ISS: 108x80m 420T 86KW 400km AMS: 3x3x3m 6T 2.3+KW 3+ years

Mike Capell / Jan ‘04 AMS-02 Electronics 1

AMS-02 AvionicsFSR-II (21 May 2007)

Mike CapellAvionics Lead

Senior Research Scientist

ISS: 108x80m 420T 86KW 400km AMS: 3x3x3m 6T 2.3+KW 3+ years

Mike Capell / May ‘07 AMS-02 Electronics 2

Subdetector Requirements: SummarySubdetector Req’ments Channels Raw Kbits

U: TRD Gas gain 5,248 84S: ToF+ACC 100 ps 48*4*8 49T: Tracker few fC 196,608 3,146 R: RICH Single g 680*16*2 348E: ECAL 1:60,000 324*(4*2+1) 47 Raw Kbits/event 3,674* Event Rate ≤ 2 Khz= Total Raw Data Rate ~7 Gbit/sec

7 Gbit/sec >> 2 Mbit/sec ⇒ Restrict Rate & Size

Specify, design, develop, produce: High Speed, High

Capacity, Low Power, Low Weight,

Reliable Signal & Data Processing

ON ORBIT !


• Subdetector specific front ends (5 types, 1600 units)

• Common DAQ nodes (1 type, 300 units)• General purpose computers with

specialized interfaces (4x redundant)• Trigger system to meter data flow.

Data Acquisition & Trigger Scheme

DAQIntermed.

DAQDAQDigitizationPreperationSignal

TriggerFast Level

-1 -3Level

Detector Front EndOutput

Buffer &Top Level


NASA AMS Electrical Interfaces on ISSPower:

109-124VDC2KW max

LRDL1553B Bus1 Kbit/s in 10 Kbit/s out10 B/sec CHD

HRDLTaxi F/O

<2Mbit/s>orbitxRDL: Duty cycle ~50-70%

Ensure AMS side of interfaces conform to NASA requirements

& C

omm

and

Mon

itorin

g

Eve

ntD

ata

Earth

TDRS

LRD

LH

RD

L

UMAEVA

International Space Station

M&C

Pow

er

Subsystems

Power & Thermal

DAQ & TriggerMonitor & Control

ElectricalInterfaces

AMS

POCC


Electronics Designed for Low Earth OrbitChallenges:Static loads: 40+10+10gVibration: 6.8g rmsDepressurization: 1 to 0 atmosphere in 2 min.0 g & Vacuum: No convection, outgassing (evaporation)Operational Range: -20 to +50 C operationalIonizing Radiation: ~ 1 Krad/yearHeavy Ions (SEE): latch ups, bit flipsAtomic O, Solar UV: Etching & AgingMM/OD(Space Junk): ImpactElectromag. Compat: with ISS, within AMSAMS Magnetic Field: several hundred GaussNO ACCESS: 3+ years


Electronics Designed for Low Earth OrbitChallenges: Solutions:Static loads: Mechanical DesignVibration: Mechanical DesignDepressurization: Mechanical Design0 g & Vacuum: Materials, Thermal ManagementOperational Range: Components, Thermal ManagementIonizing Radiation: Component SelectionHeavy Ions (SEE): Comp Sel, Beam Tests, ProtectionAtomic O, Solar UV: MaterialsMM/OD(Space Junk): Mechanical DesignElectromag. Compat: Shielding, GroundingAMS Magnetic Field: Selection & TestNO ACCESS: Redundancy, Reliability,

TEST, TEST, TESTProcess validated with AMS-01 electronics


AMS-01 Electronics: Qualification

Mike Capell / May‘07 AMS-02 Electronics 8

AMS-01 Electronics: Typical board


Process to transform electronics from High Energy Physics for use in Low Earth Orbit

PrototypePrototypePrototype

EM

QM1

QM2

FM, FS (==QM2)

functional

+ Vibration, Thermal

+ Thermal-Vacuum,

EMC, Prod.

All (min level)

Models TestingComponents Performance, Beam Test


GSI Heavy Ion Beam Test Setup: Main Computer components

CPC 700 Bridge

PPC 750 CPU

Ion BeamDirection

GSI Heavy Ion Accelerator


Reliability Thermal requirements (-40 to +85 C) testSpace use heritage, fabrication process technologySingle lot procurement & ScreeningTotal dose (600 Rad/year) testSingle Event Effects – Latch-ups & Upsets: test

Design modified for some components for: retestLatch-up & Bit flip protection.

AMS-02 Electronics Component Selection

Date Location Ions LETMeV/mg/cm2

Test/Pass

Nov’00 GSI, Darmstadt Xe, Au, U 6-59 21 / 11 Nov’01 GSI, Darmstadt Kr, Au 3-40 19 / 18Dec’01 GSI, Darmstadt U 19-30 7 / 4May’02 GSI, Darmstadt U 16 - 59 33 / 29Feb’03 LNS, Catania Kr 27 - 39 6 / 5May’05 GSI, Darmstadt Au 12 - 33 37 / 32Sep’05 Indiana p 1 - 14 11 / 5


AMS Custom/Common Readout Unit

Cust/Comm power supplies w/high efficiency.Cust/Comm monitor & control interfaces.Cust/Comm processing unit, software, links.

DSP (ADSP-2187L), Gate Array (Actel A54SX-2A), SRAM (Samsung K6R-016V1C), Flash (AMD Am29LV004), LVDS Tx/Rx (TI SN65LVD-39-), etc.

M.Capell Jan 04GlobalPower 120V

Detector ADCMUX

DataReduction

(H)V Detect. Vdd(Digital)

Subd. Power

28 V

Digitization& HoldSample

DC-DC Converters(28 -> 5,3.3,+-2)

(High Efficiency) 28V Filter (I/O)

CustomASIC

LinReg

Vdd (Analog)

DSP

Memories

Gate

Slave M&C

GA

DSP

Mem

Trigger

LRS

AMSWireMAINDATA

HRDL

LRDL

2x CAN

Array

CDDC Command Distrib, Data Collect.

AmsW

Global DAQSubdetector DAQ

CDDC

AmsW

Gate BusySequence

Trigger Input

Comp

PartDigital

CDP: Common


Data Acquisition Tree(parallel, independent tree for trigger)

TrackerTOF&ACC

TRDTracker

Tracker

TOF&ACCTRD

Tracker

TrackerTOF&ACCTracker

TrackerTOF&ACCTracker

RICH

RICH

ECAL

ECAL

CDDCSDR

CDDCCDDC

CDDC

SDRCDDC

CDDC

CDDCSDR

CDDC

CDDCSDR

CDDC

CDDC

CDDC

CDDC

CDDC

JLV1

12

6 x 2

6 x 212

244 x 2

24

24

4 x 224

24

24

24

24

4 x 2

4 x 2

6 x 2

6 x 2

CDDC

2

2

2

2

2

24

JMDC

Lowest-LevelCDDC(JINF)

Top-LevelCDDC(JINJ)

MainDAQ

Computers

CDDC =

CommandDistributorand

DataConcentrator

JT Crate J Crate

JPD = Power Supplyfor J and JT

JINJJINJJINJJINJ

JLV1JLV1

JTBX

JINJJINJJINJJMDC

JHIF

JLIF

x4 redundant

10 MB/s serial links


JT-Crate Connects about ~ 200 signal cables.


Data Reduction (UDR2, TDR2) Boards

70 types of boards454 boards total

Where to put them ?


Electronics Mechanics– Crates & Boxes on Radiators 1. Keep heat away from Magnet2. Temp range of

electronics >> detectors3. Shortest path to radiators

Mike Capell / May‘07 AMS-02 Electronics 17

Ram Radiator (~4m2) Electronics ~ 750W“xPD”

“x-Crate”

28VDC to LV

readout &monitoring

Each type of box optimized for weight vs. thermal vs. structural performance.

Design and test supported by NSPO, Taiwan x=E,J,S,T,TT,U,UG,…


Electronics Production & Quality Assurance

• Designed by Academia Sinica, CSIST & MITAdapted for particular subdetectors by Aachen,

Geneva, Perugia, Bologna, Madrid, Annecy, Pisa, …

• Most electronics produced at CSIST:High Reliability (Mil Spec) infrastructure,Qualification: Vibration, Thermal, EMC on siteTeam of 25 engineers and 40 techniciansQuality assured by NASA & AMS team reviews every

3 months.

• Testing & Qualification by board designers


Recent Board Tests at CSIST

Jesus & Antonio test DC-DC(July)

Lucio testing TBS & TPSFE (July)

Sylvie & Nadia testing EIB (July)

Daniel testing TDR2 (June)

Sandor testing DCDC with Wang & Liu(June)


Thermal Stress Screening


J-Crate Scheme & test setup4* Main Computer + Interfaces

J-Crate

CompactPCI Bus Backplane

AMS Specific Backplane (ASB) Signals and Power

JSBCLocal Bus

SDRAM Flash PROM

PPC 750 CPC 700

PCI Agent

DPRAM

Registers

JIM-CAN

PCI Agent

DPRAM

Registers

JIM-AMSW&15

53

PCI Agent

DPRAM

Registers

JIM-HRDL/422

JBU

FPGA

JHIF

x4JLIF

JPD USC M

AMSWx4

CANx2

Front Panel ConnectorsHRDL

x2RS422

x21553

x2Power

x1

CANx2

CDDCCDDCCDDCCDDCx4

EVA PanelROEU Panel


J-Crate in Thermal Chamber

Thermal Qualification Operating: -15, +60CNon-Oper: -40, +90


J-Crate inside EMI Chamber


J-Crate in Thermal Vacuum Tests

Thermal Balance Phase

Pump Down

Chamber Environments: Pressure≦ 1.0x10-5 mbar

Return To Ambient

Ambient

Hotnon-operation

(+85oC)

Temperature(Proto-flightTest Level)

Thermal Cycling Phase

HotOperation(+55oC)

Coldnon-operation

(-45oC)

ColdOperation

(-25oC)

A B C D E F G H I J K L M

2 hrsHot soak

Hot Balance

Cold Balance

Transient Cool-Down

1 hr

1 hr 1 hr

1 hr

1 hr

Operation (on)

Non-operation (off)1 hr 1

hr Turn offTurn on

2 hrsHot soak

2 hrscold soak

2 hrscold soak

N O P Q

Thermal Balance Phase

Pump Down

Chamber Environments: Pressure≦ 1.0x10-5 mbar

Return To Ambient

Ambient

Hotnon-operation

(+85oC)

Temperature(Proto-flightTest Level)

Thermal Cycling Phase

HotOperation(+55oC)

Coldnon-operation

(-45oC)

ColdOperation

(-25oC)

A B C D E F G H I J K L M

2 hrsHot soak

Hot Balance

Cold Balance

Transient Cool-Down

1 hr

1 hr 1 hr

1 hr

1 hr

Operation (on)

Non-operation (off)1 hr 1

hr Turn offTurn on

2 hrsHot soak

2 hrscold soak

2 hrscold soak

N O P Q


NASA AMS Electrical Interfaces on ISSPower:

109-124VDC2KW max

LRDL1553B Bus1 Kbit/s in 10 Kbit/s out10 B/sec CHD

HRDLTaxi F/O

<2Mbit/s>orbitxRDL: Duty cycle ~50-70%

Ensure AMS side of interfaces conform to NASA requirements

& C

omm

and

Mon

itorin

g

Eve

ntD

ata

Earth

TDRS

LRD

LH

RD

L

UMAEVA

International Space Station

M&C

Pow

er

Subsystems

Power & Thermal

DAQ & TriggerMonitor & Control

ElectricalInterfaces

AMS

POCC


AMS-02 HRDL InterfaceISS is Zero Fault Tolerant for Payloads

UMA

B/HEVA

Tx F/O Rx Tx F/O Rx

RS422Cu

CuRS422

to ISS/APS

AMS Data Acquisition

EVA Cross strap

Tx RS422 4x1 MUXAux. 4x1 MUXPrim. 4x1 MUX

STS/KUSP, T0

PEDS

TAXICu

F/OTAXI

JMDC 0 JMDC 1 JMDC 2 JMDC 3

ROEU


Practicing EVA cable swap at in Neutral Buoyancy Lab


Ku

Ku

~70% D.C.

To POCC

To POCC

"DISKS"

"DISKS"

BUFFER

DAQ

"DISKS"

WSGC

MSFC

TDRS

STATUS

Express Rack

CMDS(AMS)STATUSCMDS(AMS)

CMDS(NASA)

"DISKS""DISKS""DISKS"

46 Mbit/s

but only 4 outputs to HCOR)APSHCORHRFMHRMISPR

High Rate Frame MultiplexerHigh Rate Modem

NASAHighrate Com. Outage Recorder

International Standard Payload Rack (Containing Express Rack)

Automated Payload Switch (1 of 2, each 20 programable interconnects,

POCC

AMSACOPPOCC

Alpha Magnetic Spectrometer Payload

Payload Operations Control Center

High Rate Fiber Optic Line(0, 0.5 to 100 Mbit/sec on Cmd)

AMS Crew Operations Post (in Express Rack Drawer)

M.Capell/Oct 00

UMA

MRD

L Up

grad

e ?

Crew Inter

face

AMS

ISPR

ACOP

AMS HIGH RATE DATA FLOW

HCORAPSAMSHRFM/HRM

High Rate Data Link Data Flow

Ku

Ku

~70% D.C.

To POCC

To POCC

"DISKS"

"DISKS"

BUFFER

DAQ

"DISKS"

WSGC

MSFC

TDRS

STATUS

Express Rack


CMDS(NASA)


46 Mbit/s






POCC

AMSACOPPOCC





M.Capell/Oct 00

UMA

MRD

L Up

grad

e ?

Crew Inter

face

AMS

ISPR

ACOP


HCORAPSAMSHRFM/HRM

Ku

Ku

~70% D.C.

To POCC

To POCC

"DISKS"

"DISKS"

BUFFER

DAQ

"DISKS"

WSGC

MSFC

TDRS

STATUS

Express Rack


CMDS(NASA)


46 Mbit/s






POCC

AMSACOPPOCC





M.Capell/Oct 00

UMA

MRD

L Up

grad

e ?

Crew Inter

face

AMS

ISPR

ACOP


HCORAPSAMSHRFM/HRM


PIT: Preliminary Interface Test - JSC - Jun 2003



ISIL Testing – July ’05 at JSC


AMS-02 Magnet & CryogenicsElectronics

Vacuum vessel

TMPs ΔT = 0.01K

4 types of Valves

Many sensors Passive Phase

SeparatorΔT = 0.001KSFHe tank


M.CapellApr 04

SwitchesPower

Cryo

cool

er

Cryo

cool

er

Cryo

cool

er

Cryo

cool

er

Valves,Heaters,Sensors


dV

CryomagnetAvionics Box

Quen

ch H

eate

rs (2

* >77

J)

Ctrl

SC C

oils

(48

H)

CAB

CCSC

QuenchSensors

Self Protection

CCS Current Source Cryomagnet

Control & SignalConditioning

1500 W

CSP

1875W Peak

2x CANCCEB

Powe

r Dis

tribu

tion

Syst

emDump Diodes

CDD-P, -S

Pers

iste

nt S

witc

h

AMS-02 CRYOMAGNET AVIONICS

UPSx2

>21V

Busbar

disconnectMechanical

FEED A"120" VDC

100+0 W nominal

x4

Dual 28 VDC Feeds

M&C Link

Feed A or B 120VDC 460W

I to 459.5 A

B

"120"-LV DC-DC

JMDC

(12) 3-Majority Sense

(2) 150 ms pulse(50) V,T,P Readings(10) 15 to 25 VDC

(15) 15 to 25 VDC(70) V,T,P Readings

5.5KV Isolation Barrier

5.5KV Iso.

PrecisionShunt

28Ah

DOWNRAMPAUTO

Detect,Quench

DC-AC

BMS

Protect

DC-DC

targetI

V < 10 V

P < 1875W

t < 2 hr

I < 459.5A

M.CapellApr 04

SwitchesPower

Cryo

cool

er

Cryo

cool

er

Cryo

cool

er

Cryo

cool

er



dV

CryomagnetAvionics Box

Quen

ch H

eate

rs (2

* >77

J)

Ctrl

SC C

oils

(48

H)

CAB

CCSC

QuenchSensors

Self Protection

CCS Current Source Cryomagnet

Control & SignalConditioning

1500 W

CSP

1875W Peak

2x CANCCEB

Powe

r Dis

tribu

tion

Syst

em

Dump DiodesCDD-P, -S

Pers

iste

nt S

witc

h

AMS-02 CRYOMAGNET AVIONICS

UPSx2

>21V

Busbar

disconnectMechanical

FEED A"120" VDC

100+0 W nominal

x4

Dual 28 VDC Feeds

M&C Link

Feed A or B 120VDC 460W

I to 459.5 A

B

"120"-LV DC-DC

JMDC

(12) 3-Majority Sense

(2) 150 ms pulse(50) V,T,P Readings(10) 15 to 25 VDC

(15) 15 to 25 VDC(70) V,T,P Readings

5.5KV Isolation Barrier

5.5KV Iso.

PrecisionShunt

28Ah

DOWNRAMPAUTO

Detect,Quench

DC-AC

BMS

Protect

DC-DC

targetI

V < 10 V

P < 1875W

t < 2 hr

I < 459.5A

2100W peak


Cryomagnet Current Source under test (460A)

TRD TEMP SENSORS

TRACKER TEMP SENSORS

CRYOCOOLER TEMP SENSORS

GLOBAL TEMPSENSOR NET

S-Crate1LV

SPD1 S1-P,S2-R

SHV1 HV

R

N

ACC-RULRDL

HRDL RS422

ISS STS1553

N

RUG-Crate

LV

UGPDManif.

UGB-S, -C

RICH

W,S

ECAL

W,P

LV

LV

E-Crate0

RICH Elec

N

R

ERPD

0

HV

HV

HV

HV

HV

RHV0.1RHV0.0

EHV0.0EHV0.1EHV0.2

LVS-Crate2LV

SPD2 S3-P,S4-W

SHV2 HV

R

N

ACC-WD

LV

TPD4 T-Crate4 TrackerW,P,D

LV

TPD1 T-Crate1 TrackerW,S,U

S-Crate0LV

SPD0 S1-W,S2-SACC-WU

SHV0 HV

R

NLV

TPD5 T-Crate5 TrackerW,S,D

LV

TPD2 T-Crate2 TrackerR,S,U

S-Crate3LV

SPD3 S3-S,S4-RACC-RD

SHV3 HV

R

N

DISTRIBUTIONSYSTEM (PDS)

POWER

LV

UPD1 U-Crate1

TRDRam

LV

UPD0 U-Crate0

TRDWake

1A

5 AI

20A

20A

20A

20A

120V-28V

DC-DCV 5 A

10 A

5 A5 A5 A

5 A

10 A

5 A5 A5 A5 A5 A5 A5 A120V-28V

DC-DCV

I

5 A

10 A

5 A5 A5 A5 A5 A5 A5 A120V-28V

DC-DCV

10 A

5 A5 A5 A5 A5 A5 A5 A120V-28V

DC-DCV

5 A

RAMSTARJ112

WAKEPORT

J111

RAMPORT

J113

T

CCS (CAB) CCEB(4*Cryocooler)

TT

TT

Main Rad. Wake+CAB

LV

TPD6 T-Crate6 TrackerR,S,D

TTT T

Main Rad. Ram - Set#1

TTT T

2x Cryocooler Starb.

TTT T

2x Cryocooler Port

TTCB-P TTCB-S

LV

TPD0 T-Crate0 TrackerW,P,U

N

RM-Crate

LV

MPD AST, GPSLAS

TT

TT

2E-Crates+10HVs

TT

TT

ECAL

WAKEJ103

Tracker Rad. Wake

Zenith WS

Zenith WP

Tracker Rad. Ram

V,I

TT

TT

RICH+Lower TOF

N

R

TT

JT-Crate

J-CrateJPDLV

CAN (A,B)

R

NTT-Crate

5A3A3A

3A

3A3A3A

3A3A

3A7.5A

I10A

Zenith RS

Zenith RP

Baseline"Parallel-32"

M.Capell / K.S.Kim 07 Dec 05

J120

T

20A

20A

20A

I5 A

10 A

5 A

5 A5 A5 A5 A5 A

10 A

5 A5 A5 A5 A5 A5 A5 A

10 A

5 A5 A5 A5 A5 A5 A5 A

120V-28V

DC-DCV

120V-28V

DC-DCV

10 A

5 A5 A5 A5 A5 A5 A5 A120V-28V

DC-DCV

120V-28V

DC-DCV

20A

RAMSTARJ212

WAKEPORT

J211

WAKESTARJ110

J213 RAMPORT

J220

5A

3A3A

7.5A3A

3A3A

3A3A3A3A

I10A

120V Out

WAKEJ203

RAMJ204

J202

LV

TPD3 T-Crate3 TrackerR,P,U

RICH

R,P

ECAL

R,S

LV

LV

E-Crate1

RICH Elec

ERPD

1

HV

HV

HV

HV

HV

RHV1.1RHV1.0

EHV1.0EHV1.1EHV1.2

LV

R

N

T

EMI

TT

TT

UG

T96W

T96W

T19.2W+75.8WLocal Heaters

T

T

T

J201

T

EMI V,I

T

T

T

T

T

T

Local Heaters19.2W+75.8W

96W

96W

J200

120V Input Section

T0(pad)

IFP

A

(flight)APCU

120V-LV

(A+B)MonitorControl+Nominal

CAN BUSInterface

(A+B)MonitorControl+Redund.

120V-LV

CAN BUSInterface

PVGF

Pri.

Sec.

EBCS

P9

P12

TTT T

Main Rad. Ram - Set#2

RAMJ104

J100

J101

EVA

UMA

P121

P122

Rad

USS

(bonding)

PAS

J102

20 A

A-Side

WAKE Side

RAM Side

Port

Starb.

Port

Starb.

ISS

ARM

ISS

BA

TSPD3

TSPD6

TSPD4

TSPD1

TMPD2

PT1000, DallasTemp Sensor

(OOR, COR)Thermostats

Default Active1A Fuse

Switch, status

Current Telemetry5A Circuit Breaker,

TelemetryVoltage, Current

V,I

28V Output

120V Out

WAKE Side

120V Input Section

B-Side

28V Output

LV

TPD7 T-Crate7 TrackerR,P,D

STS

ROEU

CABN

R

STARWAKEJ210

DTS DTS DTS

DTS

DTSDTS DTSDTS

DTS

DTS

DTS

DTS

DTS

DTS

DTS

DTS DTS DTS

DTS

DTSDTSDTS

DTSDTSDTS

DTS DTS DTS

DTS

DTSDTSDTS

DTSDTSDTS

DTS DTS DTS

DTS

DTSDTS

DTS

DTSDTS

DTS

P TS

DTS

J R

S1 RER0 RU0

T5

T0T4ER0 N

UG R

ER1 NT2

S3 NM NU1S2 NCAB R

T6

T3

TT R

J NS1 NUG NS0 RT1

T7

M RS3 R

S2 RCAB N

ER1 R

S0 N

TT N

DTS DTS

DTSDTSDTS

DTS

DTS

DTS

DTS

DTS

P TSDTS P TS DTS

DTSDTSDTS

DTSDTS DTS

P TS

P TS

P TS

P TS

DTS

DTS

DTS

DTS

DTS

DTS

DTS

DTS

P TS

P TS

DTS

J R

S1 RER0 RU0

T5

T0T4ER0 N

UG R

ER1 NT2

S3 NM NU1S2 NCAB R

T6

T3

TT R

J NS1 NUG NS0 RT1

T7

M RS3 R

S2 RCAB N

ER1 R

S0 N

TT N

DTSDTSDTS

DTS

DTS

DTS

DTS

DTS

DTS

DTS

DTSDTSDTS

DTS

AMS-02: Power System (PDS) for ISS+SSRMS+STS


AMS ElectronicsAdapted particle physics capabilities to

work in low Earth orbit.

Key stepsComponent selection & beam testing,Thermo-mechanical design,Quality assurance & Hi-rel processing, High Power (PDS), High Current(CAB) units produced by “space rated firms”, Continuous oversight/interaction with NASA/(Lockheed/LM/JS/Jacobs).

Documents

ISS: 108x80m 420T 86KW 400km AMS: 3x3x3m 6T 2.3+KW 3+ years