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Sep, 2018
Industry Leading Provider of Outsourced
Semiconductor Assembly, Test & Bumping Services
Safe Harbor Notice
This presentation contains certain forward-looking statements. These forward-looking
statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’
‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by
discussion of, among other things, strategy, goals, plans or intentions. These
statements include financial projections and estimates and their underlying
assumptions, statements regarding plans, objectives and expectations with respect to
future operations, products and services, and statements regarding future
performance. Actual results may differ materially in the future from those reflected in
forward-looking statements contained in this document, due to various factors. Actual
results may differ materially in the future from those reflected in forward-looking
statements contained in this document, due to various factors. Further information
regarding these risks, uncertainties and other factors are included in the Company’s
most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange
commission (the “SEC”) and in the Company’s other filings with the SEC.
2
Group Snapshot
Manufacturing footprint in China & Taiwan
Shanghai, China
Unimos (JV with Unigroup)
Hsinchu, Taiwan
ChipMOS Taiwan
Tainan, Taiwan
ChipMOS Taiwan
Overview
(1) As of June 30, 2018
Key milestones
2001 2000 2011 2014 2018 2015 2016
• Started TCP
package for
LCD driver IC
and 12" wafer
assembly and
testing
business
• ChipMOS
Bermuda listed
common shares
on the Nasdaq
exchange
market
• Set up 12”
Gold bumping,
Cu RDL, MCP,
Cu pillar, MCB
bumping and
WLCSP line
• Listed ChipMOS Taiwan on TWSE
• Announced the merger between ChipMOS Taiwan and ThaiLin
• Invested in JMC and Ryowa
• ChipMOS
Taiwan merged
ThaiLin
• Announced
strategic
partnership
with Tsinghua
Unigroup
• ChipMOS
Taiwan merged
ChipMOS
Bermuda and
issued ADS
(Nasdaq Ticker:
IMOS)
2017
• Completed
whole
investment
tranche of
Shanghai
facility in Q1
Founded : 1997
Headquarters : Hsinchu, Taiwan
Ticker Symbol : TWSE : 8150.TW
NASDAQ : IMOS (ADS)
Employees(1) : Taiwan : 5,955
3
• ChipMOS
Taiwan
formed
Shanghai
JV with
Tsinghua
Unigroup
Corporate Holding Structure
4
紫光宏茂微电子(上海)有限公司 Unimos Microelectronics (Shanghai) Co., Ltd.
Strategic investors led by Tsinghua Unigroup invested RMB 498.43 million for ChipMOS Shanghai-JV
closed on March 24, 2017, and capital injection done in March 2018, ChipMOS Shanghai received a
total RMB 1,074 million in funding
ChipMOS Shanghai already changed company name to Unimos on Jul/4’18, and new logo is in
registry process
ChipMOS is not consolidating Unimos post the JV closure. UniMOS becomes a long-term investment
of ChipMOS and recognized profit/loss generated pro rata.
100%
45% 7% 48%
Employee and strategic investors ChipMOS BVI
ChipMOS Positioned to Expand Market Leadership
Memory DDIC
Core Technology
Mixed Signal
Offer turn-key solutions for core technology product segments
Dedicated OSAT capacity and strategically focused on collaboration-driven growth
Leverage current partnerships to expand customer base
5
Q2’18: 9%
Q2’18: 47% Q2’18: 44%
6
Capture High Growth Market Position
Major OSAT for Taiwan niche DRAM makers
Supporting various automotive, display, smart speaker, and gaming products
NOR demand from display, automotive and entertainment center segments remains
strong, utilizing full wafer test capacities
Expanding NAND product type offerings
Added Cu based plating capacity to service non-driver customers
Integrating wafer bumping and assembly core technologies, to support multiple
growth opportunities in RDL, WLCSP, flip chip, power IC, & E-compass etc.
Partnering with key customer to capture new high-end smartphone demand and in
volume production since 3Q 2017
Expanding to multiple products using core technologies
Market penetration to proliferate across end customer offerings
Optical
Sensor
Memory
Mixed-
Signal
Technology Update – Bumping Trend for Memory
PC/Server DRAM is migrating from wire bond BOC to flip-chip package
Cu pillar bumping technology has been used on flip chip packaging
RDL has been used on multi-chip packaging for functionality or higher density
Re-Distribution Layer + wire bond
Copper Pillar Bumps
Re-Distribution Layer
Copper Pillar flip chip Bonding
Chip
substrate
Cu pillar Molding
Compound
7
COF Growth
Stable demand of TV COF for continued 4K/UHD TV uptake higher penetration ratio
12” fine pitch COF new demand is coming from new panel features of smartphone, 18:9 format and narrow bezel
TDDI Transition in 2018
Integrating touch and DDIC function in one chip, more than x3 times test time compared to discrete DDIC.
Currently COG is majority, but some COF is emerging now
High TDDI penetration and strong demand in H2 of 2018
OLED Proliferation
>4 years 12” bumping of OLED driver production experience for Korea customer
Turn-key services of OLED driver, including 12” Au bumping & 12” COF, of other Korea customer is ramping up in H2 2018
Capturing the coming China OLED driver business with non-Korean OLED driver customers
DDIC
Capture High Growth Market Position of Display Driver
8
Technology Update – Bumping Trend for DDIC
Driving for fine pitch and smaller bump size capability together with COF process in order
to fulfill the application like higher resolution, bezel-less phone or some OLED.
Fine Pitch Au Bumping COF Tape Inner Leads / Bonding
9
Diversified Product Portfolio on Higher Growth Markets Q218
10
DDIC
38% Smart Mobile
20% Consumer
9% Computing
22% 11%
TV Auto/Industry
Smart phone
Tablet
Wearable device
DSC, STB
Pen driver
Game
Smart speaker
PC/Laptop
Server, SSD
Hard disk
Crypto-mining
UHD/4K TV Industrial PC
In-car Infotainment
ECU, ADAS
Memory & Mixed-signal
Infotainment Multimedia Module
(DRAM, NOR Flash, DDIC)
Radar system In-car sensor
(DRAM, NOR Flash)
ADAS (DRAM, NOR Flash)
Communication (DRAM, NOR Flash)
Growth in New Advanced Applications Market
11
ECU (NOR Flash)
ChipMOS already was qualified by 7 of top 10 automotive electronic component suppliers
Fingerprint sensor
3D facing sensing
DDIC
DDIC TDDI OLED driver
Low power,
mobile DRAM
Load switch
E-compass, Gyro, …
Low power,
mobile DRAM
NOR (TDDI, OLED)
High ChipMOS Content in New Smartphones
12
Load switch
E-compass, Gyro, …
16:9 18:9 Narrow Bezel
Full screen
More product content
Higher ASP
More Intensive Process = Higher ASPs
13
Conversion of 12” fine pitch COF for full screen panel and 18:9 panel
TDDI is ramping up
Leverage DDIC Leadership Position
14
YoY: >30%
QoQ: >12%
QoQ: 18%
Turnkey, High-yield, OSAT Partner of Choice
15
Memory Supply Chain
Design Wafer probing
(ChipMOS)
Ass’y/Test
(ChipMOS) Module Foundry
Design Foundry Wafer probing
(ChipMOS)
COF/COG
(ChipMOS)
Bumping
(ChipMOS)
COF film
Manufacture
Panel Module
DDIC Supply Chain
D D I C
16
Q2’18 Financial Highlights
Q2’18 Revenue Breakdown (unaudited)
By Manufacturing Segment By Product
17
Q2’18 Capital Expenditures (unaudited)
18
CapEx
3,123.3
4,702.7
2,241.8
1,395.3
977.7
0
500
1,000
1,500
2,000
2,500
3,000
3,500
4,000
4,500
5,000
2016 2017 1H 18 Q2'17 Q2'18
( NT$ M)
Testing
38.3%
Assembly
6.0%
LCD
Driver
46.7%
Bumping
9.0%
Q2’18 CapEx Breakdown
19
Market Information
New Smartphone Features Driving DDIC Revenue Growth
Source: WitsView Jul. & Aug., 2017
2015 - 2020 AMOLED & TDDI Penetration in Global Smartphone
Full-screen/18:9 switches COG to fine pitch COF and AMOLED require COF capacity
Integration of new smartphone features, including TDDI and fine pitch COF, driving need for
added test capacity
20
UHD/4K TV Growth DDIC COF Capacity Demand
21
2015 - 2020 UHD TV growth
Source: Futuresource consulting, Apr.’2016 & HIS market Jan.’2017
UHD(4K) TV & OLED propel significant memory/storage market growth in set top boxes, TV,
home entertainment systems
Market penetration of UHD TV accelerating, & drives DDIC COF demand increasing
New Applications Driving Increased NOR Demand
Source: HIS, Gartner, Synaptics, & summarized by Haitong Securities, 2017
New end-product & application drive NOR flash demand, and particularly wafer test capacity
Margin benefit from fully utilized, fully depreciated wafer testers for NOR flash
22
Company Website
http://www.chipmos.com
23