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PHYS 534 (Fall 2008)Module on Microsystems & Microfabrication
Lecture 1
Introduction to Microdevices
1
and Microsystems
Srikar Vengallatore, McGill University
Outline of Lecture
•Introduction to Microsystems
-Basic definitions and examples
-How are they designed?
-How are they manufactured?
2
2
Introduction to Microsystems
Micro: Small SystemInput Output
•System dimensions: 1 mm to 10 cm
•Structural components: 10 nm to 100 μm
3
•Designed and manufactured to performuseful activity
LENGTH SCALES
10-3 m = 1 mm
10-4 m = 100 μm
10-5 m = 10 μm
10-6 m = 1 μm
10-7 m = 100 nm Molecules
Bacteria STRUCTURESFOR
MICROSYSTEMS
4
10-8 m = 10 nm
10-9 m = 1 nm
10-10 m = 0.1 nm
Atoms
3
1 m
1 μm
1 mm
51 nm
1 μm
Source: Kalpakjian and Schmid
Example 1.Integrated Circuit
>1 Million wires per cm2 !>1 Million wires per cm2 !
•No moving parts
•$200 Billion per year
•Revolutionary
6(I.B.M)
Revolutionary(Internet, computers,…)
4
Cross-Section of an I.B.M Integrated Circuit
Copper
Silicon dioxide
7Silicon
Tungsten
1 μm
Example 2: Texas Instruments Micromirrors
11 μm
8DIGITAL LIGHT PROCESSING (DLP)
5
9
TorsionalHi
Electron Micrograph of Texas Instruments DMD
Hinge
10www.dlp.com
6
11
Samsung DLP TVsDLP Projectors
12
7
13
Some TerminologyMicrosystems are known by many names…..
•Microdevices•MicroelectronicsMi l t h i l S t (MEMS)•Microelectromechanical Systems (MEMS)
•Microsystems Technology (MST)•Microfluidic systems•Micro total analysis systems (micro-TAS)•Bio-MEMS/ Bio-microsystems•Optical MEMS/ Optical microsystems
14
•Optical-MEMS/ Optical microsystems•RF-MEMS (for radio-frequency MEMS)•Power MEMS (micro-engines, micro fuel cells)•…
8
Terminology Reflects Evolution of Technology
•In the beginning, there was the transistor…..
Invented in 1947 in
…Nothing micro yet!
Bell Labs.
15
Walter BrattainJohn BardeenWilliam Shockley
Nobel Prize in Physics(1956)
16
9
Use of a Transistor in an Electrical Circuit
17
Jack Kilby, Texas Instruments
The World’s First Integrated Circuit
Aluminum Wires(Interconnects)
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•Robert Noyce
10
Kilby: Nobel Prize for Physics (2000)
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Robert Noyce(co-founder of Intel)
Evolution of Integrated Circuits (1950 – 2000)
Year # of Transistors per device
1960 < 100
1970 104 (4004 8008)1970 104 (4004, 8008)
1980 105 (386 processor)
1990 106 (486 processor)
1992 2 x 106 (Pentium processor)
20
1992 2 x 10 (Pentium processor)
1996 107 (Pentium II)
2000 108 (Pentium 4)
11
Stage 2: From Microelectronics to Micromechanics
1970s: Realization that mechanical components can also be miniaturized
Emergence of micromachined pressure g psensors
Sealed Vacuum CavityMembrane
21
Pressure Port (P)
•Estimate pressureby measuring deflection
Pressure Sensors: Principle of Operation
8 mm
22
12
Micromachined Pressure Sensors are now Widely Used
23www.issys-mems.com
1980s: Micro Sensors and Actuators•Sensors for force, acceleration, pressure, mass,….
Micromachined Accelerometers
24~8 million accelerometers are manufactured each year
Analog Devices
13
mk F ma ka δ= ⎫⇒ =⎬
Principle of Operation of Accelerometer
aa
F k mδ⇒ =⎬= ⎭
δ
Quasi-Static Accelerometer
25
Applications for Micromachined Accelerometers
•Modal analysis of vibratory systems
•Navigation
•Crash Sensors: Air-bag deployment in automobiles
•Protection of hard-disks in laptop computers
•Video games
26
•……..
14
1980s Micro Actuators: Motion in Microsystems
Linear
ELECTROSTATIC ACTUATORS
Gap, g0
LinearSpring, k
Mass, m
g < g0V+
_
27
Fixed electrode
Micro Electro + Mechanical System, or MEMS
Types of Microscale Actuators
• Electrostatic
• Thermal
• Piezoelectric
• Shape Memory Alloy
28
Motion is either due to Applied Forces orDifferential Expansion and Contraction
15
α1
α2
THERMAL ACTUATORS
α2 α2α1 >
Heat
29
1990s: Increasing Focus on Commercialization
Important Trends
•Microsystem community focused on Utility(design, manufacture, marketing, reliability, cost, etc.)
•Range expanded from Electro + Mechanical to multipleenergy domains
•Optical•Chemical•Radio-Frequency communications
30
•Biological•Fluidic•…
There is a complete world of engineering at these scales!
16
OPTICAL MICROSYSTEMS FOR DISPLAYS
Silicon Light Machines
31
OPTICAL MICROSYSTEMS FOR COMMUNICATIONS
32
17
OPTICAL CROSS-CONNECTS
33Lucent
OPTICAL MICROSYSTEMS FOR SENSING
POLYCHROMATOR
34
10 μm
18
1990s: Microfluidics and Bio-Microsystems
Texas Instruments
35
D. Therriault, Ecole Polytechnique
Microfluidic Networks
36
19
1990s: Micro Needles for Painless Drug Delivery
37
Georgia Institute of Technology
IMPLANTABLE CHIPS FOR PROGRAMMED DRUG DELIVERY
38
20
39Microchips
EMERGING APPLICATIONS: PORTABLE POWER GENERATION
Direct MethanolFuel cell
40Toshiba
•12 W @ 11 V for 5 hours with one cartridge•No recharge times
21
Micro Gas Turbine Engine
41
MIT
Micro Solid-Oxide Fuel Cells
Anode (NiO-YSZ)
Cathode (LSM)
Électrolyte (YSZ)
42McGill University/Ecole Polytechnique
22
Refining our Terminology
In this course, we will use MICROSYSTEMS as a synonym for
•Microdevices•Microelectronics•Microelectromechanical Systems (MEMS)•Microsystems Technology (MST)•Microfluidic systems•Micro total analysis systems (micro-TAS)•Bio-MEMS/ Bio-microsystemsO ti l MEMS/ O ti l i t
43
•Optical-MEMS/ Optical microsystems•RF-MEMS (for radio-frequency MEMS)•Power MEMS (micro-engines, micro fuel cells)•…
Microsystems are useful….
•Computation•Information storage & display•Optical telecommunications •Sensing (force, mass, acceleration, chemistry, biology,….)•Actuator technology •Portable power generation•Energy storage•Microscale chemical synthesis and analysis
44
•Medical diagnostics•Therapeutics (drug delivery)•…..
23
Estimated Global Market for Microsystems
Device Applications Market
Integrated Information & >$250 BillionCircuits Communications
Ink-Jet PrintersNozzles
Accelerometers AutomobilesPressureSensors
~$10 billion
45
Sensors
DNA Microarrays Genome sequencing
Drug delivery, fuel cells, microneedles, etc. (in advanced stages of commercialization)
Outline of Lecture
•Introduction to Microsystems
-Basic definitions and examples
-How are they designed?
-How are they manufactured?
46
24
47
How are they Designed?
•Formulate a plan to satisfy a need or solve a problem*.
If this plan results in the creation of something having a physical reality, then the product must be:
-Functional
-Safe
-Reliable
-Competitive
48
-Usable
-Manufacturable
-Marketable
*JE Shigley, CR Mischke & RG Budynas, Mechanical Engineering Design
25
Ashby’s Approach to Design
Market need
C tEvaluationCreativity
Concept
Embodiment
D t il
of competitiony
& experience
Behavioralmodels
Manufacturingconsiderations
In house Management
49
Product Specification
DetailIn-house expertise
Managementdecisions
Modeling and Analysis of Microsystems
•Microsystems operate in multiple energy domains(mechanical, fluidic, electrostatic, thermal, magnetic,…)
•Frequently, coupling between different domains(electromechanical; thermoelastic; magnetomechanical,..)
•Critical question: validity of continuum physics
50
26
Approach to Structural Design
•What kind of STRUCTURES (Machine elements) to use?Beams, plates, rods, or membranes?Solid section or shaped cross-section?pMonolithic or composite?Electrostatic or electrothermal actuation?
•What kind of MATERIALS to use?Ceramics, metals, or polymers?Fiber-reinforced composites or layered composites?
51
…
Structural Design is Constrained by Manufacturing Limitations
How are they manufactured?
•Starting MaterialFlat Plate (substrate; wafer)
•Add material
•Pattern transfer
•Remove Material
52
Pattern transfer(Photolithography)
•Package microdevice!
27
Patterning
Starting Material: Substrate (wafer)
Overview of Microdevice Manufacture
PhotolithographyE-beam lithography
Processes
g
Additive Processes
SubtractiveProcesses
EvaporationSputteringCVDElectrodeposition
g p yIon beam lithographySoft lithography
Wet etchingDry etchingPlasma etching
53
Package Microdevice
ElectrodepositionWafer bondingDRIE
Polishing
Catalog of Manufacturing Processes
Patterning Techniques: Photolithography, Microstamping,Electron/ion beam lithography,Soft lithography,…
Additive processes: Thin-film deposition, wafer bonding,oxidation, epitaxy, …..
Subtractive processes: Wet etching, dry etching, ion milling,
54
p g, y g, g,deep reactive ion etching,…
We will study these processes in GREAT DETAIL!
28
Where are they Made (Fabricated) ?
55
•Need Clean Room Fabrication Facilities (Fabs)Micromachining = Microfabrication = Microdevice Manufacture
56
29
NanoTools Microfabrication Facility at McGill University
57
•Basement of the Rutherford Physics Building
58Images courtesy of Sandia National Laboratories
30
Fundamentally Different Approach to Manufacturing
•Parallel manufacture of hundreds of devices
•Simultaneous manufacture & assembly of components
•Layer-by-layer manufacture
596x106 moving parts106 mirrors
Objective of this Module: Manufacturing of Microsystems
•This is an area of very active research
•Focus on: Fundamental principles + Established methods•Focus on: Fundamental principles + Established methods
•Science lags behind technology(We will use it even if we don’t understand why it works!)
•Learn ideas, but also some crucial details
60
•Learn by assimilation: Case Studies
31
Market Need
System concept StructuralEmbodimentDesign
R i t
MECH 553: Design and Manufacture of Microdevices
Device concept
StructuralEmbodiment
DetailsAdditive Processes Subtractive
RequirementsProcessConstraints
61
Details
Pattern formation(Photolithography)
Processes(Thin film deposition)
processes (Etching)
Processes
Microdevice