Embed Size (px)
Citation preview
©2017 System Plus Consulting | Integrated Passive Devices Review 1
Integrated Passive Devices ReviewBroadcom, Qorvo, Skyworks, STMicroelectronics, IPDiAMEMS report by Stéphane ELISABETHDecember 2017 – Version 1
©2017 System Plus Consulting | Integrated Passive Devices Review 2
Table of ContentsOverview / Introduction 3
o Executive Summaryo Reverse Costing Methodology
Company Profile 6o Qorvo, Broadcom Limited, Skyworks Solution, STMicroelectronics,
Murata Integrated Passive Solutions (Former IPDiA)o Smartphones Teardown:
Xiaomi Mi6, Samsung Galaxy S7, Samsung Galaxy S8, Apple iPhone Xo STMicroelectronics technologyo IPDiA Technologyo IPD applications
Market Analysis 45
o RF Substrate
o Substrate by Application
o Glass Substrate Market for RF devices
Physical Comparison 45
o Materials Comparison
o Passives density per applicationso Process Comparisono Cost Comparison
Physical Analysis 47
o Synthesis of the Physical Analysis
o RF IPD for Wifi/Bluetooth Application 50
o Qorvo’s IPD 51
Die Views & Dimensions
Die Top Structure
Die Electrical Structure
Die Cross-Section
Package Opening
Die Process
o Skyworks’s IPD 74
o STMicroelectronics’ IPD 101
o RF IPD for LTE/HSPA/EDGE/GSM 129
o Broadcom’s IPD 130
o Murata’s IPD 141
o Skyworks’ IPD 160
o RF IPD for ISM/SRD 179
o STMicroelectronics’ IPD 180
o iPDIA’s IPD 206
o Skyworks’ IPD 160
Manufacturing Process Flow 238o Global Overview
o RF IPD for Wifi/Bluetooth Application 240o Wafer Fabrication Unito Front-End Process Flow
o RF IPD for LTE/HSPA/EDGE/GSM 258
o RF IPD for ISM/SRD 276
Cost Analysis 284o Yields Explanation & Hypotheseso RF IPD for Wifi/Bluetooth Application 287
o Qorvo’s IPD Die 288 Main Steps of Economical Analysis Wafer Front-End Cost Wafer Front-End Cost per process steps Back-End 0 Cost: Bumping & Dicing Back-End Final Test Component Cost
o Skyworks’s IPD 297
o STMicroelectronics’ IPD 306
o RF IPD for LTE/HSPA/EDGE/GSM 315
o Broadcom’s IPD 316
o Murata’s IPD 325
o Skyworks’ IPD 331
o RF IPD for ISM/SRD 337
o STMicroelectronics’ IPD 338
o iPDIA’s IPD 347
o Skyworks’ IPD 356
Estimated Price Analysis 365
Company services 367
Same structure for all devices
Same structure for all Applications
Same structure for all devices
©2017 System Plus Consulting | Integrated Passive Devices Review 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
• This comparative technologies & cost study has been conducted to provide insight on technology & costing data forRF Integrated Passive Devices (IPD) working on different ranges of communication frequency. The report includesthe study of seven IPDs found in flagships smartphones (Apple iPhone X, Samsung Galaxy S7 & S8, LeTv Le Max 2Pro) or on the market. This report provides a deep analysis of RF IPD containing inductance, resistor, andcapacitance. Its complete System Plus reports portfolio along with decoupling capacitors IPD.
• This comparative technology study was conducted to provide insight regarding technology and cost estimates for RFIPDs in various applications. This report studies nine devices in three applications (Wifi/Bluetooth/cellularcommunication (LTE/HSPA/GPRS/EDGE), industrial, and scientific/medical short-range devices (ISM/SRD), where fiveplayers (Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics) are active. Besides the ISM/SRD applications,the other devices are extracted from recent smartphones like the new Apple iPhone X.
• All devices are analyzed in detail, and electrical structures of each component are presented. Sizes and technologiesare extracted to provide a large sampling of various IDMs’ technical and economical choices. We also provide anoverview of passive integration techniques for inductors, resistors, and capacitors.
• This report includes a description of each component, its major characteristics (substrate type (GaAs, silicon, glass),passivation layers, passive integration, etc.) and a comparison of all devices analyzed. Also included is amanufacturing cost estimate for the IPDs.
Executive Summary
©2017 System Plus Consulting | Integrated Passive Devices Review 4
Overview / Introduction
Company Profile & Supply Chain o Qorvoo Broadcomo Skyworkso STMicroelectronicso Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Smartphones Teardown – Apple iPhone X
Apple iPhone X – Front & Back View©2017 by System Plus Consulting
Apple iPhone X – Opened View©2017 by System Plus Consulting
Apple iPhone X – Board Extracted©2017 by System Plus Consulting
©2017 System Plus Consulting | Integrated Passive Devices Review 5
Overview / Introduction
Company Profile & Supply Chain o Qorvoo Broadcomo Skyworkso STMicroelectronicso Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Package Opening
©2017 System Plus Consulting | Integrated Passive Devices Review 6
Overview / Introduction
Company Profile & Supply Chain o Qorvoo Broadcomo Skyworkso STMicroelectronicso Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Integrated Passives Devices Applications
©2017 System Plus Consulting | Integrated Passive Devices Review 7
Overview / Introduction
Company Profile & Supply Chain o Qorvoo Broadcomo Skyworkso STMicroelectronicso Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Glass Material Market for RF devices
©2017 System Plus Consulting | Integrated Passive Devices Review 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Materials Comparison
©2017 System Plus Consulting | Integrated Passive Devices Review 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Synthesis of the Physical analysis
©2017 System Plus Consulting | Integrated Passive Devices Review 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ IPD – Package/Die View & Dimensions
©2017 System Plus Consulting | Integrated Passive Devices Review 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ IPD – Die Structure – Top view
©2017 System Plus Consulting | Integrated Passive Devices Review 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ Bluetooth IPD – Die Structure – Electrical Structure
Equivalent Circuit Schematic View
©2017 System Plus Consulting | Integrated Passive Devices Review 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ Bluetooth IPD – Die Structure – Top view
©2017 System Plus Consulting | Integrated Passive Devices Review 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ Bluetooth IPD – Die Structure – Top view
©2017 System Plus Consulting | Integrated Passive Devices Review 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ Bluetooth IPD – Die Cross Section
©2017 System Plus Consulting | Integrated Passive Devices Review 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Qorvo’s WiFi IPDo Skyworks’s WiFi IPDo STMicroelectronics’
Bluetooth IPDo Broadcom’s LTE IPDo IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
STMicroelectronics’ Bluetooth IPD – Die Cross Section – Capacitance
©2017 System Plus Consulting | Integrated Passive Devices Review 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo MEMS Front-End Process
Cost Analysis
Selling Price Analysis
Global Overview
©2017 System Plus Consulting | Integrated Passive Devices Review 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo MEMS Front-End Process
Cost Analysis
Selling Price Analysis
Qorvo’s IPD – MEMS Process Flow
©2017 System Plus Consulting | Integrated Passive Devices Review 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo MEMS Front-End Process
Cost Analysis
Selling Price Analysis
Qorvo’s IPD – Die Process Flow 1/4
©2017 System Plus Consulting | Integrated Passive Devices Review 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Supply Chaino Yieldso Front-End Cost.o Back-End Costo Component Cost
Selling Price Analysis
STMicroelectronics’ IPD – Wafer Front-End Cost
©2017 System Plus Consulting | Integrated Passive Devices Review 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Supply Chaino Yieldso Front-End Cost.o Back-End Costo Component Cost
Selling Price Analysis
STMicroelectronics’ IPD – Component Cost
©2017 System Plus Consulting | Integrated Passive Devices Review 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Financial Ratioso Manufacturer Price
STMicroelectronics’ IPD – Estimated Manufacturer Price
