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Claudio Talarico Gonzaga University
Intrinsic Capacitance BW – Supply Current Tradeoff
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 2
The Culprit
§ In practical circuits, the presence of capacitance prevents us from building circuits that can run “infinitely” fast – Sometimes inductors can be used improve the situation
iC+vC- dt
dvCi CC =
§ Intuition – High frequency results in large dvC/dt and large iC
– Capacitor becomes a “short” for high frequencies
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 3
Modeling MOSFET Capacitance (1)
§ To predict the frequency response of our CS amplifier, we need to understand the capacitances associated with the MOS device
§ We will first look at "intrinsic gate capacitance" – Intrinsic means that this capacitance is unavoidable and required for
the operation of the device
§ There are plenty of “extrinsic” capacitances as well – We'll neglect these for the time being and discuss them in detail next
lecture § To model gate capacitance, we must distinguish the MOSFET’s
operating regions – Transistor on
• Triode and active regions – Transistor "off"
• Sub-threshold operation
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 4
Transistor Off
§ There is no conductive channel – Gate sees a capacitor to substrate, equivalent to the series
combination of the gate oxide capacitor and the depletion capacitance
§ If the gate voltage is taken negative, the depletion region shrinks, and the gate-substrate capacitance grows – With large negative bias, the capacitance approaches WLCOX
substrate
source drain
gate Cgc
Ccb No Inversion Layer
Depletion Layer
D S G
Cgc Ccb =
Cgc ⋅Ccb
Cgc +Ccb
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 5
Transistor in Triode Region
§ Gate terminal and conductive channel form a parallel plate capacitor across gate oxide CGC= WLεox/tox= WLCox – We can approximately model this using lumped capacitors of
size ½ CGC each from gate-source and gate-drain • Changing either voltage will change the channel charge
§ The depletion capacitance CCB adds extra capacitance from drain and source to substrate – Usually negligible (see above comment)
Electrons respond to gate via the S and D; this effectively “short out” the effects of CCB (Bulk charge is not changing with VGB: any increment in gate charge is mirrored in the inversion layer )
1/2Cgc
1/2Cgc
Cgd =
Cgs =
Cgs and Cgd model Cgc Cgb models Ccb
Cgd
Cgs
Cgb
substrate
source drain
gate Cgc
Ccb
Inversion Layer Depletion Layer
D S G
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 6
Transistor in Saturation Region § Assuming a long channel model, if we change the source voltage
– The voltage difference between the gate and channel at the drain end remains at Vt, but the voltage at the source end changes
– This means that the "bottom plate" of the capacitor does not change uniformly
§ Detailed analysis shows that in this case Cgs=2/3WLCox
– For your amusement you can derive this; write Q(V(y)) and integrate from 0 to L
§ In the long channel model for active operation, the drain voltage does not affect the channel charge – This means Cgd=0 in the saturation region!
• Neglecting second order effects and extrinsic caps, of course
substrate
source drain
gate Cgc
Ccb
Inversion Layer Depletion Layer
D S G 1/2Cgc
1/2CgcCgs=⅔WLCox
Cgd≈0
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 7
Intrinsic MOS Capacitor Summary
Cgd
Cgs
Cgb
Subthreshold Triode Saturation
Cgs 0 ½ WLCox 2/3 WLCox
Cgd 0 ½ WLCox 0
Cgb 0 0 1
11−
""#
$%%&
'+
oxCB WLCC
WLx
Cd
SiCB
ε= xd is the width of the depletion region at the silicon surface
xd (VGB ) =2εSi (Vbi −VGB )
q1Na
+ 1Nd
⎛⎝⎜
⎞⎠⎟= xdo 1− VGB
Vbi
Vbi =KTqln NaNd
ni2
§ For Vbi ≤ VGB ≤ Vt
xdo !
2εSiVbiq
1Na
+ 1Nd
⎛⎝⎜
⎞⎠⎟
source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 8
Performance Considerations (1)
§ Suppose we want to maximize the bandwidth of our circuit – And keep the current consumption (ID) as low as possible
§ Further assume that Ri, R and Av0 are fixed – Fixed by the particular application in which the circuit is used
§ For the bandwidth, we can write
Rga;VLWCg;
WLCRCR mvOVoxm
oxigsi
dB =⋅µ=⋅
==ω 03
3211
OViv
dB VRa
RL
⋅⋅
⋅µ=ω⇒0
23 23
Technology Specs Design “knob”
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 9
Performance Considerations (2)
§ For the current we can write
Rga;VIg mvOV
Dm == 0
2
Specs Design “knob”
OVv
D VRa
I ⋅=⇒ 0
21
• Observations – Larger VOV means larger bandwidth – Unfortunately larger VOV also results in larger ID
• Part of your job as an analog designer is to choose VOV such that you get sufficient bandwidth while using as little current as possible
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 10
Performance Considerations (3)
§ Even though we've come to this observation using a very simple example, this tradeoff tends to hold in general – Of course, additional considerations and second order dependencies
will factor in as you learn more about analog circuit design…
§ The reasons behind this tradeoff lie in the fundamental properties of the transistor itself
§ To see this, think about what we really want from the MOSFET – Large gm without investing much current
• I.e. large gm/ID – Large gm without having large Cgs
• I.e. large gm/Cgs
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 11
gm/ID and gm/Cgs
VOV
gm/ID
gm/Cgs
OVD
m
VIg 2=
223LV
Cg OV
gs
m µ=
VOV small VOV large gm/ID Large Small gm/Cgs Small Large
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 12
Product
§ In cases where we want to get the "best of both worlds", it is interesting to look at the product of our two figures of merit
VOV
gm/ID
gm/Cgs
gm/ID*gm/Cgs
23LC
gIg
gs
m
D
m µ=⋅
• While this result looks boring, it shows that using smaller channel lengths improves circuit performance – Either or both speed and current efficiency
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 13
Scaling Impact
§ Thanks to "Moore's Law" feature sizes and thus the available minimum channel length has been shrinking continuously – Lmin has decreased roughly 2x every 5 years – Lmin=10mm in 1970, Lmin=45nm in 2007
§ From the above discussion, it is clear that we can exploit technology scaling in different ways – Build faster circuits (higher gm/Cgs), while keeping power efficiency
constant (gm/ID) • E.g. A/D converter for a disk drive - want to maximize bandwidth/
throughput – Build more efficient circuits (higher gm/ID), while keeping the
bandwidth constant (gm/Cgs) • E.g. A/D converter for video signals - bandwidth fixed by a certain
standard
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 14
-0.2 -0.1 0 0.1 0.2 0.3 0.40
5
10
15
20
25
30
35
40
VOV
[V]
g m/I D
[S/A
]
Real MOSFET2/V
OV (EE114)
BJT (q/kT)
Aside: gm/ID of a “Real Transistor”
More Advanced Classes in
Design
• Long channel predication (2/VOV) is fairly close to “real device” for VOV > 150mV
• Unfortunately gm/ID does not approach infinity for VOV à 0
• In this course limit VOV >= 150mV in to avoid non-physical design outcomes
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 15
Aside: Transit Frequency (ωT)
§ The transit frequency of a transistor has "historically" been defined as the frequency where the magnitude of the common source current gain (|io/ii|) falls to unity
iiio
(Biasing not shown)
• Ignoring extrinsic capacitance, it follows that
223LV
Cg OV
gs
mT
µω ==
• Incidentally, this metric is identical to the figure of merit we considered on the previous slides
Source: B. Murmann
Fall 2014 – Intrinsic Capacitance; BW – Supply Current Tradeoff 16
Aside: Transit Frequency Interpretation
§ The transit frequency is only useful as a figure of merit in the sense that it quantifies gm/Cgs
§ It does not accurately predict up to which frequency you can use the device – At high frequencies, many assumptions in our "lumped" transistor
model become invalid – Rule of thumb: lumped model is good up to about ωT/5
§ At higher frequencies, device modeling becomes more challenging and many effects depend on how exactly you layout and connect the device
Source: B. Murmann