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I S S U E N ° 1 2 8 A P R I L 2 6 , 2 0 1 2

E D I T O R I A L

The MEMS market saw strong 17% growth in 2011, to reach $10.2 billion, according to Yole Développement’s latest market analysis.

STMicroelectronics capitalized on the exploding demand for motion processing in mobile phones for a 42% jump in MEMS sales, to push past $900 million in revenues, edging up neck in neck with traditional

sector leader Texas Ins t ruments in Yo le Développement’s annual ranking of the Top 30 MEMS companies. Texas Instruments’ (TI) more mature micromirror MEMS business saw more modest, single-digit growth, but also passed the $900 million mark…

M E M S

C O N T E N T S

• I N S I D E … 4• M E M S 5• M E DT E C H 9• C O M P O U N D S E M I C O N D U C TO R S 1 1

• L E D 1 3• O P TO E L E C T R O N I C S 1 5• P H OTO V O LTA I C S 1 6• A D VA N C E D PA C K A G I N G 1 7

• N A N OT E C H N O L O G Y 1 9• P O W E R E L E C T R O N I C S 2 0

Yole Développement top 30 MEMS ranking: STMicroelectronics challenges Texas Instruments for top spot

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THE D ISRUPT IVE SEMICONDUCTOR TECHNOLOGIES MAGAZ INE

COme to WIN in smart systems innovation Top two suppliers close in on $1B sales level, as MEMS market sees 17% growth

to pass $10 billion mark.

This issue of Micronews illustrates quite well the evolution of the MEMS industry. With double-digit growth and a well-consolidated industrial chain, MEMS is a key fi eld when it comes to generating economic growth. This belief is shared by the European Commission, which has included smar t systems as a key component to reinforcing European competitiveness. As you’ll discover in this i s s u e , t w o E u r o p e a n c o m p a n i e s – STMicroelectronics and Bosch – are today the top t wo leading manufac turers of accelerometers in the consumer electronic fi eld, and the European Commission desires to support the emergence of tomorrow’s new leaders as well. Smart R&D is critical to success, and it’s why the COWIN European support action was launched in October 2010. T h i s i n i t i a t i ve , c o o r d i n a te d by Yo l e Développement, gathers partners bringing their unique expertise in order to support value creation for European collaborative research projects. COWIN is a very hands-on support for people and companies willing to successfully innovate in smar t systems. Micronews Media supports COWIN’s actions, and throughout the year you’l l have the opportunity to learn more about COWIN’s support, actions, and success!

Géraldine Andrieux-GustinCOWIN CoordinatorYole Développement

The new company will be 51% owned by Philips and 49% by Optogan. Financial details of the joint venture were not disclosed. The joint venture will

combine Philips’ latest LED road lighting solutions and international quality standards with Optogan’s LED knowledge, innovative solutions and understanding of

local market requirements in this field. Products developed and manufactured by the joint venture will be sold in the Russian Federation and within its customs union with Kazakhstan and Belarus…

Philips and Optogan sign up to cooperate in LED road lighting solutions in Russia

L E D

Royal Philips Electronics, a worldwide actor in innovative lighting solutions, and Optogan, a Russian manufacturer of LED products announced the signing of a joint venture agreement to become a strong player in the fast growing LED road lighting market in Russia.

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17Georgia Tech Packaging Research Center (GT-

PRC), through an industry consortium of about ~15 semiconductor, package and supply-

chain companies from the US, Europe and Asia, has been pioneering ultra-miniaturized electronics by

Embedded MEMS, Actives and Passives (EMAP) Technology with chip-last (CL) interconnections but with chip-f irst benef its to demonstrate ultra-miniaturized modules with digital, RF, analog, MEMS and sensor functions. …

Georgia Tech proposes industry consortium on advanced packaging technologies and heterogeneous 3D integration

A D V A N C E D P A C K A G I N G

For ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with Global companies.

Free registration onwww.i-micronews.com

P L A T I N U M P A R T N E R S

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

E enquiries@selectbiosciences.com P +44 (0)1787 315110 Woodview, Bull Lane, SUDBURY, CO10 0FD, UK

SelectBiosciences.com

HAMBURGGERMANY30 TO 31 MAY

Welcome to our European Lab Automation congress and exhibition, Europe’s largest event dedicated to automation within life science.

Offering over 150 scientific presentations across 8 different conference streams linked with an exhibition containing more than 150 equipment vendors, ELA aims to highlight and showcase the latest in automated instruments and workflows.

Life science researchers and professionals are presented with an unparalleled opportunity to foster technological discussions and scientific collaboration.

Visit www.EuroLabAutomation.com

Biobanking - Preparation, Storage and Analysis

Drug Discovery Automation - Chemistry Automation &

Compound Management

Drug Discovery Automation - HCS & Cell Based Assays

Informatics for Automation

Conference Streams

Liquid Handling & Robotics

Nano & Microfluidics

Next-Gen Sequencing Automation

Separation & Detection

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

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G O L D P A R T N E R S

CONSULTING

COWIN Marketplace @ MNBS Workshop 4th May 2012— Athens, Greece

COWIN Marketplace is an effec ve instrument to foster technology transfer, find new customers for innova ve Smart Systems and best strategic partnerships and collabora ons.

Are you looking for new partners, applica ons, technological solu ons or funding opportuni es in the Micro-Nano-Bio-Systems area?

Contact us to work on your individual schedule of one-to-one mee ngs fi ng your expecta ons.

COWIN Marketplace is the right place to COme to Win!

Contact: Jérôme Mouly, mouly@yole.fr

Meet key partners to turn your innova on into success

www.cowin4u.eu

T O M E E T U S

PCIM Europe - Booth #12-257 - May 8 to 10 – Nuremberg, GermanyThe conference program with its focus on Power Electronics, Intelligent Motion, Renewable Energy and Energy Management will offer more than 200 previously unpublished oral and poster presentations… Come to participate to Yole Développement Market Briefing on May 10, 1:00 pm, at booth #670

Sensors + Tests - Booth #12-270 - May 22 to 24 – Nuremberg, GermanyThe SENSOR+TEST trade fair in Nürnberg is the world's leading forum for sensors, measuring and testing. From simple microsensors to complex test r igs, from ready-to-use components to individualised services, the SENSOR+TEST represents the complete competence in measurement technology.

MEPTEC - MEMS Technology Symposium - May 23 - San Diego, USASensors – A Foundation for accelerated MEMS Market Growth to $1 Trillion

ISiCPEAW - May 29 to 30 - Kista, SwedenISiCPEAW 2012 is a two day event on the latest results and innovations on the use of Silicon Carbide technology in power electronics applications. International experts will meet in Stockholm to share their expertise, recent developments and vision of SiC electronics applications.

ECTC - Booth # 104 - May 29 to June 1 - San Diego, USAThe premier international packaging, components, and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information. This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors…

Feel free to ask for a meeting with Yole Développement’s analysts. Contact: S. Leroy (Leroy@yole.fr)

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

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I N S I D E …

SCHMID’s solar cell turnkey manufacturing solutionsSCHMID, a well-established machine manufacturer, offers a complete turnkey solar solution—from silicon to module. The company’s machines and processes are, notably, also suitable for use in many microelectronics applications.

As a privately held, family business based in Germany, SCHMID has a remarkably long h i s to r y o f near l y 15 0 year s mak ing

machinery. The company, known for its printed circuit board and fl at panel display technologies, became involved in the photovoltaics industry back in 2001 and is now providing solar cell turnkey manufacturing solutions.SCHMID is differentiating itself in the photovoltaics industry by offering true turnkey solutions ranging from silicon to module manufacturing, and, most no t ab ly, by be ing t he on ly c ompany t ha t manufactures nearly 100% of the equipment it uses in-house for si l icon, wafer, cell, and module manufacturing.

MachineryIn the photovoltaic area, SCHMID makes and offers a wide range of equipment. For silicon manufacturing, the company offers a full turnkey facility or individual pieces of equipment such as hydrochlorination, disproportionation, or CVD reactors, based on a monosilane- process. Their wafer manufacturing tool line includes: Diverters, metrology sorter systems, pick+place robots, wafer cleaning, wafer pre-cleaning, and wafer singulation tools. For cell manufacturing, their tool line and product offerings include: Acid texturing, alkaline texturing, buffer and fl ex buffer, carrier loader and unloader, cell sorter, conveyor including inline measurement, inline diffusion furnace, electroplating, fi ring, inkjet DOD 300, laserblue, laser transfer printing, laser treatment, LIP light-induced plating, load cell line, multilane loader and unloader, PECVD loader and unloader, phosphor doper, pick+place robots, POCL3 diffusion furnace, APCVD system, SE jet, selective emitter technology, single-side edge isolation, and PSG etching.For modules, they offer: Module certifi cation, glass loader, glass washer, stringer, laminator, layup station, trimming station, framing station, conveyor, and sun simulation. And for thin fi lms, their tool line

and products include: Developer, glass washer, KCN-etch, single-side etch, and TCO-etch.

ProcessesThe manufac tur ing p rocesses invo lved in photovoltaics are, for the most part, quite different than those used in microelectronics, according to Christian Buchner, vice president of SCHMID Group’s Cell Unit. But there is some crossover and there are areas in which the microelectronics industr y could benef i t f rom their too ls and processes.Solar cell manufacturing begins with metallurgical s i l icon, which is essent ia l ly run through a hydrochlorination process, followed by a distillation, and then f ina l ly through a chemical vapor deposition monosilane process to generate silicon. “The advantage of this process is that we end up with a very high purity silicon, which provides effi ciency benefi ts at the end,” explains Buchner. “The conversion of sunlight to electricity depends on the mater ia l qual i t y of the wafers. Our technology also includes excel lent c leaning processes of the wafers. When using ingot-generated silicon, it gets sliced into wafers, and then c leaned again before we send i t of f to manufacturing.”The next step is cel l manufactur ing and the processes become more closely linked to those in the microelectronics wor ld. Using a doping process, the p-n junction is added to the solar cells, which then generates the electricity. “We use thin film applications for passivation and an ant i - re f lec t ion coat ing, then meta l l izat ion processes in which we seed silver-lined plates, which then act as the final electrode,” Buchner says. “Metall ization also uses par tial screen printing processes.”A f te r c reat ion of the f ina l ce l l comes the “moduleing” step, in which SCHMID tabs and strings the cells. This is followed by “laying up” the strings to a matrix. Encapsulation and sun simulation are the final

steps, and the result is functional modules.

“As a machine manufacturer, we design the products and are also actively involved in solar cell design. We’re working in-house in our R&D labs to develop new solar cell concepts that increase the solar cell power conversion effi ciency as well as to reduce the cost—both major issues. Rather than just building machines, we’re focused on improving the fi nal product,” points out Buchner.

Applications in microelectronicsSCHMID’s technology and their machines can also be used outside the solar realm. The polysilicon material generated for solar purposes is ideal for microelectronics, Buchner notes. “The cell manufacturing steps in which we use wet chemistry processes, faci l i ty automation, or m e t a l l i z a t i o n c a n a l s o b e u s e d i n t h e microelectronics or PCB industries. Our thin fi lm deposition systems are ideal for microelectronics. And doping is one of the key things that comes out of the semiconductor industry and, with our modifi cation, can be made cheaper,” says Buchner.

GoalsSolar power is already quite competitive cost-wise, but remains greatly underestimated. In the future, f rom a cost perspect ive, Buchner bel ieves photovoltaics will make it diffi cult for conventional power-generating plants to compete.“We intend to push photovoltaics to its limits in terms of effi ciency and lower costs. And by the end of this year, SCHMID will be coming out with storage solutions, which is a big step in pushing photovo l ta ics through and into the pr ivate households and industry. If you’re able to store power cheaply, it becomes a total solution. Our goal is for photovoltaics to power independent households in the future,” says Buchner.

www.schmid-group.com

SCHMID Solar cell manufacturing line(Courtesy of SCHMID Group)

SCHMID Mono Silane based Silicon Fab (Courtesy of SCHMID Group)

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M E M S

Yole Développement top 30 MEMS ranking: STMicroelectronics challenges Texas Instruments for top spot

Top 30 worldwide MEMS companies ranking - 2011 Revenues(Yole Développement estimates US M$ - March 2012)Bosch is a very strong 4th top MEMS company

with strong growth in 2011 in both automotive and consumer electronics. Bosch and

STMicroelectronics are now the main manufacturers of accelerometers in the consumer electronic fields.Smart phone demand drove whopping 40% or better growth across a whole range of sensor suppliers. Knowles Electronics moved up to fourth rank on 40% growth in MEMS microphones to $362 million. Magnetometer supplier AKM jumped 46%, to $279 million and eighth place. Though most magnetometers are not a purely MEMS technology, they a re now so c lose ly in tegra ted w i th accelerometers that Yole now tracks them with the MEMS industry. Fabless InvenSense jumped 67% to $144 million, thanks to its gyroscope and motion sensing offerings made at TSMC, and pulled off the MEMS industry’s first major IPO. MEMSIC reported better than 80% growth on the strength of its magnetometer and accelerometer sales, to enter the Top 30 ranks at $55 million.

Despite its wide diversity of players and products, MEMS still remains a very concentrated industry. The four leading IDMs -- TI, ST, Hewlett Packard and Robert Bosch-- together sell some $3.3 billion 2 worth of MEMS devices, accounting for around a third of all MEMS sales worldwide. These Top 30 companies account for almost 80% of total MEMS packaged device sales worldwide.

This burgeoning demand for motion sensing, location sensing, and better acoustic sensing in hand held devices will continue to drive rapid growth in MEMS. But i t wil l also change the traditional structure of the industry, as those players and markets outpace the once dominant inkjet and micromirror components. These high volume consumer markets wil l reward those players who best deliver not only low cost and reliable high volume production, but also fast time to market and ease-of-use. The coming solutions to reduce costs and improve performance by integrating multiple sensors and providing more sophisticated software to transform the sensor data into easy-to-use functions will drive suppliers from separate components to combination sensors and modules and software that simpli fy the systems integration work. “Growth is now coming f r o m c o m b o s o f a c c e l e r o m e t e r s a n d m a g n e t o m e t e r s a n d f r o m c o m b o s o f accelerometers and gyros, which started to ship in volume last year” says Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies. “Companies who make only accelerometers will have to change.” For companies that do not release their MEMS results, Yole estimates sales based on the number

of devices sold in the companies’ product markets, the companies’ market share, and the device price based on published prices or reverse engineering studies. Yole Développement released its MEMS

market data in April, including MEMS Market Forecast, MEMS Foudries ranking. Discover them on i-Micronews, Financial Buzz section.

www.yole.fr

From page 1

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

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M E M S

SCC1300 combo sensor enables cost savings in precision agriculture

Sensor requirements for heavy machinery are typically higher than for passenger car applications due to the more difficult working

conditions. Components have to withstand extremely harsh conditions, including very high or low temperatures, moisture, dust, shock and/or continuous vibration. Harvesters, forest machines, tractors, mining equipment and other heavy machinery also typically require longer component lifetime. Sensors have to withstand these condit ions without compromising high performance and accuracy. “VTI’s proprietary 3D MEMS technology, together with a state-of-the-art ASIC and highly reliable packaging solution, results in very stable, robust and accurate

sensors that perfectly meet the requirements of these demanding applications,” says Mr. Ville Nurmiainen, VTI Product Manager for Gyros.One growing sensor application field is precision agriculture. As in any other industry, the objective is to increase efficiency by cutting costs, saving time and ensuring maximum output from the fields. Modern sensor technology can be used to achieve these objectives. VTI MEMS gyroscopes are perfectly adapted to the most accurate GPS systems that are used in the position control of farming equipment. “GPS systems are not capable of defining the orientation of a stationary vehicle. VTI Gyro combo sensors are used to compensate for GPS systems by

measuring the tilt, pitch and yaw of the antenna, which is typically several meters above the ground and changing position as the inclination of the vehicle changes over the terrain,” explains Ville Nurmiainen. “The VTI Gyro also controls the steering of the vehicle at the end of the pass, enabling accurate auto-steering functionality and signif icantly improving the effectiveness of equipment time. One of our leading customers calculates that an auto-steering system combined with VTI sensors can achieve savings of up to 20% in typical farm use.”

www.vti.fi

Based on VTI’s long experience as a reliable supplier of sensors for automotive safety applications, the company is also developing MEMS solutions that are perfectly suitable for the most demanding agricultural and other heavy machinery applications.

Measurement specialties unveils the Model 4807A high resolution accelerometer

Measurement specialties unveils the Model 4807A high resolution accelerometerThis DC response accelerometer features

micro-g resolution and offers an industry-first, remote auto zero function. The 4807A provides an amplified, signal conditioned output in ranges from ±2g to ±200g with a dynamic range of 98dB. This sensor incorporates a gas damped silicon MEMS sensing element with integral mechanical overload stops for shock protection up to 5,000g as well as a wide bandwidth from DC to 1500Hz.Specifically designed for low level vibration monitoring, the 4807A can be used in diverse applications such as transportation testing, flight testing, machine control and structural monitoring. Its stainless steel, hermetically sealed housing ensures reliable operation in rugged environments while its ±2Vdc bias output is compatible with industry-standard instrumentation. The Model 4807A features a Total Error Band of <2% with an excitation voltage range from 8 to 18Vdc. The <2 second turn on time of the 4807A plus a broad compensated temperature range (-40°C to +121°C) makes this accelerometer an “all-

weather” sensor that can jump to life quickly in power-starved installations.The IP67 rating of this accelerometer provides significant protection in high humidity environments and against liquid incursion. The optional detachable cable (340A), triaxial mounting block(AC-D02652) and convenient three channel DC signal condition/amplifier (101) facilitates ease of installation. Those wishing the remote auto-zero function would choose the 341A cable assembly. Each unit is packaged with an NIST traceable calibration certificate. These devices are EAR99 export compliant and warranted for a period of one year from date of shipment to original purchaser to be free from defects in material and workmanship.Measurement Specialties designs and manufactures sensors and sensor-based systems. The company produces a wide variety of sensors and transducers to measure precise ranges of physical characteristics such as pressure, force, vibration, torque, position, temperature, humidity, fluid properties, mass air flow and photo optics. Measurement Specialties uses mult iple advanced technologies – including

piezo-resistive, electro-optic, electro-magnetic, variable reluctance, magneto resistive, digital encoders, thermistors, thermocouples, RTDs, capacitive, resonant beam, application specific integrated circuits (ASICs), MEMS, piezoelectric polymers and strain gauges to engineer sensors that operate accurately and cost-effectively in customers' applications.

www.meas-spec.com

Measurement Specialties has just released to production its ultra low noise Model 4807A accelerometer.

MEAS 4807A accelerometer (Courtesy of Measurement Specialties)

Tegal focuses MEMS and semiconductor experience on healthcare technologies

HealthTech Capital invests in a portfolio of early-stage healthcare technology companies. HTC focuses on capital efficient companies that

leverage mobility and information technologies to improve healthcare delivery and decrease healthcare costs. HealthTech companies improve existing providers workflow or, empower consumers to manage their chronic conditions or improve their wellness.

Tegal expects to have an active partnership with HTC, said Thomas Mika, the company’s President and Chief Executive Officer. Tegal currently has one portfolio company in healthcare technology, NanoVibronix Inc., a private company that develops medical devices and products that implement its proprietary therapeutic ultrasound technology.“HealthTech Capital is an excellent partner for Tegal as we intensify our investment focus on a $2-trillion

market that HTC has identified for healthcare technologies,” Mr. Mika said. “Government mandates and efficiency requirements are powerful growth drivers in this market, which is tailor-made for Tegal and our decades of leadership in semiconductors, MEMS and related technologies. We expect our partnership with HealthTech Capital to produce extraordinary investment opportunities for Tegal.”

www.tegal.com

Tegal announced that is has become an industry partner of HealthTech Capital, one of Silicon Valley’s most prominent investing groups in emerging healthcare technology companies.

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

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M E M S

MEMS packaging market is growing twice

faster than the overall

IC packaging industry…

Discover the NEWreport on

i-Micronews.com/reports

MEMSPackaging

MicroVision announces defi nitive agreements with pioneer for HD PicoP Gen2 display engines using direct green lasers

Movea Chemistry of Motion™ Enables Rapid Prototyping and Development of Motion-Enabled Products

MicroVision, the leader in innovative ultra-miniature projection display technology, announced that it has signed definitive agreements with Pioneer Corporation to manufacture, distribute, license and supply MicroVision’s

HD PicoP® Gen2 display engine technology using direct green lasers (PicoP Gen2). Under the agreements, Pioneer will produce PicoP Gen2 display engines for its own automotive aftermarket products and will pay MicroVision royalties from sales of these products. Pioneer plans to release its first aftermarket head-up display product later this year.Under the agreements, Pioneer will also manufacture and supply key display engine subsystems to MicroVision for consumer, industrial, and other applications. MicroVision began shipments of PicoP Gen2 display engine samples to OEMs in February for evaluation and is working to secure commitments from these customers to design products that will use the PicoP Gen2 display technology.This arrangement allows the companies to leverage Pioneer’s advanced operational technologies and product distribution networks to promote adoption of its automotive aftermarket products and supports MicroVision’s continued transition to an “Image by PicoP” ingredient brand model, which is expected over time to reduce working capital requirements. Additional details of the manufacturing, distribution, licensing and supply agreements were not disclosed.

www.microvision.com

Movea revealed its Chemistry of Motion™ that enables the company to rapidly prototype new motion features for customers in the mobile, Interactive TV, sports, and health markets. Built on Movea’s patented SmartMotion®

“atoms”, Chemistry of Motion builds on hundreds of years of R&D which has identified the fundamental elements of human motion and tools for combining SmartMotion atoms into molecules of more complex, end-user features.Movea’s Chemistry of Motion characterizes and organizes the basic elements of human motion and assembles them into “molecules” which represent the richer, more complex end-user features that the market is increasingly demanding. In Movea’s Table of SmartMotion Elements, basic features are organized into columns according to the type of motion analysis they perform. Each element in the table is characterized by fundamental properties such as category of motion, computational complexity, sensor configuration and sensor placement.The creation of new features by assembling motion atoms into molecules is accelerated through a powerful internal toolkit the company’s engineers have developed called MoveaLab™. Bruno Flament explains, “When developing new features, our engineers think in terms of data flows in a functional diagram. To accelerate our development time, we created a signal processing design studio where our extensive library of algorithms and IP have been converted into functional blocks that can be organized into a signal processing data flow by simply clicking and dragging into place with a computer mouse. Our engineers can immediately see how the processing flows work with real sensor data, in real-time and then fine tune the flow to analyze and optimize performance. The Graphical User Interface (GUI) has rich and detailed graphical objects for feature validation and demos.”

www.movea.com

Pioneer will manufacture and sell products using Micro-Vision’s PicoP Gen2 display engine technology, providing licensing revenue to MicroVision.

Company’s MoveaLab™ speeds assembly of SmartMotion® Elements into advanced motion features.

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

Association Sponsor

MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

Tenth Annual

MEMS Technology SymposiumSensors: A Foundation for Accelerated MEMS Market Growth to $1 TrillionWednesday, May 23, 2012 • Wyndhan San Jose Hotel • San Jose, CA

Topics will include: Roadmap to a $1 Trillion MEMS Market The Next Large Market Opportunity: Motion Interface Realizing the Full Potential of MEMS Design Automation Software Awareness Through a Trillion MEMS Sensors MEMS Integration of the Accelerometer: The First Step of the MEMS Revolution

MEMS R&D Prototyping to Manufacturing in Singapore Evolution of MEMS Packaging Supporting High Volumes Requirements to Launch Roadmap Funding

New Markets Enabled by MEMS

Platinum Sponsor Gold Sponsors

R E G I S T E R O N L I N E T O D A Y A T W W W . M E P T E C . O R G

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Gain the knowledge you need from the leading experts and peers in the industry. This year’s Conference Program includes more Technical Sessions in Tracks covering the topics that are most important to you and your business, including:

Identify specific solutions to your most difficult sensing, detection and control-related challenges on the Expo floor.

Sensors Expo brings together the largest and best-in-class showcase of sensing technologies and systems for attendees to evaluate and make informed decision. Plus – see new Pavilions on the Expo floor to help you easily find your specific sensor solution.

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Subscribers: Visit www.sensorsexpo.com to register today! Use discount code A338F for an EXTRA $50 off a Gold or Main Conference Pass!

Scan QR code to register on the go!

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M E D T E C H : M I C R O F L U I D I C S & B I O M E M S

Fluidigm has begun direct service to customers in China.Fluidigm China opens its doors

Through the establishment of a wholly-owned Fluidigm subsidiary in China in late January 2012, officially known as Fluidigm (Shanghai)

Instrument Technology, Fluidigm will improve services to its Chinese customer base and expects to rapidly build a strong presence in that country’s burgeoning life science research community.Fluidigm is the creator and world’s leading supplier of integrated fluidic circuits. Fluidigm microfluidic chips, systems, assays and other reagents enable genetic analysis that in many instances were previously impractical. To help its customers achieve and exploit advances in life science research, agricultural biotechnology, or Ag-Bio, and molecular diagnostics,

Fluidigm provides robust systems that deliver high throughput and simpler workflows at decreased costs. Fluidigm microfluidic systems overcome many of the limitations of conventional laboratory systems by integrating a vast number of fluidic components onto a single microfabricated chip. Fluidigm technology enables its customers to perform and measure thousands of sophisticated biochemical reactions on samples smaller than the content of a single cell, while utilizing minute volumes of reagents and samples. Similarly, for next generation DNA sequencing, Fluidigm systems enable rapid preparation of multiple samples in parallel at low cost.

www.fluidigm.com

GE Healthcare, a unit of GE, announced today that it has acquired SeqWright, a provider of nucleic acid sequencing and other genomic services.

Creating an integrated diagnostics company.

GE Healthcare completes acquisition of SeqWright, expanding capabilities in fast growing molecular diagnostic segment

Abingdon Health raises £3 million and acquires controlling stake in Molecular Vision

The acquisition adds complementary genomics capabilities to Clarient, a unit of GE Healthcare and a leader in the fast-growing molecular

diagnostics sector. The deal also provides a platform for Clarient to expand its clinical diagnostic offerings to include next generation sequencing. Financial terms of the acquisition were not disclosed.“Understanding how genetic variation at the molecular level impacts disease is critical in the continued discovery and development of new and more effective therapies, and increasingly in the management of patient care through the use of more precise diagnostic tests” said Pascale Witz, President and CEO, GE Healthcare, Medical Diagnostics.“Combining the expertise and capabilities of the two companies will enable GE Healthcare to offer a substantially wider range of services to the biopharmaceutical, diagnostic and research industries and eventually to patients and health care providers.”

Molecular diagnostics provide precise information about a patient’s disease and can help doctors decide on the best treatment. The rapid increase in the incidence of cancer worldwide, together with advances in specific cancer-focused therapies, is driving significant demand for molecular diagnostics.As biopharma companies continue to develop large portfolios of increasingly targeted therapies, the need for fast, accurate and cost effective sequencing technologies and services to determine the genetic profile of patient samples becomes vital to clinical trials and the development of companion diagnostics. SeqWright has an extensive history of projects that focus on clinical trial and regulatory support for compan ion d iagnos t i c submiss ions . The complementary capabilities of Clarient & SeqWright will allow the combined business to add immediate incremental value to existing pharmaceutical and biotechnology partnerships throughout their drug

development and companion diagnostic development efforts.Clarient provides pathologists and oncologists with access to diagnostic tests that shed light on the complex nature of various cancers by combining innovative diagnostic technologies with pathology expertise to assess and characterize cancer. Clarient is focused on developing novel, proprietary diagnostic markers and tests for the profiling of breast, lung, colon, melanoma and blood-based cancers, to help clinicians make informed decisions on how best to treat their patients. Given the increasing importance of more targeted cancer diagnostics, Clarient is well positioned to bring differentiated, added-value molecular diagnostic products and services to market. Since 2007, Clarient’s revenues have grown at an approximate 30 percent compounded annual growth rate.

www.gehealthcare.com

Abingdon Health, a specialist medical diagnostics company announces that it has received £3 million of equity investment in a funding round

led by Imperial Innovations Group, a technology commercialisation and investment group. The company will use the funds to acquire a controlling 50.1% interest in Imperial's portfolio company Molecular Vision, as well as investing in other projects in its portfolio including those from its joint venture with the University of Birmingham, Bioscience Ventures.Molecular Vision is developing a low-cost, lab-quality, point of care diagnostic test called BioLED, which will complement Abingdon's existing technologies. BioLED is a miniaturised, easy-to-use, disposable device that can simultaneously test for multiple disease markers using numerous single methods in the same device.

Currently focused on areas of high disease burden such as kidney function or cardiovascular disease, the device has the potential to be used across a wide spectrum of healthcare and other applications where disposable, quantitative, simple to use on-site analysis is required.In November 2010, Abingdon launched a joint venture with the University of Birmingham, Bioscience Ventures, to commercialise intellectual property developed at the University. Bioscience Ventures is developing new diagnostic tools for conditions where there is currently unmet need in markets such as oncology, genetic diseases and platform technologies with applications in many areas including infectious diseases, drug testing and veterinary. It currently has the following companies within its portfolio:

• Serascience - developing fast, accurate point of care tests to aid the diagnosis of myeloma and related conditions;• Linear Diagnostics - focused on the development of a platform technology based on linear dichroism which is currently being applied to the multiplexed detection of infectious disease agents in sepsis• Alta Bioscience - manufactures and sells speciality chemicals such as peptides and oligonucleotides and performs amino-acid analysis and protein sequencing for the pharmaceutical industry, food industry and academia;• Bioscience Ventures is also working on a new urine test for the diagnosis of adrenal cancer

www.molecularvision.co.uk

Fluidigm's 96.96 Dynamic Array microfluidic chip conducts 9,216 biology experiments at one time.

(Courtesy of Fluidigm Corporation)

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M E D T E C H : M I C R O F L U I D I C S & B I O M E M SM E D T E C H : M I C R O F L U I D I C S & B I O M E M S

Acquisition will broaden life sciences consumables product portfolio.Corning to acquire majority of BD Discovery Labware

Corning announced that it has reached a definitive agreement with BD (Becton, Dickinson and Company) to acquire the

majority of its Discovery Labware unit for approximately $730 million in cash. The acquisition is expected to be completed later this year, subject to customary closing conditions, including receipt of regulatory approvals.“The Discovery Labware unit’s extensive product portfolio and established dealer network will significantly improve Corning Life Sciences’ offerings to customers and is a critical part of Corning’s long-term growth strategy,” Wendell P. Weeks, chairman, chief executive officer and president, said. “With sales of

approximately $235 million, the acquisition will expand Corning Life Sciences’ annual revenues by 40% and catapult the segment toward its goal of being a $1 billion business by 2014. And, the acquisition provides added momentum for Corning to achieve our $10 billion revenue target in the next few years,” he added. Corning expects to reach this revenue goal through a combination of organic growth and strategic acquisitions.When complete, the acquisition will augment Corning’s global market access and enhance its broad portfolio of life sciences products in the areas of drug-discovery tools, bioprocess solutions, and laboratory research

instruments. Corning will integrate four of the Discovery Labware unit’s main product platforms: plastic consumable labware (including tubes, pipettes, Petri dishes, tissue culture dishes, and flasks); liquid-handling products; cell-based assays and cell cultureware; and ADME research into the Corning Life Sciences business segment upon closing of the acquisition.The Discovery Labware unit, headquartered in Billerica, Mass., has operations in Massachusetts, North Carolina, and the United Kingdom, and extensive dealer networks in Asia, Europe and North America.

www.corning.com

GenMark Diagnostics and Advanced Liquid Logic (ALL) announced that they have entered into a Heads of Agreement defi ning the key terms of collaboration to develop an all-electronic, fully integrated in-vitro diagnostic platform bringing together ALL's proprietary electrowetting technology and GenMark's proprietary electrochemical detection.

GenMark and Advanced Liquid Logic enter into agreement to develop an all-electronic fully integrated diagnostic platform

"This partnership will allow us to leverage both companies' unique technologies and know-how, to deliver a digital sample-to-answer

in-vitro diagnostic platform," said Hany Massarany, President and CEO of GenMark Diagnostic. "Our initial focus on multiplex molecular testing will be followed by efforts in other areas of diagnostics including

protein detection and point-of-care testing, as we redefine industry standards for performance, reliability and ease of use with even the most complex of assays.""We are excited to be working with the GenMark team and technology," said Richard West, President and CEO of Advanced Liquid Logic. "We bring a unique

capability in comprehensive, electronically-driven sample preparation and we expect that it will integrate well with GenMark's eSensor® detection technology. This further validates that the fluid-handling flexibility of our platform can be integrated with multiple types of detection for a wide range of applications."

www.genmarkdx.com

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Oclaro and Opnext agree to merge

Order for a research machine in Russia

Oclaro, a tier-one provider and innovator of optical communications and laser solutions, and Opnext, a global leader in the design and manufacture of optical modules, components and subsystems, announced that they have

entered into a definitive agreement to merge in an all-stock transaction. Under the terms of agreement, Opnext shareholders will receive a fixed ratio of 0.42 shares of Oclaro common stock for every share of Opnext common stock they own.The Oclaro and Opnext merger is expected to mark a major transformation in the optical industry, bringing together over 30 years of combined telecom and datacom optical technology innovation. The merger will create a new industry leader in the fast-growing optical components and modules market, forecast to reach $9.2 billion in 2015. The broad product portfolio, technology innovation, engineering resources, cost structure and strategic customer relationships of the combined company are expected to expand its opportunities for growth and to create long-term shareholder value.

Data-intensive applications such as video and cloud computing, and the proliferation of mobile devices, are driving the need for increased performance and bandwidth throughout the core optical networks, at the heart of the world's Internet traffic. These trends are also forcing enterprises and data centers to upgrade and deploy new data communications infrastructures.

As a result, traditionally separate telecom and datacom networks are converging, leveraging advanced optical networking technologies from companies such as Opnext and Oclaro. The combined company will be well positioned to capitalize on these trends to become the No. 1 supplier to the core optical networks with a strong leadership position in the fastest-growing 40G and 100G segment, which is expected to grow at a CAGR of 42% through 2015. The broader product line resulting from the merger strengthens the combined company's position as a key supplier to existing and new customers.

In addition to the telecom and datacom markets, there is a large and growing opportunity for laser diodes in a range of high-growth industrial and consumer markets. Through this transaction, the combined company will be the largest supplier of laser diodes for industrial and consumer applications. With a substantial portfolio of products and technologies, the combined company is well positioned to accelerate innovation and inroads into these high-volume markets.The combined heritage of Oclaro and Opnext comes from some of the leading optical technology innovators over more than 30 years, including Hitachi, Nortel, Alcatel, Marconi, Corning, Opnext, Bookham and Avanex.The combined company will be led by Alain Couder, who will serve as chairman and CEO. Upon closing, Harry Bosco will join the combined company's board of directors.

http://investor.oclaro.com

This order, supplying one Epineat model MBE machine in 2012, will develop laboratory's research capacities on III-V components.The Epineat system represents the most effective solution for basic research

of compound semiconductor materials on 4-inch substrates.These new order confirms RIBER's growing reputation among the scientific community in Russia, where the semiconductor industry is booming.

www.riber.com

Transformative merger of Telecom and Datacom innova-tors creates a new leader complementary products and customers expand opportunities for growth.

RIBER is announcing the sale of a research system to a leading research institute based in Russia.

How LEDs will boost the

GaAs substrate market in the next years?

Discover the NEWreport on

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GaAs Wafer

Market & Applications

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GT Advanced Technologies receives $12.6 million follow-on order from Zhejiang Shangcheng Science & Technology for ASF™ sapphire furnaces

EMCORE announces $17 Million sale of assets for Its VCSEL-based product lines

Oxford Instruments transfers ownership of TDI to Ostendo Technologies as part of strategic partnership

Shangcheng’s ASF-grown sapphire material now qualified for LED production.

EMCORE, a provider of compound semiconductor-based components and subsystems for the fiber optics and solar power markets, announced that it had entered into a definitive agreement, subject to closing conditions, to sell certain assets and transfer certain obligations of its Vertical Cavity Surface Emitting Lasers (VCSEL)-based product lines to Sumitomo Electric Device Innovations USA.

Technology and Devices International (TDI) & Oxford Instruments has formed a strategic partnership with Ostendo Technologies (Ostendo), to exploit an emerging technology which has the potential to improve the manufacturing of High Brightness LEDs.

The ASF furnaces will increase Shangcheng’s production capacity, which the company believes is needed to meet expected demand

from the LED industry and other industrial applications.“This fol low-on order for our ASF furnaces demonstrates Shangcheng’s confidence not only in the robustness of our sapphire growth technology, but in the continued growth of the LED industry,” said Tom Gutierrez, GT’s president and CEO. “The winners in this industry will be the companies that are positioning themselves for the future by investing today in best-in-class technology that enables low cost production of high quality sapphire. Shangcheng has demonstrated the kind of leadership and technological expertise needed to prepare the company for long-term success.” “The ASF furnaces we initially purchased are now qualified and already producing high quality ASF-grown material,” said Mr. Yuncai Wu, General Manager of Zhejiang Shangcheng Science & Technology. “Our

manufacturing operations and technology teams worked closely with GT’s local sales, service and support teams to ensure a successful startup of our new sapphire production plant, which is demonstrated by the fact that we have already qualified our material by some top LED manufacturers at two, four and six-inch diameters. We are very grateful for the level of support GT has provided during the ramp up of our new plant.”Shangcheng is a vertically integrated sapphire manufacturer producing boules, cores and wafers which it sells to LED manufacturers. The company also produces sapphire which is used in a variety of other industrial applications.

www.gtat.com

The consideration for this sale will be $17 million in cash, subject to closing adjustments.The assets to be sold include fixed assets,

inventory and intellectual property for the VCSEL-based product lines within EMCORE's fiber optics business unit. These product lines include VCSEL and photodiode components, parallel optical transceiver modules, and active optical cables. EMCORE will retain its Telecom and Broadband fiber optics products that include its market leading tunable lasers, tunable XFPs, Cable TV modules and transmitters, FTTx transceivers, Indium Phosphide (InP)-based lasers,

photodiodes, and modulators, video transport and specialty photonics products. The sale of the VCSEL product line allows EMCORE to focus its fiber optics product portfolio in areas of strong product differentiation. In fiscal year 2011, the VCSEL-based product lines contributed approximately 5% of EMCORE's overall revenue.

Furthermore, this sale of the VCSEL-based product lines is expected to simplify EMCORE's operating structure, reduce fixed costs, and improve market focus. EMCORE's core competencies in compound

semiconductor-based products and performance capabilities remain the cornerstones of its Fiber Optics business, addressing high-speed fiber optic transmission for telecom, broadband, and military and defense applications.The transaction is expected to close shortly after securing regulatory approval by the Committee on Foreign Investment in the United States ("CFIUS").

http://investor.emcore.com

Oxford Instruments has transferred its ownership of TDI, a wholly owned subsidiary which develops hydride vapour phase

epitaxy (HVPE) technology for use in the production of High Brightness LEDs, to Ostendo, a privately owned company based in California. Oxford Instruments has received 0.65 million shares of Ostendo common stock plus $0.65 million in cash of which $0.15 million will be paid six months after the

closing date. Oxford Instruments will also receive a royalty when certain HVPE reactor sales are realised.

Under the terms of the transaction, Oxford Instruments is subject to certain restrictions on the transfer of the stock in Ostendo and consequently until a liquidity event, will ascribe no value to the Ostendo stock acquired. The cash component of the proceeds of the disposal will be used in Oxford Instruments’ existing business.

The gross assets which are the subject of the transaction are $0.6 million. TDI had a loss after development expenses in the year to March 2011 of $4.3 million including amortisation of acquired intangible assets of $1.9 million.

www.oxford-instruments.com

GT's ASF(tm) utilizes the production-proven heat exchanger method (HEM) for producing high quality

sapphire boules and cores suitable for the LED industry and other industries requiring high quality sapphire

material.(Courtesy of GT Advanced Technologies)

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Philips and Optogan sign up to cooperate in LED road lighting solutions in Russia

Phoseon Technology delivers high performance UV LED pinning lamp

Sensor Electronic Technology reaches milestone UVC LED effi ciencies of over 10%, bringing consumer disinfection markets within reach

Veeco supports growth of LED industry in Korea

Faster, higher quality printing with Angle Reduction Technology.

The Philips-Optogan partnership will focus on developing a local LED industry, supporting the energy efficiency (EE) initiatives by the Russian

government. Switching to LED street and road lighting can reduce energy consumption by up to 80% and lead to significant savings in service and maintenance costs. The enhanced visibility created by the bright

light can also contribute to an enhanced feeling of security and can help improve road safety.Road lighting in Russia is an attractive market segment as it is anticipated to become one of the leading growth segments for LED. The Russian road lighting market is expected to double over the next four years to EUR 100 million by 2015.This growth is mainly driven by

government energy eff iciency programs for modernization of road lighting. It is expected that due to this also the share of LED will reach 50% as early as 2015.

www.optogan.com

Phoseon Technology has begun shipments of its newest UV LED product line targeting high-speed, high-quality digital inkjet pinning

applications. The new FireEdge™ FE200 specifically addresses the rapidly growing inkjet market by matching the length of today’s most popular inkjet print head dimensions. "Printer manufacturers use the pinning process to ‘freeze’ ink drops before overlaying other colors or doing a full-cure,” stated Mike Willis of IMI Europe. “It's also used to control gloss or matte surface finishing characteristics.” “This product is a fundamentally new design based on customer input from around the world to enable higher quality at higher speeds,” said Bill Cortelyou, President and CEO of Phoseon Technology. “Pinning achieves both goals in

a cost-effective way. The FE200 top air intake and exhaust eliminate inkjet print head interference and the units can be scaled to meet a variety of print width applications.” Mr. Cortelyou continues, “The optional patent-pending Angle Reduction Technology reduces the angular spread of UV light by up to 67% with no loss of power, minimizing the risk of reflected light curing ink in the nozzles. One customer asserted, “The FE200 performed the best of all pinning lamps we’ve tested and the daisy-chain feature for scaling is a great feature. It provided good pinning results with 4 colors, even using non-LED inks.” While bringing the three-tiered benefits of UV LED curing (advanced capabilities, economic savings, and environmentally friendly), Phoseon’s products differentiate themselves

through superior performance, integrated control and real-world reliability for customer’s challenging curing environments. Both products will be on display at the upcoming Drupa Trade Fair in Dusseldorf, Germany at the Phoseon stand 9A46.

www.phoseon.com

Sensor Electronic Technology (SETi) announced record efficiencies of ultraviolet light emitting diodes (UV LEDs) operating in the germicidal

UV-C range of 11% external quantum efficiency (EQE) with a corresponding wall-plug efficiency (WPE) of 8%. This industry beating result was achieved under the DARPA Compact Mid-Ultraviolet Technology (CMUVT) program and in collaboration with Army Research Laboratories (ARL). This latest development from the world’s leading supplier of UV LEDs represents more than a 5X improvement in performance: primarily attr ibuted to improved l ight extraction from encapsulated LED chips with a novel transparent p-region and a reflective contact and further reductions in defect density in the LED structure, grown on sapphire substrates. Traditionally, UV LEDs have been manufactured with GaN p-layers, due to the difficulties of p-doping AlGaN materials. However, GaN absorbs

wavelengths shorter than 365nm, and therefore reduces the extraction efficiency of UV LEDs operating at short wavelengths. SETi have developed a completely new ptype region using doped AlGaN, which is transparent, even in the UVC range. This coupled with a transparent p-contact significantly increases extraction efficiencies. SETi has also further developed its MEMOCVD® growth process to reduce dislocation densities in the quantum well structure of UV LEDs grown on sapphire substrates and has demonstrated threading dislocation densities (TDD) of less than 2x108 (measured by TEM). This improvement in TDD leads to a high internal quantum efficiency (IQE) of 60%.“This milestone is a very exciting development of UV LEDs, and represents a major step forward in reaching efficiencies of incumbent technologies, such as medium pressure mercury vapor lamps, which typically

operate at efficiencies of 15% or less” said Dr. Remis Gaska, President and CEO of SETi. The 350um x 350um encapsulated LEDs were designed for emission at 278nm and measured at Army Research Laboratory where they were reported to emit 9.8mW at 20mA (the highest value ever reported for an LED shorter than 365nm at this forward current) and 30mW at 100mA.Details will be presented at CLEO 2012 meeting, San Jose, CA. SETi has previously reported highly effective LED based water treatment systems that disinfectwith >4 log reduction drinking water flowing at 0.5 liters per minute with less than 35mW of optical power at 275nm. The results from this development put UV LED disinfection systemswithin the reach of consumer markets for applications such as point of use water purification.

www.s-et.com

Veeco Instruments recently participated in an investment signing ceremony at the 2012 Korea Investment Forum in New York City to

commemorate the Company’s substantial investment in a new R&D facility in Seoul, Korea to advance high

brightness light emitting diode (LED) technology.The Investment Forum event, jointly sponsored by the Korea Trade-Investment Promotion Agency (KOTRA) and the Korea Ministry of Knowledge Economy (MKE), brought together government officials, investors,

industry experts and business leaders from South Korea and the United States to celebrate and promote investment in South Korea by U.S.-based companies.

www.veeco.com

From page 1

The new FireEdge™ FE200 (Courtesy of Phoseon technology)

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III-V Epitaxy: Preparingthe next

investment cycle

III-V Epitaxy Equipment

& Applications Market

Discover the NEWreport on

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Mitsubishi Electric to restructure lighting businessThree lighting-related affi liates to merge as of October 1, 2012.

Mitsubishi Electric announced that it has decided to restructure its lighting business for greater efficiency in expanding its business and responding to rapid developments in light-emitting diode technologies and other market

conditions in the Japanese lighting industry. The company’s three lighting-related affiliates will be merged as of October 1, 2012, with further details to be decided.In the late 1980s, Mitsubishi Electric established two joint ventures in Japan with Germany-based Osram AG, aiming to reinforce its lighting business by integrating Osram’s technological strengths with Mitsubishi Electric’s sales advantages. Osram-Melco Ltd. handled production of fluorescent and other lamps and Mitsubishi Electric Osram Ltd. sold these products. In 1989, Mitsubishi Electric also established Mitsubishi Electric Lighting Corporation as a wholly owned subsidiary to manufacture and sell lighting fixtures.Increasing environmental awareness has focused attention on LED lighting as a sustainable product. Especially following the Great East Japan Earthquake in 2011, the adoption of LED lightings has accelerated in Japan as a means of saving energy. Now that advances in LED lighting have created needs to integrate lamps and lighting fixtures, the joint venture relationship between Mitsubishi Electric and Osram will be constructively dissolved in the process of the merger. However, in consideration of the solid 23-year relationship, Mitsubishi Electric and Osram have agreed to maintain ties in the areas of sales and production, and continue to be strategic global partners in the lighting business.Mitsubishi Electric’s new lighting company will handle a wide variety of products, from lamps to lighting fixtures, which will strengthen Mitsubishi Electric’s capabilities to satisfy market demands and offer customer solutions. The company will expand its product lineup by enhanced development capabilities realized through the integration of resources for marketing and development. It will also strengthen product development, mainly for LED lighting products, through the combination of technological synergies and cooperation with Mitsubishi Electric’s R&D centers.

www.mitsubishielectric.com

Panasonic to expand LED lighting business in EuropePanasonic will launch a 40W equivalent clear LED lamp into the European consumer market from July 2012, which will mark the beginning of its full-scale entry into the Euro-pean LED lamp market.

In Europe, where environment is high on the agenda, incandescent light bulbs are being phased out, which is expected to accelerate the shift to energy-efficient LED lighting in the future. Panasonic introduced a 20W equivalent LED Clear

Type in some European countries last year, which is designed to replicate a traditional clear incandescent light bulb in size, shape, position of light source, color of light, brightness and distribution of luminous intensity. Panasonic's original light diffusion and heat radiation technologies enable it to deliver a light quality similar to that of a clear incandescent light bulb. The bulb has won acclaim and awards, including coveted international design awards in Germany.A new LED bulb with brightness equivalent to a 40 W incandescent light bulb will be added to the lineup of the popular LED lamp Clear Type. As these bulbs are very similar to a traditional clear type light bulb in shape, people will feel comfortable replacing existing light sources with the new technology in their homes.By leveraging the latest industry-leading LED lighting technology fostered through product development for the Japanese market, Panasonic plans to significantly expand the lineup of LED lamps for the European market, thereby contributing to energy saving in Europe.

http://news.panasonic.net

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Cisco completes acquisition of Lightwire

Silicon Photonics innovator Kotura signs Japanese distribution agreement with Nissho Electronics

LightPath targeting IR market

OneChip Photonics names Dan Meerovich VP of Global Manufacturing Operations & reaches manufacturing agreement with Fabrinet

Cisco announced the completion of the acquisition of privately held Lightwire, headquartered in Allentown, Pennsyl-vania., Lightwire develops advanced optical interconnect technology for high-speed networking applications.

Silicon photonics innovator Kotura and Nissho Electronics, a high-tech distributor in Japan, announced a distribution agreement whereby Nissho will distribute Kotura's entire suite of integrated silicon photonic solutions including high-speed, single-channel Variable Optical Attenuators (VOAs), high-speed VOA arrays, and WDM multiplexers for 40 and 100 Gb/s data center applications.

Optics maker LightPath Technologies said it will focus on products for the infrared market under its new growth strategy.

OneChip Photonics announced that is has named Dan Meerovich its Vice President of Global Manufacturing Operations.

The acquisition will allow Cisco to deliver cost-effective, high-speed networks with the next generation of optical connectivity, allowing

service provider and data center customers to meet the growing demands of video, data, voice, mobility

and cloud services. The acquisition of Lightwire exempli f ies Cisco's bui ld, buy, and partner innovation strategy and supports its focus on driving market leadership in core networking, one of Cisco's five strategic priorities. The acquisition also

builds on Cisco's existing optical networking expertise and complements Cisco's acquisition of CoreOptics in 2010.

www.cisco.com

Kotura's photonics chips are based on the company's micron scale manufacturing platform currently in mass production and

deployed in live networks around the world since 2006. With three of the five largest telecommunication OEMs already using Kotura products in their 10, 40 and 100 Gb/s networks, the company is approaching a million channels per year currently in production.

"Photonics integration in silicon provides small, low-power solutions for next generation networks," said S. Gene Kawaratani, president and CEO of Nissho Electronics. "Kotura is a leading innovator in the silicon photonics movement. Combining their technology with our specialized global high-tech partnerships wil l bring real value to our customers."

"Nissho Electronics has a large customer base in Japan and an excellent reputation in the high tech industry," said Xavier Clairardin, vice president of product marketing and sales at Kotura. "We look forward to working closely with Nissho to expand our global customer base and our position in the Japanese market."

www.kotura.com

Under the plan announced, LightPath will concentrate on low-cost molded infrared optics for thermal imaging, security and

surveillance, automotive, sensing and defense applications; laser optics for high-volume, growing industrial applications such as laser tools for c o n s t r u c t i o n , m e d i c a l i n s t r u m e n t s a n d

te lecommunicat ions sys tems; and opt ica l assembl ies fo r laser l igh t co l lec t ion and management through fiber optics for industrial and laser instrumentation. "Applications of infrared and thermal imaging technology have grown dramatically over the last ten years into various markets including industrial

inspection, automotive safety, chemical and biological sensing, and security and surveillance," LightPath CEO Jim Gaynor said.

To read the ful l art ic le, please go on http:/ /photonics.com/

http://photonics.com

The company also announced that it has reached an agreement with Fabrinet to manufacture OneChip’s Photonic Integrated

Circuit (PIC)-based Passive Optical Network (PON) transceivers. Meerovich is responsible for building OneChip’s volume manufacturing capabilities and ensuring cost-effective and efficient operations across its supply chain. Before joining OneChip, Meerovich served as VP of Operations at Xtellus, which was acquired by Oclaro in 2009. One year after the acquisit ion, he was instrumental in increasing revenue by 50 percent, while increasing labor efficiency by 70 percent. He also expanded the company’s R&D and manufacturing capabilities in Korea and Thailand. Previously, Meerovich was VP of Manufacturing Operations at Multiplex, where

he established and managed a wholly owned manufacturing subsidiary in China. He also held senior-level operations positions at Asip/Apogee Photonics, JDS Uniphase and Tyco/Laser Diode.According to Meerovich, OneChip selected Fabrinet as its contract manufacturer “because of Fabrinet’s strong global footprint and its ability to get our manufacturing l ine up and running quickly.” “Fabrinet has extensive experience manufacturing optical components and systems and will help OneChip meet the high demand for our integrated optical transceivers,” Meerovich said. Fabrinet will provide a range of manufacturing services for OneChip, including optical component attachment for OneChip’s Bi-directional Optical Sub Assemblies (BOSAs) and final integration and testing of its fully

packaged optical transceivers.Fabrinet, a vertically integrated manufacturer, will provide manufacturing services for OneChip at its Pinehurst campus in Thailand. On a global basis, Fabrinet has more than 1 million square feet of manufacturing space at its facilities in Thailand, the People’s Republic of China and the United States. Greg Reny, Sen io r D i rec to r o f Bus iness Development at Fabrinet, said, “We look forward to helping OneChip bring its breakthrough solutions to market globally. We are known for the quality and precision of our optical manufacturing, assembly and test processes, and we are excited to put our expertise to work for OneChip.”

www.onechipphotonics.com

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P H O T O V O L T A I C S

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Q-Cells SE fi les for insolvency proceedings

First Solar under strong market pressure

EMCORE awarded III-V solar panel manufacturing contract for space applications

Arkema and CEA set up two new joint laboratories dedicated to micro-electronics and organic electronics

The former in crystalline silicon solar cell manufacturer has abandoned an attempt to refinance its debts.

First Solar announced it is restructuring its operations in response to deteriorating market conditions in Europe and to reduce costs and align its organization with sustainable market opportunities.

Emcore produces III-V cells and modules for space applications and terrestrial concentrator systems.

The outputs of the R&D activities in the domain of organic electronics can be valorized also in organic PV

Q-Cells SE files for insolvency. The company employs currently more than 2,000 workers.Against the background of the final ruling of

the Frankfurt Higher Regional Court in the Pfleiderer case on March 27, 2012, the company had come to the conclusion that no going concern prognosis is

given anymore. Following an intensive review of alternative concepts for the implementation of the financial restructuring, the Executive Board has reached the conclusion that a going concern of the company cannot be restored on a sufficiently secure legal basis. Therefore the filing for insolvency

proceedings is legally necessary. The Executive Board and the preliminary insolvency administrator will work together to secure the continuity of the company within the insolvency proceedings.

www.q-cells.com

Frankfurt (Oder) manufacturing facility to be closed in the fourth quarter of 2012• Four production lines in Kulim, Malaysia, to

be indefinitely idled• Workforce to be reduced by 2,000As part of this program, First Solar will close its manufacturing operations in Frankfurt, Germany, in the fourth quarter of 2012. Additionally, the Company will indefinitely idle four production lines at its manufacturing center in Kulim, Malaysia, on May 1, 2012. These actions, combined with other personnel reductions in Europe and the U.S., will reduce First Solar's global workforce by approximately 2,000 positions, about 30 percent of the total.The restructuring initiatives are expected to reduce

First Solar's costs by $30-60 million this year and $100-120 million annually going forward. In addition, the Company's average manufacturing cost is expected to improve to $0.70-$0.72 per watt in 2012 as a result of the changes, below prior expectations of $0.74 per watt. In 2013 the Company estimates average module manufacturing costs will range from $0.60 to $0.64 per watt.To achieve these significant cost savings, the Company will record restructuring and other related charges of $245-370 million, of which $80-120 million are cash expenditures, consisting of: • $150-250 million in asset impairment, primarily related to the Frankfurt plants • $50-70 million in severance

• $30 million for repayment of a government grant related to the Frankfurt operations • $15-$20 million for other charges which represents valuation allowances for deferred tax assets in Europe and costs associated with the repayment of the German debtFirst Solar expects to incur these charges primarily during the first quarter of 2012 and the rest over the course of this year. In addition, First Solar has voluntarily paid down approximately $145 million of debt ahead of schedule in 2012, which represents repayment in full for outstanding amounts under the Company's German loan agreement.

www.firstsolar.com

EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and solar power

markets, announced that it has been awarded a contract by Ball Aerospace & Technologies Corporation (BATC) to design, manufacture, test and deliver solar panels for a new spacecraft. The period of performance for this program is about 2 years, with a total contract value of nearly $6 million. The solar panels delivered

to BATC will be populated with EMCORE's ZTJ multi-junction solar cells. The ZTJ is currently the highest performance space-grade solar cell available in volume production to the global market. Production of the solar cells and panels will take place at EMCORE's state-of-the-art manufacturing facilities located in Albuquerque, New Mexico, USA. EMCORE is a manufacturer of highly-efficient radiation-hard solar cel ls for space power applications. With a

beginning-of-life (BOL) conversion efficiency nearing 30% and the option for a patented, onboard monolithic bypass diode, EMCORE's industry leading multi-junction solar cells provide the highest available power to interplanetary spacecraft and earth orbiting satellites.

www.emcore.com

Arkema and CEA are to extend their existing collaboration in photovoltaics to the field of micro-electronics and organic electronics by

setting up two joint research laboratories. These public-private mixed laboratories will enable the development of new ultra high performance materials and their integration within manufacturing processes in growth areas of the electronics sector in France. Both laboratories will pool Arkema’s expertise in the design and production of high performance polymers with the competences of CEA researchers in the design and processes involved in the development of electronic components. The CEA-Leti (Laboratoire d'Electronique et de Technologie de l'Information) and CEA-Liten

(Laboratoire d'Innovation pour les Technologies des Energies Nouvelles et les nanomatériaux) laboratories constitute world-class applied research centers, in microelectronics and information technologies for the former, and in new energy technologies for the latter. As part of its collaboration with Leti, Arkema will draw on its expertise in polymer nanostructuring to produce new materials designed to optimize the performances of silicon components and significantly reduce their manufacturing costs in next generation integrated circuits. As part of its collaboration with Liten, Arkema, which markets a group of leading technical polymers ( f luor inated, p iezoelectr ic , nanostructured thermoplastic polymers), will be able to meet the

technological challenges of the large-area printed electronics sector (flexible screens, intelligent packaging and textiles, photovoltaic panels), such as lifetime of the systems, cost of manufacture, and integration of several functions onto a single support. In fact, the use of organic materials, rather than silicon, opens up a new field of printable, transparent and flexible components that can be integrated into large-area printed electronic products. Both these research structures will help expand the technological offering of the French electronics sector and its competitiveness on the world scene.

www.arkema.com

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2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE IITC

DOUBLETREE HOTEL SAN JOSE, CA

JUNE 4 – 6, 2012

For complete IITC 2012 conference and registration

information visit: www.his.com/~iitc/

Innovations In InterconnectionsSHORT COURSE OFFERED ON SUNDAY, JUNE 3

The IITC one-day Short Course precedes the technical program, providing an opportunity for instruction and interaction on advanced interconnect technology, emerging materials and design/reliability issues:

Scaling Options for Barriers Eric Eisenbraun, University of Albany CNSE

3D Interconnect Clair Webb, Intel

Reliability Lucile Arnaud, ST/LETI

Chip Package Interaction Thomas Shaw, IBM

Optical Interconnects David Miller, Stanford

BEOL Memory Jorge Kittl, IMEC

Advanced Interconnects Mizuhisa Nihei, AIST/Fujitsu

Georgia Tech proposes industry consortium on advanced packaging technologies and heterogeneous 3D integrationwins fi rst order

GT-PRC has demonstrated groundbreaking technologies that include ultra-thin organic s u b s t r a t e s , f i n e - p i t c h C u - t o - C u

interconnections, low temperature bonding with high assembly throughput and prototype functional module demonstration of digital Si and RF GaAs die embedding.

GT-PRC proposes the next consortium, building upon the above advances, 3D ThinPack with a focus on:- 3D package stacking beyond conventional PoP leading to ultra-thin stacked modules- Ultra-fi ne pitch and low profi le package-to-package interconnections- Novel thermal solutions for embedded thin die eliminating TIM- 15μm pitch die-to-package Cu-Cu I/Os with high current carrying capability- Ultra-slim substrates with low warpage- Embedded thin IPDsThe primary objective of the proposed 3D ThinPack consor t ium is to achieve ultra-miniatur ized

heterogeneous sub-systems by 3D integration of multiple ultra-slim packages with embedded thin active or passive components. The two-year goal is to demonstrate a four-package stack within ~1mm thickness by advancing the above fi ve technologies shown in Fig 1.

The proposed 3D ThinPack research addresses the need for highly-miniatur ized and highly-

functional heterogeneous modules with particular focus on:1. High-yield, low-cost, chip-last embedding with FR4-compatible manufacturing-processes2. Interconnections and assembly processes compatible with existing infrastructure

www.prc.gatech.edu

From page 1

Proposed technologies for ultra-miniaturized 3D stacked modules (Courtesy of Georgia Tech)

3D stackingbeyond PoP

Ultra-thin package substrateswith low warpage

Ultra-fi ne pitch and low profi lepackage to package I/Os

Embedded thinIPDs

Novel thermal solution forembedded die

Ultra-fi ne pitch, lowprofi le interconnections

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ChipMOS to expand its 12’’ gold bumping capacity for LCD driver IC assembly and test

ASE plans to invest nearly 1 Billion $ to build 2 new fabs in Taiwan for assembly and test services

Amkor licenses through mold via technology to Shinko for PoP and 3D packaging

ChipMOS Technologies, is expanding its 12-inch-wafer gold bumping capacity for packaging and testing LCD driver ICs, according to the company.

Advanced Semiconductor Engineering plans to spend NT$28.2 billion (US$955.87 million) to build two factories in Greater Kaohsiung and one research and development building to meet growing customer demand for smartphones, tablets and game consoles, the Ministry of Economic Affairs said.

Amkor Technology, announced that it has granted SHINKO ELECTRIC INDUSTRIES, a non-exclusive license to its pro-prietary Through Mold Via (“TMV®”) technology.

ChipMOS has set aside a 2012 capex budget of NT$2 billion (US$67.8 million), with 70% of which is to be used in gold bumping process for LCD driver IC packaging and testing and 30% in copper-wire bonding process,

wafer-level packaging and testing equipment, the company indicated. ChipMOS aims to reach gold bumping capacity of 16,000 12-inch wafers and copper-nickel-gold bumping capacity of 8,000 12-inch wafers a month in 2012, the company said.To read the complete article, please visit www.digitimes.com

www.digitimes.com

ASE, the chip packager, said it plans to build six plants within the next fi ve years, including the ones already under construction, to expand its global market share to 25 percent. The expansion also allows Kaohsiung-based

ASE to seize more business opportunities from increasing outsourcing from chip companies, the ministry said. The capacity expansion plan would increase ASE’s hiring by 3,000 people each year, it said. ASE held a groundbreaking ceremony for the facilities on Friday. Vice Minister of Economic Affairs Hwang Jung-chiou said its expansion in capacity and research and development programs would strengthen the company’s leading position in the industry by enhancing its high-end chip packaging technologies.To read the complete article, please go on http://www.taipeitimes.com

www.taipeitimes.com

The agreement provides for the transfer of Amkor’s TMV® technology to SHINKO and a license under Amkor’s patents to enable SHINKO to manufacture packages based on this technology. The license also permits

SHINKO to use Amkor’s registered TMV® trademark in its sales and marketing activities. Since their introduction, package-on-package (“PoP”) components have been rapidly adopted for 3D integration of logic and memory. Amkor’s TMV® technology enables leading-edge PoP designs for smartphone and tablet applications, delivering increased integration, miniaturization and performance without requiring the development of new surface mount stacking infrastructure or adding cost. Amkor’s TMV® technology improves warpage control, reduces package thickness, facilitates fi ner pitch memory interfaces, enables both wirebond and flip chip interconnects and supports stacked die or passive integration requirements.

www.amkor.com

Teardown of the world’s 1st embedded die

package in high volume production

Discover the NEWreport on

i-Micronews.com/reports

Texas Instruments MicroSiP™ Module using AT&S ECP®

Process

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N A N O T E C H N O L O G Y

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CRANN and Thomas Swan partner on graphene production

Air Products completes acquisition in DuPont Air Products NanoMaterials LLC JV

Graphene for faster & cheaper cooling of electronic devices

Collaborative research partnership worth €750,000 focusing on the industrial scale-up of graphene production.

Air Products announced it had completed the acquisition of DuPont’s interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), the two companies’ 50-50 joint venture serving the global semiconductor and wafer polishing industries. Terms of the agreement were not disclosed.

A North Carolina State University researcher has developed a more effi cient, less expensive way of cooling electronic devices – particularly devices that generate a lot of heat, such as lasers and power devices.

CRANN, the Science Foundation Ireland (SFI) funded nanoscience institute based at Trinity College Dublin, has announced a new

collaborative research partnership worth €750,000 with Thomas Swan & Co, an independent manufacturer of performance and speciality chemicals, based in the north east of England. The collaboration will focus on the industrial scale-up of graphene production. Graphene is the wonder material of modern science and was the focus of the Nobel Prize in 2010. It has unique properties and is both the strongest and most conductive material known to man. There are many potential applications for graphene including next generation electronic devices, mechanically strengthened plastics and new thermoelectric materials. Graphene is the focus of one of six of the EU’s FET Flagship Pilot research projects, two of which will be

chosen to receive funding of €1 billion for 10 years from the EU Commission.CRANN’s research in the fi eld of graphene production is led by Professor Jonathan Coleman, who was named as SFI Researcher of the Year in 2011 and is also recognised as one of the top 100 material scientists of the last decade – the only Irish representative on the list. There is currently no method to produce high quality pure graphene on an industrial scale and the collaboration between CRANN and Thomas Swan aims to address this problem. CRANN has been identifi ed by Thomas Swan as the leading academic research site globally for solution processing of graphene and the partner of choice around this challenging research area.Thomas Swan, in addition to funding the research programme, will place an engineer to work with Professor Coleman’s team for two years. This

partnership between industry and academia is a model for how world leading technology developed in Irish Universities can be exploited to provide both economic and societal benefi t.

www.crann.tcd.ie

DA NanoMaterials manufactures chemical mechanical planarization (CMP) slurries for the semiconductor and wafer polishing industries.

Headquartered in Tempe, Ariz., with regional headquarters in Hsinchu County, Taiwan, the company operates state-of-the-art applications and formulation laboratories in Tempe and Taiwan. DA NanoMaterials has established a portfolio of products for copper CMP, tungsten CMP, shallow trench isolation (STI) CMP and wafer polishing applications. The current market for CMP and wafer polishing slurries is valued at more than $1 billion and is growing two times as fast as the underlying semiconductor MSI index,

which measures millions of square inches of silicon shipped. The DA NanoMaterials acquisition fi ts neatly with Air Products’ other differentiated materials which serve advanced technology nodes. In addition to the CMP and wafer polishing slurries it will now market, Air Products also offers a line of post-CMP cleaning solutions designed to provide leading edge cleaning performance. Last year Air Products acquired Poly-Flow Engineering (PFE), an equipment manufacturer in Albuquerque, N.M., that produces a line of CMP delivery and blending equipment for semiconductor manufacturers. Air Products provides atmospheric, process and

specialty gases; performance materials; equipment; and technology. For over 70 years, the company has enabled customers to become more productive, energy effi cient and sustainable. More than 18,000 employees in over 40 countries supply innovative solutions to the energy, environment and emerging markets. These include semiconductor materials, refi nery hydrogen, coal gasifi cation, natural gas liquefaction, and advanced coatings and adhesives. In fi scal 2011, Air Products had sales of $10.1 billion.

www.airproducts.com

The technique uses a “heat spreader” made of a copper-graphene composite, which is attached to the electronic device using an

indium-graphene interface fi lm “Both the copper-graphene and indium-graphene have higher thermal conductivity, allowing the device to cool effi ciently,” says Dr. Jag Kasichainula, an associate professor of materials science and engineering at NC State and author of a paper on the research. Thermal conductivity is the rate at which a material conducts heat.In fact, Kasichainula found that the copper-graphene f i lm’s thermal conductivity al lows it to cool

approximately 25 percent faster than pure copper, which is what most devices currently use.Dissipating heat from electronic devices is important, because the devices become unreliable when they become too hot.The paper also lays out the manufacturing process for creating the copper-graphene composite, using an electrochemical deposition process. “The copper-graphene composite is also low-cost and easy to produce,” Kasichainula says. “Copper is expensive, so replacing some of the copper with graphene actually lowers the overall cost.”The paper, “Thermal Conductivity of Copper-

Graphene Composite Fi lms Synthesized by Electrochemical Deposition with Exfoliated Graphene Platelets,” is published in Metallurgical and Materials Transactions B. The research was funded by the National Science Foundation.

http://news.ncsu.edu

Prof Jonathan Coleman and Harry Swan, MD Thomas Swan.

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Vishay Intertechnology announced a new high-performance metallized DC polypropylene film capacitor for DC-link applications featuring a

slim design, the industry’s broadest CV range from 2 μF up to 100 μF, and voltage ratings of 500 VDC, 700 VDC, and 1,000 VDC. Providing designers with a number of options for their specific application, the slim MKP1848S features low profiles of 12 mm, 15 mm, 18 mm, and 24 mm.With a long life of > 100,000 hours at nominal DC voltage and + 70 °C, the MKP1848S is optimized for inverters, power supplies, solar micro-inverters, on-board chargers (EV/HEV), pumps, and LED drives.The DC-l ink capacitor features capacitance tolerance down to ± 5 %, low self- inductance of < 1 nH per mm of lead spacing, high peak current capabilities to 900 A, and high RMS current to 22 A. Offered in a flame-retardant plastic case with a resin

seal, the device features a high operat ing temperature to + 105 °C, is lead (Pb)-free and RoHS-compliant, and introduces halogen-free materials to

Vishay’s portfolio of film capacitors. Samples are available now.

www.vishay.com

Power Integrations agrees to acquire CT-Concept CT Concept is a developer of integrated, energy-effi cient drivers for high-voltage IGBT modules.

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, announced that it has signed an

agreement to acquire privately held CT-Concept Technologie AG (known as CONCEPT) for approximately 105 million Swiss francs in cash, or about US$115 million, net of cash assumed.Founded in 1986 and based in Biel, Switzerland, CONCEPT is a developer of highly integrated, energy-efficient drivers for high-voltage IGBT modules. The company's products are used in a range of high-voltage power-conversion applications

including industrial motor drives, renewable energy generation, electric trains and trams, high-voltage DC transmission, electric cars and medical equipment. CONCEPT employs approximately 65 people and holds 14 patents with additional patents pending.CONCEPT's management team and employees will remain at the company's Biel headquarters, which will become Power Integrations' center of excellence for high-voltage driver design. Wolfgang Ademmer will continue as president of CONCEPT and will also become a vice president of Power Integrations, reporting directly to Mr. Balakrishnan.

Based on full-year 2011 results, Power Integrations estimates that the acquisition will add approximately 10 percent to its annual revenues, and expects the transaction to be immediately accretive to its non-GAAP gross margin, operating margin and earnings per share. The company expects the transaction to close during the second quarter of 2012.In conjunction with its approval of this transaction, Power Integrations' board of directors has cancelled the company's previously announced $30 million share-repurchase authorization.

www.powerint.com

Infi neon release 650V CoolMOS™ CFDA for automotive applications

Vishay Intertechnology introduces slim polypropylene fi lm capacitor for DC-Link applications

This is the industry’s first Superjunction MOSFET solution with integrated fast body diode to meet the highest automotive qualification standard AEC-Q101.

Vishay Intertechnology announced a new high-performance metallized DC polypropylene film capacitor for DC-link applications featuring a slim design.

Infineon’s 650V CoolMOS in D²PAK (Courtesy of Infineon)

Infineon Technologies expands its Automotive power semiconductor lineup with the new 650V CoolMOS™ CFDA. This is the industry’s first

Superjunction MOSFET solution with Integrated Fast Body Diode to meet the highest Automotive qualif ication standard AEC-Q101. The 650V CoolMOS™ CFDA is particularly designed for resonant topologies such as battery charging, DC/DC converters and HID (High Intensity Discharge) Lighting, also in hybrid and electric vehicles. Infineon’s new solution combines all benefits of fast switching Superjunction MOSFETs: a better light load efficiency, reduced gate charge, lower switching losses, easy implementation as well as an outstanding reliability. Infineon offers a superior solution to the

demand for higher energy efficiency of automotive applications: the new 650V CoolMOS™ CFDA provides lower area specific on-resistance while offering easy control of switching behavior as well as the highest body diode ruggedness in the market. Lower value of Q rr and Q oss at repetitive commutation on body diode reduces switching losses and turn on/off delay times. Good controllability of rapid current and voltage transients and softer commutation behavior that results in reduced EMI (Electromagnetic Interference) appearance, gives the new series a clear advantage in comparison with competitor parts. Limited voltage overshoot during hard commutation of the body diode enables easier implementation of layout and design.

CoolMOS™ CFDA provides 650V breakdown voltage, which means an increased safety margin compared to 600V.

www.infineon.com

MKP1848S film capacitor (Courtesy of Vishay Intertechnology)

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P O W E R E L E C T R O N I C S

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Yole Développement is glad to announce its Power E lec t ron ics Marke t b r ie f i ng "Conversion in Assembly". This event will take

place on May 10 at PCIM Europe 2012 (Nuremberg, May 8-10), at 1:00 PM, Booth #670 - FREE ADMISSION. Join the Market Briefing to listen to presentations and take part in panel discussions between invited speakers:

• Ty R. McNutt, Director of Business Development, Arkansas Power Electronics International, Inc. (APEI)

• Alfred Hesener, Marketing Manager EMEA, Fairchild Semiconductor

• Jean-François De Palma, Power Electronics Specification Engineering Manager & VP of R&D, Mersen

• Alexandre Avron, Technology & Market Analyst, Power Electronics, Yole Développement

"Conversion in Assembly" market briefing will provide a market analysis as well as envisioned supply-chain and technical evolutions: Yole Développement’s

power electronics team has performed a cross-analysis, between the main power electronics applications, and will present some of the results, followed by a presentation of players at different levels of the supply-chain. This market briefing will wrap up with a panel discussion bringing various points of view and comparing the visions.

See you soon at the Power Electronics Market Briefing, powered by Yole Développement, at PCIM Europe 2012.

For more information, please contact S. Leroy (leroy@yole.fr).

Power Electronics Market Briefi ng "Conversion in Assembly"PCIM Europe 2012 – Nurember, May 8-10 at 1:00 PM, booth #670

ISiCPEAW 2012 is a two day event on the latest results and innovations onthe use of Silicon Carbide technology in power electronics applications. FromMay 29 to 30, international experts will meet in Stockholm to share theirexpertise, recent developments and vision of SiC electronics applications. In2011, the workshop attracted more than 200 attendees from all around theworld and we expect no less this year.This event is organized by the Swedish SiC Power Center in cooperation withYole Développement and Enterprise Europe Network. It includes workshop,exhibition area and networking opportunities with business-to-business (B2B)matchmaking.

May 29-30, Kista Science TowerStockholm, Sweden

For more information please visit: www.i-micronews.com

Int. SiC Power ElectronicsApplications Workshop

The exhibitionMore than just a conference,

the workshop ISiCPEAWincludes debates

and numerous networkingtimes all along the days.The Swedish SiC Power

Center, EnterpriseEurope Network

and Yole Développement set up an exhibition areadedicated to the experts

of the SiC industry.Do not miss the opportunity

to meet the key players,share point of views

and debate abouttechnologies issues,

business development,market organization

and more.

Oganized by:

FREE ADMISSION

Exhibition PCIM 2011 (Courtesy of Mesago Messe Frankfurt)

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A P R I L 2 0 1 2 i s s u e n ° 1 2 8 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE

Y O L E L I F E

THE D ISRUPT IVE SEMICONDUCTOR TECHNOLOGIES MAGAZ INE

Editorial StaffBoard Members: Jean-Christophe Eloy & Jeff Perkins - Media Activity, Editor in chief: Dr Eric Mounier - Editors: Alexandre Avron, Frédéric Breussin, Lionel Cadix, Barbara Jeol, Jerôme Mouly, Dr. Éric Mounier, Pars Mukish, Laurent Robin, Milan Rosina, Benjamin Roussel, Dr. Philippe Roussel - Media & Communication Manager: Sandrine Leroy - Media & Communication Coordinators: Clotilde Fabre, Camille Favre - Production: K.Zen

CONTACTS

Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to fi nance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, MedTech, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, Optoelectronics and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

For more information about :• Services : Jean-Christophe Eloy (eloy@yole.fr)• Reports: David Jourdan (jourdan@yole.fr)• Media : Sandrine Leroy (leroy@yole.fr)

MEDIA• Critical news, bi-weekly: Micronews, the magazine• In-depth analysis & Quarterly Technology Magazines: MEMS Trends– 3D Packaging – iLED – Power Dev'• Online disruptive technologies website: www.i-micronews.com • Exclusive Webcasts

CUSTOM STUDIES• Market data, market research and marketing analysis• Technology analysis • Reverse engineering and reverse costing• Strategy consulting• Corporate Finance Advisory (M&A and fund raising)

TECHNOLOGY & MARKET REPORTS• Collection of market & technology reports• Players & market databases• Manufacturing cost simulation tools• Component reverse engineering & costing analysis

More information on www.yole.fr

About Yole Développement

O U R R E P O R T S

Discover our latest reports

III-V Epitaxy Equipment & Applications MarketAnticipating the next investment cycle after the dip.This report covers established and emerging epitaxy technology for III-V semiconductors used in the following applications:• High Brightness LED (GaN and InGaAlP based)• RF GaAs devices• Power GaN devices• High concentrated Photovoltaic (HCPV)The report provides a comprehensive company profi le of the main players in MOCVD and MBE business.Released in April 2012 – For more information, feel free to contact David Jourdan (jourdan@yole.fr)

Also available…

MEMS PackagingThe MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry.This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates. It provides market data on key MEMS packaging industry market metrics & dynamics, technical insight about key MEMS packaging technology trends & challenges and give a deep understanding of the MEMS packaging value chain, infrastructure & players.Released in April 2012

UV LED MarketA comprehensive survey on UV LED and related AlN substrates and epiwafers.The report presents UV LED industry main players & associated strategies, the industrial value & supply chains in 2011 for UVA/B and UVC, the revenues and market shares. It also details all UVA applications with a deep analysis of UV curing and same for UVC applications & purifi cation. In our analysis we feature UV LED roadmap with performance & price roadmap, main specifi cations to enable UVC applications… Substrate industry is also analyzed with focus on competition AlN template vs. bulk AlN, key players…Released in March 2012

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III-V Epitaxy Equipment & Applications Market

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