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Goetz 1FIELDS iCDR - TDS
Solar Probe Plus - FIELDSInstrument CDR
Time Domain SamplerTDS
Keith Goetz
University of Minnesota
Goetz 2FIELDS iCDR - TDS
Agenda
• Science• Changes• Performance Requirements• Block Diagram(s)• Design Description & Specifications• Resources • Breadboard/Engineering Model Testing• Parts & Materials• Verification Plans• Peer Reviews• Schedule & Open Work• Issues
Goetz 3FIELDS iCDR - TDS
Time Domain Sampler - Science
• Time Domain Sampler (TDS) is based on previous instruments– Based most recently on STEREO instrument
• Gathers impulsive events – voltage as a function of time– Centered peaks– Simultaneous sampling on all channels– Fixed sampling rate – 1.92MSa/s which is ~160Mb/s 24x7
throughput– Programmable effective sampling rate– Programmable event duration
• Events have peaks - triggered– After that, flight software scores event based on programmable
criteria– Quality can be adjusted – up or down - after the fact– When telemetry is available (nominally to DCB), best event is
sent– When memory is needed (for a new event), worst event is
deleted• Event selection can be based on quality or not –
honesty– Delivered bit-rate is highly programmable – nominally 10kb/s
• Low rate stream gives peak activity as a function of time
Goetz 4FIELDS iCDR - TDS
STEREO snapshot
Goetz 5FIELDS iCDR - TDS
STEREO snapshots
BurstActivity
Goetz 6FIELDS iCDR - TDS
Dust
Goetz 7FIELDS iCDR - TDS
Big Dust
Goetz 8FIELDS iCDR - TDS
Waveform and Particles
SamplesΔt = 500ns
CLK~2MHz
V(t)Δt = 500ns
count(t)
Goetz 9FIELDS iCDR - TDS
Waves and Particles
SamplesΔt = 500ns
V(t)Δt = 500ns
count(t)
t = 1,500ns t = 2,000ns t = 2,500ns t = 3,000ns t = 3,500ns t = 4,000ns t = 4,500ns t = 5,000ns
V = 0mV V = -2mV V = -4mV V = +5mV V = -12mV V = -15mV V = -10mV V = -5mV
n = 2 n = 4 n = 2 n = 2 n = 7 n = 3 n = 5
Goetz 10FIELDS iCDR - TDS
TDS Heritage
• Time Domain Sampler (TDS) is based on STEREO instrument– The first instrument fully integrated on both spacecraft and
the only instrument never to come off
• Changes – Science – close to the sun– Plasma frequency up from 10’s to 100’s of kHz – shock time
scales are faster– TDS samples at ~2MSa/s and ~1MHz Nyquist
• Programmable down-sampling– Continuous sampling – reduced power supply load variations– Direct deposit – increases duty cycle – eliminates event length
limit– Wave-particle correlation with SWEAP
Goetz 11FIELDS iCDR - TDS
Time Domain Sampler – FIELDS2
• Part of increased FIELDS reliability, TDS has DPU-like functions– Center of FIELDS2– TM/TC Interface to S/C– Handles some FIELDS subsystems
• MAGi, AEB2, LNPS2• SWEAP
– Interface to FIELDS1/DCB for TM/TC and timing synchronization– Interface to SWEAP for wave particle correlation,
communications and timing• Similar functionality in STEREO instrument
– Multiple instruments– S/C TM/TC interface
Goetz 12FIELDS iCDR - TDS
TDS Changes Since iPDR
• LVDS protection added to S/C interfaces• Eliminated in-flight E-parallel measurement
– Simplified in-flight calculations– To be done on the ground
• LVDS protection added to SWEAP interface– A new PAY requirement is coming soon
Goetz 13FIELDS iCDR - TDS
TDS Requirements
• TDS-01 Mission Length – TDS Components shall be selected to withstand the
environment of SPP for the duration of the extended mission (possible launch delay).
• TDS-02 Spacecraft Interface Compliance (General) – TDS shall implement the spacecraft interface protocol…
• TDS-03 Timing from S/C– TDS shall provide latching facility upon detection of the "Virtual
1PPS" S/C timing signal…• TDS-04
– Timing from DCB TDS shall provide an electrical interface to the Data Control Board capable of…
Goetz 14FIELDS iCDR - TDS
SWEAP Requirements
• TDS-05 SWEAP Interface - CDI– TDS shall provide an electrical interface to the SWEAP
instrument capable of sending CDI commands, receiving CDI messages:
• [a] sending Command/Data Interface (CDI) messages to SWEAP;• [b] receiving SWEAP status and burst information from SWEAP;• [c] sending TDS time-keeping information;• [d] sending TDS clock synchronization.
• TDS-06 SWEAP Interface – Particles– TDS shall provide an electrical interface to the SWEAP
instrument capable of:• [a] receiving particle count information from SWEAP• [b] receiving particle synchronization and state information from
SWEAP
• TDS-17 SWEAP Interface – Do no harm– TDS shall provide protection in the LVDS interfaces to/from the
SWEAP instrument so as to avoid allowing a single TDS failure to damage SWEAP.
Goetz 15FIELDS iCDR - TDS
MAG Requirements
• TDS-07 MAG Interface – CDI– TDS shall provide an electrical interface to the MAG Electronics
capable of:• [a] setting control registers• [b] receiving MAG Science and Engineering data• [c] provide MAG AC heater synchronization
Goetz 16FIELDS iCDR - TDS
AEB Requirements
• TDS-08 Antenna Electronics Board Interface (AEB)– TDS shall provide an electrical interface to the Antenna
Electronics Board capable of:• [a] setting Biasing D/A converters and relays• [b] reading back the biasing voltages• [c] provide DC-DC converter synchronization
Goetz 17FIELDS iCDR - TDS
LNPS Requirements
• TDS-09 Low Noise Power Supply Interface (LNPS)– TDS shall provide an electrical interface to the Low Noise
Power Supply capable of• [a] setting control registers for Power Control and Housekeeping
Channel• [b] receiving an analog housekeeping signal• [c] provide DC-DC synchronization
Goetz 18FIELDS iCDR - TDS
TDS Requirements
• TDS-10 Time Domain Sampler Control– TDS shall provide electrical interfaces to the Time Domain
Sampler data acquisition system capable of:• [a] setting TDS instrument modes• [b] receiving TDS instrument data
• TDS-11 TDS Memory Management– TDS shall include memory such that:
• [a] is capable of storing ~20 TDS snapshot events• [b] allows best available event to be sent to telemetry
• TDS-12 TDS Instrument Calibration– TDS analog science and analog housekeeping conversion
coefficients shall be determined and provided prior to S/C Integration to include gain, phase and timing
Goetz 19FIELDS iCDR - TDS
Science Requirements
• TDS-13 E Signals– TDS shall provide an electrical interface capable of:
• [a] signal processing and measurement of the low frequency component of E-Field signals
• TDS-14 E Signals– TDS shall provide an electrical interface capable of:
• [a] signal processing and measurement of the AC or plasma frequency (ranging to ~1MHz) component of E-Field signals."
• TDS-15 B Signals– TDS shall provide an electrical interface capable of:
• [a] signal processing and measurement of the AC or plasma frequency (ranging to ~1MHz) component of B-Field signals (single axis)."
• TDS-16 Instrument Calibration– TDS shall provide calibration parameters and algorithms so as
to allow conversion from telemetry units to physical units (gain and offset per channel) prior to S/C Integration.
Goetz 20FIELDS iCDR - TDS
FIELDS block diagram
Goetz 21FIELDS iCDR - TDS
TDS Block Diagram
Goetz 22FIELDS iCDR - TDS
TDS Block Diagram – “DPU” additions
Goetz 23FIELDS iCDR - TDS
TDS – Single Board Data Acquisition System
• Centers on RTAX4000 FPGA daughter board– Holds all logic, interfaces and LEON 3 processor instantiation
• TDS event data gathered by 16-bit ADCs at ~2MSa/s– Multiplexed 16-bit data bus
• Simultaneous acquisition of SWEAP particle counts• TDS event data stored directly into dedicated event
memory– 16MB event SRAM – 8 parts – 512k by 32bits– Circular buffers
• Processor support– 8-bit data bus
• Local SRAM w/ ECC• Local boot PROM (some in FPGA?)• Local program EEPROM
• S/C serial interfaces• CDI interfaces to DCB, MAG, SWEAP• Device interfaces – AEB, LNPS• Mezzanine interface
– Diagnostic UARTs
Goetz 24FIELDS iCDR - TDS
TDS EM1 – top and bottom
Goetz 25FIELDS iCDR - TDS
FIELDS2
LNPS2MAGiAEB2
Goetz 26FIELDS iCDR - TDS
GSEOS on the Bench – FIELDS2
Goetz 27FIELDS iCDR - TDS
MAG Simulator
Goetz 28FIELDS iCDR - TDS
TDS Channel 1
Goetz 29FIELDS iCDR - TDS
TDS Channel 2
Goetz 30FIELDS iCDR - TDS
TDS Channel 3
Goetz 31FIELDS iCDR - TDS
TDS Channel 4
Goetz 32FIELDS iCDR - TDS
TDS Channel 5
Goetz 33FIELDS iCDR - TDS
TDS Big Screen
Goetz 34FIELDS iCDR - TDS
Resources
• TDS mass CBE is 435g (not counting structure) with 500g NTE
• TDS power CBE is 2.36W secondary with 2.50W NTE– May increase on ±6V– +1.5V and +3.3V will increase when hot– Measured values as a function of temperature in TV
• TDS science bit-rate to DCB (flash) is ~10,000 b/s uncompressed– Highly flexible (by command)
• 1kbps to 100kbps
Goetz 35FIELDS iCDR - TDS
Parts
• Parts list is complete– Most parts are ok– Some issues remain with SE issues – being worked– One part needs further testing – ADC AD7621– De-rating worksheets are well along
• Selected ADC is great – but plastic – AD7621– Astrium/ESA testing suggests we’ll be ok (only SEU/SEFI
sensitive)– Beam testing planned at TAMU– Topless parts are in hand – to be attached to demo boards for
the beam• Test software is coming along
– As a risk mitigation, an over current circuit breaker is in current design
Goetz 36FIELDS iCDR - TDS
Reviews
• FIELDS iPDR held on 13-14 November 2013– No actions directed specifically at TDS
• TDS circuit, FPGA and FSW peer reviews held on 5 December 2014– Electronics review provided 7 recommendations – 6 unique
• 3 are complete, 3 will be done in the near term– FPGA review provided 7 recommendations
• All will be completed in the near term– Flight Software review provided 7 recommendations
• 4 are complete and 3 will be completed in the near term
• FIELDS iCDR held on 14-16 January 2015
Goetz 37FIELDS iCDR - TDS
Next
• Continue development work with EM1– FPGA
• AEB control• SWEAP interface operational
– FSW– Calibrations and trimming– Closed box operations
• Deliver EM1 to UCB and integrate FIELDS1 with FIELDS2– Continue with the full FIELDS level I&T at UCB– Run a full FIELDS CPT
• Populate a second board – EM2 (happening now)– Continue development work with EM2 at UMN
• Beam testing ADC• Move to flight schematics, layout
Goetz 38FIELDS iCDR - TDS
Conclusions
• TDS design is well advanced• TDS EM is in great shape
– Better than usual at this point (iCDR)• Design meets or exceeds all requirements
– Except SWEAP protection addition which will be added to FM• Overall power
– We’re only now getting to good power estimates for running hot
• Based on LASP’s testing with DFB• Results are very promising – power increase when hot is less than
expected
• LVDS protection needs to be extended to SWEAP communications
• TDS is on track for flight
Goetz 39FIELDS iCDR - TDS
Backup Slides
Goetz 40FIELDS iCDR - TDS
Electronics Peer Review Recommendations
Action Name Description Response Closed?TDS-01 LF Signals to TDC Need to decide if LF signals will go to TDS before CDR To be done before 1 April
TDS-02 ADC Protection DiodesConsider protection diodes on housekeeping ADC input to stay within spec. Needs a test to verify the series resistor provides enough protection against out of range transients. Should coordinate a test between FIELDS and SWEAP
To be done before 1 April
TDS-03 SWEAP ICD Complete updated SWEAP to FIELDS ICD including any particle pulse signal constraints. To be done before 1 April
TDS-04 Housekeeping ADC Supply
Housekeeping ADC is powered from a different supply than the FPGA.There may be an overstress problem when one supply is active and the other is off. At the very least, series resistors should be placed on the signal lines between the FPGA and the ADC to protect each device from overcurrent. Operationally, there could be a 0.6V differential in the two "Vcc"s. This should be checked to make sure the operation is reliable.
Series resistors will be installed in FM
TDS-05 LF Input Impedances
The TDS analog LF channel inputs for the nominal V5 and optional (TDS-06) V3..4 channels have an effective input impedance of ~28-kohms to analog ground arising from the voltage divider used to bring +/- 115-V LF dynamic range down to the range needed by the TDS.
This input impedance is at least a factor of 5 less than the expected impedance of all the other end users of the LF channels (AEB bias drivers; AEB FGND driver; DFB LF analog inputs) in parallel (at least 100-kohm or more), and so will add a significant load the LF preamp outputs.
It's likely that this extra loading will lead to performance issues on the LF channel (distortion), and so I Recommend that the TDS team consider increasing the resistances used in the V5 input voltge divider to levels comensurate with those found on the AEB and DFB.
Input impedance will be adjusted on the EM and FM models.
TDS-07 ADC input capacitorsRE the ADC128S102: consider adding 1nF caps on all the analog inputs. This is a datasheet recommendation which was found to be necessary (learned when bringing up DCB-ETU#1).
Capacitors will be added on FM.