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KIT – Universität des Landes Baden-Württemberg undnationales Forschungszentrum in der Helmholtz-Gemeinschaft
Institute for Data Processing and Electronics (IPE)
www.kit.edu
Balloon-Experiment JEM-EUSO
EC-Design Review
EC-HV Board
KIT-IPE2 10.04.23
The EC-HV Board
First Design: Single-Layer PCB, 1,5mm FR4
A. Ebersoldt
KIT-IPE3 10.04.23
The EC-HV Board
Second Design: Single-Layer PCB, 1,5mm FR4
A. Ebersoldt
KIT-IPE4 10.04.23
IPE - Experience
A. Ebersoldt
PottingUse of 2 component silicon materials.
Mass production @ IPE:Project Quench Detection(W7X, TOSKA, KATRIN, HZ-Berlin)
Company-Connection:Coating & Potting:
Balloon-ExperimentsAtmospheric measurements with MIPAS, developed @ KIT
- many flights with MIPAS flown by CNES
also in Kiruna (same as maiden flight for EUSO-Balloon)
- Flight altitude up to 40km and 18 hours
- @ IPE developed electronics:
instrument control, communication, power-management, thermal design, for balloons and aircrafts
KIT-IPE5 10.04.23
IPE Test Facilities
Climate chamber:
Vibrating table:
A. Ebersoldt
IPE assembly center for PCB and many more:
-Pick-and-Place machine-Flying-Prober-Camera inspection systems-Wire bonder-Clean room-Dry cabinets-Laser-Labeler-…
-Laboratories: -Electronics-Mechanics-Optics-Hybrid-Technology