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Getting Started With TI DLP ® Display Technology Application Report Literature Number: DLPA059C January 2015–Revised May 2018

Getting Started with TI DLP® Display Technology (Rev. C)

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Page 1: Getting Started with TI DLP® Display Technology (Rev. C)

Getting Started With TI DLP® DisplayTechnology

Application Report

Literature Number: DLPA059CJanuary 2015–Revised May 2018

Page 2: Getting Started with TI DLP® Display Technology (Rev. C)

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Copyright © 2015–2018, Texas Instruments Incorporated

Contents

Contents

1 Scope ................................................................................................................................. 42 Introduction to Texas Instruments DLP Technology ................................................................. 5

2.1 Digital Micromirror Device (DMD).......................................................................................... 52.2 Illumination.................................................................................................................... 52.3 Optical Module ............................................................................................................... 6

3 Display System Overview Using DLP Technology.................................................................... 73.1 DLP Display Products ....................................................................................................... 73.2 Pico Display Application .................................................................................................... 7

3.2.1 Electronics Size ..................................................................................................... 83.3 Standard Display Application............................................................................................... 93.4 DLP Controller .............................................................................................................. 103.5 Power Management IC, LED Driver, and Motor Driver ............................................................... 103.6 Field Programmable Gate Array.......................................................................................... 103.7 Complementary System Components ................................................................................... 10

4 Display System Tradeoffs.................................................................................................... 114.1 Brightness vs. Power Consumption...................................................................................... 114.2 Brightness vs. Size......................................................................................................... 114.3 Throw Ratio vs. Size ....................................................................................................... 11

5 DLP Display Chipset Selection Guide ................................................................................... 126 Resources to Get Started With DLP Technology for Display Applications ................................. 13

6.1 Resources to Get Started With DLP Technology for Display Applications ......................................... 13

7 Common Display and Projection Terminology ....................................................................... 14Revision History.......................................................................................................................... 17

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List of Figures

List of Figures2-1. DLP® DMD.................................................................................................................... 52-2. Close Up of DMD Micromirrors ........................................................................................... 52-3. RGB LED Illumination ....................................................................................................... 62-4. Simplified Diagram of an LED Optical Module........................................................................... 62-5. Simplified Diagram of a Laser Phosphor Optical Module .............................................................. 63-1. Block Diagram of a Typical DLP® Pico™ System ....................................................................... 73-2. Example of a Small Board Design......................................................................................... 83-3. DLP® Pico™ Evaluation Module (EVM) With Optical Module and System Electronics ............................ 93-4. Block Diagram of a Typical 4K UHD DLP® Display System ........................................................... 94-1. The Tradeoffs Between Brightness, Size, and Power Consumption ................................................ 117-1. Effect of Offset .............................................................................................................. 147-2. Throw Ratio ................................................................................................................. 14

List of Tables5-1. DLP® Display Technology Chipset Selection Guide ................................................................... 12

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(1) Pico is a trademark of Texas Instruments.(2) DLP is a registered trademark of Texas Instruments.

(1)(2)

Chapter 1DLPA059C–January 2015–Revised May 2018

ScopeThis document is a guide to getting started with DLP® technology for display applications. Multiple systemcomponents, including illumination and optics, as well as design considerations when developing displayproducts using DLP chipsets are explained.

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Chapter 2DLPA059C–January 2015–Revised May 2018

Introduction to Texas Instruments DLP Technology2.1 Digital Micromirror Device (DMD)

Figure 2-1. DLP® DMD Figure 2-2. Close Up of DMD Micromirrors

Texas Instruments DLP technology is a micro-electro-mechanical systems (MEMS) technology thatmodulates light using a digital micromirror device (DMD). DMDs vary in resolution and size and cancontain over 8 million micromirrors. Each micromirror (see Figure 2-2) of a DMD can represent either oneor more pixels on the display and is independently controlled, synchronized with color sequentialillumination, to create stunning images on virtually any surface. DLP technology enables a wide variety ofdisplay products worldwide, from tiny projection modules embedded in smartphones to high powereddigital cinema projectors, and emerging display products such as near-eye display, head up display,projection mapping, and laser TV.

The most recent class of chipsets from Texas Instruments is based on a breakthrough micromirrortechnology, called the TRP pixel architecture. With a smaller pixel pitch of 5.4 μm and increased tilt angleof ±17 degrees, TRP chipsets enable higher resolution in a smaller form factor compared to our previouspixel architecture and enhanced image processing features while maintaining high optical efficiency.

2.2 IlluminationDisplay systems based on DMD technology require an illumination source to create a projected image.The technology can be used with virtually any light source including lamps, LEDs, lasers, and laserphosphors. Also, the DMD can steer a wide range of light wavelengths including visible, infrared, andultraviolet wavelengths. Many traditional projectors still use lamps as an illumination source, however asignificant market has developed for LED and laser phosphor illuminated systems. LEDs and laserphosphors provide a long life illumination source with instant on/off capabilities and enable a wide colorgamut.

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Figure 2-3. RGB LED Illumination

The illumination choice will depend on the application and system requirements. DLP product developerscan work with optical module manufacturers to determine the best illumination source for their application.Refer to Chapter 6 for more information.

2.3 Optical ModuleThe DLP DMD, along with its associated electronics, an illumination source, optical elements, andnecessary mechanical components are combined into a compact and rugged assembly known as anoptical module or light engine. The optical module is the core display component of the system. Opticalmodules can be of various sizes depending on the application and requirements. In general, the higher thebrightness, the larger the size of the optical module due to larger illumination sources, optics, DMD andthermal management in the form of heat sinks and fans.

Figure 2-4. Simplified Diagram of an LED Optical Module Figure 2-5. Simplified Diagram of a Laser PhosphorOptical Module

DLP optical modules of various designs, sizes, capabilities, and performance are available from a numberof optical module manufacturers. The availability of existing optical modules accelerates the productdevelopment cycle of an end equipment producer because an appropriate DLP optical module can beutilized or adapted for use in the end product without requiring in-house expertise or resources. DLPdesign houses and some optical module manufacturers also have the ability to design and build customoptical modules for applications when required. Refer to Chapter 6 for more information.

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...

LED_SEL(2)

DC Supplies

BAT+ ±

1.1V

WVGADDR DMD

DLPDMD

RESETZ

Included in DLP® Chip Set

1.8V

PROJ_ONPROJ_ON

2.3V-5.5V

DLP Pico Subsystem

INTZ

PMIC/LED driver

DLPA2000

3.2x3.4mmPARKZ

1.1V

1.8V

VCORE

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Illumination

Optics3

BIAS, RST, OFS

I2C

24-bit RGB dataParallel I/F

HOST_IRQ

VCC_INTF

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ControllerDLPC3430

VCC_FLSH

SPI_1

I2C_1

SYSPWR

1.8V

1.8VOtherSupplies

Sub-LVDS DATACTRL

ConnectivityWiFI

Bluetooth

Applications Processor or

Front-EndProcessor

ChargerDC_IN

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L1

L2

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RED

CurrentSense

Spare R/W GPIO18

GPIO_8 (Normal Park)

SPI_0

eDRAM

7 x 7 mm

Touch Control

HDMI

Audio Interface

Power Management

Solution

Memory Interface

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Chapter 3DLPA059C–January 2015–Revised May 2018

Display System Overview Using DLP Technology3.1 DLP Display Products

DLP display products are used in a wide range of traditional accessory projectors and emerging displayequipment including embedded projectors in smartphones and tablets, interactive surface computing,screenless and laser TV, near-eye displays, digital signage, and projection mapping. DLP displaytechnology contains two families of products, DLP Pico™ chipsets and DLP Standard chipsets. DLP Picochips offer versatile display capability and can create images on virtually any surface from ultra-mobiledevices. They are a good fit for any application requiring a display with high contrast, small size, and lowpower. DLP Standard chips enable amazing images for systems that require bright, high resolution, andlarge screen displays. Refer to Chapter 5 for more details describing the portfolio of DLP display chips.

3.2 Pico Display ApplicationDLP Pico technology offers an easy connection to the rest of the system (see Figure 3-1). The subsystemrequires two primary connections: Power and data. Power must be supplied to the DLP PMIC chip. Digitalvideo data (24-bit RGB) must be supplied to the DLP controller chip via a parallel interface. A front endmedia processor, which accepts external sources like HDMI and sends digital video data to the DLPcontroller, is commonly used. Alternatively, a product's host processor, such as in a smartphone or tablet,can also send digital video data to the DLP controller.

Figure 3-1. Block Diagram of a Typical DLP® Pico™ System

Page 8: Getting Started with TI DLP® Display Technology (Rev. C)

16.5mm.

Top View:

8.00

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X1

Flash 2 x 1.5

Bottom View:

0603

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DLPA2000 3.4x3.204

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xxxxxxxxxxxxxxxxxxxx

DMD socket

Flex to DMD

Inductor1.6x.8

Pico Display Application www.ti.com

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3.2.1 Electronics SizeDLP controller and PMIC chips that accompany the DLP Pico DMDs are very small (7 mm × 7 mm and3.4 mm × 3.2 mm, respectively) enabling extremely compact display products. Figure 3-2 shows bothsides of an example printed circuit board design (estimate only) with the DLPA2000 PMIC and DLPC3430controller device, which drive a DLP2010 DMD.

Figure 3-2. Example of a Small Board Design

3.2.1.1 Optical Module InterfaceA DLP Pico optical module is connected to system electronics on a PCB mounted near the optical module.The DMD is connected to the DLP Pico controller via flex cable or board-to-board connector and the LEDsin the optical module are connected with wires to the PMIC/LED driver chip. System boards, fans, heatsinks, mechanical parts, switches, and other parts are assembled into a compact and robust final productaround the optical module.

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Figure 3-3. DLP® Pico™ Evaluation Module (EVM) With Optical Module and System Electronics

3.3 Standard Display ApplicationA system design using DLP Standard display chips has two main components: The formatter printedcircuit board (PCB) and the DMD PCB (see Figure 3-4). The DMD PCB houses the DMD, the powersupply circuitry for the DMD, and communication interfaces between the DLP controller and the DMD. Theformatter board contains the electronics required to format the data and images to be displayed on theDMD.

Figure 3-4. Block Diagram of a Typical 4K UHD DLP® Display System

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3.4 DLP ControllerThe DLP controller chip is the digital interface between the DMD and the rest of the system. The DLPcontroller takes digital input from front end digital receivers and drives the DMD over a high speedinterface. The DLP controller also generates the necessary signals (data, protocols, timings) required todisplay images on the DMD. Some systems require dual controllers to format the incoming data beforesending it to the DMD. The DMD and its appropriate controller are required to be used together in asystem design to ensure reliable operation.

3.5 Power Management IC, LED Driver, and Motor DriverDLP chipsets are comprised of a DMD, controller and sometimes a power management/LED driver chip.The power management IC (PMIC) and LED driver chip provide all of the voltage regulators required bythe DMD and display controller. It also provides the driver functionality for the LEDs, other monitoring andprotection functions, and dynamic LED control based on image color content. Integration of the powersupply and LED driver circuitry in a small IC not only allows for small size electronics to be designed, butalso reduces the product design cycle time.

A motor driver is also needed for systems that include a color wheel. This capability provides the colorwheel motor drive control for lamp and laser illumination based applications as well as switchingregulators and adjustable linear regulators for customer designed peripherals. It supports two peripheralsby supplying three fan drivers and one 3-phase BEMF motor driver or controller for a color wheel.

3.6 Field Programmable Gate ArraySome display systems include a field programmable gate array (FPGA) between the front end interfaceand the DLP controller. The main function of the FPGA is to process high-resolution video into twosuccessive sub-frames so that it can be displayed at the native DMD resolution. The FPGA is alsorequired to split output video between the two display controllers required in some systems.

3.7 Complementary System Components• Front-end/Receiver Chips

For systems designed to accept an external display source, such as HDMI, a front-end chip (alsoknown as a receiver chip) is required. A front end chip accepts the incoming data and converts it to thecorrect format to be sent to the controller or FPGA. Front-end chips vary in feature set depending onthe application.

• Applications ProcessorSystems with an integrated applications processor, such as a smartphone or tablet, can drive the DLPdisplay system directly if it can output the format required by the display controller.

• WirelessIt is becoming more common for designers to integrate wireless connectivity into display systems sothat content can be shown without running cables between equipment. For example, a smart projectoror screenless TV may have a built in media processor and WiFi to enable wireless video streaming. Ifsuch a system is battery powered, it can enable a truly wireless display experience.

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Chapter 4DLPA059C–January 2015–Revised May 2018

Display System Tradeoffs4.1 Brightness vs. Power Consumption

In general, the brighter the projection module, the higher the power consumption (driven mainly by theillumination power). For embedded applications, a target power of 1 to 2 W is typical, while accessoryprojectors can range from a few watts to tens of watts. In the case of LED illumination sources, efficiencyis typically not linear, meaning doubling the power to the LEDs results in less than double the brightness(see Figure 4-1). Finding the right balance of brightness and power consumption is important.

4.2 Brightness vs. SizeOptical modules can vary greatly in size from a few cubic centimeters in embedded smartphone or tabletapplications to hundreds of cubic centimeters in high brightness accessory projectors. In general,projection modules with higher brightness capability are larger in size. A larger illumination source, optics,and DLP DMDs may be used in order to achieve a higher brightness. The power and heat generated bythe illumination source increases as the brightness increases. Heat dissipation requirements add to thesize if heatsinks or fans are necessary. The size of small, low power DLP Pico systems is driven mainly bythe size of the optical module, while the size of larger, higher brightness DLP display systems is driven notonly by the size of the optical module but also the size of the thermal solution (see Figure 4-1).

Figure 4-1. The Tradeoffs Between Brightness, Size, and Power Consumption

4.3 Throw Ratio vs. SizeIn general, the shorter the throw ratio (see definition in Chapter 7), the larger the optical module due tolarger optical components such as lenses and mirrors.

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Chapter 5DLPA059C–January 2015–Revised May 2018

DLP Display Chipset Selection GuideChoosing the right DLP chipset for your display application will depend on a number of requirements andtradeoffs. TI provides a wide range of chipsets across multiple resolutions from nHD to 4K UHD. SeeTable 5-1 to compare DLP chipsets.

(1) Contact TI for more information on this device.

Table 5-1. DLP® Display Technology Chipset Selection Guide

DLP® Pico™ DMDMicromirror ArrayDiagonal

(inch)

DisplayResolution

MicromirrorPitch (μm)

TypicalBrightness(Lumens)

Controller PartNumber

PowerManagement

/Illumination DriverPart Number

DLP2000 0.2 640x360 7.6 15-25 DLPC2607 DLPA1000.24" VGA (1) 0.24 640x480 7.6 30-50 DLPC2607

DLP3000 (.3" WVGA) 0.3 854x480 7.6 50-150 DLPC2607DLP4500

0.45 1280x800 5.4 150-750 DLPC6401(.45" WXGA)

DLP20100.2 854x480 5.4 50-100

DLPC3430 DLPA2000(.2" WVGA) DLPC3435 DLPA2005

DLP230GP0.23 960x540 5.4 50-200 DLPC3432

DLPA2000DLPA2005

(.23” qHD) DLPA3000

DLP230KP0.23 1280x720 5.4 50-200 DLPC3434

DLPA2000DLPA2005

(.23” HD) DLPA3000

DLP30100.3 1280x720 5.4 100-300

DLPC3433DLPA2000DLPA2005

(.3" 720p) DLPC3438 DLPA3000DLP3310

0.33 1920x1080 5.4 100-300 DLPC3437 (2x) DLPA3000(.33" 1080p)

DLP47100.47 1920x1080 5.4 300-1000 DLPC3439 (2x)

DLPA3000(.47" 1080p) DLPA3005

DLP Standard DMD.65" WXGA (1) 0.65 1280x800 7.6 1000-4000 DLPC4422 DLPA100.65" 1080p (1) 0.65 1920×1080 7.6 1000-4000 DLPC4422 DLPA100DLP660TE

0.66 3840x2160 5.4 1000-5000 DLPC4422 (2x) DLPA100(.66" 4K UHD)

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Chapter 6DLPA059C–January 2015–Revised May 2018

Resources to Get Started With DLP Technology forDisplay Applications

6.1 Resources to Get Started With DLP Technology for Display Applications

1. Learn more about DLP technology:• For DLP Pico chipsets:

– Browse getting started resources– Learn about the variety of display applications which DLP technology enables– Browse DLP products and datasheets– Read other technical documents for video and data display

• For DLP Standard chipsets:– Browse DLP products and datasheets– Learn about the variety of display applications which DLP technology enables– Read other technical documents for video and data display

2. Evaluate DLP display technology with an easy to use Pico evaluation module (EVM).3. Download TI Designs reference designs to speed product development, including schematics, layout

files, bill of materials, and test reports.• For DLP Pico chipsets:

– DLP2010: Ultra Mobile, Ultra Low Power Display Reference Design using DLP Technology– DLP3010: Portable, Low Power HD Projection Display using DLP Technology– DLP4710: Portable, Low Power Full HD Projection Display using DLP® Technology

• For DLP Standard chipsets:– DLP660TE: 4K UHD Display using DLP Technology

4. Browse TI’s E2E community to search for solutions, ask for help, share knowledge and solve problemswith fellow engineers and TI experts.

5. Find optical modules and design support.• For DLP Pico chipsets:

– Buy small quantities of DLP Pico projection optical modules from a distributor– Contact optical module manufacturers for high volume, production-ready optical modules– Contact DLP design houses for custom DLP Pico display technology solutions

• For DLP Standard chipsets:– Contact optical module manufacturers for high volume, production-ready optical modules– Contact DLP design houses for custom DLP Standard display technology solutions

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Chapter 7DLPA059C–January 2015–Revised May 2018

Common Display and Projection Terminology• Offset

The DMD in many DLP projectors is offset to a position below the optical axis of the projection lens inorder to shift the image above the horizontal plane. This is useful when the projector is placed on atable to avoid cutting off the bottom of the projected image. The offset also avoids the distortion of theimage which would occur if the projector was simply tilted up.

Figure 7-1. Effect of Offset

• Throw ratioIn many projection applications, the placement of the projector with respect to the viewing screen isimportant. The throw ratio of the projector determines how far away the projector must be placed inorder to achieve a certain screen size. The width of the projected image (W) with respect to thedistance from the lens to the center of the screen (D) is the throw ratio (T).

Figure 7-2. Throw Ratio

Rough definitions: Normal throw T>1; short throw 1>T>0.4; ultra short throw T<0.4.

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• F-numberThe relative brightness of a projected image is a function of both the brightness of the illuminationsystem and the aperture of the lens – that is, the width (D) of the lens opening with respect to the focallength (f) of the lens (determines the size of the projected image). This is expressed as a value calledthe F-number (N). N = ƒ/D.The relative “brightness” (rb) of two lenses is a function of square of the inverse ratio of their f-numbers. rb= (N2N1)2. For example, a lens of N1=2 is 4x “brighter” than a lens of N2=4. f-numberimpacts the system as a tradeoff between brightness and volume (dimensions). Higher f-number(N=2.4) systems are thinner, but sacrifice brightness compared to a system with lower f-number(N=1.7).

• BrightnessBrightness is a measure of how much light is perceived by the human eye in a given scene. This is afunction of the amount of light (number of photons) and their spread across the color spectrum (photonenergy), as well as the varying sensitivity of the human eye across the visible spectrum (most sensitivein the yellow-green region, less sensitive in the blue and red regions). The International System ofUnits (SI) identifies the lumen as the unit of measurement for brightness.

• LumensA DLP projector will often be specified by the number of lumens it is capable of delivering in itsprojected image. The brightness (lumens) determines how large a screen the projector can create andstill be viewable in a given ambient light environment. The greater the brightness, the bigger thedisplayed image can be made. End products utilizing DLP display technology can range from 20-30lumens in smartphones and tablets to greater than 50,000 lumens in digital cinema projectors.

• ResolutionThe level of detail available in an image is determined by the number of pixels which make up thedisplayed image. In a DLP system, this is a function of the number of mirrors on the DMD which canrepresent one or more pixels of the displayed image. Resolution is the number of pixels that can bedisplayed. The level of detail displayed is not only dependent on the resolution of the projector systembut it is also dependent on the resolution of the source content. If the resolution of the source contentdoes not match the resolution of the projector system, the source content is mapped by the controllerto make maximum usage of the resolution displayed. DLP display resolutions range from 640 × 360(nHD) to 3840 × 2160 (4K UHD).

• KeystoneWhen the optical axis of a projection system is not perpendicular to the imaging screen, the image willbe geometrically distorted. One of these distortions, caused by the different distance to the screen topand bottom, is called keystone distortion. The resulting image will have a different width from top tobottom, giving the image the shape of an architectural keystone (used at the top of an arch). Thisdistortion can be avoided by keeping the projection axis perpendicular to the screen. However, this issometimes unavoidable. The keystone distortion can be corrected optically (very difficult, costprohibitive, not adjustable) or by image processing means. DLP controllers provide keystone correctionby re-mapping the input image to the DMD array in such a way as to produce a rectangular image atthe screen. The keystone correction feature is commonly paired with an accelerometer in the system toautomatically adjust the image as the projector is tilted up and down.

• Front Projection / Rear Projection and ScreensA DLP display system uses an optical system to produce a real image of the pixel pattern displayed onthe DMD. In order for the projected image to be seen by viewers, the light must be scattered off asurface co-located with the plane of image focus. This function is provided by a screen, which may bea specially optimized sheet of material, or simply a wall, floor, or countertop - any smooth, light coloredsurface can make a great image. In a front-projection system, the screen must be a reflective surface.A rear-projection system requires a translucent, dispersive screen. In both cases the viewer focusestheir eyes on the screen in order to see the projected image. There are some display systems whichwork by producing a virtual image. For example, near eye displays and head-up displays createimages that are only formed after the light travels through the eye onto the retina.

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• ContrastThe quality of a displayed image is greatly dependent on the distinction between the brightest and thedarkest areas of the viewed image. This is quantified by the contrast ratio, which is the ratio of thebrightest possible region of the image to the darkest possible region of the image. While the contrastratio specification of a DLP system is based on system performance, the viewing experience can alsobe greatly impacted by ambient light. The more ambient light on the screen, the lower the viewablecontrast of the image. Together, system contrast and ambient light determine the true viewablecontrast of the image. Special attention must be given to the optical design, and quality of optics usedin the optical module to maximize contrast.

• Color Sequential DisplayDLP DMDs are made up of micromirrors. They only reflect the light which illuminates them. So, howcan a DMD chip reproduce full color images? The secret is in the way the human eye works. Thehuman retina and brain synthesizes perceived color by means of a short-term time averageddifferential response to the quantity of light impinging on the 3 types of retinal cones (red sensitive,green sensitive, blue sensitive). Since the eye continuously averages the light striking the retina over aperiod of about 1/50 second, it is possible to illuminate the eye sequentially at a sufficient rate with red,green, and blue images such that the viewer perceives the impression of full color images. This isachieved by a DLP optical module by sequentially turning the R, G, B light sources on and off suchthat there is, for example, a red image, followed by a green image, followed by a blue image.

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Revision History

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from B Revision (August 2017) to C Revision ................................................................................................ Page

• Added the DLP230GP (.23" qHD) and DLP230 KP (.23" HD) to the DLP Display Technology Chipset Selection Guide(Table 5-1) ................................................................................................................................ 12

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Revision History

Changes from A Revision (January 2017) to B Revision ..................................................................................................... Page• Updated .2" nHD DMD to DLP2000 and added corresponding links in Table 5-1 .............................................. 12

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Revision History

Changes from Original (January 2015) to A Revision .......................................................................................................... Page• Updated all images and sections........................................................................................................ 5

Page 20: Getting Started with TI DLP® Display Technology (Rev. C)

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who aredeveloping applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms ofthis Notice.TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TIproducts, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,enhancements, improvements and other changes to its TI Resources.You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing yourapplications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. Yourepresent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures thatmight cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, youwill thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted anytesting other than that specifically described in the published documentation for a particular TI Resource.You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that includethe TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TOANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTYRIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationregarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty orendorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES ORREPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TOACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OFMERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUALPROPERTY RIGHTS.TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOTLIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IFDESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH ORARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THEPOSSIBILITY OF SUCH DAMAGES.You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-compliance with the terms and provisions of this Notice.This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluationmodules, and samples (http://www.ti.com/sc/docs/sampterms.htm).

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