INVESTOR PRESENTATION

July 2013

2 July 2013

SAFE HARBOR STATEMENT

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including , but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of

words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in

our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our

business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated

orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for

semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,

loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of

terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and

protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,

political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;

potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those

additional risk factors set forth in Besi's annual report for the year ended December 31, 2012 and other key factors that

could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory

consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our

forward-looking statements whether as a result of new information, future events or otherwise.

3 July 2013

AGENDA

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

4 July 2013

I. COMPANY OVERVIEW

5 July 2013

COMPANY OVERVIEW

• Leading assembly equipment supplier with #1 and #2 positions in key products. 27% addressable market share

• Broad portfolio: die attach, packaging, plating, wire bond

• Strategic positioning in wafer level and substrate packaging

• Global mfg. operations in 7 countries; 1,520 employees worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• 2012 revenue and net income of € 273.7 and € 15.8 million

• Cash at 6/30/13: € 81.1 million

• Total debt at 6/30/13: € 24.9 million

Financial Highlights

• Advanced packaging, smart phone/tablet growth and Asian production transfer offer significant upside potential

• Restructuring and production transfer have transformed company and earnings potential

• Stock market valuation at discount to peers

Investment Considerations

6 July 2013

• Market cap € 303.2 million: 37.2 million shares x € 8.15 price (July 31)

• Shares listed on NYSE Euronext Amsterdam (BESI) and NASDAQ OTCQX

International (BESIY). 2013 average daily volume of 105,000 shares

• Trading at significant discount to industry multiples:

Besi (a) Peers (b, c) Industry (c, d)

TTM P/S 1.1x 1.5x 2.1x

TTM EV/EBITDA 8.6x 8.4x 11.5x

2013E P/S 1.1x 1.6x 2.1x

2013E EV/EBITDA 8.5x 9.3x 11.8x

STOCK PRICE INFORMATION

Source: a) Besi: Canaccord Genuity, SNS Securities research & ABN AMRO b) Peers: ASMPT, Disco Corp, Mühlbauer, Tokyo Seimitsu, Shinkawa, Süss MicroTec and K&S c) Reuters & MS estimates d) Industry: Reuters semi equipment universe

7 July 2013

BESI EQUIPMENT PORTFOLIO

Die Attach

• Die Bonding

- 2100 xP

- 2009 series

- 2100 HS

- 2100 sD

- 2100PPP

• Multi Module Die

Attach

- 2200 evo

• Flip Chip - 8800 Quantum

- 8800 Chameo

- "Smart Line"

- 2100FC

Packaging & Plating Wire Bonding

• Die Sorting

- DS 9000E

- CS 1250

- DS 11000

• 3100

• 3100

Smart Card

• 3200 Smart

Card

• Molding

- AMS series

- AMS Foil

- AMS LM 95

• Trim & Form

- Compact series

- Power series

- Compact Line

XHD

• Singulation

- FSL

• Plating

- Leadframe

- Solar

- Film & foil

New

New

In Development

• TCB flip chip system

• Common die attach platform

• Common packaging platform

New

New

New

8 July 2013

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

Substrate

Wire Bond Assembly

Substrate

Flip Chip Assembly

Wafer Level Packaging

Flip Chip Assembly

Wire Bond

Die Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

BESI PRODUCT POSITIONING

9 July 2013

GLOBAL OPERATIONS

as of 30 June 2013

Europe/N.A. Asia

Revenue (MMs) € 26.4 19.3% € 110.0 80.7%

Headcount 668 43.9% 852 56.1%

• Development activities in Europe and USA

• Increasing production and sales/service

activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

Chengdu Shanghai

Korea

Taiwan

Philippines Malaysia

Singapore*

Salem* Suzhou

Radfeld, (Austria) Cham,

(Switzerland)

Duiven & Drunen,

(The Netherlands)

Chandler

Shenzhen

10 July 2013

II. MARKET

11 July 2013

ASSEMBLY EQUIPMENT MARKET FORECAST

• Since 2010 rebound, assembly market has been trending lower

• However, 25%+ growth from 2013 levels anticipated by 2015

2.3

4.9

4.6

4.13.9

4.5

4.9

-20.6%

-6.4%-10.2%

-4.7%

15.3%8.6%

114.9%

0

1

2

3

4

5

6

2009 2010 2011 2012 2013E 2014E 2015E

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

160%

Assembly Equipment Market Size YoY Growth Rate

Source: VLSI July 2013

12 July 2013

Assembly Market Environment Cautiously Improving

VLSI forecasts 4.7% decline.

Initially assumed 6.1% downturn

Mixed industry picture. Renewed strength in tablets,

low/mid range smart phones and

automotive

Less robust demand for high

end smart phones. PC slowdown also

a negative

Customers more optimistic than

prior years. However, limited

visibility

2013 INDUSTRY OUTLOOK

13 July 2013

ASSEMBLY EQUIPMENT MARKET COMPOSITION

• 51% assembly market 2012 represented by die attach and wire bonding equipment

• Die attach increasing market share relative to wire bonding

• Besi focus: fastest growing die attach and packaging segments serving advanced

applications

Die Attach

61%

Packaging

38%

Plating

1%

Flip Chip

14%

Die Sorting

3%

Singulation

8%

Presses

10%

Molds

14%

Lead Trim &

Form

6% Die Bonding

44%

Assembly Equipment Market *

(2012: $4.1 billion) Besi Addressable Market *

(2012: $1.7 billion)

Wire Bonding

22%

Die Attach

29%

Packaging

20%

Plating

1%

Other Assembly

(Inspection, Dicing)

28%

* Source: VLSI July 2013

Plating

2%

14 July 2013

Customers OEMs End Products

CUSTOMER ECOSYSTEM

• Blue chip customer base, top 10 customers represented 48% of 2012 revenue

• Leading Asian Subcontractors and IDMs. 57/43% split in 2012

• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek

• Long term relationships, some exceeding 45 years

IDMs

Subcontractors

15 July 2013

• Customers are largest producers.

• Most advanced packaging

applications

• Strong customer market shares:

• 50 – 100% of die attach

requirements

• 35 – 50% of packaging

requirements

• Customer market shares/annum

vary depending on capacity

requirements and purchasing

cycles

• Primary competition:

• Die Attach: ASMPT, Shinkawa,

Hitachi

• Packaging: Towa, Yamada,

ASMPT

ESTIMATED SHARE OF WALLET

LEADING CUSTOMERS

* YTD through May 31

** No customer purchases indicated

*** Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly

production done by subcontractors

**** In general, Samsung satisfies approximately 50% of its equipment needs internally

Die Attach Packaging

In USD FY2011 FY2012 YTD2013* FY2011 FY2012 YTD2013*

Subcontractors

ASE 76% 67% 72% 34% 36% 49%

Amkor 36% 75% 90% 63% 45% 28%

STATSChippac 100% 95% 100% 61% 28% - **

SPIL 63% 47% 100% 35% 37% 86%

Unisem 100% 92% - ** 68% - ** - **

Cowell/Foxconn

(Camera Modules) 0% 100% - **

IDMs ***

Skyworks 78% 100% 100% 0% 13% 0%

ST Micro 92% 91% 87% 51% 44% 100%

Infineon 93% 81% 100% 37% - ** - **

Samsung**** 17% 5% - ** 37% - ** 100%

% of Besi Die Attach

and Packaging

systems revenue 30%

47%

66%

67%

53%

78%

16 July 2013

ADVANCED PACKAGING GROWTH FAVORS BESI

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage

• <40 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2012E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, 2100

• Flip Chip: DC 8800 FC

• Multi Module: DC evo 2200

Packaging

• Molding: AMS-LM 95

• Singulation: FSL

High Growth End

User Areas:

Mobile internet

devices, Digital set

top boxes, Autos,

MEMS

17 July 2013

Source: Gartner

MOBILE INTERNET DEVICE MARKET TRENDS

• Rapid unit growth in smart

phones and tablets forecast

over next 5 years

• Estimated unit growth rates:

• Smart phones:

• 2013: 27%

• 2016: 2.9x

• Tablets:

• 2013: 54%

• 2016: 5.5x

• Significant potential revenue

growth driver

2011 2012 2013 2014 2015 2016

Units 488 708 897 1,088 1,270 1,411

-

400

800

1,200

1,600

Units (

mill

ions)

Smartphone Units

2011 2012 2013 2014 2015 2016

Units 67 120 185 242 341 371

-

100

200

300

400

Units (

mill

ions)

Tablet Units

45.1%

26.7%

21.3% 16.7%

11.1%

79.1%

8.8%

40.9%

30.8%

54.2%

18 July 2013

SMART PHONE ILLUSTRATION

Main Components Manufacturer Country Besi Systems Utilized

Processor Samsung South Korea 8800FCQ, AMS-W, Singulation

DRAM Memory Samsung South Korea 2100sD, AMS-W, Singulation

Flash Memory Chip Samsung South Korea 2100sD, AMS-W, Singulation

Battery Samsung South Korea N/A

Power Management Dialog Germany 2100sD, 2009

Compass AKM Japan N/A

Accelerator/Gyroscope ST Micro Italy/France 2100sD

Communications

Radio Frequency Memory Intel USA 8800FCQ, Singulation

Wi-Fi/Bluetooth/GPS Broadcom USA 2200 evo, AMS-W, Singulation

Receiver/Transceiver Infineon Germany 8800FCQ, AMS-I, Singulation

PA Module Skyworks, Triquint USA

2200 evo, AMS-W, Singulation, 8800 Chameo

Video/Audio

Touch Screen Control TI USA 2100sD, AMS-W, Singulation

Audio Codec Cirrus Logic USA 2100sD, AMS-W, Singulation

LCD Display LG South Korea N/A

Touch Screen Wintek USA N/A

Camera – 5/8 megapixel/VGA LG, Foxconn, Cowell

South Korea, China 2200 evo

Besi systems can assemble components representing up to 50% of smart phone content.

19 July 2013

Computer,

PCs50%

Mobile

Internet Devices

22%

Auto13%

Industrial

10%

LED3%

Service

2%

2008

BESI’S PRODUCT SHIFT TO ADVANCED

PACKAGING END USER APPLICATIONS

Computer,

PCs21%

Mobile

Internet Devices

35%

Auto17%

Industrial10%

LED5%

Service

12%

2012

Source: 2012 Company Estimates

• Mobile internet

devices now equal

35% of Besi’s end

user revenue

• Automotive has also

increased significantly

in recent years

• Service/spare parts

have grown to 12%.

Less cyclical revenue

stream

20 July 2013

Wire

Bonding

$1,016 75%

Flip Chip

$335

25%

2017E

FLIP CHIP/WIRE BOND OPPORTUNITY

Wire

Bonding

$923 80%

Flip Chip

$228

20%

2012 Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI July 2013

• Move to <40 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 20% currently of total potential market of $1.2 billion

• Expected to gain share rapidly over next 5 years vs. wire bonding (5.5% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates of key IDMs/subcons

CAGR 2012 – 17

Flip Chip 8.0%

Wire Bond 1.6%

21 July 2013

III. STRATEGY

22 July 2013

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

0

50

100

150

200

250

300

350

2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

Gro

ss M

arg

in

Re

ve

nu

e (

€ m

illio

n)

Revenue Gross Margin

CORPORATE TRANSFORMATION

Restructuring

Asian Production Transfer

Dragon I

complete:

€ 6 million

cost savings

Dragon II

complete:

€ 15 million

cost savings

Die Attach Acquisitions

Standard packaging and certain die

bonding systems transferred to

Malaysia

Dutch tooling &

Hungarian die bonding

transferred to Asia

Epoxy DB transferred

to Malaysia

Asia capacity expansion

Cost

savings

plan

initiated

13%

Headcount

reduction;

Plating unit

rationalized

Soft solder

DB

transfer to

Malaysia

initiated

Asian headcount increased from 34% in ‘06 to 54% in ‘12

Malaysian system and Chinese tooling capacity expansion

23 July 2013

KEY STRATEGIC OBJECTIVES

2012 2013 2014

Operational Objectives

Soft Solder DB production transfer to Malaysia

50% Malaysia/100% China capacity expansion

European Die attach integration activities

Expansion of Asian supply chain. System module outsourcing

Development Objectives

TCB flip chip die bonding development

300-450 mm wafer handling

Common platform/parts activities

24 July 2013

396

487

658

170

331

553

42.9%

68.0%

84.0%

0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

-

100

200

300

400

500

600

700

2010 2011 2012

% D

irect

Sh

ipm

en

ts

Sh

ipm

en

ts

Total Asian Shipments Direct Asian Shipments % Direct

SUCCESSFUL ASIAN PRODUCTION TRANSFER

25 July 2013

HAS LED TO LOWER EUROPEAN AND

AGGREGATE HEADCOUNT

• Headcount trends continue to favorably influence

break even revenue levels

• Fixed European headcount gradually reducing

as shift to Asia manufacturing progresses:

• Down by 1.7% sequentially in Q2-13

• Down by 12.7% year over year

• Declined from 56% of total in 2009 to 43% at

end of Q2-13

• Aggregate of 1,520 headcount at Q2-13 quarter

end (including temps):

• Flat vs. Q1-13

• Down 9.2% vs. Q2-12

770 56%

738 49%

741 48%

680 46%

644 44%

633 43%

614 44%

772 51%

802 52% 799

54% 820 56%

825 57%

1,384

1,510 1,543

1,479 1,464 1,458

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2009 2010 2011 2012 Q12013

Q22013

He

ad

co

un

t

Europe/NA Fixed HC Asia Fixed HC

26 July 2013

AQUISITION STRATEGY

1993 1995 1997 2000 2002 2005 2009

• € 50 million packaging company has become € 274 million assembly

equipment supplier

• Consolidating leading edge assembly technologies

• 4 acquisitions since 2000 totaling € 80 million, net created Die Attach leader

• Seeking technology led companies which increase advanced packaging

presence and can be incorporated into One Besi platform

Packaging Plating Leadframes Flip Chip Chip Sorting Flip Chip/

Multi Chip

Die Bonding

Packaging & Plating Die Attach

27 July 2013

IV. FINANCIAL REVIEW

28 July 2013

SUMMARY FINANCIAL HIGHLIGHTS

• Financial transformation since 2008

• Scale and market presence have changed:

• Esec acquisition expanded mainstream presence

and leveraged revenue potential

• Strategic positioning in advanced packaging has

yielded benefits:

• Enhanced top line growth

• Increased gross margins

• Restructuring has aided gross margins and profits

despite 2011/2012 cyclical volatility due to:

• Advanced packaging positioning

• Ongoing Asian production transfer

• Reduction of European based costs

• Die attach integration

• Product line restructurings

• Scalability of business model increased in

response to increased order volatility

• Solid liquidity base. Expanding net cash

Year Ended December 31,

(€ millions, except share data) 2010 2011 2012

Revenue

351.1 326.9 273.7

Orders 376.5 301.1 276.1

Gross margin 39% 40% 40%

EBITDA 60.5 45.6 32.4

Pretax income 47.4 34.4 19.5

Net income 47.3 26.4 15.8

EPS (diluted) 1.25 0.73 0.42

Net margin 13% 8% 6%

Adj. net income (loss) 41.6 27.1 18.2

Adj. EPS (diluted) 1.11 0.74 0.49

Net Cash 22.9 62.7 79.5

29 July 2013

REVENUE/GROSS MARGIN TRENDS

• Quarterly revenue/order patterns show

cyclicality of semiconductor business:

• Three cycles past 3 years

• Global macro uncertainty = customer

caution + short term purchasing

• Q4-12 was recent trough

• Product mix shift to higher margin

advanced packaging systems:

• Multi module and flip chip die attach

• Ultra thin molding systems

• Drivers: mobile internet devices and

intelligent automotive components

• Exit from lower margin plating, wire

bonding and packaging systems

• Gross margins have held up despite

cyclicality:

• Increased scalability of production model

• Product mix shift to higher margin

advanced packaging systems

• Lower unit costs due to:

• Asian production transfer

• Reduction in European personnel

91 90

76

70

56

87

75

56

64

72

88

83

75

55

84

91

49 52

64

83

40.0%

40.0%41.2%

40.0%

38.5%

39.4%

41.5%

40.3%

37.7%

39.6%

40.4%

30.0%

32.0%

34.0%

36.0%

38.0%

40.0%

42.0%

44.0%

46.0%

48.0%

50.0%

0

20

40

60

80

100

Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12 Q4-12 Q1-13 Q2-13

(eu

ro in

mill

ion

s)

Revenue OrdersGross Margin Gross Margin ex Restructuring

30 July 2013

BREAK EVEN REVENUE LEVELS

270

235

200 212

-

50

100

150

200

250

300

2011 2012 2013E

(€ m

illi

on

s)

(13.0%)

(10.0% - 15.0%)

31 July 2013

NET INCOME TRENDS

• Cyclical peak earnings of € 47.3 million

reached in 2010

• 2012 earnings declined to € 15.8 million.

Adversely affected by:

• 16.3% YOY revenue decrease due to

ongoing customer caution

• € 2.4 million restructuring charges

• € 1.2 million increased forex losses

• Partial offset from restructuring:

• -11% European headcount

• -7% cost/production employee

• -12% opex

• € 3.0 million tax loss benefit

• H1-13 rebound from Q4-12 trough due

to order upturn and reduction in break

even revenue levels

• Significant leverage in operating model

• Quarterly opex have ranged between

€ 20-24 million over past 8 quarters

• € 20.3 million in Q2-13 ex restructuring

9.6

8.8

4.9

3.2

0.2

10.0

4.3

1.2

3.8

6.5

3.9

4.6

3.3

4.0

7.0

0

2

4

6

8

10

12

Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12 Q4-12 Q1-13 Q2-13

(eu

ro in

mill

ion

s)

Net Income Adjusted Net Income

32 July 2013

LIQUIDITY TRENDS

• Solid liquidity position

• € 81.1 million cash at 6/30/13

• € 2.16 per share vs. price of

€ 7.93 at quarter end

• Net cash has grown to € 56.2 million

from € 19.6 million at year end 2009

• Significant increase in profitability

• Redemption and share conversion of

5.5% convertible notes in Q2-2011

• Improved working capital management

• Shareholder value enhanced

• € 38 million spent on share repurchases

and cash dividends 2011-2013

• 1.5 million share buyback initiated in

October 2012. 600k shares purchased

• Strong balance sheet supports future

organic growth and acquisition strategy

65.5

61.8

76.6

87.5

93.5

77.3

89.8

106.4

91.9

81.1

45.9

16.1

27.0 24.8

23.1

27.9 30.6

26.9 27.7 24.9

0

20

40

60

80

100

120

Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12 Q4-12 Q1-13 Q2-13

(euro

in m

illio

ns)

Cash Debt

Net Cash 19.6 45.7 49.6 62.7 70.4 49.4 59.2 79.5 64.2 56.2

33 July 2013

DIVIDEND TRENDS

0.20 0.22 0.22

- -

0.08

4.0% 4.3%

3.8%

5.2%

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

2009 2010 2011 2012 (b)

Div

ide

nd

yie

ld

Div

ide

nd

(€)

Base Dividend Special Dividend

Base Dividend Yield (a) Total Dividend Yield (a)

a) Based on year end stock price

• Dividend policy: Can pay out up to 50% of annual net income, depending on

business prospects and cash needs

• Will consider special dividend if circumstances permit

34 July 2013

V. OUTLOOK & SUMMARY

35 July 2013

IC PRICING AND ASSEMBLY MARKET TRENDS

Assembly Capacity Utilization & IC Pricing

Book to Bill Ratio

Source: VLSI Jul 2013 Source: Semi Jul 2013

1.23

1.12

1.08

1.51

1.40

1.23

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

1.60

Jan 1

0

Mar

10

May

10

Jul 1

0

Sep

t 10

Nov

10

Ja

n 1

1

Ma

r 1

1

Ma

y 1

1

Jul 1

1

Sep

t 11

Nov

11

Jan 1

2

Mar

12

May

12

Jul 1

2

Sep

t 12

Nov

12

Jan 1

3

Mar

12

May

12

Semiconductor Equipment Book to Bill Trends(3 month moving average)

Assembly Equipment

Total Semi Equipment

1.14

1.16

1.18

1.20

1.22

1.24

1.26

1.28

1.30

1.32

1.34

1.36

1.38

1.40

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

2010 JAN

MAY SEP 2011 JAN

MAY SEP 2012 JAN

MAY SEP 2013 JAN

MAY

3 M

on

th A

vg

Pri

cin

g (

$)

% C

ap

acit

y U

tili

zati

on

Assembly Utilization IC ASP

• Relatively short seasonal cycles over past three years driven by:

• Smart phone and tablet purchasing patterns

• Macro economic conditions

• Assembly book/bill and capacity utilization have increased since Q4-12 industry trough

36 July 2013

Q3-2013 GUIDANCE AS PER JULY 31, 2013

• Q3-13 revenue approximately flat to down 10%

• Gross margins between 39% - 41%

• Opex approximately equal to € 20.3 million (ex restructuring)

• Capex of € 1.4 million

Revenue Gross Margin Operating Expenses* Capex

Q2 Q3 Q2 Q3 Q2 Q3 Q2 Q3

€ 72.4 40.4% € 20.3 € 1.1

41%

-

39%

Flat

-

down

10%

€ 0.3

MM

* Excluding restructuring

Approx.

equal

37 July 2013

SUMMARY

Leading semi assembly equipment supplier with #1

or #2 positions in fastest growing advanced

packaging segments

Scalability and profitability of business model greatly

enhanced for cyclical industry

Favorable industry outlook 2014/2015

Solid liquidity position. Committed to enhancing

shareholder value

Significant upside potential.

Advanced packaging, mobile internet devices,

ongoing cost reduction and Asian production transfer

Attractive stock market valuation and dividend yield relative to peers

38 July 2013

FINANCIAL CALENDAR

13-Aug-13 Roadshow ABN AMRO, Boston USA

14-Aug-13 Canaccord Growth Conference, Boston USA

19-Sep-13 Roadshow London, organized by Kepler Cheuvreux

30-Sep-13 Roadshow Netherlands, organized by SNS Securities

1-Oct-13 Roadshow Belgium, organized by SNS Securities

2/3-Oct-13 NYSE Euronext Paris Large & Midcap Event, Paris France

31-Oct-13 Q3-2013 Results

20/22-Nov-13 Morgan Stanley TMT Conference, Barcelona Spain