GENERAL PURPOSE MEMORY MODULE GPM AND GPM … solver/cards/Processor... · ProcessorTechnology Processor Technology Corparltlon GPM Manual ALS-B Manual 7100 Johnsonlndustnal Drive

GENERAL PURPOSE MEMORY MODULEGPM AND GPM - Sol

ASSEMBLY AND TEST INSTRUCTIONS

~~Processorlec,--,--·r~6200 HoII~~"""" ~t""-'-'

Emeryville CA94608

ProcessorTechnology

Processor TechnologyCorparltlon

GPM ManualALS-B Manual

7100 Johnsonlndustnal DrivePleasllnlon CA 94566

(415) 829·2600Cable Addfess PROCTEC

Change Notice #lA

A set of three or four ROMs containing the ALS-8 programdevelopment system may be used on the GPM and GPM-Sol boards.Alternative procedures are given below for entering the ALS-8program from the SOLOS monitor program in the Sol Terminal Computer with GPM-Sol, and from the CUTER monitor program in ROMon GPM. The procedure differs also depending on whether serialdata input is used, as from a teletype or CRT terminal, or parallel data input is used, as from a keyboard. The proceduresassume that a VDM-l video display module is in use.

1) Serial Data Input

a) From the CUTER command mode, type EXEC E~24 (CarriageReturn) •

b) Type ·Control-Z (CR), i.e., depress Z and CTRL key simultaneously. This initializes the ALS-8 video display driver,clearing parameters.

c) Next type Control-So The AL5-8 program will respond:SPEED?

d) Lastly, type one key from 1 to 9 (CR) to set the rate atwhich new characters are added to the video display. Normally type 1 for the fastest speed. ALS-8 is now ready touse.

e) To exit to CUTER from ALS-8, type EXEC C~~3 (CR).

2) Parallel Data Input

a) From the SOLOS/CUTER command mode, type EXEC E~24 (CR).This moves the ALS-8 input and output driver from ROM intoRAM, where they may be modified.

b) In a Sol, with GPM-Sol, Press upper Case and Repeat keyssimultaneously. In other computers, first stop the computerfrom running, then start up CUTER again, at location C~~~.

The video display will respond with a prompt.

c) Enter the data shown below. The underline indicatescharacters which are responses from SOLOS/CUTER:

CN#l Rev A page 1 7/77

ENTRIES FOR CUTER ENTRIES FOR SOLOS

ENTR D~9F (CR) ENTR DMF (CR)

, 03 (CR) , FC (CR)- -

D~A6, 2F E6 ~l C9 (CR) , D~A5, FA 2F E6 ~l C9 (CR)- -, D~D~, 77 FE (CR) , D~D~, 77 FE (CR)- -

. D~96, 77 FE / (CR) , D~96, 77 FE / (CR)-SOLOS/CUTER should again respond with a prompt: ). The aboveentries modify the standard input and output drivers, which arewritten for a serial console interface, to work with a parallelconsole interface, as for a keyboard. You may want to recordthese entries on tape for later use.

e) Type EXEC E~6~ to transfer control to the ALS-8.start the ALS-8 at E~24 as this will reinitializeerasing the entries just made.

Do not try tothe----ai?ivers,

f) Do steps b, c, and d from Serial Data Input procedure above.

g) To exit to SOLOS/CUTER from ALS-S, type EXEC C~~3 (CR).

CN#l Rev A page 2 7/77

ProcessorTechnoIogy

ProcH,or T.ehnologyCOrpor1ltlon

GPM Manual

7tOO Johnson Industrial DrivePleasanton, CA 94566

(415) 829-2600Cable Address PROCTEC

Change Notice #2

1) Refer to Section 2, page 2-7, Step 3.

This step calls for the installation of U33, a 7812 voltageregulator Ie. Please note that this regulator does notS2. .£!!. the heat sink. It goes on the top the 'board abovethe heat sink. with the leads facing to the left, asdescribed in this assembly step. Only U34, a 7805 goeson the heat sink. The heat sink is designed for twoparts, and there are pads for an additional regulator onthe heat sink, but these are for the optional regulatorU35, which is not supplied with this kit. U35, a negativeregulator, is only used if the GPM is later set up for 2708ROMs. Two other parts, C14 and CIS, are not included inthe kit and are only needed if U35 is installed. MarkStep 3 to refer you to this page, so that when you come tothis point in the assembly procedures, you will be remindedto reread this information.


It is recommended that the check procedure in this stepbe repeated for CIS, to ensure there is no short accrossthe -17 volt supply. Note this step is only necessary ifthe optional negative regulator U35 is installed. Makea note below step 4 containing this information.


In the second line of this step, change" (below U9)" toread, "(below U19) II.

eN ~2 6/77

•

•

•

GENERAL PURPOSE MEMORY MODULEGPM and GPM-Sol

ASSEMBLY and TEST INSTRUCTIONS

Copyright ~ 1977, Processor Technology CorporationFirst Printing, July, 1977

Manual No. 210,003

• GPM

SECTION

PROCESSOR TECHNOLOGY CORPORATION

TITLE

Contents

PAGE

1 INTRODUCTION and GENERAL INFORMATION

1.1 Introduction

1.2 General Information

1-1

1-1

1. 2.11. 2.21. 2.3

DescriptionGPM and GPM-Sol VersionsGPM Voltage Requirements, Typical.

1-11-21-4

1.3 warranty and Replacement Information 1-4

1.3.11. 3.21. 3.31. 3.4

Receiving InspectionWarranty InformationReplacement PartsFactory Service

1-41-41-41-5

•2 ASSEMBLY

2.1 Parts and Components

2.2 Assembly Tips ..

2.3 Assembly Precautions

2-1

2-1

2-3

2.3.12.3.22.3.32.3.4

2.3.5

Handling MOS Integrated CircuitsSoldering **IMPORTANT**.Installing and Removing GPM ModuleInstalling and Removing IntegratedCircuits ..Use of Clip Leads.

2-32-32-3

2-42-4

2.4 Required Tools, Equipment and Haterials

2.5 Orientation.

2.6 Assembly-Test

2-4

2-4

2-4

•

2.6.12.6.22.6.3

2.6.4

Circuit Board CheckAssembly-Test ProcedureALS-a, and ALS-8 with SIM-l and TXT-2Options .Operation in Computers withoutSense Switches ...

2-52-7

2-12

2-12


GPM Contents

SECTION

3 GPM OPTIONS

3.1 GPM Options

3.2 Switch Options

TITLE PAGE

3-1

3-2

3.3 Read Only Memory Options 3-2

3.3.1

3.3.2

Replacing34000P5Replacing

9216Bs with 8316Es or

9216B5 With Two 2708 PROMS3-23-3

4 THEORY OF OPERATION

4.1 Overview

4.2 Circuit Description

4-1

4-1

4.2.14.2.24.2.34.2.44.2.54.2.64.2.7

5 DRAWINGS

Address DecodingMemory AllocationRead Operation .Write OperationPhantom (Automatic) Start-UpWait State CircuitRegulators .

4-14-24-34-34-44-44-4

GPM Assembly Drawing

Schematic, GPM Module Drawing

APPENDICES

1 Statement of Warranty

2 8080 Operating Codes

3 Standard Color Code

4 Loading DIP Devices,Soldering Tips andInstalling Augat Pins

5 Ie Pin Configurations


Replacing 9216B (2Kx8) with 2708 (lKx8) ROMs 3-5

Replacing 921GB (lKx8) ROMs with 8316E or34000P (2Kx8) ROHs . . . • • • . . . . 3-3

Necessary To Operate the GPM

• GPM

TABLE

2-1

3-1

3-2

3-3

4-1

FIGURE

TITLE

GPM Parts List

Switch SettingsModule ...

Memory Allocation Table . .

TITLE

Tables/Figures

PAGE

2-2

• • 3-1

4-2

PAGE

•

•

1-1

3-1

GPM and GPM-Sol Memory Maps

Locations For Trace Cuts and Jumpers

1-3

3-6

i

II

tef!

lI!r

I~e

tfr!ll

SECTION 1

INTRODUCTION AND GENERAL INFORMATION

GPM (General Purpose Memory) and GPM"'Sol MODULES

•GPM

1.1


INTRODUCTION

Section 1

This manual provides all information necessary to assemble,test, and use the General Purpose Memory (GPM) Module. Beforestarting to assemble the kit, scan the entire manual, and be surethat you have all the parts and components in Table 2-1, GPMParts List, page 2-2. All instructions are presented in theorder in which you must assemble the module.

1.2

1. 2.1

GENERAL INFORMATION

Description

•

The GPM is an S-100 bus compatible memory module availablein kit or assembled form for use in BOBO-based computers includingthe Processor Technology Sol, and models by several other manufacturers. It has a capacity of 10,240 a-bit bytes of read-only-memDry (ROM) for storing programs as "firmware", and 1024 bytes ofread-write-memory (RAM) which is normally used as a "scratch-pad"memory. The user can store any frequently-used programs on theGPM, or use the module to house a companion product, the ALS-8program development system, a resident monitor-assembler system,available in ROM. GPM ~ay be adapted for use with several typesof ROMs and PROMs including types 921GB, 8316E, 34000P, and2708. A switch-selectable automatic start-up mode is included,so that the system is "uptl and ready to accept corrunands as soonas power is applied. All signal lines are fully buffered.

The GPM memory is available separately or as a componentmodule in a system of five modules; "Subsystem B", by ProcessorTechnology. Subsystem B includes CUTS, VDM-l, 3P+S, and a choiceof RAM memory boards, as well as the GPM. CUTS provides cassettetape masS storage interface; VDM-l provides a pov7erful video display interface; 3P+S provides parallel and serial data channelsfor keyboard, TTY, paper tape reader or other peripherals; the RAMmemory provides working systems storage area. GPM fits into thissystem by providing the CUTER monitor program, and space for theALS-- 8 program development system or other "firmware". Overall, Subsystem B turns the mainframe computer offered by many manufacturersinto a powerful integrated computer system.

1. 2.2 GPM and GPM-Sol Versions

•Two versions of the product are available; GPM-Sol, for

use in the Sol Terminal computer by Processor Technology, and GPM,for use in other 5-100 computers. The main differences betweenthese two versions is illustrated in Figure 1-1, GPM and GPM-SolMemory Map, page 1-3. This figure shows the full addressing capability, 0000 to FFFF (hex.), of the 8080 central Processing unitused in S-lOO computers and how the subsections of the GPM andthe GPM-Sol may be addressed within this range. The right-hand

1-1

GPM


Section 1

figure shows the GPM-Sol sections mapped within the Sol addressingstructure, and left-hand figure shows GPM mapped within othermanufacturerls addressing structures. The main differences between the two maps are:

1. The GPM version contains 2K of ROM normallyaddressed at locations C¢¢0 to c800(hexadecimal) contain CUTER (Computer Userlg~ape ~ntry and Retrieval monitor program), aversion of the SOLOS monitor program used inthe Processor Technology Sol. The use ofthis program is covered in the SOLOS/CUTERUserlg Manual. Since the Sol already contains the SOLOS program, it is not includedin the GPM-Sol version.

2. The GPM version includes lK of RAM addressedCB¢¢ to CBFF which is used by CUTER as systems memory area. The GPM-Sol version doesnot include the RAM, since this too isincluded in the Sol. However, IK of p~ maybe added to the GPM-501, and addressed ~~~~ to¢3FF (hex).

3. The Sol includes a video display circuitaddressed CC¢¢ to D¢¢¢. To ensure compatibility,it is recommended that the GPM version be usedin conjunction with the VDM-I Video DisplayModule, which is similar to the video section ofthe 501, and is also addressed CC~~ to D~~~.

4. Both the GPM and GPM-501 versions contain spacefor 8K of ROM addressed at E0¢¢ to FFFF (hex).This area may be used to store programs as "firmware ll in ROM Or PROM. A companion product, theAL5-8 program development system is available inthree or four ROMs which plug into the GPM or GPM501 board, and are addressed at these locations.This is shown on Figure 1-1 as the AL5-8 areawithin the dotted lines. An option is availa-ble with ALS-8: 51M-I, an 8080 simulator program,and TXT-2, a text editor program. The ALS-8 kitcontains three ROMs with the ALS-8 program, anoptional fourth ROM with SIM-l and TXT-2, a software manual, and assembly instructions. A systemwhich includes all three programs is a powerfulprogram development system including an assembler,

1-2

• Figure 1-1. GPM and GPM-Sol Memory Maps

GPM Memory Mop GPM-Sol Memory Map

4K RAM

Video Display Module>1---------1cc~0

ALS-6Option

an be addedijh GMP-Sol

Needed ifALS-8 is used

Already includedIn a Sol

Fr:::::::::':':':';';':':';':';';':':':';';j(f';':'~::=:~

13:::~§..!..M;:.!.}tL.;.:.;.;;~.:.f.i:i~ :I I

I II'>I ALS-8 I

I II II ,L .J

4K RAM

Video Display Module

IK RAM I')

(2K ROMSOLOS )OR SOLED

UserDefined

Area

IK RAM Cw

FFFHex

D¢¢¢

CC0¢

C¢¢¢

CB¢¢

\J--------1D~~~Recommended

for CUTER

.---------1 CB~¢

On <GPM CUTER 2K ROM

module

e======="", FFFFmif~l~J~:r':B::':T-X:f:'2::~~~~ He x..:.;.:.;.:.:.:.:.:.:.:.:.:.;-:.:.:,:,:,:,:.:.:~.:.:.:.:.:.:.:.:,:~

I I

ALS- 6 I IOption < : ALS- 8 I

I II II IL J. \c!'====c=-==='-="'-! E,00¢

Needed IfALS-8 is used

'I----------I C¢¢¢

IK RAM

...... -I¢¢¢¢

UserDefined

Area

•

• 1-3

GPM

1. 2.3


Section 1

an 8080 simulator, a text editor; and support routines for file-handling, programexecution, and debugging. When ALS-8 is usedon either GPM or GPM-Sol, 4K of RAM must beadded at locations D¢¢¢ to E¢¢¢.

GPM Voltage Requirements, Typical

The basic GPM board requires: +7.5+15-15

to +10 V de atto +18 V de atto -18 V de at

750 rna.,50 rna.,50 rna.

and

Each additional 2708 draws:

Each additional 9216 draws:

+7.5 to +10 V dc, 6 rna. ,+15 to +18 V dc, 50 rna. , and-15 to -18 V dc, 30 rna.

+7.5 to +10 V dc, 15 rna. , and+15 to +18 V dc, 50 rna.

1.3

1. 3.1

WARRANTY AND REPLACEMENT INFORMATION

Receiving Inspection

When your kit arrives, examine the shipping container,noting any conditions that might indicate damage to the contentsduring transit. Then inspect the contents. (We suggest you savethe shipping materials for use in returning the Kit to ProcessorTechnology if it is necessary. If your GPM is damaged, pleasewrite us at once describing the condition of both the shippingcontainer and the contents, so that we can take appropriateaction.

1. 3.2 Warranty Information

In brief, parts that fail because of defects in materialsor workmanship are replaced at no charge for 3 months for kits,and one year for assembled products, following the date of purchase.Also, products assembled by the buyer are warranted for a period of3 months after the date of purchase; factory assembled units arewarranted for one year after the date of purchase. Refer toAppendix I for the complete "Statement of Warranty".

1. 3.3 Replacement Parts

Order replacement parts by component nomenclature (DMSl3lIe or IN2222 diode, for example) and/or a complete description(680 ohm, 1/4 watt, 5% carbon resistor, for example).

1-4

• GPM

1.3.4


Factory Service

Section 1

•

•

In addition to in-warranty service, Processor Technologyalso provides factory repair service on out-of warranty products.Before returning the unit to Processor Technology, obtainauthorization to do so by writing us a letter describing theproblem. After you receive our authorization to return the unit,proceed as follows:

1. Write a description of the problem.

2. Securely pack the unit and the description in a shipping container.

3. Ship prepaid to Processor TechnologyCorporation, 6200 Hollis Street,Emeryville, CA. 94608

Your unit will be repaired as soon as possible afterreceipt and returned to you prepaid. (Factory service chargeswill not exceed $20.00 without prior notification and yourapproval) .

1-5

~.

•

SECTION 2

ASSEMBLY

GPM (General Purpose Memory) and GPM-Sol Modules

•PROCESSOR TECHNOLOGY CORPORATION

GPM

2.1 PARTS AND COMPONENTS

Section 2

Check all parts(Table 2-1 on Page 2-2).parts by sight, refer tofollowing page 2-2.

2.2 ASSEMBLY TIPS

andIf

the

components against the "Parts List"you have difficulty in identifying anyComponent Identification Illustrations,

•

•

1. Read Sections 2 and 3 before you start to assembleyour GPM.

2. Assembly steps and component installations are precededby a set of parentheses. Check off each installationand step as you complete them. This will minimize thechances of omitting a step or component.

3. When installing components, make use of the assembly aidsthat are incorporated on the GPM PC board and theassembly drawing. (These aids are designed to assistyou in correctly installing the components.)

4. In assembling your GPM, follow the step-by-step integratedassembly-test procedure. FOLLOW THE INSTRUCTIONS INTHE ORDER GIVEN. The circuit reference (R3, CIO, andU7, for example) for each component is silk screened onthe PC board near the location of its installation.Both the circuit reference and value or nomenclature(1.5k and 74LS08, for example) for each component areincluded on the assembly drawing near the location ofits installation.

5. To simplify reading resistor values after installation,install resistors so that their color codes read fromleft-to-right and top-to-bottom as appropriate (boardoriented as defined in Paragraph 2.5 on Page 2-6).

6. Unless specified otherwise in the instructions, installall components, especially disc capacitors, as closeto the board as possible.

7. If you encounter any problem during the assembly, feelfree to calIon us for help.

Table 2-1. GPM Parts List

Quantity ;,

Desillnation(s) I AcceptableGPM GPM Sol Partli Function , Substitute

Integrated

ICircuits

v """"1 0 9216B (AMD) U9 2Kx8 ROM I8 0 91L02A (AMD) lKxl RAM 2l02L1PC or

2lL02B1 1 74LS04 U23 HEX INVERTER

[:;2 2 74LS74 U20-U21 DUAL FLIP-FLOP 74742 2 74LS132 U19-U22 QUAD NAND SCHMITT

, 1 1 74LS138 U31 DECODERV 4 4 74367 U18,U28,U29, HEX BUFFERS 8097 or 8T97

""U32

" 4 4 74LS367 U24-U27 HEX BUFFERS 8T971 1 82S129B(SIGNETICS) U30 256X4 PROM 3601 (INTEL)

(Speciallyprogrammed)

· 1 1 7812 +12V REGI

• 1 1 7805 +5V REGI,

Resistors i(BOURNS)

""2 2 4308R-IOl-222 Rl,R2 8 PIN 2.2K

I~ARRAY

: 6 6 L5Kn,l/4 WATT RJ-R82 2 47011, 1/4 WATT RIO,Rl1

•"" 1 1 10Iill, 1/4 WATT R9

Capacitors

\1/

23 23 .04hlF DISC Cl-C12,C15,C16,C20-C28

""2 2 IjJF TANT C13,C29

c 3 2 15jJF TANT C17 ,C19, (C30)

DIP Sockets

, "" 5 5 14 PIN~ 18 18 16 PIN

9 9 24 PIN

DIP Switch

v V 1 1 206-8 (CTS) 'WI 8 pas DIP

Transistors

~1 1 2N2907 Ql PNP TRANSISTOR

Miscellaneous

•V- I 1 210-001 P. C. BOARD

1 1 680-5220 HEAT SINK

1 1 HEAT SINK

V COMPOUND

4 4 6-32x~ SCREWr 4 4 #6 LOCKWASHER

· 4 4 6-32 NUT

2-2


•GPM Section 2

COMPONENT IDENTIFICATION ILLUSTRATIONS

NOTE: Pin 1 may be indicatedby corner dot or cut-out..

pin 1

Dual Inline Package (DIP) Ie(8,14,16,24 or 40 pins)

DIP Switch

(+) lead

Dipped TantalumElectrolytic Capacitor

pin l~ pin 1 indicated byDIP Socket

•

Carbon Film Resistor5% (gold), 10% (silver) Transistor

TO-18 Package (Metal Can)

• Star Lockwasher Resistor Network

Disc CeramicCapacitor

TO-220 Regulator Ieor Power Transistor

• GPM

2.3

2.3.1


ASSEMBLY PRECAUTIONS

Handling MOS Integrated Circuits

Section 2

Many of the res used in the GPM are MOS devices. They canbe damaged by static electricity discharge. Always handle MOS resso that no discharge will flow through the Ie. Also, avoid unnecessaryhandling, and wear cotton--NOT synthetic--clothing when handlingthese res.

2.3.2 Soldering **IMPORTANT**

1. Use a fine tip, low-wattage iron, 25 watts maximum.

2. DO NOT use excessive amounts of solder. DO solder asneatly and as quickly as possible.

4. To prevent solder bridges, position iron tip so thatit does not touch adjacent pins and/or tracessimultaneously.•

3. Use onlysolder or

60-40 rosin-core solder. NEVER use acid-coreexternally applied fluxes.

5·. DO NOT rest tip of iron on pad or trace.cause the pad or trace to "lift" off thepermanently damage it.

To do soboard and

can

2.3.3

6. The GPM circuit board has plated-through holes. Solderflow through the component (front) side of the boardcan produce solder bridges. Check for such bridgesafter you install each component.

7. The GPM circuit board has an integral solder mask(a lacquer coating) that shields selected areas on theboard. This mask minimizes the chances of creatingsolder bridges during the assembly. DO, however,check all solder joints for possible bridges.

8. Additional pointers on soldering are provided inAppendix 3 of this manual.

Installing and removing GPM Module.

•NEVER install the GPM in, or remove it from the computer,

with the power on. To do so can damage the module .

2-3

GPM

2.3.4


Installing and Removing Integrated Circuits.

Section 2

NEVER installis applied to the GPM.

or remove integrated circuits while powerTo do so can damage the Ie. •

2.3.5 Use of Clip Leads

NEVER attach clip leads to the top edge of the GPM circuitboard. Clip leads so attached are apt to short the +8, +16, -16 V dc,and ground buses.

2.4 REQUIRED TOOLS, EQUIPMENT AND MATERIALS

The following tools, equipment, and materials are recommendedfor assembling and testing the GPM Module:

1. Needle nose pliers

2. Diagonal cutters

3. Screwdriver

4. Sharp knife

5. Controlled heat fine tip soldering iron, 25 watts

6. 60-40 rosin-core solder (supplied)

7. Volt-ohm meter

2.5 ORIENTATION

The heat sink area (large foil area) will be located inthe upper right hand corner of the board when the 100-pin edgeconnector is at the bottom. In this position the component (front)side of the board· is facing up and the solder (back) side is facingdown. Also, the Ie legends (Ul through U9, U10 through U18, etc.)will read from left to right. The assembly drawing in Section 5reflects this position. Subsequent position references in theinstructions assume this orientation.

2.6 ASSEMBLY-TEST

Refer to the GPM assembly drawing, Figure 5-1, in Section 5.Note that the assembly drawing shows values, e.g. 1.5K, as well ascircuit references, e.g. R3.

2-4

• GPM

2.6.1


Section 2

NOTE

Instructions preceded with an asterisk (*)do not apply to the GPM-Sol.

CAUTION

THIS DEVICE USES MOS MEMORY INTEGRATED CIRCUITS WHICHCAN BE DAMAGED BY STATIC ELECTRICITY DISCHARGES. HANDLETHESE ICs SO THAT NO DISCHARGE FLOWS THROUGH THE Ie.AVOID UNNECESSARY HANDLING AND WEAR COTTON RATHER THANSYNTHETIC CLOTHING WHEN HANDLING THESE ICs. (STATICDISCHARGE PROBLEMS ARE MUCH WORSE IN LOW HUMIDITYENVI RONMENTS . )

Circuit Board Check

•Visually check GPM circuit board for solder bridges (shorts)between traces, broken traces, and similar defects.

() Check board to ensure that the +8, +16, -16, +12, +5,-5 volt buses are not shorted to one another or to ground.Using an ohmmeter, make the following measurements (referto GPM assembly drawing in Section 5). You should measureno continuity in any of these measurements.

() +8-volt Bus Test. Measure between edge connector pin 1 or51 (left end of connector) and pin 50 or 100 (right end ofconnector) .

() +16-volt Bus Test. Measure between edge connector pin 2(second top, or front, pin from left end of connector)and pin 50 or 100.

( ) -l6-volt Bus Test.(second bottom, orand pin 50 or 100.

Measure between edge connector pin 52back, pin from left end of connector)

•

() +5-volt Bus Test. Measure between positive (+) mountingpad for C13 and edge connector pin 50 or 100.

() +12-volt Bus Test. Measure between positive (+) mounting'pad for C29 and edge connector pin 50 or 100.

() -5-volt Bus Test. Measure between negative (-) mountingpad for C14 and edge connector pin 50 or 100.

2-5

GPM


Section 2

() 8/16/(-16)/5/(-5)/12 Volt Bus Test. Measure between:

A. Edge Connector pins 1 or 51 and--

Edge connector pin 2

Edge connector pin 52

Positive (+) pad for C13

Negative (-) pad for C14


B. Edge Connector pin 2 and--

Edge Connector pin 52




C. Edge connector pin 52 and--




D. Positive (+) pad for C13 and--



E. Negative (-) pad for C14 and--

( ) Positive (+) pad for C29

•

If you measure continuity in any of the preceding tests, recheckthe measurement(s). If you still measure continuity, the board isdefective. Return it to Processor Technology for replacement. Ifnone of the measurements show continuity, go on to the next paragraph.

2-6

• GPM

2.6.2


Section 2

Assembly-Test Procedure

Step 1. Install heat sink. position the large, blackheat sink (flat side to board) over the square foil areain the upper right corner. Orient the sink so that thetwo triangles of mounting holes in the board are under thetwo triangular cutouts in the sink. Using two 6-32 screws,lockwashers and nuts, attach heat sink to board. Insertthe screws from back (solder) side of board.

•

•

() Step 2. Install U34 (7805). Position U34 over left handcutout in heat sink and observe how the leads must be bentto fit the mounting pads. Note that the center lead (3)must be bent down at a point approximately 0.2 inchesfurther from the body than the other two leads. Bend leadsso that no contact is made with the heat sink when U34is flat against the sink and its mounting hole is alignedwith the hole in the sink. Coat both the bottom surface ofU34 and the heat sink area to which U34 mates with a thinfilm of heat sink compound. Insert leads and fasten U34to sink with a 6-32 screw, #6 lockwasher and nut. Insertscrew from solder (back) side of board, place washer onscrew and drive nut. Solder and trim leads.

NOTE

U35, the negative supply regulator, is not supoliedwith standard GPM modules. It is needed only-when2708 ROMs are used. (Refer to Sec'.:.ion 3).

() Step 3. Install U33 (7812). Position U33 in the upperright hand corner of the board with the leads facing left.Observe how the leads must be bent down to fit the mountingpads and bend accordingly. U33 should lie flat againstthe board with its mounting hole aligned with the hole inthe circuit board. Insert leads and fasten u33 to boardwith a 6-32 screw, #6 lockwasher and nut. Insert screwfrom solder (back) of board, place washer on screw anddrive nut. Solder and trim leads.

() Step 4. Install DIP switch in location SWl. Positionswitch so Switch No. I (SWl-l) is at the left. (Refer to"Loading DIP Devices It in Appendix 4.)

2-7


GPM Section 2

() Step 5. Install all resistors in numerical order in thefollowing locations. Bend leads down to fit distancebetween mounting holes, insert leads, pull down snug toboard, bend leads outward on solder (back) side of board,solder and trim.

LOCATION VALUE (ohms) COLOR CODE

( ) R3 1.5k brown-green-red( ) R4 1.5k brown-green-red( ) R5 1. 5k brown-green-red( ) R6 1. 5k brown-green-red( ) R7 1. 5k brown-green-red( ) RB 1. 5k brown-green-red( ) R9 10K brown-black-orange( ) RiO 470 yellow-violet-brown( ) Rll 470 yellow-violet-brown

Step 6. Install resistor networks Rl and R2 (2.2k ohms)in their respective locations. Position RI and R2 sothat the dot on their packages is at the bottom right.Insert leads, solder and trim.

CAUTION

RESISTOR NETWORKS ARE DELICATE. HANDLE WITH CARE.

() Step 7. Install the five tantalum capacitors in thefollowing locations. Take care to observe the proper valueand orientation for each installation.

LOCATION VALUE (ufd) ORIENTATION

C13 1 "+" lead rightC14 (not used)C17 15 "+" lead bottom rightCiS (not used)

( C19 15 "+" lead right( C29 1 n+n lead right

* ( C30 15 "+" lead down

* C30 is not marked on the board. It is the unmarked capacitor tothe right of IC socket U20.

NOTE

C14 and CIS are not supplied with standard GPMmodules. They are needed only when ROMs thatrequire -5 V de are used. (Refer to Section 3.3.2,steps 2 and 3.)

2-8

• GPM


Section 2

() Step 8. Install all disc capacitors in numerical orderin the following locations. Insert leads, pull downsnug to board, bend leads outward on solder (back) sideof board, solder and trim.

NOTE

Disc capacitor leads are usually coated with waxduring the manufacturing process. After insertingleads through mounting holes, remove capacitorand clear the holes of any wax. Re-insert andinstall.

LOCATION VALUE (ufd) TYPE

( ) CI .047 Disc Ceramic( ) C2 .047 Disc Ceramic( ) C3 .047 Disc Ceramic( ) C4 .047 Disc Ceramic( ) C5 .047 Disc Ceramic( ) C6 .047 Disc Ceramic

• ( ) C7 .047 Disc Ceramic( ) CB .047 Disc Ceramic( ) C9 .047 Disc Ceramic( ) CIO .047 Disc Ceramic( ) Cll .047 Disc Ceramic( ) Cl2 .047 Disc Ceramic( ) Cl5 .047 Disc Ceramic( ) Cl6 .047 Disc Ceramic( ) C20 .047 Disc Ceramic( ) C21 .047 Disc Ceramic( ) C22 .047 Disc Ceramic( ) C23 .047 Disc Ceramic( ) C24 .047 Disc Ceramic( ) C25 .047 Disc Ceramic( ) C26 .047 Disc Ceramic( ) C27 .047 Disc Ceramic( ) C28 .047 Disc Ceramic

Step 9. Install DIP sockets. Install each socket in theindicated location with its end notch at the bottom. (Notethat pin I is in the lower right corner of each location. )Take care not to create solder bridges between the pins and/ortraces.

• 2-9

GPM


Section 2

INSTALLATION TIP

Insert socket pins into mounting pads ofappropriate location. On back (solder) side ofboard, bend pins at opposite corners of socket(e.g. pins 1 and 9 on a 16-pin socket) outwarduntil they are at a 45° angle to the board surface.This secures the socket until it is soldered.Repeat this procedure with each socket until allare secured to the board. solder the unbent pinsOn all sockets. Then straighten the bent pins totheir original position and solder.

NOTE

If you intend to use eight lK ROMS. instead o~ four2K ROMs, 24-pin sockets should be lDstalled lD thesefour locations.

LOCATION SOCKET TYPE

() Ul through U9() UID through U18() U19 through U23() U24 through U32

24 pin16 pin14 pin16 pin

() Step 10. Check regulator operation. This check is madeto prevent potential damage to the ICs from incorrectvoltages.

( ) Using an ohmmeter, make the following measurements:

S~P~

+5 V dc+12 V dc

~lliASUREMENT POINTS

Positive (+) and negative (-) leads of Cl3Positive (+) and negative (-) leads of C29

You should measure some resistance in both measurements.Zero resistance indicates a short. If required, findand correct the problem before proceeding. Especiallycheck for solder bridges.

() Install GPM in computer. (The use of a Processor Technology ~EXB Extender Board is recommended.)

2-10

• GPM


Section 2

CAUTION

NEVER INSTALL OR REMOVE GPM WITH POWER ON.

() Turn power on and make the following voltage measurements:

I.I

MEASUREMENT POINTS

Across C13Across C29

VOLTAGE (±5%)

+5 V de+12 V de

•

If either voltage is incorrect, determine and correct thecause before proceeding. If voltages are correct, turnpower off, remove GPM from computer and go on to step 11.

() Step 11. Install the following les in the indicatedlocations. Pay careful attention to the properorientation.

NOTE

Pin 1 is positioned in the lower right corner ofeach Ie location, and is indicated by a dot on theassembly drawing.

IC NO. TYPE.( ) U9# 9216# (CUTER ROM).( ) U10 through 17# 91L02A, 2102LIPC or 21L02B#( ) U18 74367, 8097 or 8T97( ) 019 74LS132 or 74132( ) U20 & 21 74LS74 or 7474( ) U22 74LS132 or 74132( ) U23 74LS04 or 7404( ) U24 through 27 74LS367 or 8T97( ) U28 & 29 74367, 8097 , or 8T97( ) U30 825129 or 3601( ) U31 74L5138 or 74158( ) U32 74367, 8097, or 8T97

* #MOS devices. Refer to CAUTION on Page 2-8.

•Assembly andnow complete

test of the GPM General Purpose Memory or GPM-sol isand ready for use with appropriately programmed ROMs.

2-11

GPM


Section 2

35C¢ for keyboard input3EC~ for serial input5~C~ for parallel input

As presently assembled, the GPM is configured to operatewith 921GB ROMs in locations U2, U4, U6, U8, and U9. Other ZK ROMs(34000 and 8316E) can also be used in these locations by reCOnfiguring the board via trace cutting and jumper options. In asimilar manner the GPM can be reconfigured to use lK ROMs (e.g. 2708)in locations 01 through U8. Instructions for making the requiredchanges are given in Section 3.

() Step 12. Install transistor 2N2907 according to thefollowing instructions. Place the middle lead of thetransistor in the hole labeled B (right below and to theleft of R4 on the component side). The small metal tabshould point to the left; then the other two leads willfit into the appropriate holes. Install the transistoras close to the board as possible. Turn the board over,solder the leads and trim.

2.6.3 ALS-8, and ALS-8 with SIM-I and TXT-2 Options

If you have purchased either the ALS-8 option alone, orthe ALS-8 plus SIM-I and TXT-2 option, and your GPM or GPM-Sol boardis functioning correctly, you may proceed to install these ROMsaccording to the instructions enclosed with them.

2.6.4 Operation in Computers without Sense Switches

At start-up, after examining location C~~~, the CUTER programinputs the sense switch data from port FF (hexadecimal) to determinethe input and output pseudoports to be used during command mode. Ifthe system has no sense switches, data from port FF will be input asFF which indicates that at locations C8~~ and C8~2 the program willfind the addresses of user-defined input and output routines. Byputting the addresses of pre-written CUTER routines in these twolocations, the desired command mode input and output routines areselected without sense switches. By entering the data in the tablebelow before examining C~~~ and running, the desired input and output routines may be chosen. Entering these addresses is known aspatching.

1. INPUT PATCH:

at C8~~ patch in:

2. OUTPUT PATCH:at C8~2 patch in 77C~ for video display output

46C~ for serial output59C~ for parallel output

2-12

.,,·

•

j•,

•

- -

SECTION 3

GPM OPTIONS

GPM (General Purpose Memory) and GPM-Sol MODULES

• GPM

3.1 GPM OPTIONS


Section 3

The eight-position DIP switch (SWl) located in the upperright corner of the PC board is used to configure the GPM for thevarious operating options. These include: the automatic start-upoption; wait-state generation; and the ability to place portionsof memory at different addresses.

Jumper arrangements are provided to permit accomodation ofvarious types of ROM chips.

TABLE }-1. SWITCH SETTINGS NECESSARY TO OPERATE THE GPM MODULE

SWITCHDESCRIPTION

ALTAIR IMSAI

•51-1

51-2

51-3

51-4

$1-5

I" ,

Sl~7

Disables Ee~e-FFFF

during phantomstart-up

Imposes 1 wai tstat"

Disables C~~~-C7FF

during phantomstart~up

Disables RAM at~ggg-g3FF when usein a Sol (i.e. if51-7 is closed)

PeI"mits,auto staI"tin ALTAIRs only

Enables on-cardPh"->1ton;

FOI" Sol (disablesPROM 9 & puts lKRAM at fJjljllJ

Ej~~-FFFF is enabled during autostart

NO wait state imposed

C~~~~C7FF is enabled during autostart

RAM is enabled ~

g~~g-g3FF (providedSl-7 is closed)

Disconnects GPMfrom PRESET, Buspin 75

Disables on-cardphantom

For ALTAIR, IMSAI(puts PROM 9 atcfJ~jl-C7FF & lK RAMat" CBjljl-CBFF)

OFF (no~al operation)

ON if slow PROMsare used

Not used

ON if Sol alreadyhas memory ~

gg;JfJ-fJ3FFOFF if Sol does not

already havememory @ fJ;J;J~

fJ3FF

'"

0'

ON if used with au--

to start at Cee~OFF if used with au

to start at E~~~

OFF (normal operation)

ON if slOw PROMs-

are used

OFF for auto start~

to C~~~ (normaloperation)

ON for nO auto start-

or auto start toE~~~

OFF (lK RAM willappear at csg~)

ON (for auto start)

OFF (for non-auto~ start)

ON for auto start-

with GPM

OFF for non-auto~

start

'"

ON if used with auto start at C~~

OFF if used with--- auto start at

E~~~

OFF (no~al operation)

ON if slow PROMS- are used.

OFF for auto start--- to C~~~ (normal operation)

ON for no autostart or autostart to E~g~

OFF (IK RAM willappear @ CSgg)

ON for auto start-

with GPM

OFF for non-auto~

start

•Sl~B Allows control from Disconnects GPM

external phantom from pin 67 On bus

3-1


GPM Section 3

3.2 SWITCH OPTIONS

Table 3-1 '~witch Settings Necessary to Operate the GPMModule" summarizes the function of the different switchs in eachof the three main types of computers: the Sol, the ALTAIR BBOO,and the IMSAI B080, in which the GPM is expected to be used. Ineach case, the first setting shown is the one that would normally be used and the second setting is the exception (i.e. Sl-2is normally OFF but should be switched to ON if slow memory chipsare used) •

If the GPM is to be used in any other computer, the switchfunctions should be studied and set according to the requirementsof that computer.

3.3 READ ONLY MEMORY OPTIONS

When assembled according to the instructions in Section 2,your GPM is configured for use with 921GB (2KxB) ROMs in locationsU2, U4, UG, UB, and U9 and no memory chips in locations Ul, U3,US, and U7. By cutting specific traces and installing specificjumpers, you can configure your board to:

1. Replace any 921GB (2KxB) ROM (U2, U4, UG, U8, and U9)with an 831GE or a 34000P ROM.

2. Replace any 921GB (2KxB) ROM in locations U2, U4, UG,and UB with two 270B (lKxB) PROMs (two 270Bs in Ul andU2 to replace the 921GB in U2, two 270Bs in U3 and U4to replace the 921GB in U4, two 270Bs in US and U6 toreplace the 9216B in U6, or two 2708s in U7 and UB toreplace the 9216B in UB). In order to use 270B PROMs,you must also add the -S V de regulator circuit.

3.3.1 Replacing 9216B5 With 8316E5 or 34000P5

A summary of traces to be cut and jumpers to be added to replace 9216B ROMs with B31GE or 34000P ROMs are given in Table 3-2.Figure 3-1 shows the locations of the traces to be cut and the jumpers to be installed.

3-2

• GPM


Section 3

Table 3-2. Replacing 921GB (2Kx8) ROMs With 831GE Or34000P (2Kx8) ROMs

,CHIP

LOCATION CUT TRACEINSTALL JUMPER

BETWEEN*

•

U2 M-P (component side) M and GNDjj-kk (solder side) kk and P

U4 Q-S (solder side) Q and GNDgg-hh (solder side) hh and S

U6 T-W (solder side) T and GNDee-ff (solder side) ff and W

U8 x-z (solder side) X and GNDcc-dd (solder side) dd and Z

U9 J-L (component side) J and GNDaa-bb (solder side) bb and L

*Install all jumpers on component side of boardusing #24 bare wire.

Your GPM is now configured to operate with 8316E or 34QOOP(2Kx8) ROMs. Return to Section II to complete assembly of your GPMmodule.

3.3.2 Replacing 9216Bs With Two 2708 PROMs

If 2708 PROMs are used on the GPM module, you must install a-5 V de regulator circuit (U35, C14, and CIS). You need the following components and hardware. This equipment can usually be purchased at any local electronics store.

To add this circuit, proceed as follows:in Section 5, Page 5-1.1

,

•

•

11111111

7905 regulator (U35)1 ufd tantalum dipped capacitor (C14)15 ufd tantalum dipped capacitor (CIS)6-32 x ~ screw, Nylon#6 lockwasher6-32 hex nutInsulator, micaHeat sink compound

(See assembly drawing

3-3


GPM Section 3

( ) Step 1. Install u35 (7905). Position U35 over righthand cutout in heat sink and determine how the leadsmust be bent to fit the mounting holes. Note that thecenter lead (3) must be bent down at a point approximately 0.2 inches further from the body than the othertwo leads. Bend leads so that no contact is made withthe sink when U35 is flat against the sink and itsmounting hole is aligned with the hole in the sink.Coat both sides of the mica insulator and the matingsurfaces on the sink and the bottom of U35 with a thinfilm of heat sink compound. Insert Nylon 6-32 x ~ screwfrom back (solder) side of board, place insulator overscrew on front (component) side, lower u35 over screwand insert leads, place #6 lockwasher on screw and drivehex nut. Solder and trim leads.

( ) Step 2. Install C14 (1 ufd tantalum dipped capacitor) inits location below the heat sink, position Cl4 with itspositive (+) lead to the left, insert leads, solder andtrim.

( ) Ste~ 3. Install CIa (15 ufd tantalum dipped capacitor)in lts location in lower left corner of board (below U9) .Position CIa with its positive (+) lead at the top, insert leads, solder and trim.

( ) Step 4. Check regulator operation. This check is madeto prevent potential damage to the ICs from an incorrectvoltage. Using an ohmmeter, measure between positive(+) and negative (-) leads of Cl4. You should measuresome resistance. Zero resistance indicates a short. Ifrequired, find and correct the problem before proceeding.Especially check for solder bridges.

( ) Install the GPM in computer.Technology EXB Extender Board

(The use of a Processoris recommended.)

CAUTION

NEVER INSTALL OR REMOVE GPMWITH POWER ON.

( ) Turn power on and measure the voltage across Cl4 (positive lead is ground). You should measure -5 V de ± 5%.If the voltage is incorrect, determine and correct thecause before proceeding. If the voltage is correct,turn power off, remove GPM from computer and configurethe GPM for 2708 PROMs as subsequently described.

3-4

• GPM


Section 3

•

A summary of traces to be cut and jumpers to be added toreplace a 9216B (2Kx8) ROM (U2, U4, U6, and U8) with two 2708(lKx8) PROMs are given in Table 3-3. Figure 3-1 shows the locations of the traces to be cut and the jumpers to be installed.These locations are also printed on the circuit board legend.

Table 3-3. Replacing 9216B (2Kx8) ROMs With 2708(lKx8) ROMs

CHIPLOCATION CUT TRACE

INSTALL JUMPERBETWEEN*

•

•

•

•-

Ul, U2 M-P (component side) M and NG-H (component side)

U3, U4 Q-S (solder side) Q and RE-F (component side)

US, U6 T-W (solder side) T and VC-D (component side)

-- ._--- -_.._.--U7, U8 x-z (solder side) X and Y

A-B (component side)

*Install all jumpers on component side of boardusing #24 bare wire.

Your GPM is now configured to operate with 2708(lKx8)EPROMs. Return to Section 2 to complete assembly of your GPMmodule.

3-5

Component (front) Side

UI U2 U3 U4 U5 U6 U7 us U9

T

D "

/

eeI)f ;A"'/""'.""i,'.i',--~,.

W/ V

c

/

;.

Q hn

\/pg\.

" ",,<\,.~ ,.," .'

J RE

/G--- '"H

kk

M h. jjN~""'-ii" j..p~/

, " , , ',','A'

\'"\:•v

{'

\\A~~$

{

i, A.,. i:. l'*::: ;:; ~(ti$ ¥q~ ~ *

Figure 3-1. Locations for Trace Cuts and Jumpers

-lI<ffl 11~

lUI tlll!'~"N

'if, ~ IIU!;

"'OO!lIl!li,W

---¢~~

<lW\iJ:_~_~*,);a W'u"-

-* -'l[ il IllW'

!'JUIIIli

,-~

---·'!N!_'4~·-

'-,; J!U!j"m_~-'--._, ,,;'% I ~~

--- ¢ 'Ii1!nf a- a -._. L,,-

(;r •.

Ii¥lUI II

-......" 1. II~ "@W@c-

'!!;~Si:t:.~

~.

~--

.;t<z),' .r ~TMi~-'

~

-="'i;"'*"",~'~

_W ii:1:'IlW '

'il:!ilolf1:ll:1:! _

:.l'H1U;%~ "[

-.",~ ..<$;;' !

~-

-;;'~h

r2': -">'~;~'~'~'~'~...~~,- -\'~~~<_~, ! NW"a

;,-:- - - .'__\=.-'<$ ;;IW ,.,

.<'; 'Jl;!l; )zyllJ

~;- !Il!''''~'W>o"--

_i'~

_j)!c~.-

',>---~,-..~~,

;;';:'t, ,. ,,'"(;

- -._<,:::-,'-..: ..... ' "

~~>

Q)

"D(/)

-'"uo

.D

o(/)

•

•

•

SECTION 4

THEORY OF OPERATION


• GPM

4.1 OVERVIEW


Section 4

•

The GPM consists of up to 10K of ROM, lK of RAM, an addressdecoder, a phantom (automatic) start-up circuit, a wait state circuit, and on-board voltage regulator circuits. While rea~ing thecircuit description, pullout the schematic in Section V, Figure 5-2.Also refer to the GPM and GPM-Sol Memory Map in Section 1, Figure 1-1.

4.2 CIRCUIT DESCRIPTION

4.2.1 Address Decoding

Address lines AQ through A9 are buffered from the bus throughU25 and U26 to the 10 address pins on each RAM chip (U10 through U17)and ROM/PROM chip (Ul through U9). AID, buffered through U24, is applied to the AID input to U2, U4, U6, and U8. AID also appear~ onpin 21 of U9, and AQ input to U30 and the A input to V3l. In addition,AID provides the enables for ROM chip select drivers VlB and PROM chipenable drivers U29.

The address decoding is done with an 825129 256x4 PROM (U30),and a small amount of support circuitry. The four outputs of theB25l29 are CARD SELECT, ROM C, ROM EF, and~. Any time the 82Sl29gets an address that one of the memories on the card should respond to,both CARD SELECT and the appropriate memory line (ROM C, ROM EF, orRAM) are activated. Whenever CARD SELECT is activated (active low),the buffers from both the wait state circuitry (which outputs to thePRDY line and will be discussed below) and from pin 11 of u22 areactivated. 5ince the inputs to this NAND gate are PDBIN and 5MEMR,output 11 will go low whenever the processor is requesting data frommemory. Thus, when CARD 5ELECT is low pin 13 of U32 will go low whenever the processor is requesting data. This signal goes to both U20(the phantom start-up circuitry which will be discussed later) and toenable the data bus drivers, U28 and U29. So, whenever data is requested from one of the memories on the GPM, the appropriate memoryline (ROM C, ROM EF, or RAM) is activated as well as CARD SELECTwhich in turn activates both the wait state output driver and the databus drivers.

The question that arises here is: which addresses does eachmemory respond to? The answer is that it depends on whether or notit is during phantom start-up (pin 15 of the 825129 is pulled lowthru either 51-6 or 51-B) and whether or not the GPM is being usedin a Sol (pin 1 of the 825129 is pulled low thru 51-7). The followingtable summarizes the address to which each memory will respond underthe four basic conditions:

4-1


GPH

Table 4-1. Memory Allocation Table

Section 4

Sol (51-7 is ON) Non-SolMemory NORMAL NORMALLine PHANTOM OPERATION PHANTOM OPERATION

ROM C None None ~~iJiHl3FF C~~~-C7FF

(if 51-3, is open)

ROM EF None E~~~-EFFF MM-~3FF E~M-FFFF

(if 51-1, is open),

RAM None ~~~~-~3FF None C8M-CBFF

Ii

4.2.2 Memory Allocation

The memory block E~~~ to FFFF consists of either(U2 1 U4, U6 1 and U8) or eight lK PROMs (Ul through U8).cations for this block are as follows:

four 2Kr-temory

ROMsallo-

ROM CONFIGURATION

SOCKET 4-2K CHIPS 8-1K CHIPS

Ul F8~~ - FBFFU2 F8M - FFFF FC~~ - FFFFU3 F~M - F3FFU4 F~~~ - F7FF F4M - F7FFUS F80~ - EBFFU6 E8~~ - EFFF ECM - EFFFU7 E~M - E3FFU8 E~M - E7FF E4~~ - E7FF

Memory block C~~~ - C7FF is assigned to U9, a 2K ROM.

The lK of RAM (UlO through U17) can be addressed at eitherC8~% - CBFF when the GPM is used with non-Sol computers at ~~~% %3FF when it is used with the Sol.

4-2

•PROCESSER TECHNOLOGY CORPORATION

GPM

4.2.3 Read Operation

Section 4

•

•

In a GPM read operation, data is read from either ROM/PROMor RAM, as requested, to the Data In Bus (DI~-7) via buffers U28and U29. The Data Out (DO) outputs of the RAM and ROM/PROM chipsare tri-stated types that float in a high impedance state whenthey are not selected. They are therefore connected in parallel.As a result, only the bits in the addressed memory can be gated toDIO-7.

Assuming the processor requests data from the GPM (PDBIN andSMEMR are both high on Bus Pins 78 and 47 respectively and it is appropriately addressed), CARD SELECT and the applicable memory lineare activated.

CARD SELECT (active low) enables the PRDY (Bus pin 72) linedriver, U32-11, and enables U32-13. With 81-2 open, PRDY will behigh and the processor will be in the run state. One wait state isimposed if 81-2 is closed. (Refer to Paragraph 4.2.6) Since PDBINand SMEMR are low when the GPM is accessed, the low on pin 13 of U32enables the 01 Bus drivers u28 and U29 .

Should the RAM be addressed, RAM is low to enable UID throughU17 to present data to U18 and U29, the 01 Bus drivers. Note thatRAM also enables U24-9 which gates the inverted MEM WR (Bus pin 68)to the WE inputs of each RAM chip. MEM WR is low for a read operation, so the WE input is high. RAM can also be applied to pin 15of U3D through Sl-3. This disables the RAM at ~~~~ - ~3FF.

If U9 is addressed, ROM C will be active (high), and providing PHANTOM is not low on U22-9 through Sl-3, U22-8 is low toenable U9 to present data to the 01 Bus drivers.

With ROM EF active (low), u31 decodes address lines AID, All,and A12 to determine which of ul through U8 is to be accessed. Theenables for U2, U4, U6, and U8 are gated when AID is high by U18,and the enables for Ul, U3, U5, and U7 are gated when AID is low byU29. Switch 81-1 determines whether or not E~~~ - EFFF is disabled(81-1 closed) during automatic start-up.

4.2.4 Write Operation

The GPM write operation is similar to a read operation. Datais written from the Data Out (DO) Bus (000-7) into the RAM memory.Each DO line is buffered (U26 and U27) to the Data In (01) of oneRAM chip. Thus, each RAM chip stores one bit of the word writteninto Ram.

4-3


GPM Section 4

The main difference between a read and a write operation isthat in a write operation MEM WR is high instead of SMEMR and onlythe RAM will be active. In this case the low on pin 6 of v19 isgated to the WE input of each RAM so that the data on the DO Bus canbe written into UIO through v17.

4.2.5 Phantom (Automatic) Start-Up

The phantom start-up circuitry (see GPM Schematic, Section 5,Figure 5-2) consists of flip-flop u20 and one-half of U21. When thepower is turned on, POC (Bus pin 99) resets the R-S flip-flop whichconsists of two (2) gates from U22 pulling pin 3 low. This, in turn,resets the phantom flip-flops. As C30 charges up, it turns Ql off.With Ql off, Rll pulls pin 1 low, which sets the R-S flip-flop(U22-3) high. Pin 5 of U21, which has been reset to zero (0), pullspin 15 of the 825129 ROM (U30) low from pin 11 of U18 (provided 51-6is closed). Thus, the memories on the board will respond as indicated under PHANTOM start-up in Table 3-1.

If PRESET is pulled low (either through 51-5 in an ALTAIR8800 or from the front panel of an IMSAI 8080), the processor beginsexecuting code at ~~~~. The first four bytes in ROM C or ROM EF willbe typically one byte NOOP (00) and a three byte JMP (C3 XX XX). Asthe processor reads these four bytes, U20 counts the memory accesspulses from pin 13 of U32. Pin 5 of U21 goes high on the fourthaccess, the GPM goes into normal operation, and the processor jumpsto address xx XX to begin executing code.

4.2.6 Wait State Circuit

The Q output of wait state flip-flop, U21-9, is reset low byPSYNC (Bus pin 76) at the start of each machine cycle. An inverted2 from pin 3 of U19 clocks U21-9 back to a high at the end of eachmachine cycle. Consequently U21-9 generates a wait state that is onemachine cycle in duration.

If 51-2 is closed, this wait state is placed on the PRDY line(Bus pin 72) via U32-11 each time the GPM is accessed. This causesthe processor to enter the wait condition and allows the GPM twocycles, rather than one, to respond.

4.2.7 Regulators

U33 and U34, series voltage regulators, supply on-card regulation to maintain constant +12 V and +5 V dc outputs respectively.(If installed, U35 provides on-card regulation to maintain a constant-5 V dc output.) Input capacitor C17 provides additional filteringof the +8 V dc input, as does C19 for the +18 V dc input. The out-put bypass capacitors C13 and C29 improve transient response. (CIS •and C14 in the -5 V dc regulator, if installed, serve the samefunctions as their counterparts in the +12 and +5 V dc supplies.)

4-4

..

••

SECTION 5

DRAWINGS

GPM (General Purpose Memory)and GPM-Sol MODULES

-

,.

E

"-

~.----

-"; ""I:""~: -hH::,".'f:':.:.:•••"'"

.d ~ID

" ,~_ .._~~~-~"""--~-~~-~ ,

i,I,

:':'''''' "1",,,,,,1,,, •

WI~hb- I filii! II"I I Ii! ; Ii: t'

i j'

,'fl ::,. '··;:r:tl,"',I;:t::1,·jdt:U'jf,UL!S;;;;,,,;d::

I,tj"qqq

'IIq

tiiLK l 1,,;~~V'r;;;_,;'f R" L ......'tI.:nU....i--l1:l, -".-% _.""_,1 'I': 'I R3li~': :,Ib, _ ......_'''i~fW :;r-1, , ,

:. l" , -fj g; CD'" 'i:l '"" '''''):tlu , " i .• ,.

1; 'Pttu:fun8,u!!Jllrm,Ui',z!:",'i

h

"

"

, ,

:, :;

"

"

''',1 ;j C :10

n

,, '

"

",

P~;VI'\Jr. -------,.-'~~

"',,'

"

'""~, '"'" :;:"" :»ro 0000",ro

~§.

I<

......I.llo.

UZo

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APPENDICES

1 Statement of Warranty

2 80BO Operating Codes

3 Standard Color Code

4 Loading DIP Devices,Soldering Tips andInstalling Augat Pins

5 Ie Pin Configurations


-GPM


Appendix 1

PROCESSOR TECHNOLOGY CORPORATION, in recognition of itsresponsibility to provide quality components and adequate instruction for theirproper assembly, warrants its products as follows:

All components sold by Processor Technology Corporation are purchasedthrough normal factory distribution and any part which fails because of defectsin workmanship or material will be replaced at no charge for a period of 3 monthsfor kits, and one year for assembled modules, following the date of purchase.The defective part must be returned postpaid to Processor Technology Corporationwithin the warranty period.

Any malfunctioning module, purchased as a kit directly from ProcessorTechnology and returned to the factory within the three-month warranty period,which in the judgement of PTC has been assembled with care and not subjectedto electrical or mechanical abuse, will be restored to proper operating conditionand returned, regardless of cause of malfunction, without charge. Kits purchasedfrom authorized PTC dealers should be returned to the selling dealer for thesame warranty service.

Any modules purchased as a kit and returned to PTC, which in thejudgement of PTe are not covered by the above conditions, will be repairedand returned at a cost commensurate with the work required. In any case,this charge will not exceed $20.00 without prior notification and approval ofthe owner.

Any modules, purchased as assembled units are guaranteed to meetspecifications in effect at the time of manufacture for a period of at least oneyear following purchase. These modules are additionally guaranteed againstdefects in materials or workmanship for the same one year period. All warrantedfactory assembled units returned to PTCO postpaid will be repaired and returnedwithout charge.

This warranty is made in lieu of all other warranties expressed or impliedand is limited in any case to the repair or replacement of the module involved.

Al-l

JUMP CALL RETURN RESTART ROTATe-C MOVE (cont) ACCUMULATOR* CONSTANTDEFINITION

C3 -IMP CD CALL C9 RET C7 RST 0 07 RLC 58 Mav EB 80 ADD B A8 XRA 6C2 JNZ C' eNZ co RNZ CF RST , OF RRC 59 Mav EC " ADD C A9 XRA C oaDH f He~CA JZ CC CZ C8 RZ 07 RST 2 " RAL 5A Mav ED 82 ADD 0 AA XRA 0 >AHD2 .JNC D' CNC DO RNC OF RST 3 'f RAR 56 Mav EE 83 ADD E AB XRA E

" JCAC'

DC ec Ad' 08 RC ., RST , 5C Mav EH 84 ADD H AC XRA H1~~~ f DeCimalE2 JPO " CPO EO RPO EF RST 5 50 MDV E.L 85 ADD L AD XRA L

" H Ee ePE " RPE n RST 6 5E MaV E.M 86 ADD M AE XRA MF2 2P " OP " RP FF RST 7 CONTROL SF MaV E.A B7 ADD A AF XRA A ;;g f OctalFA JM cc eM F8 RME9 PCHL 00 Nap 60 Mav H.6 86 ADC B BO aRA B

" HLT OJ Mav H.C 89 ADC C B' aRA C~~:~~IBinaryF3 01 62 Mav H.D 8A ADC 0 B2 aRA 0

FB EI 63 MaV H.E 86 ADC E 83 aRA EMOVE A" LOAD 84 MaV H.H 8C ADC H B' aRA H

TEST f ASCI!IMMEDIATE IMMEDIATE-' IMMEDIATE STACK OPS 65 MaV HL 80 ADC L B5 ORA L A 8'66 MaV H.M BE ADC M 86 aRA M

06 MVI 8 C6 ADI " LXI

B }

C5 PUSH BMOVE B7 MaV H.A 8F ADC A B7 aRA A

DE M'I C CE ACI " '" ~. D1605 PUSH D

MaV L.B 68 CMP BOPERATORS

" MVI 0 06 SUI " '" E5 PUSH H '0 6.8 68 MaV 90 SU6 8

" M'I E DE S81 3J '" SP. F5 PUSH PSW 4J MaV 8C 69 MaV LC OJ SU8 e 69 CMP C26 08

E6 ANO 08 " MaV B.D 6A MaV LD 92 SUB 0 6A CMP 0MVI H

" MV' EE XR' " MaV 8E 6B MaV L.E 93 SU6 E 6B CMP EL C' POP 88C CMP36 "'I M F6 0", OJ POP ° " MaV 8.H 6C MaV LH 94 SU6 H H

3E CE ePI 45 MaV B.G 50 MaV LL 95 SU6 L 80 CMP L\lVI A EJ pap HMav LM BE CMP MDOUBLE ADD;' pap PSW' " 6M 56 Mav 96 SUB MFJMav LA SUB A 8F CMP A09 DAD 8 " BA 6F Mav B7

J9 DAD 0 E3 XTHL

" Mav co " Mav M.6 98 SB6 629 DAD H F9 SPHL

" Mav C.C 7J Mav M.C 99 SB6 C PSEUDO STANDARDINCREMENT" DECREMENT" 39 DAD SP <A Mav CD 72 Mav M.D 9A 566 0 INSTRUCTION SETS

'6 Mav C.E 73 Mav M.E 9B SBB E

" '" " O~ OCR B SPECIALS 'C Mav C.H " Mav MH 9C 566 H aRG M, A SET 7DC 'NS C 00 OCR C

" Mav C.L 75 Mav ML 90 SB6 L END 8 SEr 0

" 'NS ° ' 5 DCR 0 LOAD/STORE E8 XCHG

" MOV CM 9E 566 M EOU 0" C SET ,JC INR [ JD OCR E " DAA'

" Mav C.A n Mav MA 9F 588 A 0 SET 20, INR H " DCR H OA LDAX 8 2F eMA OS 0" E SET 320 'NR L 20 OCR L 'A LOAX 0 37 STC7 50 Mav 0.6 78 Mav A6 AO ANA 6 DB D8 II H SET 4

" eNR M 35 OCR M 2A LHLD Adr 3F CMCc 5J MaV D.C 79 MaV A.C A' ANA C OW D16 I I L SET 53C INR A 3D OCR A 3A LOA Ad, 52 MaV 0.0 7A MaV AD A2 ANA 0 M SET 6

53 Mev D.E 7B Mav A.E A3 ANA E SP SET 603 INX 8 OB DCX B 02 STAX 8 INPUT/OUTPUT " Mav DH 7C Mav AH A< ANA H PSWSET 6

" INX 0 'B DCX 0 12 STAx D 55 Mav D,L 70 Mav A,L AS ANA L23 INX H 2B DCX H 22 SHLD Adr 03 aUT 08 56 Mav D.M 7E Mav A,M A6 ANA M33 INX SP 3B DCX SP 32 STA Ad, DB IN D8 57 MQV D,A 7' Mav AA A7 ANA A

os constant. or logical arlthmellc f'~press,on lhal evaluates 0" constant. or logicaVarithmetic e~pre55ion that evaluates Adr ~ 16 bit addressto an 8 bit r1ala quarlhly to a 16 bit data quantity .. - all Flags e~cepl CARRY affected:all Flags ICZ 5 PI aflecle<! -, only CARRY affected (e~ceplion. INX & DCX affect no Flags)

•APPENDIX II

•© Processor Technology Corp,

•

1-~ - ~

00 NOP 28 ... 50 MOV D.B " MOV A.B AO ANA B CB RZ FO RP HEX-ASCII TABLE

" LXI B,016 29 DAD H " MOV D.C 79 MOV AC " ANA C C9 RET F1 POP PSW02 STAX 8 2A LHLD Ad, 52 MOV 0.0 7A MOV A.D A2 ANA 0 CA JZ F2 JP Ad, Printing Characters03 INX B 2B DCX H 53 MOV D.E 7B MOV AE A3 ANA E CB ... F3 01 30 0 40 @

" INR B 2C INR L " MOV D.H 7C MOV A.H A4 ANA H CC CZ Ad, F4 CP Ad; 31 1 20 space05 OCR B 20 OCR L 55 MOV D.L 70 MOV A.L AS ANA L CD CALL Ad, F5 PUSH PSW 32 2 21 !06 MVI BD8 2E MVI L,D8 56 MOV D.M lE MOV A.M A6 ANA M CE Ael DB F6 ORI DB 33 3 2207 RLC 2F CMA 57 MOV D.A 7F MOV A.A AT ANA A CF RST 1 F7 RST 6 " 4 23 #08 30 58 MOV E.B BO ADD B AS XRA B DO RNC F8 RM 35 5 24 $09 DAD B 31 LXI SP,D16 59 MOV E.C " ADD C A9 XRA C 01 POP 0 F9 SPHL 36 6 25 00

OA lDAX 8 32 5TA Ad, SA MOV E.D 82 ADD 0 M XRA 0 02 JNC Ad, FA JM Ad, 37 7 26 &GB DCX B 33 INX SP 5B MDV E.E 83 ADD E AB XRA E 03 OUT DB FB EI 3B B 27oc INR C " INR M 5C MOV E.H B4 ADD H AC XRA H 04 CNC Ad, FC CM Ad, 39 9 28OC OCR C 35 OCR M 50 MOV E.L 85 ADD L AD XRA L 05 PUSH 0 FD 29DE M'I C,D6 36 MVI M.D8 'iE Mav EM 86 ADD M AE XRA M 06 SUI DB FE CPI DB " A 2AOF 9RC 37 SOC 5,", MOV EA " ADD A AF XRA A 07 RST 2 FF RST 7 " B 2B'0 3B kC MOV H.B 68 ADC S BO ORA B DB RC 43 C 2C

" LXI 0,016 39 DAD SF 001 MOV H.e 89 ADC C B1 ORA C 09 44 0 2012 STAX 0 3A LOA Adr 62 MOV H.D BA ADC 0 B2 ORA 0 DA JC Ad, 45 E 2E'3 INX 0 3B DCX SP 53 MQv' H,E 8B ADC E B3 ORA E DB IN 08 46 F 2F

" INR 0 3C INR A B4 MO'; HH 8C ADC H B4 ORA H DC CC Ad, 47 G 3A15 OCR 0 3D OCR A 65 ~OV H.L BD ADC L B5 ORA L DO 48 H 3B16 MVI 008 3E M'II A,D8 66 MOY H.M 8E ADC M B6 ORA M DE 5B' 08 HEX-ASCII TABLE " I 3C

" "AL 3F CMC 57 MOV H,A SF ADC A B7 ORA A DF RST 3 4A J 3D'8 " Mav B.8 68 MOV LB 90 SUB B B8 CMP B EO RPO Non-Printing 'B K 3E,g DAD C " MOV B.C 69 MOV LC " SUB C B9 CMP C E1 POP H 4C L 3F 7

14 LOAX 0 42 MOV 8.0 €A MOV l.D 92 SUB 0 BA CMP 0 E2 JPO Ad, 00 NULL '0 M 5B'B DCX D " MOV BE 6B MOV L.E 93 SUB E BB CMP E E3 XTHL 07 BELL 4E N 5C'C INR E " MOV BH 6C MOV L.H 94 SUB H BC CMP H " CPO Ad, 09 TAB 4F 0 50

'" OCR E 45 MOV B,L 60 MOV L"L 95 SUB L BD CMP L E5 PUSH H OA LF 50 P 5E I )

" MVI E 08 " MOV 8,M 6E MaV L.M 96 SUB M BE CMP M E6 ANI DB OB VT 51 0 " (- )F RAR 42 MOV B.A SF MOV LA 97 SUB A BF CMP A E7 RST 4 OC FORM 52 R

20 48 MDV C.B 70 MOV M.B 98 SBB B CO RNZ E8 RPE 00 CR 53 S

" LXI H 016 " Mav C.C " MOV M.C 99 SBB C C1 POP B E9 PCHl 11 X-ON 54 T22 SHLD Ad, " MOV CD 72 MOV MD 9A SBB 0 C2 JNZ Ad, EA JPE Ad, 12 TAPE 55 U23 - INX H 'B MOV CE 73 Mav ME 9B SBB E C3 JMP Ad, EB XCHG 13 X-OFF 56 V24 INR H 4C MOV C,H " Mav MH 9C SBB H C, CNZ Ad, EC CPE Ad, 14 57 W25 OCR H '0 MOV CL 75 MOV M.L 90 SBB L C5 PUSH B ED 1B ESC 58 X26 MYi H,D8 4E MOV C.M 76 HLT 9E SBB M C6 ADI 08 EE XRI 08 70 AlT MODE 59 y27 OM 4F MOV C.A 77 MOV M,A 9F SBB A C7 RST 0 EF RST 5 7F RUB OUT SA Z

08 = constant. or 10gicaVarrthmetic expression that evaluatesto an 8 bit data quantity

016 = constant, or logicaVarithmetic expression that evaluatesto a 16 bit data quantityI Processor Technology Corp.

APPENDIX II

Adr = 16 bit address

GPM


Appendix 3

The electrical value of many types of resistors and capacitors isprinted on the component. Other types, however, are identified bycolor coding which gives all the information needed to correctlyidentify the component. In most cases color coding conforms with theEIA (Electronic Industries Association) Standard Color Code. In othercases a manufacturer will adapt the standard to fit his particularrequirement. Both the standard Color code and a code used to identify tantalum dipped capacitors are provided below.

STANDARD COLOR CODE FOR RESISTORS AND CAPACITORS

COLOR 1st 2nd MULTIPLIER TOLERANCE VOLTAGEFIGURE FIGURE (%) RATING*

Black a a 1 --Brown 1 1 10 100Red 2 2 100 200Orange 3 3 1,000 300Yellow 4 4 10,000 400Green 5 .s 100,000 500Blue 6 6 1,000,000 600Violet 7 7 10,000,000 700Gray 8 8 100,000,000 800White 9 9 1,000,000,000 900Gold - - 0.1 5 1000Silver - - 0.01 10 2000None - - --- 20 500

Tolerance

MUltit)~

l~1st and 2ndSignificant

Figures•

*Applies only to capacitors.

RATED CAPACITANCE

VOLTAGE COLOR IN PICOFARADS

VDC 25°C 1st 2nd MultiplierFiCTure FiCTure (uuF)

3-4 Black a a 13-6 Brown 1 1 103-10 Red 2 2 1003-15 Orange 3 3 1,0003-20 Yellow 4 4 10,0003-25 Green 5 5 100,0003-35 Blue 6 6 1,000,0003-50 Violet 7 7 10,000,000-- Gray 8 8 ---3 White 9 9 ---

[

Polarity &Voltage

1st Figure<Eo- 2nd Figure

~~J--Multiplier

+

•A3-1

GPM


Appendix 4

LOADING DIP (DUAL IN-LINE PACKAGE) DEVICES

(1) Sockets. DIP sockets are marked to indicate the correctorientation for the Ie which will be inserted. This markmay be a notch at the end of the socket, or a filled-incorner on the inside of the socket as shown in the Component Ientification Illustrations in Section II.

Orient the socket so that pin 1 lines up with the indicationfor pin 1 printed on the printed circuit board legend, whichmay be a white dot. Insert the socket into the board, andwhile pressing the socket into place to ensure that it isfUlly seated, bend two diagonally opposite pins to retainthe socket in its fully seated position while soldering.

(2 ) rcs. Manymay not bebe "walked

DIP devices have their leads spread soinserted directly into their sockets.in" using the following procedure.

thatThey

theymust

•orient pin 1 of the device so that it lines up with pin 1on the socket and the printed circuit board legend. Insertthe pins from one row only into the socket until theybarely engage. Push the device using both hands with evenpressure to bend this first row of pins until the secondrow of pins lines up with the holes in the socket~ thenpush the second row of pins into the socket. After all resare inserted, examine each to make sure that no pins arebend out or under. Careful examination might prevent hoursof unnecessary troubleshooting later.

SOLDERING TIPS

(1) Use a low-wattage iron--25 watts is good. Larger irons runthe risk of burning the printed-circuit board. Don't try touse a soldering gun, they are too hot.

(2) Use a small pointed tip and keep it clean. Keep a damp pieceof sponge by the iron and wipe the tip on it after each use.

(3 ) Use 60-40 rosin-core solder ONLY.or externally applied fluxes. Usesolder you can get.

DO NOT use acid-core solderthe smallest diameter

NOTE: DO NOTtrace.of the

pressThis

board

the top ofwill causewhich will

the iron on the padthe trace to "lift"result in permanent

oroffdamage.

(4) In soldering, wipe the tip, apply a light coating of newsolder to it, and apply the tip to both parts of the joint,that is, both the component lead and the printed-circuit pad.Apply the solder against the lead and pad being heated, butnot directly to the tip of the iron. Thus, when the solder

A4-1

GPM


Appendix 4

melts the rest of the joint will be hot enough for the solderto "take", (i. e., form a capillary film).

(5) Apply solder for a second or two, then remove the solder andkeep the iron tip on the joint. The rosin will bubble out.Allow about three or four bubbles, but don't keep the tipapplied for more than ten seconds.

(6) Solder should follow the contours of the original joint. Ablob or lump may well be a solder bridge, where enough solderhas been built upon one conductor to overflow and "take" onthe adjacent conductor. Due to capillary action, these solder bridges look very neat, but they are a constant source oftrouble when boards of a high trace density are being soldered. Inspect each integrated circuit and component aftersoldering for bridges.

(7) To remove solder bridges, it is best to use a vacuum II solderpuller" if one is available. If not, the bridge can be reheated with the iron and the excess solder "pulled" with thetip along the printed circuit traces until the lump of solderbecomes thin enough to break the bridge. Braid-type solderremover, which causes the solder to II wick Upll away from thejoint when applied to melted solder, may also be used.

A4-2

•

•

•PROCESSOR TECHNOLOGY CORPORATION

GPM

82S129B 74LS138

Appendix 5

---------~~-~---------------------+~-----------I

9lL02A (AMD)

74367, 74LS367

7805, 7812

TO-220 lTl

"",," ,"

rrE~/''''"Oil'

" '-.",,,,,'(JOY'"

GPM


Appendix 5

•34000P, 8316E 2708

" 2. Vee

" 2 23 A, "A5 , 22 A , "

,,' "A. • 21 CS3JCS3 ,A, 5

[0~l20csl/CSi ,,'

"" 6 I 19 A,o " M2708

• , 18 CS2/CS2 ,,' "A 0 8 17 0, Il'.' A.

eLsa, 00

° 9 16 °," "°2 1O 15 0,"

,0, " 14 ° 5 ~ "'"' 12 " °•

•,CLOC~

,CcE A~

,PRES' f

74LS749216B (AMD)

•ADD"'" ," "ce"'VI

, '00"''"AM"" , , 'co"",.

, .ooe, " "

ADO"" " " <s"ES,

'O'>"'>s , " v OD '·""'.~.,"

.00"'" " C', os,

'00""<: " Ql"'o' ,

OOTPc' " DUU,T;

OU""' , " oU"o' ,.

00".' ' , ","'0"-""[ " O"·,~-

74LS04 74LS132

.. 'co"1 ' 1""10']" " ,,, Ii .(;] ,11,8

,. ..,"1·) l I ,,~ ....

" ,.1~ 4Y,', I- Jlj,. ..

,~ I' ~ '"1'{C~1" ..

", 10 ~'"", " ",or I ~ 3'(

PosII,,,,, 'og;c ,.' •A5-2

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