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FunctionaldescriptionOVERVIEWFEATURES

InterfacesBLOCKDIAGRAMPOWERRFFCCAPPROVEDANTENNASPERIPHERALSANDGPIORGBLED,SETUPANDRESETBUTTONJTAGANDSWDEXTERNALCOEXISTENCEINTERFACE

MemoryMapSTM32F205RGY6FLASHLAYOUTOVERVIEWDCTLAYOUTMEMORYMAP(COMMON)MEMORYMAP(MODULARFIRMWARE-DEFAULT)MEMORYMAP(MONOLITHICFIRMWARE-OPTIONAL)

PinandbuttondefinitionPINMARKINGSPINDESCRIPTIONPINOUTDIAGRAMCOMPLETEP1MODULEPINLISTING

TechnicalspecificationABSOLUTEMAXIMUMRATINGSRECOMMENDEDOPERATINGCONDITIONSWI-FISPECIFICATIONSI/OCHARACTERISTICS

MechanicalspecificationsOVERALLDIMENSIONSP1MODULEDIMENSIONSP1MODULERECOMMENDEDPCBLANDPATTERN

P1ReferenceDesignSchematicSCHEMATIC-USBSCHEMATIC-POWERSCHEMATIC-USERI/OSCHEMATIC-P1WI-FIMODULE

P1ReferenceDesignLayoutP1REFERENCEDESIGNTOPLAYER(GTL)P1REFERENCEDESIGNBOTTOMLAYER(GBL)

Recommendedsolderreflowprofile

232425252525

262728303132

OrderinginformationQualificationandapprovalsProducthandling

TAPEANDREELINFOMOISTURESENSITIVITYLEVELSESDPRECAUTIONS

DefaultsettingsGlossaryFCCICCEWarningsandEndProductLabelingRequirementsRevisionhistoryKnownErrataContact

Functionaldescription

TheP1isParticle'stinyWi-FimodulethatcontainsboththeBroadcomWi-FichipandareprogrammableSTM32F205RGY632-bitARMCortex-M3microcontroller.TheP1comespreloadedwithParticlefirmwarelibraries,justlikeourdevkits,andit'sdesignedtosimplifyyourtransitionfromprototypetoproduction.TheP1isthePØ'sbigbrother;it'sabitbiggerandatadmoreexpensive,butitincludessomeextraflashandanantennaandu.FLconnectoronboard.ParticleprovidesfreeaccesstoParticleCloudforprototyping.PaidtiersofParticleCloudstartwhenyoucreateaproductwithmorethan25devices.

ParticleP1Wi-Fimodule

BroadcomBCM43362Wi-Fichip802.11b/g/nWi-FiSTM32F205RGY6120MhzARMCortexM31MBflash,128KBRAM1MBexternalSPIflash(MX25L8006E)IntegratedPCBantennaIntegratedu.FLconnectorforexternalantennaIntegratedRFswitch

25Mixed-signalGPIOandadvancedperipheralsOpensourcedesignReal-timeoperatingsystem(FreeRTOS)SoftAPsetupFCC,CEandICcertified

OVERVIEW

FEATURES

Interfaces

PowertotheP1issuppliedvia3differentinputs:VBAT_WL(pin2&3),VDDIO_3V3_WL(pin5),VDD_3V3(pin26&27).Optionally+3.3VmaybesuppliedtoVBAT_MICRO(pin38)fordataretentioninlowpowersleepmodes.Eachoftheseinputsalsorequiresa0.1uFand10uFceramicdecouplingcapacitor,locatedascloseaspossibletothepin(seeFig1).Thevoltageshouldberegulatedbetween3.0VDCand3.6VDC.(PleaserefertoAbsoluteMaximumRatingsformoreinfo).

Typicalaveragecurrentconsumptionis80mAwith5V@inputoftherecommendedSMPSpowersupplywithWi-Fion.Deepsleepquiescentcurrentistypically80uA(PleaserefertoRecommendedOperatingConditionsformoreinfo).WhenpoweringtheP1makesurethepowersupplycanhandle600mAcontinuous.Ifalesserpowersupplyisprovided,peakcurrentsdrawnfromtheP1whentransmittingandreceivingwillresultinvoltagesagattheinputwhichmaycauseasystembrownoutorintermittentoperation.

Warning:WhenpoweringtheP1fromlongwires,careshouldbetakentoprotectagainstdamagingvoltagetransientsifusingthesameregulatorasisusedonthePhoton.FromtheRichtekdatasheet:

Whenaceramiccapacitorisusedattheinputandthepowerissuppliedbyawalladapterthroughlong

wires,aloadstepattheoutputcaninduceringingattheinput,VIN.Atbest,thisringingcancoupletothe

outputandbemistakenasloopinstability.Atworst,asuddeninrushofcurrentthroughthelongwirescan

potentiallycauseavoltagespikeatVINlargeenoughtodamagethepart.

Toavoidthesevoltagespikes,keepinputwiringasshortaspossible.Iflongwiresareunavoidable,itisadvisabletoadda5.1VzenerdiodeorsimilartransientsuppressiondevicefromVINtoGND.Anothertechniqueisaddingmorecapacitancetotheinputusinganelectrolyticcapacitor.PleaserefertoAN-88byLinearforagooddiscussiononthistopic.

BLOCKDIAGRAM

POWER

Fig.1Recommendedpowerconnectionswithdecouplingcapacitors.

TheRFsectionoftheP1includesanon-boardPCBtraceantennaandau.FLconnectorwhichallowstheusertoconnectanexternalantenna.ThesetwoantennaoutputsareselectableviaauserAPI,madepossiblebyanintegratedRFswitch.

ThedefaultselectedantennawillbethePCBantenna.

TheareasurroundingthePCBantennaonthecarrierPCBshouldbefreeofgroundplanesandsignaltracesformaximumWi-Fiperformance.

AntennaType Manufacturer MFG.Part# Gain

Dipoleantenna LumenRadio 104-1001 2.15dBi

PCBAntenna Included - -

RF

FCCAPPROVEDANTENNAS

TheP1modulehastonofcapabilityinasupersmallfootprint,withanalog,digitalandcommunicationinterfaces.

Note:P1pinnameswillbepreservedastheyarenamedintheUSIdatasheet,howeverforthescopeofthisdatasheetwewillalsorefertothemastheirPhotonandcodeequivalents,i.e.D7insteadofMICRO_JTAG_TMSandA2insteadofMICRO_GPIO_13.Thiswillhelptosimplifydescriptions,whileprovidingaquickreferenceforcodethatcanbewrittenfortheP1suchas intvalue=

analogRead(A2);

PeripheralType Qty

Input(I)/Output(O)

FT[1]/3V3[2]

Digital 24 I/O FT/3V3

Analog(ADC) 13 I 3V3

Analog(DAC) 2 O 3V3

SPI 2 I/O 3V3

I2S 1 I/O 3V3

I2C 1 I/O FT

CAN 1 I/O 3V3[4]

USB 1 I/O 3V3

PWM 12[3] O 3V3

Notes:

[1]FT=5.0Vtolerantpins.AllpinsexceptA3andDACare5Vtolerant(whennotinanalogmode).Ifusedasa5Vinputthepull-up/pull-downresistormustbedisabled.

[2]3V3=3.3Vmaxpins.

[3]PWMisavailableonD0,D1,D2,D3,A4,A5,WKP,RX,TX,P1S0,P1S1,P1S6withacaveat:PWMtimerperipheralisduplicatedontwopins(A5/D2)and(A4/D3)for10totalindependentPWMoutputs.Forexample:PWMmaybeusedonA5whileD2isusedasaGPIO,orD2asaPWMwhileA5isusedasananaloginput.HoweverA5andD2cannotbeusedasindependentlycontrolledPWMoutputsatthesametime.P1S6requiresSystemFeatureWi-FiPowersaveClocktobedisabled.SeeSystemFeaturesinFirmwareReference.

[4]Technicallythesepinsare5.0Vtolerant,butsinceyouwouldn'toperatethemwitha5.0Vtransceiverit'spropertoclassifythemas3.3V.

WhenusingtheP1module,itisveryimportanttorememberthatyourdevicemusthaveanRGBLEDtoshowtheusertheconnectivitystatus.AlsorequiredisaSETUPandRESETbuttontoentervariousDeviceModes.BydefaulttheRGBLEDoutputsareconfiguredforaCommonAnodetypeofLED.ThesecomponentsshouldbewiredaccordingtotheP1ReferenceDesign-UserI/O.RGBpinsmaybeaccessedincodeas:RGBR,RGBGandRGBB.

PERIPHERALSANDGPIO

RGBLED,SETUPANDRESETBUTTON

PinD3throughD7areJTAGinterfacepins.ThesecanbeusedtoreprogramyourP1bootloaderoruserfirmwareimagewithstandardJTAGtoolssuchastheST-Linkv2,J-Link,R-Link,OLIMEXARM-USB-TINI-H,andalsotheFTDI-basedParticleJTAGProgrammer.Ifyouareshortonavailablepins,youmayalsouseSWDmodewhichrequireslessconnections.

PhotonPin JTAG SWD

STM32F205RGY6Pin

P1Pin# P1PinName

DefaultInternal[1]

D7 JTAG_TMS SWD/SWDIO PA13 54 MICRO_JTAG_TMS ~40kpull-up

D6 JTAG_TCK CLK/SWCLK PA14 55 MICRO_JTAG_TCK ~40kpull-down

D5 JTAG_TDI PA15 53 MICRO_JTAG_TDI ~40kpull-up

D4 JTAG_TDO PB3 52 MICRO_JTAG_TDO Floating

D3 JTAG_TRST PB4 51 MICRO_JTAG_TRSTN ~40kpull-up

3V3 Power Power

GND Ground Ground

RST Reset Reset

Notes:[1]DefaultstateafterresetforashortperiodoftimebeforethesepinsarerestoredtoGPIO(ifJTAGdebuggingisnotrequired,i.e. USE_SWD_JTAG=y isnotspecifiedonthecommandline.)

Astandard20-pin0.1"shroudedmaleJTAGinterfaceconnectorshouldbewiredasfollows:

(clicktostopsquinting)

JTAGANDSWD

TheP1supportscoexistencewithBluetoothandotherexternalradiosviathreepinsavailableontheP1module.

Whentworadiosoccupyingthesamefrequencybandareusedinthesamesystem,suchasWi-FiandBluetooth,acoexistenceinterfacecanbeusedtocoordinatetransmitactivity,toensureoptimalperformancebyarbitratingconflictsbetweenthetworadios.

P1PinNameP1Pin# I/O Description

BTCX_RF_ACTIVE 57 I Coexistencesignal:Bluetoothisactive

BTCX_STATUS 56 I Coexistencesignal:BluetoothprioritystatusandTX/RXdirection

BTCX_TXCONF 58 O OutputgivingBluetoothpermissiontoTX

WhenthesepinsareprogrammedtobeusedasaBluetoothcoexistenceinterface,they'resetashighimpedanceonpowerupandreset.

EXTERNALCOEXISTENCEINTERFACE

MemoryMap

Bootloader(16KB)DCT1(16KB),storesWi-Ficredentials,keys,mfginfo,systemflags,etc..DCT2(16KB),swapareaforDCT1EEPROMemulationbank1(16KB)EEPROMemulationbank2(64KB)Systemfirmware(512KB)[256KBWi-Fi/comms+256KBhal/platform/services]Factorybackup,OTAbackupanduserapplication(384KB)[3x128KB]

TheDCTareaofflashmemoryhasbeenmappedtoaseparateDFUmediadevicesothatwecanincrementallyupdatetheapplicationdata.Thisallowsoneitem(say,serverpublickey)tobeupdatedwithouterasingtheotheritems.

DCTlayoutin release/stable foundhereinfirmware.

Region Offset Size

systemflags 0 32

version 32 2

deviceprivatekey 34 1216

devicepublickey 1250 384

ipconfig 1634 120

featureflags 1754 4

countrycode 1758 4

claimcode 1762 63

claimed 1825 1

ssidprefix 1826 26

devicecode 1852 6

versionstring 1858 32

dnsresolve 1890 128

reserved1 2018 64

serverpublickey 2082 768

padding 2850 2

flashmodules 2852 100

productstore 2952 24

antennaselection 2976 1

cloudtransport 2977 1

altdevicepublickey 2978 128

altdeviceprivatekey 3106 192

altserverpublickey 3298 192

altserveraddress 3490 128

deviceid 3618 12

radioflags 3630 1

modebuttonmirror 3631 32

STM32F205RGY6FLASHLAYOUTOVERVIEW

DCTLAYOUT

ledmirror 3663 96

ledtheme 3759 64

reserved2 3823 435

Note:Writing0xFFtooffset34(DEFAULT)or3106(ALTERNATE)willcausethedevicetore-generateanewprivatekeyonthenextboot.AlternatekeysarecurrentlyunsupportedontheP1butareusedontheElectronasUDP/ECCkeys.Youshouldnotneedtousethisfeatureunlessyourkeysarecorrupted.

//RegenerateDefaultKeysecho-e"\xFF">fillbyte&&dfu-util-d2b04:d00a-a1-s34-Dfillbyte//RegenerateAlternateKeysecho-e"\xFF">fillbyte&&dfu-util-d2b04:d00a-a1-s3106-Dfillbyte

Region StartAddress EndAddress Size

Bootloader 0x8000000 0x8004000 16KB

DCT1 0x8004000 0x8008000 16KB

DCT2 0x8008000 0x800C000 16KB

EEPROM1 0x800C000 0x8010000 16KB

EEPROM2 0x8010000 0x8020000 64KB

Region StartAddress EndAddress Size

SystemPart1 0x8020000 0x8060000 256KB

SystemPart2 0x8060000 0x80A0000 256KB

UserPart 0x80A0000 0x80C0000 128KB

OTABackup 0x80C0000 0x80E0000 128KB

FactoryBackup 0x80E0000 0x8100000 128KB

Region StartAddress EndAddress Size

Firmware 0x8020000 0x8080000 384KB

FactoryReset 0x8080000 0x80E0000 384KB

Unused(factoryresetmodular) 0x80E0000 0x8100000 128KB

MEMORYMAP(COMMON)

MEMORYMAP(MODULARFIRMWARE-DEFAULT)

MEMORYMAP(MONOLITHICFIRMWARE-OPTIONAL)

Pinandbuttondefinition

Pin Description

RSTActive-lowresetinput.On-boardcircuitrycontainsa1kohmpull-upresistorbetweenRSTand3V3,and0.1uFcapacitorbetweenRSTandGND.

VBAT SupplytotheinternalRTC,backupregistersandSRAMwhen3V3notpresent(1.65to3.6VDC).

3V3

Thispinrepresentstheregulated+3.3VDCpowertotheP1module.Inreality,+3.3Vmustbesuppliedto3differentinputs:VBAT_WL(pin2&3),VDDIO_3V3_WL(pin5),VDD_3V3(pin26&27).Optionally+3.3VmaybesuppliedtoVBAT_MICRO(pin38)fordataretentioninlowpowersleepmodes.Eachoftheseinputsalsorequiresa0.1uFand10uFceramicdecouplingcapacitor,locatedascloseaspossibletothepin.

TX PrimarilyusedasUARTTX,butcanalsobeusedasadigitalGPIOorPWM[1].

RX PrimarilyusedasUARTRX,butcanalsobeusedasadigitalGPIOorPWM[1].

WKPActive-highwakeuppin,wakesthemodulefromsleep/standbymodes.WhennotusedasaWAKEUP,thispincanalsobeusedasadigitalGPIO,ADCinputorPWM[1].Canbereferredtoas A7 whenusedasanADC.

DAC12-bitDigital-to-Analog(D/A)output(0-4095),referredtoas DAC or DAC1 insoftware.CanalsobeusedasadigitalGPIOorADC.Canbereferredtoas A6 whenusedasanADC.A3isasecondDACoutputusedasDAC2 insoftware.

A0~A7

12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs. A6 and A7 arecodeconveniencemappings,whichmeanspinsarenotactuallylabeledassuchbutyoumayusecodelikeanalogRead(A7) . A6 mapstotheDACpinand A7 mapstotheWKPpin.A4,A5,A7mayalsobeusedasaPWM[1]output.

D0~D7 DigitalonlyGPIOpins.D0~D3mayalsobeusedasaPWM[1]output.

P1S0 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsocanbeusedasadigitalGPIOorPWM[1].

P1S1 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsocanbeusedasadigitalGPIOorPWM[1].

P1S2 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsocanbeusedasadigitalGPIO.

P1S3 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsocanbeusedasadigitalGPIO.

P1S4 PrimarilyusedasadigitalGPIO.

P1S5 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsocanbeusedasadigitalGPIO.

PINMARKINGS

PINDESCRIPTION

P1S6 CanbeusedasadigitalGPIOorPWM[1]output.MustdisableWi-FiPowersaveClockfirst,seeSystemFeaturesinFirmwareReference.

Notes:[1]PWMisavailableonD0,D1,D2,D3,A4,A5,WKP,RX,TX,P1S0,P1S1,P1S6withacaveat:PWMtimerperipheralisduplicatedontwopins(A5/D2)and(A4/D3)for10totalindependentPWMoutputs.Forexample:PWMmaybeusedonA5whileD2isusedasaGPIO,orD2asaPWMwhileA5isusedasananaloginput.HoweverA5andD2cannotbeusedasindependentlycontrolledPWMoutputsatthesametime.P1S6requiresSystemFeatureWi-FiPowersaveClocktobedisabled.SeeSystemFeaturesinFirmwareReference.

PINOUTDIAGRAM

YoucandownloadahighresolutionpinoutdiagraminaPDFversionhere.

Notes:[1]ConnectedtoMCO1bydefault,outputs32kHzclockforWICEDpowersavemode.SeeSystemFeaturesintheFirmwareReferencetodisabletheWi-FiPowersaveClockandallowusageofthispin.

[2]MICRO_SPI1_SSisonlyforreferenceasaP1modulepinname.ItistechnicallyspeakingtheSTM32pinPA4whichistheSSpininanhardwareSPIdrivensense,howeverintheParticleAPISPISSisonlyusercontrolledasaGPIO.ThehardwareSSpinisnotimplemented.ThedefaultSSpinfortheParticleSPIAPIisA2(STM32pinPC2),butanyGPIOcanbeusedforthisfunctionwithSPI.begin(pin).

P1Pin# P1PinName

Type/STM32F205RGY6

Port Description

1 GND PWR Ground

2~3 VBAT_WL PWR +3.3V

4 GND PWR Ground

5 VDDIO_3V3_WL PWR +3.3V

6 GND PWR Ground

7 WL_REG_ON PWR BCM43362DebuggingPin

8~12 NC NC NC

13 GND PWR Ground

14 NC NC NC

15 GND PWR Ground

16 WL_JTAG_TDI DEBUG BCM43362DebuggingPin

17 WL_JTAG_TCK DEBUG BCM43362DebuggingPin

18 WL_JTAG_TRSTN DEBUG BCM43362DebuggingPin

19 WL_JTAG_TMS DEBUG BCM43362DebuggingPin

20 WL_JTAG_TDO DEBUG BCM43362DebuggingPin

21 MICRO_SPI1_MISO PA6 A4(SPIMISO)

22 MICRO_SPI1_SCK PA5 A3(SPISCK)

23 MICRO_SPI1_MOSI PA7 A5(SPIMOSI)

24 MICRO_SPI1_SS PA4 DAC

25 GND PWR Ground

26~27 VDD_3V3 PWR +3.3V

28 GND PWR Ground

29 MICRO_UART2_RTS PA1 RGBR(RGBLEDRED)

30 MICRO_UART2_CTS PA0 WKP

31 MICRO_UART2_RXD PA3 RGBB(RGBLEDBLUE)

32 MICRO_UART2_TXD PA2 RGBG(RGBLEDGREEN)

33 TESTMODE PA8

P1S6(ConnectedtoMCO1bydefault,outputs32kHzclockforWICEDpowersavemode.SeeSystemFeaturesintheFirmwareReferencetodisabletheWi-FiPowersaveClockandallowusageofthispin.)

34 MICRO_RST_N I /RESET(ActivelowMCUreset)

35 MICRO_I2C1_SCL PB6 D1(I2CSCL)

36 MICRO_I2C1_SDA PB7 D0(I2CSDA)

COMPLETEP1MODULEPINLISTING

37 GND PWR Ground

38 VBAT_MICRO PWRSupplytotheinternalRTC,backupregistersandSRAMwhen3V3notpresent(1.65to3.6VDC)

39 GND PWR Ground

40 MICRO_GPIO_1 PB0 P1S0

41 MICRO_GPIO_2 PB1 P1S1

42 MICRO_GPIO_3 PC0 P1S2

43 MICRO_GPIO_5 PC3 A1

44 MICRO_GPIO_6 PC4 P1S3

45 MICRO_GPIO_7 PB5 D2(I2SSD)

46 MICRO_GPIO_8 PC7 /SETUP(I2SMCK)

47 MICRO_GPIO_9 PC13 P1S4

48 MICRO_GPIO_12 PC1 P1S5

49 MICRO_GPIO_13 PC2 A2(DEFAULTSPISS)

50 MICRO_GPIO_14 PC5 A0

51 MICRO_JTAG_TRSTN PB4 D3

52 MICRO_JTAG_TDO PB3 D4(I2SSCK)

53 MICRO_JTAG_TDI PA15 D5(I2SWS)

54 MICRO_JTAG_TMS PA13 D7

55 MICRO_JTAG_TCK PA14 D6

56 BTCX_STATUS I Coexistencesignal:BluetoothstatusandTX/RXdirection

57 BTCX_RF_ACTIVE I Coexistencesignal:Bluetoothisactive

58 BTCX_TXCONF O OutputgivingBluetoothpermissiontoTX

59 GND PWR Ground

60 WL_SLEEP_CLK DEBUG BCM43362DebuggingPin

61 MICRO_UART1_RTS PA12 OTG_FS_DP(USBD+)

62 MICRO_UART1_CTS PA11 OTG_FS_DM(USBD--)

63 MICRO_UART1_RXD PA10 RX

64 MICRO_UART1_TXD PA9 TX

65~73 GND PWR Ground

74 PAD1 NC NC

75 PAD2 NC NC

Technicalspecification

Parameter Symbol Min Typ Max Unit

SupplyInputVoltage V3V3-MAX +3.6 V

StorageTemperature Tstg -40 +85 °C

ESDSusceptibilityHBM(HumanBodyMode) VESD 2 kV

Parameter Symbol Min Typ Max Unit

SupplyInputVoltage V3V3[1] +3.0 +3.3 +3.6 V

SupplyInputCurrent(VBAT_WL) IVBAT_WL 310 mA

SupplyInputCurrent(VDDIO_3V3_WL) IVDDIO_3V3_WL 50 mA

SupplyInputCurrent(VDD_3V3) IVDD_3V3 120 mA

SupplyInputVoltage VVBAT_MICRO +1.65 +3.6 V

SupplyInputCurrent(VBAT_MICRO) IVBAT_MICRO 19 uA

OperatingCurrent(Wi-Fion) I3V3avg[1] 80 100 mA

OperatingCurrent(Wi-Fion) I3V3pk[1] 235[2] 430[2] mA

OperatingCurrent(Wi-Fion,w/powersave) I3V3avg[1] 18 100[3] mA

OperatingCurrent(Wi-Fioff) I3V3avg[1] 30 40 mA

SleepCurrent(5V@VIN) IQs 1 2 mA

DeepSleepCurrent(5V@VIN) IQds 80 100 uA

OperatingTemperature Top -20 +60 °C

HumidityRangeNoncondensing,relativehumidity 95 %

Notes:

[1]V3V3andI3V3representsthethecombined4inputsthatrequire+3.3V:VBAT_WL,VDDIO_3V3_WL,

VDD_3V3andVBAT_MICRO.

[2]Thesenumbersrepresenttheextremerangeofshortpeakcurrentburstswhentransmittingandreceivingin802.11b/g/nmodesatdifferentpowerlevels.AverageTXcurrentconsumptioninwillbe80-100mA.

[3]Theseareveryshortaveragecurrentburstswhentransmittingandreceiving.OnaverageifminimizingfrequencyofTX/RXevents,currentconsumptioninpowersavemodewillbe18mA

Feature Description

WLANStandards IEEE80211b/g/n

AntennaPort SingleAntenna

FrequencyBand 2.412GHz--2.462GHz(UnitedStatesofAmericaandCanada)

2.412GHz--2.472GHz(EU)

SubChannels 1--11(UnitedStatesofAmericaandCanada)

1--13(EU)

ABSOLUTEMAXIMUMRATINGS

RECOMMENDEDOPERATINGCONDITIONS

WI-FISPECIFICATIONS

Modulation DSSS,CCK,OFDM,BPSK,QPSK,16QAM,64QAM

P1moduleWi-Fioutputpower Typ. Tol. Unit

RFAverageOutputPower,802.11bCCKMode 1M Avail.uponrequest +/-1.5 dBm

11M - +/-1.5 dBm

RFAverageOutputPower,802.11gOFDMMode 6M - +/-1.5 dBm

54M - +/-1.5 dBm

RFAverageOutputPower,802.11nOFDMMode MCS0 - +/-1.5 dBm

MCS7 - +/-1.5 dBm

ThesespecificationsarebasedontheSTM32F205RGY6datasheet,withreferencetoPhotonpinnomenclature.

Parameter Symbol Conditions Min Typ Max Unit

StandardI/Oinputlowlevelvoltage VIL -0.30.28*(V3V3-2)+0.8

V

I/OFT[1]inputlowlevelvoltage VIL -0.30.32*(V3V3-2)+0.75

V

StandardI/Oinputhighlevelvoltage VIH0.41*(V3V3-2)+1.3

V3V3+0.3 V

I/OFT[1]inputhighlevelvoltage VIH V3V3>2V0.42*(V3V3-

2)+15.5 V

VIH V3V3≤2V0.42*(V3V3-

2)+15.2 V

StandardI/OSchmitttriggervoltagehysteresis[2]

Vhys 200 mV

I/OFTSchmitttriggervoltagehysteresis[2] Vhys 5%V3V3[3] mV

Input/Outputcurrentmax Iio ±25 mA

Input/Outputcurrenttotal Iiototal ±120 mA

Inputleakagecurrent[4] IlkgGND≤Vio≤V3V3

GPIOs±1 µA

Inputleakagecurrent[4] Ilkg RPUVio=5V,I/O

FT3 µA

Weakpull-upequivalentresistor[5] RPU Vio=GND 30 40 50 kΩ

Weakpull-downequivalentresistor[5] RPD Vio=V3V3 30 40 50 kΩ

I/Opincapacitance CIO 5 pF

DACoutputvoltage(buffersenabledbydefault)

VDAC 0.2 V3V3-0.2 V

DACoutputresistiveload(buffersenabledbydefault)

RDAC 5 kΩ

DACoutputcapacitiveload(buffersenabledbydefault)

CDAC 50 pF

Notes:

[1]FT=Five-volttolerant.InordertosustainavoltagehigherthanV 3V3+0.3theinternalpull-up/pull-

downresistorsmustbedisabled.

[2]HysteresisvoltagebetweenSchmitttriggerswitchinglevels.Basedoncharacterization,nottested

inproduction.

I/OCHARACTERISTICS

[3]Withaminimumof100mV.

[4]Leakagecouldbehigherthanmax.ifnegativecurrentisinjectedonadjacentpins.

[5]Pull-upandpull-downresistorsaredesignedwithatrueresistanceinserieswithswitchable

PMOS/NMOS.ThisPMOS/NMOScontributiontotheseriesresistanceisminimum(~10%order).

Mechanicalspecifications

P1moduledimensionsare:0.787"(28mm)(W)x1.102"(20mm)(L)x0.0787"(2.0mm)(H)+/-0.0039"(0.1mm)(includesmetalshielding)

Actualsize(sotiny!)

ThesearethephysicaldimensionsoftheP1moduleitself,includingallpins:

OVERALLDIMENSIONS

P1MODULEDIMENSIONS

TheP1canbemounteddirectlyonacarrierPCBwithfollowingPCBlandpattern:

AP1partforEAGLEcanbefoundintheParticleEAGLElibrary

P1MODULERECOMMENDEDPCBLANDPATTERN

P1ReferenceDesignSchematic

SCHEMATIC-USB

SCHEMATIC-POWER

SCHEMATIC-USERI/O

SCHEMATIC-P1WI-FIMODULE

P1ReferenceDesignLayout

Tobeadded.

Tobeadded.

P1REFERENCEDESIGNTOPLAYER(GTL)

P1REFERENCEDESIGNBOTTOMLAYER(GBL)

Recommendedsolderreflowprofile

Phase TemperaturesandRates

A-B. Ambient~150°C,Heatingrate:<3°C/s

B-C. 150~200°C,soaktime:60~120s

C-D. 200~245°C,Heatingrate:<3°C/s

D. Peaktemp.:235~245°C,Timeabove220°C:40~90s

D-E. 245~220°C,Coolingrate:<1°C/s

Orderinginformation

P1modulesareavailablefromstore.particle.ioascuttapeinquantitiesof10each.

Qualificationandapprovals

RoHSCEFCCID:COFWMNBM11IC:10293A-WMNBM11

Producthandling

TheMoistureSensitivityLevel(MSL)relatestothepackagingandhandlingprecautionsrequired.TheP1moduleisratedlevel3.Ingeneral,thisprecautionappliesforPhotonswithoutheaders.WhenreflowingaP1directlyontoanapplicationPCB,increasedmoisturelevelspriortoreflowcandamagesensitiveelectronicsontheP1.Abakeprocesstoreducemoisturemayberequired.

Formoreinformationregardingmoisturesensitivitylevels,labeling,storageanddryingseetheMSLstandardseeIPC/JEDECJ-STD-020(canbedownloadedfromwww.jedec.org).

TheP1modulecontainshighlysensitiveelectroniccircuitryandisanElectrostaticSensitiveDevice(ESD).HandlingaP1modulewithoutproperESDprotectionmaydestroyordamageitpermanently.ProperESDhandlingandpackagingproceduresmustbeappliedthroughouttheprocessing,handlingandoperationofanyapplicationthatincorporatesP1modules.ESDprecautionsshouldbeimplementedontheapplicationboardwheretheP1moduleismounted.FailuretoobservetheseprecautionscanresultinseveredamagetotheP1module!

TAPEANDREELINFO

MOISTURESENSITIVITYLEVELS

ESDPRECAUTIONS

Defaultsettings

TheP1modulecomespre-programmedwithabootloaderandauserapplicationcalledTinker.ThisapplicationworkswithaniOSandAndroidappalsonamedTinkerthatallowsyoutoveryeasilytoggledigitalpins,takeanaloganddigitalreadingsanddrivevariablePWMoutputs.

Thebootloaderallowsyoutoeasilyupdatetheuserapplicationviaseveraldifferentmethods,USB,OTA,SerialY-Modem,andalsointernallyviatheFactoryResetprocedure.Allofthesemethodshavemultipletoolsassociatedwiththemaswell.

YoumayusetheonlineWebIDEParticleBuildtocode,compileandflashauserapplicationOTA(OverTheAir).ParticleDevisalocaltoolthatusestheCloudtocompileandflashOTAaswell.Thereisalsoapackage SparkDFU-UTIL forParticleDevthatallowsforCloudcompilingandlocalflashingviaDFUoverUSB.Thisrequires dfu-util tobeinstalledonyoursystem.'dfu-util'canalsobeused

withParticleCLIforCloudcompilingandlocalflashingviathecommandline.FinallythelowestlevelofdevelopmentisavailableviatheGNUGCCtoolchainforARM,whichofferslocalcompileandflashviadfu-util.Thisgivestheusercompletecontrolofallsourcecodeandflashingmethods.Thisisanextensivelist,howevernotexhaustive.

GlossaryRadioFrequency

SMT

SurfaceMountTechnology(oftenassociatedwithSMDwhichisasurfacemountdevice).

AP

AccessPoint

USB

UniversalSerialBus

Quiescentcurrent

Currentconsumedinthedeepestsleepstate

FT

Five-tolerant;Referstoapinbeingtolerantto5V.

3V3

+3.3V;Theregulated+3.3Vsupplyrail.Alsousedtonoteapinisonly3.3Vtolerant.

RTC

RealTimeClock

OTA

OverTheAir;describinghowfirmwareistransferredtothedevice.

FCCICCEWarningsandEndProductLabelingRequirements

FederalCommunicationCommissionInterferenceStatementThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuanttoPart15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmfulinterferenceinaresidentialinstallation.Thisequipmentgenerates,usesandcanradiateradiofrequencyenergyand,ifnotinstalledandusedinaccordancewiththeinstructions,maycauseharmfulinterferencetoradiocommunications.However,thereisnoguaranteethatinterferencewillnotoccurinaparticularinstallation.Ifthisequipmentdoescauseharmfulinterferencetoradioortelevisionreception,whichcanbedeterminedbyturningtheequipmentoffandon,theuserisencouragedtotrytocorrecttheinterferencebyoneofthefollowingmeasures:

Reorientorrelocatethereceivingantenna.Increasetheseparationbetweentheequipmentandreceiver.Connecttheequipmentintoanoutletonacircuitdifferentfromthattowhichthereceiverisconnected.Consultthedealeroranexperiencedradio/TVtechnicianforhelp.

FCCCaution:Anychangesormodificationsnotexpresslyapprovedbythepartyresponsibleforcompliancecouldvoidtheuser'sauthoritytooperatethisequipment.ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:

1. Thisdevicemaynotcauseharmfulinterference,and2. Thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation.

FCCRadiationExposureStatement:ThisequipmentcomplieswithFCCradiationexposurelimitssetforthforanuncontrolledenvironment.Thistransmittermodulemustnotbeco-locatedoroperatinginconjunctionwithanyotherantennaortransmitter.ThisEndequipmentshouldbeinstalledandoperatedwithaminimumdistanceof20centimetersbetweentheradiatorandyourbody.

IMPORTANTNOTE:Intheeventthattheseconditionscannotbemet(forexamplecertainlaptopconfigurationsorco-locationwithanothertransmitter),thentheFCCauthorizationisnolongerconsideredvalidandtheFCCIDcannotbeusedonthefinalproduct.Inthesecircumstances,theOEMintegratorwillberesponsibleforre-evaluatingtheendproduct(includingthetransmitter)andobtainingaseparateFCCauthorization.

EndProductLabelingThefinalendproductmustbelabeledinavisibleareawiththefollowing:

ContainsFCCID:2AEMI-PHOTON

ManualInformationtotheEndUserTheOEMintegratorhastobeawarenottoprovideinformationtotheenduserregardinghowtoinstallorremovethisRFmoduleintheuser’smanualoftheendproductwhichintegratesthismodule.

CanadaStatementThisdevicecomplieswithIndustryCanada’slicence-exemptRSSs.Operationissubjecttothefollowingtwoconditions:

1. Thisdevicemaynotcauseinterference;and2. Thisdevicemustacceptanyinterference,includinginterferencethatmaycauseundesiredoperationofthedevice.

LeprésentappareilestconformeauxCNRd’IndustrieCanadaapplicablesauxappareilsradioexemptsdelicence.

L’exploitationestautoriséeauxdeuxconditionssuivantes:

1. l’appareilnedoitpasproduiredebrouillage;2. l’utilisateurdel’appareildoitacceptertoutbrouillageradioélectriquesubi,mêmesilebrouillageestsusceptibled’encompromettrelefonctionnement.

CautionExposure:Thisdevicemeetstheexemptionfromtheroutineevaluationlimitsinsection2.5ofRSS102anduserscanobtainCanadianinformationonRFexposureandcompliance.Ledispositifrépondàl'exemptiondeslimitesd'évaluationderoutinedanslasection2.5deRSS102etlesutilisateurspeuventobtenirdesrenseignementscanadienssurl'expositionauxRFetlerespect.

Thefinalendproductmustbelabelledinavisibleareawiththefollowing: TheIndustryCanadacertificationlabelofamoduleshallbeclearlyvisibleatalltimeswheninstalledinthehostdevice,otherwisethehostdevicemustbelabelledtodisplaytheIndustryCanadacertificationnumberofthemodule,precededbythewords“Containstransmittermodule”,ortheword“Contains”,orsimilarwordingexpressingthesamemeaning,asfollows:

ContainstransmittermoduleIC:20127-PHOTON

ThisEndequipmentshouldbeinstalledandoperatedwithaminimumdistanceof20centimetersbetweentheradiatorandyourbody.Cetéquipementdevraitêtreinstalléetactionnéavecunedistanceminimumde20centimètresentreleradiateuretvotrecorps.

Theendusermanualshallincludeallrequiredregulatoryinformation/warningasshowninthismanual.

Revisionhistory

Revision Date Author Comments

v001 4-May-2015 BW Initialrelease

v00231-May-2015

BW Updateassets

v003 1-June-2015 BW UpdatedVBAT_MICROinfo

v00424-July-2015

BW

AddedFCCICCEWarningsandEndProductLabelingRequirements,Updatedpoweroutput,addedapprovedantennas,CorrectedDAC2asA3,CorrectedA0aspin50,CorrectedExternalCoexistenceInterfacepinnumbers,AddedRGBLED,SETUPandRESETbuttonsection.

v00511-April-2016

BW

Added:fullSTM32partnumber,Memorymap,DAClimits,SWDpinlocations,maxsource/sinkcurrent,knownerrataURLandtape-and-reeldimensions.Updated:BTCOEXinfo,pinoutdiagrams(fixedRESETpinnumbererror),operatingconditions,pindescriptions(P1S0~P1S5pins),land-patternimagesignalkeepoutnote.

v006 14-July-2016 BWUpdatedP1pinlisting:TESTMODEpin33(PA8),connectedtoMCO1bydefault,outputs32kHzclockforWICEDpowersavemode-currentlyunsupportedforusercontrol.

v00720-

September-2016

BWUpdatedP1pinlisting:TESTMODEpin33(PA8),canusenowasP1S6ifenabled.UpdatedPinmapandaddedP1S6.UpdatedPinDescriptionandPeripheralsandGPIO.

v00825-July-2017

BW

AddednotetoclarifyMICRO_SPI1SSlabel,renamedSPI1/SPI3_tomatchParticleAPIinsteadofSTM32pinnamestoavoidconfusion(nowSPIandSPI1),updatedthePinDescriptionsectionandaddedhighresolutionpinoutPDF,updatedPWMnotes,JTAG_TDOpinnumber(54->52),blockdiagramandDCTlayout,addedwarningtopowersection

v00930-August-

2017BW Addedpartnumberfor1MBexternalSPIflash(MX25L8006E)

KnownErrata

Wearetrackingknownerratawiththisdatasheethere.Theseissues/errorsinthedatasheetwillberesolvedinsubsequentrevisions.

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