact the exposed polarizers with anything harder 2.3 Soldering than an HB pencil lead. To clean dust off the display surface, (1). Solder only to the I/O terminals.wipe gently with cotton, chamois or other soft material soaked (2). Use only soldering irons with proper grounding andin petroleum benzin. no leakage.(3). Wipe off saliva or water drops immediately. Contact with (3). Soldering temperature: 280±10over a long period of time may cause polarizer deformation or (4). Soldering time: 3 to 4 sec.color fading, while an active LCD with water condensation on (5). Use eutectic solder with resin flux fill. its surface will cause corrosion of ITO electrodes. (6). If flux is used, the LCD surface should be cove to(4). Glass can be easily chipped or cracked from rough handling, avoid flux spatters. Flux residue should be removed after especially at corners and edges. wards.(5). Do not drive LCD with DC voltage.

2.4 Operation2. Liquid Crystal Display Modules (1). The viewing angle can be adjusted by varying the LCD2.1 Mechanical Considerations driving voltage V0.LCM are assembled and adjusted with a high degree of precision. (2). Driving voltage should be kept within specified range; Avoid excessive shocks and do not make any alterations or excess voltage shortens display life.modifications. The following should be noted. (3). Response time increases with decrease in temperature.(1). Do not tamper in any way with the tabs on the metal frame. (4). Display may turn black or dark blue at temperatures(2). Do not modify the PCB by drilling extra holes, changing its above its operational range; this is (however not pressing on outline, moving its components or modifying its pattern. the viewing area) may cause the segments to appear (3). Do not touch the elastomer connector, especially insert an “fractured”. backlight panel (for example, EL). (5). Mechanical disturbance during operation (such(4). When mounting a LCM make sure that the PCB is not under pressing on the viewing area) may cause the segment any stress such as bending or twisting. Elastomer contacts are appear “fractured”.very delicate and missing pixels could result from slight dislocation of any of the elements. 2.5 Storage (5). Avoid pressing on the metal bezel, otherwise the elastomer If any fluid leaks out of a damaged glass cell, wash off any connector could be deformed and lose contact, resulting in human part that comes into contact with soap and water.missing pixels. Never swallow the fluid. The toxicity is extremely low but

caution should be exercised at all time.2.2 Static ElectricityLCM contains CMOS LSI’s and the same precaution for such 2.6 Limited Warranty devices should apply, namely Unless otherwise agreed between S-TEK and customer,(1). The operator should be grounded whenever he/she comes S-TEK will replace or repair any of its LCD and LCM into contact with the module. Never touch any of the conductive whichis found to be defective electrically and visually when partssuch as the LSI pads, the copper leads on the PCB and the inspected in accordance with S-TEK acceptance standards,interface terminals with any parts of the human body. for a period of one year from date of shipment. Confirmation (2). The modules should be kept in antistatic bags or other of such dateshall be based on freight documents. The containers resistant to static for storage. warranty liability of S-TEK is limited to repair and/or(3). Only properly grounded soldering irons should be used. replacement onthe terms set forth above. S-TEK will not (4). If an electric screwdriver is used, it should be well grounded responsible for any subsequent or consequential events.and shielded from commutator sparks.

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15. OUTLINE DRAWING

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