Heterogeneous Integration of Materials for Passive Components …assets.cambridge.org/97815589/99268/frontmatter/... · 2013. 2. 21. · Integration of PZT on SOI Wafers: Increasing

Heterogeneous Integrationof Materials for Passive

Components andSmart Systems

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Cambridge University Press978-1-558-99926-8 - Materials Research Society Symposium Proceedings Volume 969:Heterogeneous Integration of Materials for Passive Components and Smart SystemsEditors: Juan C. Nino, Fred Roozeboom, Paul Muralt, Susan Trolier-McKinstry and David LaVanFrontmatterMore information

http://www.cambridge.org/9781558999268

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MATERIALS RESEARCH SOCIETYSYMPOSIUM PROCEEDINGS VOLUME 969

Heterogeneous Integrationof Materials for Passive

Components andSmart Systems

Symposium held November 27-29,2006, Boston, Massachusetts, U.S.A.

EDITORS:

Juan C. NinoUniversity of Florida

Gainesville, Florida, U.S.A.

Fred RoozeboomNXP Semiconductors Research

Eindhoven, The Netherlands

Paul MuraltSwiss Federal Institute of Technology EPFL

Lausanne, Switzerland

Susan Trolier-McKinstryThe Pennsylvania State University

University Park, Pennsylvania, U.S.A.

David LaVanYale University

New Haven, Connecticut, U.S.A.

IMIRIS1Materials Research Society

Warrendale, Pennsylvania






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© Materials Research Society 2007

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First published 2007 First paperback edition 2013

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isbn 978-1-558-99926-8 Hardbackisbn 978-1-107-40877-7 Paperback

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CONTENTS

Preface ix

Materials Research Society Symposium Proceedings xi

PACKAGING AND EMBEDDEDCOMPONENTS

Investigation of Ultralow Loss Interconnection Techniquefor LTCC Based System-in-Package (SIP) Technology at60 GHz 3

Dong-Young Kim, Jae Kyoung Mun, Dong-Suk Jun,and Haechoen Kim

Influence of Full-Filled Polymer Molding on High-FrequencyCircuits 9

Kiyoshi Nakanishi and Masayuki Fujimoto

Dielectric Properties of PCB Embedded Bismuth-Zinc-Niobium Films Prepared Using RF Magnetron Sputtering 17

Seungeun Lee, Jung Won Lee, Inhyung Lee, andYul Kyo Chung

JOINT SESSION-SYSTEM IN PACKAGE

* Silicon Based System-in-Package: Breakthroughsin Miniaturization and fNanof-Integration Supportedby Very High Quality Passives and System LevelDesign Tools 27

Franck Murray, Francis LeCornec,Serge Bardy, Catherine Bunel, Jan Verhoeven,F.C.M. van den Heuvel, J.H. Klootwijk, andFred Roozeboom

* Process and Material Requirements for SuccessfulHeterogonous Passive Component Integration inRF System 37

Eric Beyne, Walter De Raedt, Geert Carchon,and Philippe Soussan

* Invited Paper






* Through Wafer Interconnects—A Technology Not Onlyfor Medical Applications 47

Gereon Vogtmeier, Christian Drabe, Ralf Dorscheid,Roger Steadman, and Alexander Wolter

A Patch-Type Flexible Physiological Monitor on a Non-Woven Material 59

Wen-Yang Chang, Jin-Sheng Chang, Chun-Hsun Chu,Tzong-Che Ho, and Yu-Cheng Lin

An Approach for Characterizing Residual MechanicalStress Caused by Packaging Processes 67

Soeren Hirsch and Bertram Schmidt

POSTER SESSION

Strategy for the Integration of PLZT Thin Films on Base-Metal Foils for High Voltage Embedded Passives 75

Beihai Ma, U. (Balu) Balachandran, David Y. Kaufman,and Krishna Uprety

y-Irradiation Stimulated Change of Recycled PolypropyleneComposites Dielectric Permittivity 81

Ulmas Gafurov and Z. Fazilova

Fabrication of SiN-assisted 0.12 um AlGaAs/InGaAs PHEMTand 60 GHz-Band MMICs for 60 GHz WPAN System 87

Hokyun Ahn, Jong-Won Lim, Hong-Gu Ji, Woo-Jin Chang,Jae-Kyoung Mun, and Haecheon Kim

Tailoring Magnetic Microspheres With Controlled Porosity 93Muhammet S. Toprak, Brandon J. McKenna,Herb Waite, and Galen D. Stucky

A Charge Feedback Controller for a Piezoelectric VoltageAmplifier/Driver 99

Maciej Noras, Peter McAnn, and Jerzy Kieres

Development of Structure-Property Relationships inDisordered Zirconia Thin Films for High Energy DensityMIM Capacitors 105

Guneet Sethi, Michael T. Lanagan, Eugene Furman,and Mark W. Horn

* Invited Paper

VI






Layered Compound Semiconductor GaSe andGaTe Crystals for THz Applications I l l

Krishna C. Mandal, Sung H. Kang, andMichael K. Choi

MEMS

Studies on Curvature Deformation Control of BilayerCantilever Fabricated by Surface Micromachining ofSOI Wafer 119

Yu-Ming Huang, Masayuki Sohgawa, Minoru Noda,Kaoru Yamashita, Masanori Okuyama, and Haruo Noma

Single-Mode Polymer Optical Fiber Sensors for LargeStrain Applications 125

Sharon M. Kiesel, Kara Peters, Tasnim Hassan, andMervyn Kowalsky

BCB Based Packaging for Low Actuation Voltage RFMEMS Devices 131

David Peyrou, Fabienne Pennec, Hikmat Achkar,Patrick Pons, Fabio Coccetti, Herve Aubert, andRobert Plana

Integration of PZT on SOI Wafers: IncreasingPiezoelectric Film Thickness for Providing aWide Range of Ultrasonic MEMS Applications 137

Brahim Belgacem, Florian Calame, andPaul Muralt

MAGNETIC COMPONENTS

* Power and Radio Frequency Inductors Using aHybrid Ferrite-Flex Foil Technology 145

Martin Gijs and Menouer Saidani

•Invited Paper

vn






Towards the Integration of Barium Ferrite SputteredFilms for Coplanar Isolators and Circulators in theMillimeter Wave Range 155

A.-S. Dehlingqr, M. Le Berre, J.-P. Chatelon,E. Benevent, D. Vincent, D. Givord, V. Larrey,and JJ. Rousseau

Author Index 161

Subject Index 163

vin






PREFACE

This book contains a selection of the papers presented at the international Symposium W,"Heterogeneous Integration of Materials for Passive Components and Smart Systems," heldNovember 27-29 at the 2006 MRS Fall Meeting in Boston, Massachusetts. The objective of thissymposium was to provide a forum for scientists and technologists to discuss recent advances,the current status, and future challenges in the broad area of materials integration for passivecomponents and smart systems. The symposium covered the current trends, requirements, andrecent developments in electronic materials and processing towards integration of smart(micro)systems for future application in wireless (RF, microwave, millimeter, and THzfrequency range) communication and portable devices.

The symposium started with a very successful tutorial session on Sunday, November 26, onTopics in Advanced Electronic Packaging—Integrated Passives, 3-D Integration, Polymers,and Integration Challenges. It was organized by the combined Symposium V (AdvancedElectronic Packaging), this Symposium W, and Symposium Y (Enabling Technologies for 3-DIntegration), and covered four areas: the integration of passive components using thin-film andbulk-ceramic processing approaches; 3-D integration for both advanced packaging and verticalintegration of integrated circuits; introduction to polymers; and a review of integrationchallenges for advanced electronic packaging. Instructors were Y. Sakabe (Murata), C.P. Wong(Georgia Institute of Technology), P. Ramm (Fraunhofer Institute), and V. Atluri and S. Sharan(both Intel).

Joint Sessions were organized with the aforementioned Symposium V on Systems-in-Package, and with Symposium T (Ferroelectrics and Multiferroics) on Capacitors.

The symposium also had an excellent Poster Session with the poster on ferrite plating usinga spin spray technique by S.A. Krishnan, Tokyo Institute of Technology, winning one of thetwo Poster Awards in the session, competing among all the posters from all the differentsymposia in that Poster Session.

Following the symposium Program, the proceedings in this book first cover papers onpackaging and embedded components and reviews low-temperature co-fired ceramic (LTCC)components and the role of interfaces and chemical compatibility, and how they influencemodule design. The road from design to actual embedded circuit elements and applications ondifferent substrates is discussed.

This is followed by papers concerning system-in-package. Current miniaturization andintegration strategies and processes for medical and RF systems-in-package are discussed.Here, the highest capacitance density ever integrated in silicon in an industrial environment(250 nF/mm2) is reported. This is ~ 10 times more than the currently available values andobtained with standard semiconductor processes and materials. Next, papers from the posterpresentations, which contain a wide variety of topics in smart device and system integration,are presented.

These proceedings conclude with papers on MEMS and NEMS engineering and onmagnetic components.

The organizers would like to express special thanks to the speakers for their interest in thesymposium, and for submitting high-quality abstracts and preparing their manuscripts at short

IX






notice. Finally, the financial support by NXP Semiconductors Research and Philips ResearchLabs, both in Eindhoven, The Netherlands, is gratefully acknowledged. Their interest andsponsorship are highly valued, especially in these economically dynamic times. The success ofthe symposium would not have been possible without their support.

Juan C. NinoFred RoozeboomPaul MuraltSusan Trolier-McKinstryDavid La Van

March 2007






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 947E—Responsive Soft Matter—Chemistry and Physics for Assemblages, Films and Forms,R.A. Vaia, J. Genzer, G.H. McKinley, N. Tabiryan, 2007, ISBN 978-1-55899-904-6

Volume 948E—Structure, Processing and Properties of Polymer Nanofibers for Emerging Technologies,2007, ISBN 978-1-55899-905-3

Volume 949E— Smart Dielectric Polymer Properties, Characterization and Their Devices, V. Bharti, Z. Cheng,Q.M. Zhang, Y. Bar-Cohen, G.M. Sessler, 2007, ISBN 978-1-55899-906-0

Volume 950E—Biosurfaces and Biointerfaces, 2007, ISBN 978-1-55899-907-7Volume 95 IE—Nanofunctional Materials, Nanostructures and Novel Devices for Biological and Chemical

Detection, A. Zribi, C. Li, L. Nagahara, M. Willander, 2007, ISBN 978-1-55899-908-4Volume 952E—Integrated Nanosensors, B. Ash, 2007, ISBN 978-1-55899-909-1Volume 953E—Fibrillar Aggregates as Materials—Assembly, Properties and Applications, M. Upmanyu,

L. Mahadevan, C. MacPhee, J.V. Selinger, 2007, ISBN 978-1-55899-910-7Volume 954E—Biofilm-Material Interactions—New Tools, Technologies and Opportunities, M. Libera,

T. Camesano, B. Kreiswirth, P. Li, R.G. Richards, 2007, ISBN 978-1-55899-911-4Volume 955E—Advances in III-V Nitride Semiconductor Materials and Devices, C.R. Abernathy, H. Jiang,

J.M. Zavada, 2007, ISBN 978-1-55899-912-1Volume 956— Diamond Electronics—Fundamentals to Applications, P. Bergonzo, R. Gat, R.B. Jackman,

C.E. Nebel, 2007, ISBN 978-1-55899-913-8Volume 957— Zinc Oxide and Related Materials, J. Christen, C. Jagadish, D.C. Look, T. Yao, F. Bertram,

2007, ISBN 978-1-55899-914-5Volume 958— Group IV Semiconductor Nanostructures—2006, L. Tsybeskov, DJ. Lockwood, C. Delerue,

M. Ichikawa, A.W. van Buuren, 2007, ISBN 978-1-55899-915-2Volume 959E—Quantum Dots—Growth, Behavior and Applications, E.A. Stach, C.R. Taylor, Z.M. Wang,

Q-K. Xue, 2007, ISBN 978-1-55899-916-9Volume 960E—Self Assembly of Nanostructures Aided by Ion- or Photon-Beam Irradiation—Fundamentals

and Applications, R. Kalyanaraman, U. Valbusa, Z. Zhang, 2007, ISBN 978-1-55899-917-6Volume 96IE—Nanostructured and Patterned Materials for Information Storage, Z.Z. Bandic, M. Rooks,

R. Berger, T. Ando, 2007, ISBN 978-1-55899-918-3Volume 962E—Nanoscale Magnets—Synthesis, Self-Assembly, Properties and Applications, J. Fassbender,

J. Chapman, C.A. Ross, 2007, ISBN 978-1-55899-919-0Volume 963E—Nanowires and Carbon Nanotubes—Science and Applications, P. Bandaru, M. Endo,

LA. Kinloch, A.M. Rao, 2007, ISBN 978-1-55899-920-6Volume 964E—Meta-Materials at the Milli-, Micro- and Nanoscale, R. Ramprasad, J. Page, P. Renaud,

P. Mangat, 2007, ISBN 978-1-55899-921-3Volume 965E—Organic Electronics—Materials, Devices and Applications, F. So, G.B. Blanchet, Y. Ohmori,

2007, ISBN 978-1-55899-922-0Volume 966E—Ferroelectrics and Multiferroics, V. Gopalan, J-P. Maria, M. Fiebig, C-W. Nan, 2007,

ISBN 978-1-55899-923-7Volume 967E—Advances in In Situ Characterization of Film Growth and Interface Processes, V. Matias,

R. Hammond, G. Rijnders, D. Schlom, 2007, ISBN 978-1-55899-924-4Volume 968— Advanced Electronic Packaging, V.P. Atluri, S. Sharan, C.P. Wong, D. Frear, 2007,

ISBN 978-1-55899-925-1






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 969— Heterogeneous Integration of Materials for Passive Components and Smart Systems, 2007,ISBN 978-1-55899-926-8

Volume 970— Enabling Technologies for 3-D Integration, C.A. Bower, P.E. Garrou, P. Ramm, K. Takahashi,2007, ISBN 978-1-55899-927-5

Volume 97IE—Hydrogen Storage Technologies, J-C. Zhao, I.M. Robertson, S-I. Orimo, 2007,ISBN 978-1-55899-928-2

Volume 972— Solid-State Ionics—E. Traversa, T.R. Armstrong, C. Masquelier, Y. Sadaoka, 2007,ISBN 978-1-55899-929-9

Volume 973E— Mobile Energy, A. Nathan, G. Amaratunga, M. Nookala, L.G. Scanlon, E. Morinobu, 2007,ISBN 978-1-55899-930-5

Volume 974E—Solar Energy Conversion, M. Beard, 2007, ISBN 978-1-55899-931-2Volume 975E—Mechanics of Biological and Bio-Inspired Materials, K. Katti, C. Hellmich, C. Viney,

U. Wegst, 2007, ISBN 978-1-55899-932-9Volume 976E— Size Effects in the Deformation of Materials—Experiments and Modeling, E. Lilleodden,

P. Besser, L. Levine, A. Needleman, 2007, ISBN 978-1-55899-933-6Volume 977E—Processing-Structure-Mechanical Property Relations in Composite Materials, L. Thilly,

N.R. Moody, A. Misra, P.M. Anderson, M. Kumar, 2007, ISBN 978-1-55899-934-3Volume 978E—Multiscale Modeling of Materials, R. Devanathan, M.J. Caturla, A. Kubota, A. Chartier,

S. Phillpot, 2007, ISBN 978-1-55899-935-0Volume 979E—Thermodynamics and Kinetics of Phase Transformations in Inorganic Materials, C. Ambromeit,

P. Bellon, J-L. Bocquet, D.N. Seidman, 2007, ISBN 978-1-55899-936-7Volume 980— Advanced Intermetallic-Based Alloys, J. Wiezorek, C.L. Fu, M. Takeyama, D. Morris,

H. Clemens, 2007, ISBN 978-1-55899-937-4Volume 98IE—Structural and Refractory Materials for Fusion and Fission Technologies, J. Aktaa, M. Samaras,

M. Serrano de Caro, M. Victoria, B. Wirth, 2007, ISBN 978-1-55899-938-1Volume 982E—Electron Microscopy Across Hard and Soft Materials, T.J. Balk, A. Minor, A. Porter, J. Plitzko,

2007, ISBN 978-1-55899-939-8Volume 983E—Focused Ion Beams for Analysis and Processing, W. MoberlyChan, H. Colijn, R. Langford,

A. Marshall, 2007, ISBN 978-1-55899-940-4Volume 984E—Magnetic Resonance in Material Science, J. Herberg, Y. Wu, P. Grandinetti, S. Hayes, I. Farnan,

2007, ISBN 978-1-55899-941-1Volume 985— Scientific Basis for Nuclear Waste Management XXX, D.S. Dunn, C. Poinssot, B. Begg, 2007,

ISBN 978-1-55899-942-8Volume 986— Actinides 2006—Basic Science, Applications and Technology, K.J.M. Blobaum, E.A. Chandler,

L. Havela, M.B. Maple, M.P. Neu, 2007, ISBN 978-1-55899-943-5Volume 987— Materials Research at High Pressure, M.R. Manaa, A.F. Goncharov, RJ. Hemley, R. Bini,

2007, ISBN 978-1-55899-944-2Volume 988E—Solid-State Chemistry of Inorganic Materials VI, R. Seshadri, J.W. Kolis, D.B. Mitzi,

M.J. Rosseinsky, 2007, ISBN 978-1-55899-945-9

Prior Materials Research Society Symposium Proceedings available by contacting Materials Research Society






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