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January 2014 EB83_01.0 iCE40LM4K Sensor Evaluation Kit User’s Guide

iCE40LM4K Sensor Evaluation Kit - Lattice Semiconductor/media/LatticeSemi/Documents/UserManuals/EI/... · iCE40LM4K Sensor Evaluation Kit ... Set /android_sdk/platform-tools

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January 2014EB83_01.0

iCE40LM4K Sensor Evaluation KitUser’s Guide

2

iCE40LM4K Sensor Evaluation Kit

IntroductionThank you for choosing the Lattice iCE40LM4K Sensor Evaluation Kit. This guide describes how to begin using the iCE40LM4K Sensor Evaluation Kit, an easy-to-use platform for rapidly prototyping system control designs using an iCE40LM FPGA. Along with the evaluation board and accessories, this kit includes a pre-loaded demo that allows communication between the iCE40LM4k Sensor Evaluation Kit and a Qualcomm Snapdragon APQ8060A board (not included in the package and may be purchased from Intrinsyc). The content of this user’s guide includes an overview of the features of the board and a step by step guide to using the iCE40LM4K Sensor Evaluation Kit with the Qualcomm Snapdragon APQ8060A.

Figure 1. iCE40LM4K Daughter Card

CAUTION: Static electricity can severely shorten the lifespan of electronic components. Be careful when handling the iCE40LM4K Sensor Evaluation Kit to prevent damage from ESD.

IR Tx

Humidity and Temperature

IR Rx

HallRGB Ambient LightProximity

Barometer

Accelerometer

GyroscopeiCE40LM4K

Compass

3

iCE40LM4K Sensor Evaluation Kit

FeaturesThe iCE40LM4K Sensor Evaluation Kit includes:

• iCE40LM4K Evaluation Board – The ICE40LM4k Evaluation Board features the following on-board compo-nents and circuits:

– iCE40LM4K Device in the 25 WLCSP Package– High-Current LED Output– Infrared Transmit and Receive – Barcode LED/Emulation– Configuration SPI Flash– On-board FT2232HL for USB Programming/Interface– Numerous Sensors– Proximity Sensor (AMS-TAOS TMD27711)– RGB Color, Infrared, and Temperature Sensors (Maxim MAX44006)– Barometric Pressure Sensor (Bosch BMP085)– Accelerometer and Gyro (ST Micro LSM330DLC)– Magnetometer/Compass/Accelerometer (ST Micro LSM303DLHCTR)– Humidity and Temperature Sensor (Sensirion SHT20)– Hall Sensor (Rohm BU52051NVX)

• SMA Connector for External Clock Input

• On-Board Oscillator

In addition to the iCE40LM4K Evaluation Board, an adapter board for connection to Dragon Board and a connector cable are also included. This secondary PCB connected by a cable allows the iCE40LM4k Sensor Evaluation Kit to interface with a Qualcomm 8060A Dragon Board (Dragon Board is available separately and not sold by Lattice). When connected properly, a sensor hub demonstration can be conducted.

4

iCE40LM4K Sensor Evaluation Kit

Sensor Hub Demo SetupThe demo setup consists of the Intrinsyc Dragon Board Gen2, Sensor Fusion Board, and flexible connecting cable.

To set up the Sensor Hub demo, connect the Sensor Fusion Board to the Intrinsyc Adapter board which is placed on the Intrinsyc Dragon Board Gen2 as shown in Figure 2

Figure 2. Intrinsyc Dragon Board Gen2

Sensor Fusion Flexible Connecting Intrinsyc Dragon Board

Board Cable

OTG Mini Touch Screen Intrinsyc DragonBoardPower Supply

5

iCE40LM4K Sensor Evaluation Kit

Sensor Fusion Board Default Jumper SettingsThis section provides the details of the Sensor Fusion Board jumper settings:

• Set J2 jumper on OSC mode in EXT CLK.

• Set J4 jumper on BAR.

• Set J5 jumper on HALL.

• Do not set J7 jumper.

• Set J8 jumper.

• Do not set J10 jumper.

• Do no set J11 jumper.

• Set J12 jumper.

• Do not set J15 jumper.

• Set both the J16 jumpers vertically.

• Set jumper on IDD-CORE and IDD-TOP (J18 & J19).

• Set VCCIO0 (J22) to 1.8V.

• Set VCCIO2 (J17) set to 3.3V.

• Set J20 jumper on USB mode.

Connecting the Sensor Fusion Board to the Intrinsyc Dragon BoardTo connect the Sensor Fusion Board to the Intrinsyc Dragon Board

1. Power-off the Intrinsyc Dragon Board.

2. Connect the Intrinsyc Dragon Board end of the processor configuration cable to the Intrinsyc Adapter board mounted on the Intrinsyc Dragon Board.

i. The marked pin of the cable connector should be connected to pin 1 of the connector on the Intrinsyc Adapter board near the white dot.

3. Connect the smaller connector on other end of the cable to the J21 connector of the Sensor Fusion Board.i. The marked pin of the cable connector should be connected to pin 1 of the J21 connector near the

white dot.4. Connect the larger connector on the other end of the cable to the J13 connector of the Sensor Fusion Board.

i. The marked pin of the cable connector should be connected to pin 1 of the J21 connector near the white dot.

5. Power-on the Intrinsyc Dragon Board after the above connections are completed.

Note: Do not connect the mini USB power cable to the Sensor Fusion Board when it is connected to the Intrinsyc Dragon Board.

6

iCE40LM4K Sensor Evaluation Kit

Figure 3 shows the connections between the Sensor Fusion Board and the Intrinsyc Dragon Board.

Figure 3. Connecting Sensor Fusion Board to Intrinsyc Dragon Board

5V fly wire (supplied) to be connected between +5V on the Intrinsyc Adapter board (plugged in) and the C1300 right side terminal (soldered) on the Intrinsyc Dragon Board

Jumper to be setat 3.3V

Marked end of cable connected topin1 of the Intrinsyc Adapter board

Marked end of smaller connector,connected to pin1 of J21 on theSensor Fusion Board

Marked end of larger connector,connected to pin1 of J13 on theSensor Fusion Board

7

iCE40LM4K Sensor Evaluation Kit

Sensor Fusion Board DetailsFigure 4 shows the details of the Sensor Fusion Board.

Figure 4. Sensor Fusion Board

D3 LED

PowerSwitch

Mini USBConnector

J16Jumpers

J21Jumper

Switch

PWRSELJ20

J13Jumper

8

iCE40LM4K Sensor Evaluation Kit

Flashing System Image and Boot Image to Intrinsyc Dragon BoardNote that this procedure is not required if the Intrinsyc Dragon Board has already been flashed with the system image and boot image (cd Lightning_Demos_Drop_WITH_APK_INSTALL/Dragonboard_boot_images/).

To flash the system image and boot image to the Intrinsyc Dragon Board:

1. Connect the Intrinsyc Dragon Board USB port to your host system through the OTG (mini-USB).i. Download and install android-sdk. Android-sdk for Linux and Windows environment at

http://developer.android.com/sdk/index.html. Set <Installation path>/android_sdk/platform-tools/ to the PATH variable.

2. Run the command below in the terminal/command prompt.#sudo –sNote: This command is applicable only for Linux machines. For Windows machine administrative permission is necessary.

3. Reboot the Intrinsyc Dragon Board in fastboot mode.i. Keep Button Vol / Zoom + pressed on the Intrinsyc Dragon Board during restart.

If the board is already On in adb mode, use the command below for fastboot mode#adb reboot bootloader

ii. When the Intrinsyc Dragon Board is in FASTBOOT mode, a white screen comes on with only Intrinsyc name displayed on it.

iii. Execute the command below in the terminal/command prompt to list the fastboot device number and its name. #fastboot devices

The board is now ready to be flashed with boot.img.

4. Enter the command below to flash system image.#fastboot flash system system.img

If flashing is successful, OKAY and Finished comments are displayed on the terminal.

5. Enter the command below to flash boot.img#fastboot flash boot boot.img

If flashing is successful, OKAY and Finished comments are displayed on the terminal.

6. Enter the command below reboot the board for current boot.img.#fastboot reboot

7. After reboot, go to Settings > Developer options > Stay awake.

9

iCE40LM4K Sensor Evaluation Kit

Installing Sensor Hub apk to AndroidTo flash the system image and boot image to the Intrinsyc Dragon Board:

1. Connect the Intrinsyc Dragon Board USB port to your host system through the OTG (mini-USB).2. Run the command below in the terminal/command prompt.

#sudo –sNote: This command is applicable only for Linux machines. For Windows machine administrative permission is necessary.

3. Use below commands on the terminal to establish and verify 'adb' connection.#adb kill-server#adb start-server#adb devices

If the connection is successful, the device id is displayed on the terminal.4. Run the command below to install the Sensor Hub apk to the Intrinsyc Dragon Board.

#cd Lightning_Demos_Drop_WITH_APK_INSTALL/Sensor_Hub_Demo_Quick_Strart /Android_Apllication

Note: This step should be performed only if not currently in the

Lightning_Demos_Drop_WITH_APK_INSTALL/Sensor_Hub_Demo_Quick_start/Android_Apllication/ folder

#adb install Sensor_Hub_Demo.apk

Demo ProcedureTo execute the demo:

1. Restart Intrinsyc Dragon Board by removing and re-plugging in the power supply, with the Sensor Fusion Board connected to it.When connecting the Sensor Fusion Board to Intrinsyc Dragon Board, make sure that jumper J20 on the Sen-sor Fusion Board is in DRG mode.

2. Wait for Android boot sequence to complete and the home screen to appear.3. Unlock the screen. Go to the Android application menu and open Sensor_Hub_LP3.5k_Intrinsyc.4. Wait for the Processor Configuration to be completed. This is indicated by the lighting of the D3 LED on the

Sensor Fusion board.5. The sensor data is displayed on the Sensor_Hub_LP3.5k_Intrinsyc application.

10

iCE40LM4K Sensor Evaluation Kit

Sensor_Hub_LP3.5k_Intrinsyc Application FeaturesThe Sensor_Hub_LP3.5k_Intrinsyc application provides the following features:

• Temperature and pressure data gives the atmosphere pressure in kPa and room temperature in degree Celcius.

• Compass image points to the magnetic north w.r.t the Sensor Fusion Board.

• Light sensor progress bar indicates the intensity of light form 0 – 4000 lux.

• Accelerometer GUI indicates acceleration in x,y and z direction. The dots indicate the direction and acceleration.

• Gyroscope GUI shows the graphical meter to display the angular rate in x,y and z direction.

• Humidity data gives humidity of the environment in %RH(Relative Humidity).Ambient RGB GUI indicates Red, Green, Blue light values.

Figure 5 shows the Sensor_Hub_LP3.5k_Intrinsyc application interface.

Figure 5. Sensor_Hub_LP3.5k_Intrinsyc Application Interface

11

iCE40LM4K Sensor Evaluation Kit

TroubleshootingIf the Android application does not respond, perform the following procedure:

1. Close the Sensor_Hub_LP3.5k_intrinsyc process running in background.In the Android menu, go toSettings > Applications > Manage Applications > Sensor_Hub_LP3.5k_intrinsyc Force Stop

2. Restart the Intrinsyc Dragon Board.3. Open the Sensor_Hub application from Android menu and application is ready to receive all sensor’s data.4. If the android application crashes while being opened, it means that the library file has not been copied.

Run the command below to install the Sensor Hub apk to the Intrinsyc Dragon Board.#cd Lightning_Demos_Drop_WITH_APK_INSTALL/Sensor_Hub_Demo_Quick_Strart /Android_Apllication

Note: This step should be performed only if not currently in the

Lightning_Demos_Drop_WITH_APK_INSTALL/Sensor_Hub_Demo_Quick_start/Android_Apllication/ folder

#adb install Sensor_Hub_Demo.apk

12

iCE40LM4K Sensor Evaluation Kit

Technical Support Assistancee-mail: [email protected]

Internet: www.latticesemi.com

Revision History

© 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

Date Version Change Summary

January 2014 01.0 Initial release.

Appendix A. Sensor Fusion Board Schematic Diagrams

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

iCE40LP3k5-WLCSP25

TOP BANK - at 1.8V

MAX44006 (I2C)

RGB ALS

LSM303DLHC (I2C)

Magentometer

APP PROCESSOR (SPI)

(10 pin CONN)

BOT BANK - at 3V3

BMP085 (I2C)

Pressure

SHT20 (I2C)

Humidity &Temp.

IR LED (TX)

IR RX TSSOP34338

BAR CODE LED

JUMPER SEL

POOL-B I2CPOOL-A I2C

SPI

POWER SUPPLIES

(from USB)

CLOCK OSC

SMA CONN

JUMPER SEL

FT2232H

SPI

CONFIG FLASH (SPI)

SPI/GPIO

USB

CHEETAH CONN

LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL

SENSOR FUSION DEMO BOARD (iCE40LP3K5-WLCSP25)

Revision History

Rev 0p0 - 9 July 2013 - Initial draft

TMD27711 (I2C)

Proximity & ALS

LSM330DLC (I2C)

Accel. & Gyro

HALL SENSOR

Rev 1p0 - 16 July 2013 - IR/HALL muxed to free up FPGA pin D3

Rev 1p1- 18July 2013 - Added CRSTb through R41 to AP INTERCONNECT

Rev 1p2- 6 Aug 2013 - VCCIO2 default changed

Rev 2- 14 Sept 2013 - VCCIO2 default 3V3,

Added R42, R43, consolidated VLT adapter in same schematic

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5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

PRESSURE SENSOR

Default: VCCIO0 = 1V8

LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL

Notes:

- Gyro and Accelerometer interfaces are both set to I2C

- I2C address LSB for both Gyro and Accelerometer is '1'

- SPI for both Gyro and Accelerometer is disabled

SENSOR FUSION DEMO BOARD (iCE40LP3K5-WLCSP25)

GYROSCOPE & ACCELEROMETER SENSOR

HALL SENSOR

RGB ALS SENSOR

LDO reverse current bypass

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A_s

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RES713

RES612

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19

INT

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VDD_IO_021

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CS_A23

SCL_A/G24

VDD_IO_125

SDO_G26

RE

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ND

16

VDD18 VDD29

SDO_A27

SDA_A/G28

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R16

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J12

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5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Humidity, Temperature Sensor

IR RX MODULE

IR EMITTER

EXTERNAL CLOCKING

BAR CODE LED

Default: VCCIO2 = 2v5

Default: 1&2

(27 Mhz Osc)

LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL

PROXIMITY SENSOR

COMPASS SENSOR

SENSOR FUSION DEMO BOARD (iCE40LP3K5-WLCSP25)

pool

B_s

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r_S

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pool

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GN

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7

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VDDIO1

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C33

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J17

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J17

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135

D1

IRT

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X

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TD

BYJ6

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DB

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J1S

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4

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1

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

SPI CONFIGURATION / FLASH

LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL

AP (DRAGON BOARD) INTERCONNECT

Note position of pin#1

in reference board

Note position of pin#1

in reference board

Note:

Place close

to DUT

Note:

Place close

to DUT

Note:

Place close

to DUT

DUT

Default: Shunt

For programming Flash - Shunt 1,3 and 2,4 (default)

For programming iCE - Shunt 3,4 and 1,2

Default: Shunt

Default: Shunt

Default: Open

Default: Shunt

Default: Shunt 1,2 (for IR LED)

SENSOR FUSION DEMO BOARD (iCE40LP3K5-WLCSP25)

pro

c_sd

ip

roc_

sdo

pro

c_in

trp

roc_

sclk

pro

c_cs

CR

ST

b

CD

ON

E

CR

ST

bC

DO

NE

pool

A_s

enso

r_S

CL

pool

A_s

enso

r_S

DA

flsh_

csfls

h_m

osi

flsh_

sclk

flsh_

mis

o

flsh_

mos

ifls

h_m

iso

flsh_

sclk

pool

B_s

enso

r_S

CL

pool

B_s

enso

r_S

DA

flsh_

csfls

h_sc

lk

pro

c_sd

o

pro

c_sd

ip

roc_

intr

pro

c_sc

lkp

roc_

cs

BA

R_L

ED

BA

R_

LE

D_

MU

X_

IR_

LE

DIR

_L

ED

BA

R_

LE

D_

MU

X_

IR_

LE

D

CR

ST

b

flsh_

cs

flsh_

mos

i

ice_

SO

ice_

SI

ice_

SO

flsh_

mis

oic

e_S

I

IR_

ING

PIO

_C

5

GP

IO_

C5

sens

or0

_X

CL

R

Hal

l_o

ut

CR

ST

b

DR

GN

5V

VC

C3V

3

VC

CIO

0

VC

CIO

2

VC

CIO

0

VC

C1V

2

VC

C3V

3

pool

B_s

enso

r_S

DA

Pg

[3]

pool

B_s

enso

r_S

CL

Pg[

3]

pool

A_s

enso

r_S

DA

Pg

[2]

pool

A_s

enso

r_S

CL

Pg

[2]

flsh_

csP

g[5

]

IR_

INP

g[3]

IR_

LE

DP

g[3

]

CR

ST

bP

g[5]

clk

Pg

[3]

flsh_

csP

g[5

]

BA

R_L

ED

Pg[

3]

CD

ON

EP

g[5

]

Hal

l_ou

tP

g[2] fls

h_m

iso

Pg[

5]

flsh_

sclk

Pg[

5]fls

h_cs

Pg[

5]fls

h_m

osi

Pg[

5]

sens

or0

_X

CL

RP

g[2

]

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:

She

eto

f

10

2-3

74

A-0

91

32

FP

GA

, Con

fig F

lash

, AP

Inte

rcon

nect

s

B

45

Sat

urd

ay, O

ctob

er 0

5, 2

013

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:

She

eto

f

10

2-3

74

A-0

91

32

FP

GA

, Con

fig F

lash

, AP

Inte

rcon

nect

s

B

45

Sat

urd

ay, O

ctob

er 0

5, 2

013

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:

She

eto

f

10

2-3

74

A-0

91

32

FP

GA

, Con

fig F

lash

, AP

Inte

rcon

nect

s

B

45

Sat

urd

ay, O

ctob

er 0

5, 2

013

J4

BA

R_

IR_

SE

L

J4

BA

R_

IR_

SE

L

123

C15

1uC

151

u

R40

10

kR

401

0k

R2

0R

20

J11

FL

SH

EN

J11

FL

SH

EN

12

SW

1

CR

ST

SW

1

CR

ST

C1

90

.1u

C19

0.1

u

J8 IDD

_B

OT

J8 IDD

_B

OT

12

C17 10

nC

17 10

n

R12

10

kR

121

0k

D3

DO

NE

D3

DO

NE

J21

AP

IN

TE

RC

ON

NE

CT

J21

AP

IN

TE

RC

ON

NE

CT

2 4 6 810

1 3 5 7 9

C16 10

nC

16 10

n

C22

1u

C22

1u

R30

2k2

R30

2k2

R41

0R

410

R10

10

kR

101

0k

C18

0.1

uC

180

.1u

J13

SP

I PG

MJ1

3S

PI P

GM

SS

21

GN

D1

2

SS

33

NC

24

MIS

O5

NC

16

SC

LK

7M

OS

I8

SS

19

GN

D2

10

C21

1u

C21

1u

TOP BANK

BOT BANK

CONFIG S

PI

iCE40LP3k5-WLCSP25

iCE

40LP

3k5-

WLC

SP

25

U1

1TOP BANK

BOT BANK

CONFIG S

PI

iCE40LP3k5-WLCSP25

iCE

40LP

3k5-

WLC

SP

25

U1

1

IOB

2E

5

IOB

3D

5

IOB

4E

4

IOB

5C

5

IOB

11_G

5E

3IO

B12_G

4C

4

IOB

16

D3

CD

ON

EC

3

CR

ST

BB

3

IOB

22_S

OD

2

IOB

23_S

IC

1

IOB

24_S

CLK

D1

IOB

25_S

SE

1

IOT

28

A1

IOT

30

B1

IOT

31

C2

IOT

45_G

1A

3IO

T46_G

0A

4

IOT

55

B5

IOT

56

A5

AV

DD

/ V

CC

B4

VC

CIO

0A

2

GN

D1

D4

VC

CIO

2/S

PIV

CC

E2

GN

D2

B2

M2

5P

80

U8

M2

5P

80

U8

SD

I5

SC

K6

WP

3

CS

1

SD

O2

HO

LD

7

8

VC

C

4

GN

D

J19

IDD

_T

OP

J19

IDD

_T

OP

12

J18

IDD

_C

OR

EJ1

8ID

D_

CO

RE

12

C38

0.1

uC

380

.1u

C14

0.1

uC

140

.1u

J16

MA

/ S

LJ1

6M

A /

SL

3 41 2

R8

10

kR

81

0k

J5

IR M

UX

J5

IR M

UX

123

R22

2k2

R22

2k2

C11

10

nC

111

0n

J10

CR

ST

J10

CR

ST

12

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

LDO REGULATORS

USB PROGRAMMER

Default: 1&2

(USB 5V)

LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL

spread across board, easy access

Default: Open

SENSOR FUSION DEMO BOARD (iCE40LP3K5-WLCSP25)

US

B_D

M

GN

D

FT

_C

RS

T

EP_CS

FT

_C

RS

T

GND

EP

_DI

GND

EP

_CLK

EP

_CS

GN

D

FT

_D

I

FT

_D

IF

T_

SK

FT

_S

K

FT

_C

S

EP_DI

FT

_D

O

FT

_C

S

EP_CLK

GN

D

US

B_D

P

GN

D

FT

_D

O

GN

D

GN

D

USB_DP

USB_DM

FT

_C

DO

NE

FT

_C

DO

NE

VC

C3V

3

VC

C3V

3

VC

C3V

3

FT

VC

OR

VC

C3V

3

FT

VC

OR

VC

C3V

3

FT

VC

OR

FT

VC

OR

VC

C3V

3

VC

C3V

3

VC

C3V

3

VC

C3V

3

VC

C5

V

VC

C1V

2V

CC

1V8

VC

C2V

5V

CC

3V

3

VC

C5V

DR

GN

5V

US

B5V

US

B5V

VC

C5V V

CC

5V

CR

ST

bP

g[4

]

flsh_

mis

oP

g[4

]fls

h_sc

lkP

g[4

]fls

h_cs

Pg[

4]

flsh_

mo

siP

g[4

]

CD

ON

EP

g[4]

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:

She

eto

f

10

2-3

74

A-0

91

32

US

B P

rogr

amm

ing

& P

ower

Sup

plie

s

B

55

Sat

urd

ay, O

ctob

er 0

5, 2

013

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:

She

eto

f

10

2-3

74

A-0

91

32

US

B P

rogr

amm

ing

& P

ower

Sup

plie

s

B

55

Sat

urd

ay, O

ctob

er 0

5, 2

013

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:

She

eto

f

10

2-3

74

A-0

91

32

US

B P

rogr

amm

ing

& P

ower

Sup

plie

s

B

55

Sat

urd

ay, O

ctob

er 0

5, 2

013

C24

27

pC

242

7p

C50

0.1

uC

500

.1u

C42

0.1

uC

420

.1u

R25

0R

250

C32 1

0u

C32 1

0u

C46

0.1

uC

460

.1u

C40

0.1

uC

400

.1u

L1

10

0M

Hz,

33

0 o

hms

L1

10

0M

Hz,

33

0 o

hms

C29

47

uC

294

7u

J9 GN

DJ9 G

ND

1

R27

10R

2710

R15

0R

150

C52

0.1

uC

520

.1u

C37

10

uC

371

0u

C25

47

uC

254

7u

L3

10

0M

Hz,

33

0 o

hmsL3

10

0M

Hz,

33

0 o

hms

C48

0.1

uC

480

.1u

R17

0R

170

R24

0R

240

C54

0.1

uC

540

.1u

C36

0.1

uC

360

.1u

Y1

12

MH

z

Y1

12

MH

z

MIC

5320

-SJY

D6

TR

U1

2M

IC53

20-S

JYD

6 T

RU

12

3.3

VO

4

3.3

EN

62.5

EN

1

2.5

VO

5

VIN3

GND2

R13

10

kR

131

0k

R21

0R

210

AP

7312

-121

8W6-

7U

13

AP

7312

-121

8W6-

7U

13

1.8

VO

1

1.8

EN

31.2

EN

4

1.2

VO

6

VIN5

GND2

C31

47

uC

314

7u

R20

2k

R20

2k

R26

1k

R26

1k

TP

4S

PT

P4

SP

1

J3 GN

DJ3 G

ND

1

C43

0.1

uC

430

.1u

J14

GN

DJ1

4G

ND

1

C23 1

0u

C23 1

0u

R23

0R

230

C20

27

pC

202

7p

C49

0.1

uC

490

.1u

C45

4.7

uC

454

.7u

J20

PW

R S

EL

J20

PW

R S

EL

123

L2

60

0 o

hm, 5

00

mA

L2

60

0 o

hm, 5

00

mA

R29

12

kR

291

2k

SW

2P

WR

SW

2P

WR

12

3

45

6

78

U9

FT

22

32

H

U9

FT

22

32

H

Gnd_1

1

OS

CI

2

OS

CO

3

VP

HY

4

Gnd_7

5

RE

F6

DM

7

DP

8

VP

LL

9

AG

nd

10

Gnd

11

VC

OR

E_1

12

TE

ST

13

RE

SE

T#

14

Gnd_2

15

AD

BU

S0

16

ADBUS117

ADBUS218

ADBUS319

VCCIO20

ADBUS421

ADBUS522

ADBUS623

ADBUS724

Gnd_325

ACBUS026

ACBUS127

ACBUS228

ACBUS329

ACBUS430

VCCIO_331

ACBUS532

AC

BU

S6

33

AC

BU

S7

34

Gnd_4

35

SU

SP

EN

D#

36

VC

OR

E37

BD

BU

S0

38

BD

BU

S1

39

BD

BU

S2

40

BD

BU

S3

41

VC

CIO

_2

42

BD

BU

S4

43

BD

BU

S5

44

BD

BU

S6

45

BD

BU

S7

46

Gnd_5

47

BC

BU

S0

48

VREGOUT49 VREGIN50 Gnd_651 BCBUS152 BCBUS253 BCBUS354 BCBUS455 VCCIO_156 BCBUS557 BCBUS658 BCBUS759 PWREN#60 EEDATA61 EECLK62 EECS63 VCORE_364

C13

0.1

uC

130

.1u

R31

68

0R

316

80

5VD-

D+ID

G

US

B P

WR

J23

5VD-

D+ID

G

US

B P

WR

J23

1

2

3

4

S2

5

S1

S3

S4

TP

8C

ST

P8

CS

1

C44

4.7

uC

444

.7u

D4

PW

RD4

PW

RC

410

.1u

C41

0.1

u

J15

FT

RS

TJ1

5F

TR

ST

12R

2810

R28

10

C39

0.1

uC

390

.1u

R14

33

0R

143

30

C47

0.1

uC

470

.1u

C27

47

uC

274

7u

93

LC

56

BT

-I/O

TU

10

93

LC

56

BT

-I/O

TU

10

GN

D2

VC

C6

DO

1

DI

3

CLK

4

CS

5

C53

47

uC

534

7u