IST Workprogramme 2000 Microelectronics Optoelectronics [email protected] European Commission INFSO E6

IST Workprogramme 2000IST Workprogramme 2000

Microelectronics Optoelectronics

[email protected]@cec.eu.int

European Commission INFSO E6European Commission INFSO E6

Organisation & IntegrationOrganisation & Integration

KA4KA4Essential technologies & infrastructureEssential technologies & infrastructure

KA1KA1 Systems & servicesSystems & services

for the citizen for the citizen

KA2KA2New methods of work &New methods of work & Electronic Commerce Electronic Commerce

KA3KA3 MultimediaMultimedia

content & toolscontent & tools

Research networkingResearch networking

Future & emerging technologiesFuture & emerging technologies

Cross Programme Themes

KAIV: Strategic Focus & ArchitectureKAIV: Strategic Focus & Architecture

Software,Systems

& Services

Microsystems,Subsystems & Peripherals

Micro- &Opto-electronics

Mobile & SatelliteCommunications & Systems

Computing,Communications

& Networking

Simulation, Visualisation& Interfaces

Nuts and Bolts of the e-Economy

KAIV: Main highlightsKAIV: Main highlights

Strengthening infrastructure convergenceStrengthening infrastructure convergence– IP/Mobile/fixedIP/Mobile/fixed– Broadcasting and communicationsBroadcasting and communications

Higher visibility to networked embedded devices, and Higher visibility to networked embedded devices, and related architectures related architectures

– Embedded devices, Software, real-time systemsEmbedded devices, Software, real-time systems

Highlighting open source software and open systemsHighlighting open source software and open systems Includes a comprehensive range of take-up measuresIncludes a comprehensive range of take-up measures Two-phase perspective Two-phase perspective

– Integration in short to medium termIntegration in short to medium term– Higher performance and adaptivity in longer termHigher performance and adaptivity in longer term

KAIV Micro- and OptoelectronicsKAIV Micro- and Optoelectronics

Connectivity Mobility+ Interactivity+

System on ChipFocus:

ApplicationsInfo appliances

CommunicationSystems (optoE)

2000 Calls 4&5: Micro- and Opto-2000 Calls 4&5: Micro- and Opto-

Microelectronics - OptoelectronicsMicroelectronics - Optoelectronics– IST 2000 - IV.8.1IST 2000 - IV.8.1(R&D)(R&D) Microelectronics Design and TestMicroelectronics Design and Test– IST 2000 - IV.8.2IST 2000 - IV.8.2(R&D)(R&D) Application-Specific MicroelectronicsApplication-Specific Microelectronics– IST 2000 - IV.8.3IST 2000 - IV.8.3(R&D)(R&D) Industrial µelectronics technologies: processes,Industrial µelectronics technologies: processes,

equipment and materialsequipment and materials– IST 2000 - IV.8.4 IST 2000 - IV.8.4 (R&D)(R&D) Opto-electronic technologiesOpto-electronic technologies– IST 2000 - IV.8.5 IST 2000 - IV.8.5 (R&D)(R&D) Advanced micro and opto-electronicsAdvanced micro and opto-electronics– IST 2000 - IV.8.6 IST 2000 - IV.8.6 (Take-up)(Take-up) µelectronics design and test.µelectronics design and test.– IST 2000 - IV.8.7 IST 2000 - IV.8.7 (Take-up)(Take-up) Application Specific micro-electronics.Application Specific micro-electronics.– IST 2000 - IV.8.8 IST 2000 - IV.8.8 (Take-up)(Take-up) Industrial µelectronics technologiesIndustrial µelectronics technologies– IST 2000 - IV.8.9 IST 2000 - IV.8.9 (Take-up)(Take-up) Research training in microelectronics: Research training in microelectronics:

Accompanying MeasuresAccompanying Measures

Call 4

Call 5

AL IV.8.4 Optoelectronic TechnologiesAL IV.8.4 Optoelectronic Technologies

Focus:Focus: Materials, devices and modules for: Materials, devices and modules for:– High-speed routingHigh-speed routing– Data processingData processing– InterconnectionsInterconnections– SensingSensing

Application Areas:Application Areas: – Photonic networks (low-cost broad-band to-the-home applications)Photonic networks (low-cost broad-band to-the-home applications)– Information and Communication TerminalsInformation and Communication Terminals

Advanced processes, materials and devicesAdvanced processes, materials and devices– based on compound semiconductors and on SOIbased on compound semiconductors and on SOI

– very high frequency and low power communicationvery high frequency and low power communication

– high power communication applications.high power communication applications.

– Cost/benefit vs Si and Si/SiGe for industrial useCost/benefit vs Si and Si/SiGe for industrial use

AL IV.8.5 Advanced Micro- and Opto-AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (1)electronics: RTD (1)

E.g. GaAs (and metamorphic compound), SiC, GaN and SOI.E.g. GaAs (and metamorphic compound), SiC, GaN and SOI.

large bandwidth or local loop transmission. large bandwidth or local loop transmission.

base stations and power amplifiersbase stations and power amplifiers

Very innovative Very innovative – materialsmaterials

– processes processes – componentscomponents

for micro- and opto-electronics industries.for micro- and opto-electronics industries.


new substrates, gate insulators for future devicesnew substrates, gate insulators for future devices

new device principles for micro-electronics applicationsnew device principles for micro-electronics applications

WAFER WEB

EURACCESS: R&D Enabler CMOS <.1μmEURACCESS: R&D Enabler CMOS <.1μm

LABLABLAB

LAB LAB

SCIENTIFIC ADVISORY BOARDRoadmap

Projects stimulation / coordination

ORGANIZATION COMMITTEE Labs support organization,....

INDUSTRIAL ADVISORY BOARDOrientation

Lighter is better

EURACCESS and ITRS RoadmapEURACCESS and ITRS Roadmap

98 99 00 01 02 03 04 05 06 07 08 09 10

nm

year

Isolated lines (MPU gates)Year of 1st product shipment

300mm

300mm

450mm

200mm VolumeProduction

VolumeProduction

VolumeProduction

VolumeProduction

Integration Pilot

Integration Pilot

Integration Pilot

Integration Pilot

ModulesBasic steps

ModulesBasic steps

ModulesBasic steps

Advanced research

Advanced research

Integration Pilot

ModulesBasic steps

Advanced research

Precompetitive

Precompetitive

130

100

70

50

35 VolumeProduct

300mm

EURACCESS

Integration of opto- and micro- technologies Integration of opto- and micro- technologies (homogeneous and heterogeneous) (homogeneous and heterogeneous)

ultra-compact ICT componentsultra-compact ICT components synergy with basic CMOS processes synergy with basic CMOS processes

– light emission, light emission, – photo-detection,photo-detection,– interconnection.interconnection.


Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits

Integration of passive optical components,

Integration of MUX-DEMUX components;

Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits

Integration of passive optical components,

Integration of MUX-DEMUX components;

Evaluation in IST for R&D projectsEvaluation in IST for R&D projects

Criteria Weight (1) Threshold (2)

Scientific/Technological Qualityand innovation 4 >= 3Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 1 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 2 >= 3Resources, Partnership, Management 2 >= 2

1) Weight on a scale of 10 (sum 10)2) Threshold with respect to score 0-5

““Take-up”Take-up”

leading-edge and established leading-edge and established

methods and technologiesmethods and technologies

time

Technology TransferTechnology TransferRTDRTD Commercial PhaseCommercial Phase

“T a k e - u p”

greater efficiencygreater efficiency

Transfer toTransfer toUser industryUser industry

TrialsTrials Best PracticeBest PracticeAssessmentAssessment

““Take-up” typesTake-up” types

Trials: Trials: – evaluation of promising, yet not fullyevaluation of promising, yet not fully

established technologies & solutionsestablished technologies & solutions

Best practice actions:Best practice actions:– promote take-up of well establishedpromote take-up of well established

technologies & methods technologies & methods

Assessments:Assessments:– evaluation of innovative productsevaluation of innovative products

User-SupplierCooperation

User-led

User-SupplierCooperation

Focus:Focus: a) For tools:a) For tools:

All areas of microelectronics design and testAll areas of microelectronics design and test

AL IV.8.6 Microelectronics design and AL IV.8.6 Microelectronics design and test - take-up measurestest - take-up measures

b) For methods:b) For methods:1. collaborative design 1. collaborative design 2. reuse of Intellectual Property (IP blocks).2. reuse of Intellectual Property (IP blocks).

Action types:Action types: TrialsTrials


Trials:Trials: – evaluation of promising, yet not fullyevaluation of promising, yet not fully





General Explanation of Trials (1)General Explanation of Trials (1)

Objective: Objective: To timely pass the barriers to successful exploitation of new technologies

– Adaptation and introduction of leading edge technology in industrial/service applications

– The technology must be promising, but not yet be established or commercially available (typically: prototype method or tool).

– Commitment for dissemination of the experience to other organisations across Europe

General Explanation of Trials (2)General Explanation of Trials (2)

Participants: At least one (industrial) technology user and one (industrial) supplier

The technology is used in a real case within the user organisation

The technology is adapted (by the supplier) to users’ needs, leading to progress beyond the state of the art.

User-supplier cooperation for joint evaluation of technological and economic benefits is essential

Funding Rules for Trials and Best PracticeFunding Rules for Trials and Best Practice

Up to 100 %:

– Personnel, Co-ordination Costs and other Specific Personnel, Co-ordination Costs and other Specific CostsCosts

Up to 50%:

– Subcontracting, Travel and Subsistence, Subcontracting, Travel and Subsistence, Consumables, Computing and Durable equipment Consumables, Computing and Durable equipment costs.costs.

No contribution:– IPR costs and Overheads.IPR costs and Overheads.

Evaluation in IST for Trial proposalsEvaluation in IST for Trial proposals


Scientific/Technological Qualityand innovation 3 - Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 1 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 3 >= 3Resources, Partnership, Management 2 >= 3


Objectives:Objectives:– Promote adoption of EXISTING Microelectronics and Promote adoption of EXISTING Microelectronics and

Optoelectronics TechnologiesOptoelectronics Technologies

– Improve EXISTING Products or ServicesImprove EXISTING Products or Services

Focus:Focus: – New Communication CapabilitiesNew Communication Capabilities

– Improved User InterfacesImproved User Interfaces

AL IV.8.7 Application-Specific AL IV.8.7 Application-Specific Microelectronics and OptoelectronicsMicroelectronics and Optoelectronics

ASICs, FPGAs, reconfigurable devices and micro-controllersASICs, FPGAs, reconfigurable devices and micro-controllersASICs, FPGAs, reconfigurable devices and micro-controllersASICs, FPGAs, reconfigurable devices and micro-controllers

Enhance Capabilities, Enhance EconomyEnhance Capabilities, Enhance EconomyEnhance Capabilities, Enhance EconomyEnhance Capabilities, Enhance Economy







Example: FUSE, FUSE ABCExample: FUSE, FUSE ABC

130 Replications

471AEs1973

Proposals2,299 workplans

3,215 Company visits8,489 Attendees at Events

14,629 Contacts and Mailings

Training

220 Demonstrators

FUSE Demonstrator ExampleFUSE Demonstrator Example

Example: FUSE, FUSE ABCExample: FUSE, FUSE ABC

Targeted Actions: FocusTargeted Actions: Focus– FunctionalityFunctionality– TechnologyTechnology– Industry SectorIndustry Sector


Projects with 5-20 UsersProjects with 5-20 Users – Quality of ProposalsQuality of Proposals

– European DimensionEuropean Dimension

Take-Up ProposalTake-Up Proposal

DisseminationDissemination ReplicationReplication

ExpertiseExpertiseCentresCentres

UsersUsers


Evaluation in IST for Best-Practice proposalsEvaluation in IST for Best-Practice proposals


Scientific/Technological Qualityand innovation 2 >= 3Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 2 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 3 >= 3Resources, Partnership, Management 2 >= 3


IV.8.8 Ind. microelectronics technologies:IV.8.8 Ind. microelectronics technologies:Assessment ActionsAssessment Actions

Semiconductor Equipment Assessment (SEA):Semiconductor Equipment Assessment (SEA):Stimulate rapid take-up of advanced prototype Stimulate rapid take-up of advanced prototype equipment by the semiconductor industry. equipment by the semiconductor industry.

User driven assessment of advanced prototype User driven assessment of advanced prototype equipment, related OEM components and materialsequipment, related OEM components and materialsfor semiconductor manufacture.for semiconductor manufacture.

Facility level equipment is not included. Facility level equipment is not included.

Bridges the gap: R&D to manufacturing requirements (reliability, repeatability, cleanliness, productivity, process parameters).

Bridges the gap: R&D to manufacturing requirements (reliability, repeatability, cleanliness, productivity, process parameters).

Market analysis, initial and final specsAt least 2 industrial assessors.

Market analysis, initial and final specsAt least 2 industrial assessors.







IV.8.8 Ind. microelectronics technologies:IV.8.8 Ind. microelectronics technologies:Assessment Actions (i,ii)Assessment Actions (i,ii)

(i) Assess beta type equipment (i) Assess beta type equipment – close to production conditions close to production conditions – create reference centres at user sites. create reference centres at user sites.

Prototype equipment, materials for novel processes, architectures plus support (e.g cleaning, metrology). No design or assembly work under SEA!

Prototype equipment, materials for novel processes, architectures plus support (e.g cleaning, metrology). No design or assembly work under SEA!

(ii) Early proof of innovative process concepts (PoC)(ii) Early proof of innovative process concepts (PoC)– adapting state-of-the-art equipmentadapting state-of-the-art equipment

New processes tested on state-of-the-art equipmentAt least 1 industrial user must be involved ; E&M suppliers access to capabilities of Res. and Indus. Equipment costs are not supported.

New processes tested on state-of-the-art equipmentAt least 1 industrial user must be involved ; E&M suppliers access to capabilities of Res. and Indus. Equipment costs are not supported.

IV.8.8 Ind. microelectronics technologies:IV.8.8 Ind. microelectronics technologies:Assessment Actions (iii)Assessment Actions (iii)

(iii) Early proof of concept (PoC)(iii) Early proof of concept (PoC)for alpha type 300 mm equipment.for alpha type 300 mm equipment.

Early tests of 300mm alpha types

At least 1 industrial user involved;

Equipment cost not supported.

Early tests of 300mm alpha types

At least 1 industrial user involved;

Equipment cost not supported.

For PoC (ii,iii) wafer, analytical, metrology services available

SEA for Display Manufacturing called in IV.6.3

SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6

For PoC (ii,iii) wafer, analytical, metrology services available

SEA for Display Manufacturing called in IV.6.3

SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6

Evaluation in IST for Assessment proposalsEvaluation in IST for Assessment proposals


Scientific/Technological Qualityand innovation 4 -Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 1 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 2 >= 3Resources, Partnership, Management 2 >= 4


Documents

IST Workprogramme 2000 Microelectronics Optoelectronics [email protected] European Commission INFSO E6