IC Micro device Fabrication(Fall 02) 1- 1

Introduction to IC Processing

I Initial Concept Review Page

A) IC Micro device Fabrication 1- 2Electrical Components 1- 2Wafer-Level Unit Processes 1- 2Process Overview 1- 2

B) Wafer Overview 1- 3Wafer Creation 1- 3Wafer-Level Unit Processes 1- 3Wafer Destruction 1- 4Technology Roadmap 1- 5

C) Introduction to Process Flows 1- 5Icon Representation of Unit Processes 1- 5

Resistor Fabrication Using the Locos Process 1- 5Capacitor Process Using a Shadow Mask 1- 6Single Level Metal Bulk Transistor Process 1- 6

D) Introduction to Fundamental Unit Families 1- 7Thermal Processing 1- 7

RTA 1- 7 Horizontal Furnace 1 -7 Vertical Furnace 1- 8

Plasma Processes 1- 9

E) Photolithography 1-10Process Sequence 1-10Equipment

Step and Repeat Lithography System

F) Metrology/Inspection 1-11Microscopy 1-11

G) Chemical Processing 1-12Subtractive Processes 1-12General Chemical Bench 1-12Chemical System Layout 1-13

IC Micro device Fabrication(Fall 02) 1- 2

A) IC Micro device Fabrication

Electrical Components

Process Overview:

Wafers - Front End - Back End - Package -Test

Silicon processes performed in most fabrication shops involve only wafer level methods.

Wafer production and packaging are seldom performed at the main fabrication facility.

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B) Wafer OverviewWafer Creation

Wafer -Level Unit Processes

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Wafer Destruction (Product Production)

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Technology Roadmap

C) Introduction to Process FlowsIcon representation of Unit Processes We have divided the equipment and processes performed in the fabricator into fundamental units.

Resistor Fabrication Using the Locos Process

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Capacitor Process Using a Shadow Masks

Single Level Metal Bulk Transistor Process

Symmetries of Process FlowNote from the process flow that certain unit processes repeat or appear in thesame order.

What Other symmetries do you see?

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D) Introduction to Fundamental Unit FamiliesThermal Processing

Most Thermal Processes are;

Additive processesUsed for Film growthUsed for impurity (DOPANT) incorporation

Used in Diffusion/Anneal step

Equipment (Tubes/ enclosures surrounded by heat source)

RTA ( Rapid Thermal Anneal) is used as a special thermal process.

Horizontal Furnace System

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Vertical Furnace

All Systems fully automated (typ.) 700 C < T< 1200 C,with gas controlled by mass flow meters and solenoid

valving

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Plasma Processes

Use glow discharge to perform process

Electrons, ions, photons, atoms

Both Additive and Subtractive Processes

DepositionCVDSputter (PVD)EtchIon ImplantPressure (Typically Sub-atmospheric)

Equipment

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E) Photolithography

Process by which expendable polymer pattern is produced onthe wafer surface to define regions that will receive the effects ofsubsequent ADDITIVE or SUBTRACTIVE processing.

Process Sequence

Surface preparation- fresh or adhesion promoterCoat with polymerCure polymer ( drive off remaining solvent)Exposure ( provide pattern of energy)Develop patternBakeInspect ( fidelity, defects, registration , line width)

Equipment

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STEP and REPEAT Lithography System

F) Metrology/Inspection

Microscopy ( optical, scanning electron)

ParticlesDefect IdentificationRegistration and Overlay

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G) Chemical Processing

Subtractive ProcessesRemove materials wafer surface, including impuritiesor film components, occasionally the wafer material.

ExamplesCleanEtchStripScrub ( physical/chemical process to remove particles)

Generic Chemical Bench

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Chemical System Layout