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  • 8/22/2019 imarc_cfp_v4_final

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    IEEE MTT-S International Microwave

    and RF Conference

    14-16 December 2013, New Delhi, India

    General Co-Chairs

    Shiban K. Koul

    Indian Inst. Of Tech. Delhi

    Karl Varian

    Raytheon

    Technical Program Co-Chairs

    Ananjan Basu

    Indian Inst. Of Tech. Delhi

    George E. Ponchak

    NASA Glenn Research Center

    Finance Co-Chair

    Alaa Abunjaileh

    EADS AstriumMahesh Abegaonkar

    Indian Inst. Of Tech. Delhi

    Publications Co-Chairs

    Jozef Modelski

    Warsaw Univ.of Tech.

    K J Vinoy

    Indian Institute of Science

    Local Arrangements

    Samir El-Ghazaly

    Univ. of Arkansas

    Enakshi Sharma

    Delhi University

    Mithilesh KumarRajasthan Technical University

    Publicity

    Sudhir Singh

    Agilent Technologies

    Madhumita Chakravarti

    RCI, DRDO

    Industry Liaison

    Rakesh Malik

    ST Microelectronics

    Exhibition

    Amit Sharma

    AmitecElectronics

    Suneet Tuli

    IIT Delhi

    Workshops

    Debatosh Guha

    IRPE Kolkata

    Vishal Gupta

    Agilent Technologies

    Webmaster

    Tim Lee

    First Call For PapersThe IEEE Microwave Theory and Techniques Society (MTT-S) with technical co-sponsorship

    from The Institution of Electronics & Telecommunication Engineers (IETE), New Delhi, India

    announces the 2013 IEEE MTT-S International Microwave and RF Conference (IMaRC) to be

    held December 14-16, 2013 in New Delhi, India. This new conference will be held annually in

    India to provide a forum for the international community of microwave engineers to meet and

    present their latest technical achievements in microwave and RF components, circuits, systems,

    and modeling methods. The conference will have two parallel session tracks and a poster sessionwith a technology exhibit and workshops. The IMaRC invites papers on all areas of microwave

    and RF technology, including, but not limited to:

    Passive components (filters, couplers, transitions, etc.) Novel waveguides, and new phenomena in waveguides Hybrid and monolithic active components (amplifiers, mixers, oscillators etc.) RF packaging and package modeling Semiconductor devices and component modeling for RF applications RF MEMS and microsystems Microwave and millimeter-wave systems Radar, SAR and microwave imaging Electronic warfare and other military applications of RF/Microwaves High power transmitters Emerging areas (nanotechnology, biomedical applications etc.)

    Papers describing technologies that enable Radio and Wireless Systems are welcome including:

    Wireless and cellular architectures, circuits, and components Cognitive and adaptive radio Transmitter Components Receiver Components Highly Integrated Packaging Active antennas and Phased arrays MIMO antennas Signal Generation and Modulation Circuits Methods of Maintaining Signal Integrity Optical/Fiber Techniques EMI/EMC

    Topics that are well-known to be covered by other IEEE societies, such as passive antennas,

    antenna measurements like near-field & CATR, and DSP and coding aspects of MIMO and other

    communication systems , will not be suitable for this conference.

    Paper submission instructions will be found at http://imarc-ieee.org/ . All submissions must beproperly formatted in the two-column IEEE format and be between three and four pages with the

    figures included. Only electronic submissions in pdf format will be accepted for review. Authorsshould indicate their preference for oral or poster presentation, but the conference chairs may

    place the paper in the best place. All submissions must be received by 1 August 2013.

    Submissions will be evaluated based on novelty, significance of the work, technical content,

    interest to the audience, and presentation. Measured data should be provided to verify component

    and circuit designs.