Introduction to Focused Test, Inc. - Primetech | Home Data Sheet.pdfIntroduction to Focused Test, Inc. Presented to: Chen Goldner Primetech, Israel. July 2014 . ... • Microsoft -

COMPANY CONFIDENTIAL

Introduction to Focused Test, Inc.

Presented to:

Chen Goldner

Primetech,

Israel.

July 2014


Company Overview Focused Test Inc. founded in August 2006

Corporate HQ in Boulder Colorado, USA

– Applications Engineering in San Jose California

Incorporated Focused Test Philippines Inc (FTPI) in 2010

– Asia Applications, Development Engineering and Logistics support

– Support team: four engineers based in Makati, Metro Manila

Mission:

– To apply focused technology to testing of Power Discretes, Power IC’s and Smart Modules

– Provide customers a significant advantage in cost of test reduction compared to general purpose analog IC test platforms


FTI Executive Management Mike Morter - Chairman of the Board

• Siliconix, Attain, AOT, HP,TMT

• Co founder of TMT, designer of ASL 1000

• Hardware design/applications

Peter Hancock - President

• Schlumberger, TMT, Credence, Eagle, Best Electronics

• Sales and marketing

Gordon Leak - Director, Engineering

• Siliconix, Rolm, Octel, TMT, Credence

• Co founder of TMT, designer of ASL 1000

• Hardware design/applications

Noah Katz - Director, Operations

• Phoenix Engineering

• Operations/finance/logistics


FTI 1000 Key Features and Benefits

Tester per Channel Board Architecture

Flexible Configuration for all Device Applications

Floating Power Instruments

– Very Scalable for Multisite/Multidie Test

– Zero Multisite Test Time Overhead

– Integrated DC and AC Mosfet Tests

– Channel Boards for Discrete and IC test

– Open Source Code Function Library

– Smart Module Capable

– Very High Power Density

– Very High Voltage instruments

– Lowest Cost of Test for Power Devices


Focused Test - Target Devices

Discretes – Mosfets

– GaN and SiC Power Transistors

– Bipolar Transistors

– Zener Diodes

– TVS

Power Management IC’s/Smart Power Modules – Regulators (PWM, LDO etc)

– Motor/Solar Controllers

– Audio IC’s

– IGBTs

– Thyristors/SCR

– Sidactor/Trisil

– Diodes

– Rectifiers

– Battery Chargers

– Drivers (Mosfet, LED etc)

– Temperature Management


Focused Test Product Line Up

FTI 1000

– Power Discrete

– Intelligent Power – IC + FET

– PMIC, LED Driver, Temperature Management IC

FTI 3000

– Zener Diode Burn-in and Test

FTI 8000 – launch date TBD

– Advanced Mixed Signal


Europe Support

UK, Ireland and Scandinavia

– Inseto Ltd., Andover, UK

Italy

– Telephone contacts with ST Catania by Elexind, Milan,

but no contract yet signed.

France

– To be announced

CE Mark Certification– completed October 2008


FTI 1000 Customer Base

Aerospace

Device

Manufacturers

Subcontractor

Bourns

Installed Base >65 Systems

Mitsumi

Analog Power Inc. Avogy, Inc.

Cirtek Electronics

USiC

6

Adamant

http://www.lockheedmartin.com/index.html


Typical FTI 1000 Installations

Mosfet UIL, Rg, DC

Testing with TSK Prober

Mosfet UIL, Rg, DC testing with

SRM handler


FTI 3000:

Zener Diode Burn-In and Test


FTI 3000 Diode String Control Block Diagram:

Shows one Diode String only. Each Board drives a total of 5 Diode Strings

Vmeas

0-400V

Isource/

Vf meas

0-10mA

+

-

External

Power

Supply

Control Diode

Floating Ground

1

2

5

3

4

Isource

Vz meas

0-2.5A

Gnd

Floating Ground

In Heat Mode switch 5 is closed and all others

open. Switch 6 is also closed to measure

voltage at end of string

In Temp Measure Mode switch 5 is open and

switches 1,2,3 and 4 are closed. 2-3 ms

duration.

In Vz Measure Mode switch 3 and 4 are open

and switches 1,2 and 5 are closed

Modes of Operation

6


FTI 3000 System Block Diagram


FTI 1000 Test Head Compact, Small Foot-Print Tester-per-Board Architecture


FTI 1000 Mosfet/IGBT/Diode

DC Channel Board with Modules

DC Channel Board

AC Channel Board

Test H

ead D

C_A

C M

UX

•FPGA Controller

•CAP Bank

•USB Support

•Relay Tree S

ou

rce/D

rain

/Ga

te_A

nalo

g c

ha

nn

els

Data Cable

Handler/Prober

Com

pute

r

USB

Cables

Module 1 DVsd/SCM/SOA/

Quad VI

Module 4 High Power

100A pulsed ( exp to 200A)

Module 3

High Voltage

1,200V ( exp to 3.6kV)

Module 2 Low Leakage


FTI 1000 AC Channel Board with Modules

for AC plus DC Tests

AC Channel Board

DC Channel Board

Dual D

ie M

UX

- DX

M

•FPGA Controller

•CAP Bank

•USB Support

•Relay Tree

•Digitizer

Data Cable

Handler/Prober

Com

pute

r

USB

Cables

Module 1

Module 4 CAP Charger

Module 3

Rg Module

Module 2 Pulse Generator


FTI 1000: Mosfet/IGBT DC Tests

Test

Category

DC Tests Low Leakage

Module 2

Hi Power

Module 3

Hi V Source

Module 4

Delta Vsd

Module 1

ON Tests Rdson, Idon,

Vgs, Gfs

OFF Tests Igss, Idss

Diode Test Vsd

Gate Zener

Test

BVgso

Breakdown

Test

BVdss

Thermal

Impedance

Delta Vsd


FTI 1000: New Features introduced in 2014

High Power SOA test option

GaN and SiC Devices

– GaN Current Collapse /Dynamic Rdson test

Next Generation Rg Instrument

– Low Cg Mosfets to 100pF

– Improved Resonance Algorithm for shorter Test Times

Multidie Wafer Sort

Smart Power MDM’s

– IC + FET


GaN Current Collapse Test


Current Collapse Test Sequence


Current Collapse/Dynamic Rdson

at Vds=10V


Current Collapse Rdson Test

at Vds=400V


FTI 1000: Diode/TVS Tests Test Name Test

Symbol

Surge

Current

Module

Slot 1

Delta Vf

Heating

Module

Slot 1

Low

Leakage

Module

Slot 2

High

Power

Module

Slot 3

High

Voltage

Module

Slot 4

Dual

Channel

Digitizer

Slot 5

Forward

Voltage

Vfm

Reverse

Current

Ir

Breakdown

Voltage

Vbr

Thermal

Impedance

Zθjx

Delta Vf DVf

Surge

Current

I surge


MIL STD 750 Diode Tests

DC Tests: V(br), Vf and Ir

Surge Current Tests – Half Sine, Pulse (8.3ms, 10/1000 and others)

Peak Reverse Power Test – Provides 20 uS Pulse to 1,600V using Internal Inductors

Noise Density Test – Programmable filter response and frequency

– Three different filter types

Dynamic Impedance Test (Zzt, Zzk)

Thermal Impedance Test Zθjx Method 3101 – Heating current up to 20A continuous

– Programmable Measurement Delay Time • typical 10-100us

– Zθjx = k (Vf1-Vf2) ºC/W

Iheat x Vf3

Thermal Resistance Rθjc and Rθja – Constant Power applied up to 150W

– Wait for Thermal Equilibrium


FTI 1000: Mosfet AC Tests

AC Tests TMU

On AC Channel

Board

Digitizer Pulse GEN

Module 2

CAP

Charger

Module 3

Rg

Module 4

Inductor

Module 10uH, 100uH,

300uH, 1mH,

3mH, 10mH

Rg/Cg

Qg, Qgs, Qgd

Timing

Avalanche

(UIL/UIS)


Gate Charge Test Method High Accuracy I Source (for Gate) – Pulse Gen Module

– Ranges 25mA, 2.5mA, 250μA, 25μA

– Full CAL performed with External Standard

Dual Digitizer – 25MHz @ 12 bits (for Gate and Drain Signal Capture) – Hi Z Input (doesn’t load down Gate)

Fixture Calibration – Typical Fixture has Qg~3nC, but this can be calibrated out for very low Qg

measurements

High Speed V to I Supply 60V, 100A for Drain Conditions – CAP Charger Module

Resistive Load Mode – Resistor ladder + CAP Supply - CAP Charger

• 0.5Ω Steps from 0.5Ω to 2kΩ Load for Voltages up to 800V

– Constant Current Limiter Module for High Compliance Voltage Devices

Current Source Mode – For Voltages to 70V

Qg Turn-Off Test Method option available

Multiple Methods to give Optimum Determination of Miller Points: – Double Differential

– Change of Slope

– Intersecting Lines • Drain Waveform

• Gate Waveform


Gate Charge (Qg) Scope Display:Line Intersect Method


UIL/UIS Scope Display


UIL/UIS Setup and Datalog


Inductor Box for UIL/UIS Test


Small Signal Series Resonance (SSSR) Technique

Cg range 100pF to 14nF

Rg range 0.2 Ω to 20 Ω

Rg accuracy 5% for Rg>1Ω, Cg> 100pF

Frequency range 200kHz to 4MHz

DC level shift +/- 10 V

Three Inductor Values: 10µH, 22µH and 47µH

Rg 3.0 Instrument Specifications


At resonance the AC impedance of the LC is zero

– L from Inductor Chooser

– C from DUT Cg

Rg is calculated by:

a) digitizing the current waveform

b) compare with Zero Ohm and 5 Ohm Resistance

c) solve for Rg

Rg measurement through Standard DUT

Connections

Rg Test Method


Advantages of

Rg Series Resonance Method

Phase Shift Resonance Detection gives

Shorter Test Times

Less Sensitive to Cable/Fixture Capacitance

Current Pulse at Resonance helps eliminate

Gate Bond Defects

Gate Bias Voltage Programmable +/- 10V

Low Cost


Gate Capacitance vs. Bias Voltage


Rg vs. Bias Voltage


FTI 1000 with Mosfet TMU


TMU Test Waveform

Overall Pulse Width 1us

VDS = 30V

VGS = 10V

Time 200ns / div


TMU: TD(on) Test

Vgs @ 2V/ div

Turn on Tests

VDS = 30V

VGS = 10V

Time 5ns / div

TD(on) = 2.995ns

Trise = 2.995ns

Vds @ 5V/ div


TMU: TD(off) Test

Turn off Tests

VDS = 30V

VGS = 10V

Time 5ns / div

TD(off) = 6.745ns

Trise = 13.620ns


Manual Test Station

Tests Diodes and Mosfets

Safety Cover

DUT Fixture Interface

pA Leakage Instrument

Diode Orientation


Tester-per Channel Board Architecture

Low Base System Overhead/Cost – No system backplane – adds cost/reduces UPH

Single Board System for Engineering or Single Site Test

Multisite System created by adding Channel Boards

Test Programs automatically scale across Multiple Channel Boards and Test Sites

Highly Scalable Architecture


FTI 1000 2 Site Index Parallel Example:

Mosfet Test with Turret Handler

Feeder

Good Bad

FTI 1000 AC-Rg,Ciss,Qg,UIL AC Channel Board with Digitizer

Pulse GEN Module

CAP Bank Module

Rg Module

FTI 1000 DC DC Channel Board

Low Leakage/Source Module

High Voltage Module

High Power Module

Inductor Box 6 Programmable Values


FTI 1000 4 Site Index Parallel Example:

Mosfet Test with Turret Handler

Feeder

Good Bad

FTI 1000 DC-DeltaVsd DC Channel Board


DVsd Module

FTI 1000 AC- UIL,Qg,Rg AC Channel Board

Pulse GEN Module

CAP Bank Module

Digitizer

FTI 1000 DC_Final Test DC Channel Board


High Voltage Module

High Power Module


FTI 1000 DC_QA DC Channel Board


High Voltage Module

High Power Module


FTI 1000 5-Site Index-Parallel Test:

DVsd, DC, UIL, Qg, Rg, Cg/Ciss

Feeder

Good Bad

FTI 1000 DC-DeltaVsd DC Channel Board


DVsd Module

FTI 1000 AC- UIL/Qg AC Channel Board

Pulse GEN Module

CAP Bank Module

Digitizer

FTI 1000 DC1 DC Channel Board


High Voltage Module

High Power Module


FTI 1000 DC2 DC Channel Board


High Voltage Module

High Power Module

FTI 1000 AC- Rg/Ciss AC Channel Board

Pulse GEN Module

Rg Module

Digitizer

Turret Handler


Multi-Die Wafer Sort and Lead Frame

Mosfet Test Solutions • Multi Die Module (MDM) converts FTI 1000 to x4, x8 and

x16 DC and AC Mosfet test

• Each MDM has four Nano Ammeters

• Dedicated Nano Ammeter per die

• Quad VI (QVI) provides a dedicated VI per DUT

• High Voltage Isolation Relay per channel

isolates shorted die so other die can still be measured accurately.

• Dedicated amplifier for Rds measure per channel

• Multidie Rdson/Ids max: 100A; BV max: 1kV


FTI 1000 testing Quad Die on

TEL P8 Prober

MDM


FTI 1000 Multidie with Multi Die

Module (MDM) on P8 Prober:

MDM


FTI 1000: Quad Die Module:

4, 8, 12 and 16 Die Wafer Test DC Tests High

Power

Source

High

Voltage

Source

Quad VI KFET Solid

State

Switches

NanoAmmeters

(<40uA fs)

High/Low

Sense Bus

Rdson, Idon,

Vsd

Adjacent Die

-Low Rdson

Vgs, BVgso

Igss

BVdss, Idss

Gfs


FTI Studio Software Architecture

Dot Net based Open System Software

– Multi-threaded Structure enables Efficient Multisite Testing

• True Parallel and Index Parallel Testing,

– Open System Architecture

• Easy to add/build New GUI Tools with Plug-n-Play

– FTI Studio uses Industry Standard Software where possible

• National Instruments – ‘Measurement Studio’

• Microsoft - ‘Visual Studio’, Windows o/s

• XML


Test Program Development with FTI Studio:

Open Source Architecture

C# Programming Language

– High Reliability

– Simple Coding similar to C or C++

– Allows Plug-n-Play and User Extensions to Tester

Extensive Discrete and IC Test Function Library

– Open-Source Test Function Library

– Extensive library of common test functions

– Set Up Screens allow easy Device Test Program

Development


Easy Test Program Generation using

Discrete Test Function Library


High Power SOA Option for FTI 1000


High Power SOA Option for FTI 1000

DIGITAL CONTROL / SIGNAL MEASUREMENT / POWER

REGULATION

AC TO DC POWER CONVERSION


Focused Test New Product Road Map:2014 Rg version 3.0

Shorter Test Time

lower Cg range: 100pF min.

Kelvin Contact Resistance Correction

Multidie Test for x4, x8 and x16 Die

DC Multidie: 1kV, 30A max

UIL Serial Die: 100A, with Crowbar Protection (Fairchild only)

Rg – Serial Die

Power Management IC/Smart Module/DrMOS Test for FTI 1000

Digital Instrument – 8 channels, 100 MHz Data Rate


Focused Test New Product Road Map:2015

High Current UIL Board

UIL to 300A; 1,500V

UIL Short Circuit/Crowbar Protection for wafer sort

Operates with Existing AC Channel Board

Next Generation AC Channel Board for IGBT’s:

UIL to 100A; 2,500V

Qg to 100A; 1,200V

Production version of SOA option

High Sample Rate Digitizer

for trr, Qrr, Qoss, Eon/off, dV/dt

Documents

Introduction to Focused Test, Inc. - Primetech | Home Data Sheet.pdfIntroduction to Focused Test, Inc. Presented to: Chen Goldner Primetech, Israel. July 2014 . ... • Microsoft -