FromTechnologies to Market - US 3DS OUTSCALE · • Growth,pressure range,type of sensor used • Market forecast by type of sensors • Competitive landscape p 46 • MEMS ranking

February © 2015

From Technologies to Market

MEMS Pressure Sensor Market &

Technologies 2018

Sample

Market report


Source : Merit

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ABOUT THE AUTHORS

Yann de Charentenay works as a Technology & Market Analyst for Yole Développement(Yole). As part of the MEMS & Sensors Business Unit, Yann is strongly involved in the technology & market analysis of the applications of disruptive technologies and components: memory, MEMS and sensors... Yann is daily contributing to the development of Yole’s activities with a dedicated collection of market & technology reports as well as custom consulting projects.

Prior his mission at Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique (CEA, France) as well as a consultant at Algoe (France). He has spoken in numerous international conferences and has authored or co-authored numerous press articles.

Yann is graduated from the University of Compiegne (France) with a master degree in innovation management. He is also graduated from INP Phelma (Grenoble, France) with a master degree in materials science.

©2018 | www.yole.fr | MEMS Pressure Sensor 2018 - Market & Technologies Report - Sample

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TABLE OF CONTENTS

• Table of Contents

• Glossary

• Companies Cited in This Report

• Definitions

• Market Research Scope and Methodology

• Executive Summary p 13

• Global market Forecast p 33

• Market forecast by market (automotive, consumer, industrial, medical ,avionics & high end)

• Applications Overview p 37

• Growth, pressure range, type of sensor used

• Market forecast by type of sensors

• Competitive landscape p 46

• MEMS ranking and global market share

• Players position by market

• Geographical localization

• Analysis of the value and supply chain

• M&A and potential acquisitions

• Focus on China

• Automotive Market p 66

• Market segmentation, market forecast by application,ASP.

• Applications description, main trends

• Players market share and supply chain analysis

• Consumer market p 97

• Similar content than automotive

• Industrial market p 118


• Medical market p 129


• Avionics & high end market p 143


• MEMS pressure sensor technologies p 154

• History of MEMS pressure sensors

• Position of main pressure sensor technologies

• Pressure range by applications

• Description of the main pressure sensor technologies

• Position of MEMS piezoresistive vs MEMS capacitive

• Players adoption of MEMS piezoresistive and capacitive

• Cost breakdown

• Main technical trends

• Technological roadmap

• General Conclusions p 176


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REPORT OBJECTIVES

• This report’s objectives are as follows:

1. To give a detailed analysis of all MEMS pressure sensor applications

• Application description, sensor function, competing technologies, main market drivers and trends.

2. To provide market data on key pressure sensors market metrics & dynamics

• Pressure sensor sales in units & in revenue by market, by application, by sensor type, and technology

• Players market share globally and by market

3. To provide key technical insight on main pressure technologies and main technological trends

• Description of the main pressure sensor technologies

• Reverse engineering trends for TPMS and consumer applications

• Technological landscape and trends for MEMS technologies (piezoresistive and capacitive).

4. To provide an in-depth understanding of pressure sensor value chain, infrastructure and players

• Who are the key pressure sensor players (IDMs, module makers, vertically integrated players) and what is their market and technological position?

• More generally, who are the key suppliers to watch and how will the pressure sensor market evolve?

• What are the potential targets for M&A ?


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WHO SHOULD BE INTERESTED IN THIS REPORT?

• MEMS device manufacturers

• Evaluate market potential of future technologies and products

• Understand the differentiated value of your products andtechnologies in this market

• Identify new business opportunities

• Identify potential strategic partners or technology providers

• Monitor and benchmark your competition’s advancements

• MEMS foundries, material and equipment suppliers,packaging and test houses

• Understand which applications will drive volumes in the future

• Identify new business opportunities and prospects

• R&D centers

• Evaluate market potential of future technologies and productsfor new applicative markets

• Identify the best candidates for technology transfer

• System integrators and developers (automotivemanufacturers, medical system makers, cell phone &tablet makers…)

• Evaluate market potential of future technologies and productsto differentiate your own products

• Evaluate the benefits of using these new technologies in yourend-system; design architecture for the next generation ofsystems

• Screen potential new suppliers able to provide newfunctionalities, or cost and size savings

• Financial & strategic investors

• Understand the structure and value chain of the MEMSpressure sensor industry

• Estimate the value of players developing disruptive productsand technologies

• Get the global list of main key players and emerging start-upsin this industry


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Alps, Amphenol, Bosch, CF sensor, Continental, Delphi, Denso, Elmos SMI, First Sensor, GE Druck, Honeywell, Infineon, Invensense, Keller, Kistler, Kulite, Meggit, Melexis,

Memscap, MEMSensing Microsystems, Merit, MT microsystem, Murata, Murata, Nano-MEMS, NXP, Omron, Panasonic, Rohm, Schraeder, Sensata, Sensirion, ShuangQiao Sensor,

ST Microelectronics, TDK, TE connectivity, Thales, Xfab

KEY COMPANIES CITED IN THIS REPORT


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DEFINITIONS

• MEMS (Micro Electro Mechanical Systems) are semiconductor devices that include moving parts in the µm to mmrange and use a photolithography process for manufacturing. A MEMS pressure sensor is a device for pressuremeasurement of gases or liquids. It converts a pressure into an electric signal. Position of pressure sensors in thesupply chain :

Second level

Packaging = module,

transducer, transmitter

• MEMS pressure sensor chips are built from silicon (front end manufacturing), assembled generally with an ASIC chipand packaged in a first level packaging (back end manufacturing). Second level packaging is adding further electronic,robust housing, and connectors. In the report, we will consider only value of first level packaging and not modulevalue (called also transducer or transmitter).

• Exceptions : for TPMS, we will consider TPMS SiP value (pressure sensor+accelerometer, RF, MCU) and forapplications that integrates chips directly in a second level packaging (automotive HVAC or oil) we will consider atheoretical first level packaging value.

Sensor + ASIC

packaged

Sensor alone or Sensor + ASIC chips

(multi chips packages or monolithic)First Level Packaging :

Devices considered for

market forecasts

Systems

(Automotive power train

example)

Front end manufacturing Back end manufacturing


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MARKET RESEARCH SCOPE AND METHODOLOGY

• Market research scope• This report surveys MEMS pressure sensors.

• Products not covered : • Other pressure sensor technologies : ceramic, thin film…• Pressure switches

• This includes the following MEMS technologies:• MEMS piezo resistive• MEMS capacitive

• Market estimates are for the period 2017 – 2023 in $ (with $1.1 = one euro conversion).

• Methodology:

• This report has been prepared based on research into:• Primary information sources: direct interviews with companies (sensor manufacturers, integrators).• Secondary information sources: conferences, web sites, newsletters....

• All data, graphs, tables, and calculations in this report are based on Yole Développement’sinvestigation.


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Applications Overview

Sensata Schraeder TPMS valve


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MEMS PRESSURE SENSOR APPLICATIONS

Overview

Pressure sensors are used in a

wide variety of

applications (29 covered

by the report)

MEMS pressure sensors

Application

Automotive

Avionics & high end

MedicalConsumer

Industrial

Smartphones

& tablets Wearables

Blood pressure

monitoringRespiratory

Smart inhalder

TPMS

Side airbags

Particle filter

HVAC

Process control

FADECAir data

BAP

Electronic cigarette

Transportation


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MEMS PRESSURE SENSOR APPLICATIONS

Covered markets and applications

29 applications

analysed and

forecasted

• Automotive

• Powertrain

• MAP

• BAP

• Particle filter

• Fuel tank

• Exhaust gazrecirculation

• Engine oil

• Automatic transmission oil

• Safety

• TPMS

• Brake booster

• Side airbags

• Pedestrian protection

• Comfort

• HVAC

• Industrial

• Industrial process controls

• HVAC

• Transportation & other

• Medical

• Blood monitoring invasive

• Blood monitoring non invasive

• Respiratory

• Smart inhaler

• Other medical applications

• Consumer

• Smartphone & tablets

• Wearable

• Electronic cigarette

• Drones

• Smart home

• Avionics & High-End

• Avionics air Data

• Avionics FADEC

• Avionics Hydraulic

• Other high end applications


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MEMS PRESSURE SENSOR MARKET FORECAST

By market in $

CAGR is 3,8% in $

• Automotive is the largest market by far (about 50% of the total) and with significant growth.

• Consumer is much smaller due to low pricing but will grow significantly.

• Medical and industrial has similar size with same moderate growth.

• Avionics&high end is a niche market but with high growth.


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Competitive Landscape


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MEMS PRESSURE SENSOR COMPETITIVE LANDSCAPE

Leading players by market

Market leaders are different for each market except for

Bosch. Honeywell,

and NXP have strong

presence in 3 markets

Automotive IndustrialConsumer avionics &

High-End

No.1

No.2

No.3

No.4

No.5

Medical


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MEMS PRESSURE SENSOR SUPPLY CHAIN

Key players categories and business models

Various supply chain are possible depending on the market

• There is a competition between IDM’s, module and systems makers to produce first level pressure sensors. xxxx

• xxxx

• xxxxx

Pressure sensor die ASIC die First level

packaging

IDM

(Integrated

Device Manufacturers)

Module

IDM + module

IDM + module+ System :

Vertically integrated

players

System

Players focused on

one step of the value chain


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MEMS PRESSURE SENSOR PLAYERS

Players market share at the first packaging level

Automotive players are owning xx % of the business

Market Share of all players 2018

$xxM


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Automotive market


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AUTOMOTIVE MARKET DESCRIPTION

Source : Infineon, 2016


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Consumer market


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CONSUMER MARKET DESCRIPTION


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Industrial Market

Rosemount Emerson pressure sensors


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INDUSTRIAL MARKET DESCRIPTION


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MEMS Pressure SensorTechnologies

Bosch BMP 280 pressure sensor


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PRESSURE SENSOR TECHNOLOGIES

History of MEMS technology & pressure sensor

Pressure sensor is one of the very-

first device of the MEMS

history

1960 1970 1980 1990 2000

BJT Transistor

IC

Pressure Sensor

(Honeywell, Fairchild)Si Pressure Sensor

(Motorola)

Silicon-to-silicon fusion

bond Pressure Sensor

(NovaSensor)

IR imager

(Honeywell)

Accelerometer

(ADI)DMD, DLP (TI)

Si Gyro

(Draper)

RF MEMS

Bio MEMS

DRIE (Bosch)

XeF2 (UCLA)

Ink jet nozzle

(HP)

Product’s first

commercialization

Micromachining

related process

Anisotropic silicon

etching

University &

industrial R&D

Pressure sensor research

(Stanford)

Pressure Sensor

(National Semiconductor)

DLP research (TI)

Piezoresistive

pressure sensor

research (Kulite)Accelerometer research

(ADI)

LIGAMetal sacrificial

process Silicon-to-silicon

fusion bond

PolySi beams

Pressure sensor

related


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Ceramic capacitive technology

• Structure: 2 disks of metallized (on one face) ceramic form the 2 electrodes of a capacitor. The dielectric thickness changes withthe pressure applied on one of the disks and the capacitor change is measured by an electronic circuit, mounted on the seconddisk.

• Diameter and thickness of the disk exposed to the media define the range of pressure.

Sensata’s ceramic capacitive pressure sensor P500

• With relative (gauge) pressure sensors, the

back of the diaphragm is vented, i.e. this

sensor measures the gauge pressure

relative to the atmospheric pressure.

• With absolute pressure sensors, the vacuum created in

the production process between the diaphragm and the

body of the cell is permanent. This permits pressure

measurements related to the vacuum.

Source: Nelege


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MEMS technologies comparison

• MEMS capacitive has some technical advantages over MEMS piezoresisitivebut is still rarely used.

• It can be explained by the following factors :

• Xx

• Xx

• xx

Despite significant technical

advantages, capacitive

technology is still less

widespread than

piezoresistive

MEMS piezoresistive MEMS capacitive

Measurement of differential pressure ●●● o

Accuracy

Power consumption

Sensitivity to temperature

Pressure range

Chip size

Signal treatment cost

Minimal order quantity

●●● Good position ● Medium position o Requirement not fulfilled


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The automotive industry is the oldest and the biggest market for MEMS pressure sensors. Powertrain applications represent more than 50% of the business, followed by safety, with tire pressure management systems (TPMS) being the biggest single automotive application. Driven by CO2 emission reduction and automation, pressure sensors will increasingly be used in the next five years, especially in China, whose regulations will require pressure sensors for several applications. These include TPMS, diesel and gasoline particle filters (DPF, GPF) and fuel tank evaporation (EVAP).

The consumer market is now the second largest pressure sensor business, thanks to recent rapid adoption in high-end smartphones and tablets. This will further extend to Android mid-to-low value smartphones, driven by new use cases, such as indoor and outdoor navigation. Lower sensor costs and better accuracy and power also enable new applications to grow, such as

wearables, electronic cigarettes, drones, and smart homes.

Avionics and high-end applications are still niche markets, but exhibit the fastest market growth thanks to the dynamic aircraft market and MEMS taking over from traditional technologies.

The medical and industrial markets are growing at a moderate rate because there is no significant change in term of applications, with one exception. New medical smart inhalers are in between the medical and consumer markets, and pave the way for many future medical consumer Internet of Things (IoT) applications.

Overall, the MEMS pressure sensor market will grow by 3.8% per year, reaching a value of $2B in 2023. The report identifies the key driving forces and restraints for each pressure sensor market and application, and provides accurate market value and volume forecasts.

MEMS PRESSURE SENSOR MARKET AND TECHNOLOGIES 2018Market & Technology report - May 2018

AUTOMOTIVE AND CONSUMER APPLICATIONS WILL CONTINUE TO DRIVE THE PRESSURE SENSOR BUSINESS

Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.

(Yole Développement, May 2018)

MEMS pressure sensor market forecast, broken down by market

WHAT’S NEW• Updated market forecast for 29

applications• New applications: pedestrian

protection, wearables, drones, electronic cigarettes, transportation, smart inhalers and avionic hydraulics

• Main specifications and trends for each application

• In depth analysis of automotive applications, especially tire pressure monitoring systems (TPMS) with key products reverse engineered

• In depth analysis of consumer applications with key products reverse engineered

• In depth analysis of key players by market and by piezoresistive or capacitive technology, and expected evolution

• Analysis of past mergers and acquisi-tions and potential future targets

• New market forecast broken down into absolute, gauge and differential pressure sensor categories

• Competitive positioning of MEMS technology against other technologies

• Competitive positioning of piezore-sistive against capacitive MEMS

• Analysis of main technical trends: miniaturization and monolithic approaches

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Market forecast for 2017-2023 in

volume and value; broken down by market, spanning automotive, consumer, industrial, medical, avionics and high-end applications; broken down across 29 different applications; and broken down into absolute, gauge and differential pressure sensor categories

• Competitive landscape with player market shares by technology and market, supply chain analysis and market dynamics

• Pressure sensor applications, market drivers, main trends and key players

• Technology descriptions and compa-risons, main trends and main players

$ 0

$ 500

$1 000

$1 500

$2 000

$2 500

2016 2017 2018 2019 2020 2021 2022 2023

Avionics and high end Medical Industrial Consumer Automotive

THE COMPETITIVE LANDSCAPE VARIES BETWEEN THE AUTOMOTIVE, CONSUMER, MEDICAL, INDUSTRIAL, AVIONICS AND HIGH END MARKETS

The competitive landscape varies greatly with the type of market addressed.

• In both the high-volume automotive and consumer markets, Bosch is clearly the

dominant leader. This is a unique position. Bosch has succeeded in leveraging its automotive product leadership to become leader in the newer consumer market.

MEMS PRESSURE SENSOR MARKET AND TECHNOLOGIES 2018

TECHNICAL TRENDS: AUTOMOTIVE ELECTRIFICATION WILL TRANSFORM THE PRESSURE SENSOR BUSINESS

MEMS pressure sensor technologies are now quite mature, and are basically segmented into piezoresistive and capacitive categories. These

two technologies are not hugely different. Today piezoresistive is clearly leading in terms of market share, and that will continue. We don’t expect big technical breakthroughs, mainly incremental improvements, with miniaturization as important as in all semiconductor products.

We expect bigger changes at the system level, especially in automotive, which has been shaken by electrification and automation. Electrification is positive for pressure sensors when it is deployed in hybrid vehicles (HEVs) that have combustion engines that use many pressure sensors. But zero emission vehicles (ZEVs), which includes pure battery vehicles (BEVs) and fuel cell vehicles (FCVs), eliminate the combustion engine, and with it the demand for powertrain sensors. With powertrain sensors representing 51% of the automotive MEMS pressure sensor business, leading powertrain pressure sensor makers like Bosch, Infineon, or Denso must be worried about their future business. However, the transition will take more than a decade. This report will help readers find new, alternative markets.

Leading players, broken down by market

Long term zero emission vehicle (ZEV) impact on the automotive powertrain pressure sensor business



COMPANIES CITED IN THE REPORT (non exhaustive list)Alps, Amphenol, Bosch, CFSensor, Continental, Delphi, Denso, Elmos SMI, First Sensor, GE Druck, Honeywell, Infineon, Invensense, Keller, Kistler, Kulite, Meggit, Melexis, Memscap, MEMSensing Microsystems, Merit, MT microsystem, Murata, Murata, Nano-MEMS, NXP, Omron, Panasonic, Rohm, Schraeder, Sensata, Sensirion, ShuangQiao Sensor, ST Microelectronics, TDK, TE Connectivity, Thales, Xfab…

Bosch has aggregated both markets’ production volume to reduce cost, and further increase its competitive advantage. Other players like Infineon, Sensata, Denso and Melexis are mainly focused on automotive, while ST Microelectronic and Alps serve the consumer

market. Only TE Connectivity and NXP also have multimarket presence. The key players are large groups active in various MEMS sensors, with inertial, pressure and gas sensor devices. Vertical integration is usual in automotive at companies like Bosch, Denso and Sensata, but not in consumer, because systems are smaller and thus there is no need for tier one component suppliers.

• The medium-to-low-volume medical, industrial, avionics and high-end markets all have many of the same key players. They include Honeywell, Amphenol, NXP, TE Connectivity, Omron, First Sensor, Merit, Elmos SMI, and TDK. These companies grow their business by targeting multiple markets, and by making added-value modules. There are also pure avionics and high-end market players, such as Kulite or Memscap.

Mergers and acquisitions (M&A) between Amphenol and GE, Sensata, Schrader and CST, TDK and Invensense, and Qualcomm, NXP and Freescale all included pressure sensor activities, and activity has therefore been concentrated. The budget for future acquisitions will probably exceed $100M. The report lists future possible targets, and ranks them to help M&A decision makers.

Automotive Industrial Consumer Avionics & high-end

No.1

No.2

No.3

No.4

No.5

Medical

$ 793M $ 302M $ 256M $ 64M $ 221M

0%

10%

20%

30%

40%

50%

60%

$ 0

$ 200

$ 400

$ 600

$ 800

$1 000

$1 200

2016 2023 2030 2050

Safety Comfort ZEV % Powertrain

OBJECTIVES OF THE REPORT• To give a detailed analysis of all MEMS pressure sensor applications

- Application description, sensor function, competing technologies, main market drivers and trends

• To provide market data on key pressure sensors market metrics and dynamics- Pressure sensor sales in volume and value by market, by application, by sensor type, and

technology- Players market share globally and by market

• To provide key technical insight on main pressure technologies and main technological trends- Description of the main pressure sensor technologies- Reverse engineering trends for tire pressure monitoring systems (TPMS) and consumer

applications- Technological landscape and trends for piezoresistive and capacitive MEMS technologies

• To provide an in-depth understanding of pressure sensor value chain, infrastructure and players- Who are the key pressure sensor players, including integrated device manufacturers,

module makers and vertically integrated players, and what is their market and technological position?

- More generally, who are the key suppliers to watch and how will the pressure sensor market evolve?

- What are the potential targets for mergers and acquisitions?

MARKET & TECHNOLOGY REPORT

Find more details about

this report here:

Table of contents

Glossary

Companies cited in this report

Definitions

Market research scope and methodology

Executive summary 13

Global market forecast 33

> Market forecast by market: automotive, consumer, industrial, medical and avionics and high-end

Application overviews 37

> Growth, pressure range, type of sensor used

> Market forecast by type of sensors

Competitive landscape 46

> MEMS ranking and global market share> Player positions by market> Geographical localization > Analysis of the value and supply chain> M&A and potential acquisitions> Focus on China

Automotive market 66

> Market segmentation and market forecast by application and ASP

> Application descriptions and main trends

> Electrification’s impact on powertrain business

> Players’ market shares and supply chain analysis

Consumer market 97> Similar content to automotive

Industrial market 118> Similar content to automotive

Medical market 129> Similar content to automotive

Avionics and high end market 143> Similar content to automotive

MEMS pressure sensor technologies 154> History of MEMS pressure sensors> Position of main pressure sensor

technologies> Pressure range by application> Description of the main pressure sensor

technologies> Position of piezoresistive vs capacitive

MEMS> Player adoption of piezoresistive and

capacitive MEMS> Cost breakdown> Main technical trends> Technological roadmap

General conclusions 176

TABLE OF CONTENTS (complete content on i-Micronews.com)

• Sensors for Robotic Vehicles 2018• Magnetic Sensor Market and

Technologies 2017

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AUTHORYann de Charentenay works as a Technology & Market Analyst for Yole Développement (Yole). As par t of the MEMS & Sensors Business Unit , Yann is strongly involved in technology & market analysis of applications of disruptive technologies and components such as memory, MEMS and sensors. Yann contributes to the development of Yole’s activities daily, with a dedicated collection of market and technology repor ts as well as custom consulting projects.Prior to joining Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique (CEA), France, as well as a consultant at Algoe, also in France. He has spoken at numerous international conferences and has authored or co-authored numerous press ar ticles.Yann graduated from the University of Compiegne in France, with a master’s degree in innovation management. He also graduated from INP Phelma in Grenoble, France, with a master’s degree in materials science.

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ASSOCIATED REPORT MEMS Pressure Sensor Comparison 2018 - Structural, Process and Cost Report by System Plus ConsultingStructure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications.Bundle offer possible, contact us for more information.

Reverse costing with:• Package views and dimensions• Package cross-sections• Precise measurements• Die descriptions

• Technology descriptions• Cost analysis• Cost comparisons

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

MEDIA & EVENTS• i-Micronews.com website and related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums,…More information on www.i-micronews.com

CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations: Sandrine Leroy ([email protected])

CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr

REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports

© 2018

Yole Développement


Source: Wikimedia Commons

http://www.yole.fr/

http://www.yole.fr/

2©2018 | www.yole.fr | About Yole Développement

FIELDS OF EXPERTISE COVERED BY OUR 40+ ANALYSTS

MEMS & Sensors

Solid State Lighting(LED, OLED, …)

Compound Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries &

Energy Management

Power Electronics

Displays

RF

Devices &

Techno.

Advanced

Substrates

Software

Memory

http://www.yole.fr/

http://www.yole.fr/


3 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization of

innovative optical systems

• Financial services (due diligence,

M&A with our partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

http://www.yole.fr/

http://www.yole.fr/

http://www.yole.fr/

http://www.yole.fr/

https://www.i-micronews.com/reports.html

https://www.i-micronews.com/reports.html

https://www.i-micronews.com/media-kit.html

https://www.i-micronews.com/media-kit.html


6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

http://www.yole.fr/

http://www.yole.fr/


OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

http://www.yole.fr/

http://www.yole.fr/


ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

http://www.yole.fr/

http://www.yole.fr/


SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developpers

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

http://www.yole.fr/

http://www.yole.fr/


SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

http://www.yole.fr/

http://www.yole.fr/


o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundle Subscription offers and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Memory

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


OUR 2018 REPORTS COLLECTION (1/3)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 - Update

− Silicon Photonics 2018 - Update

− Consumer Biometrics: Sensors & Software 2018 - Update

− MEMS Pressure Sensors 2018

− Air Quality Sensors 2018

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− Gas & Particles Sensors

− MEMS Pressure Sensors

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

RF DEVICES AND TECHNOLOGIES


− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Update

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –

Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Wireless technologies (Radar, V2X) for Automotive 2018

− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018


− RF Front-End Modules in Smartphones

− RF GaN*


− RF Front End Module – Patent Landscape Analysis

− RF GaN – Patent Landscape Analysis

IMAGING & OPTOELECTRONICS


− Status of the CMOS Image Sensor Industry 2018 – Update

− Status of the Compact Camera Module and Wafer Level Optics Industry 2018 -

Update

− 3D Imaging and Sensing 2018 - Update

− Machine Vision for Industry and Automation 2018

− Sensors for Robotic Vehicles 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− LiDAR 2018: Market and technologies

o QUARTERLY UPDATE – by Yole Développement

− CMOS Image Sensors 2018 *


− CMOS Image Sensors

− Compact Camera Modules


− LiDAR – Patent Landscape Analysis

SOFTWARE


− Consumer Biometrics: Sensors & Software 2018 - Update

− Processing Hardware and Software for AI 2018 – Vol. 1 & 2

Update : 2017 version still available / *To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING


− Status of Advanced Packaging Industry 2018 - Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like

PCB Trends

− Fan-Out Packaging 2018 – Update*

− 3D TSV and Monolithic Business Update 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update*

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Memory Packaging Market and Technology Report 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive for Advanced Packaging 2018

− Processing Hardware and Software for AI 2018 – Vol. 1 & 2

− Integrated Passive Devices (IPD) 2018


− RF Front-End SiP

− Fan-Out Packaging *


− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

MANUFACTURING


− Wafer Starts for More Than Moore Applications

− Equipment for More than Moore: Technology & Market Trends for Lithography &

Bonding/Debonding 2018

− Equipment for More than Moore: Technology & Market Trends for Thin Film Deposition & Etching 2018

− Polymeric Materials for wafer-level Advanced Packaging 2018


− Wafer Bonding Technology Overview 2018

MEMORY


− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing 2018 (NAND & DRAM)


− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018


− 3D Non-Volatile Memories – Patent Landscape Analysis

COMPOUND SEMICONDUCTORS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− Power SiC 2018: Materials, Devices, and Applications - Update

− Power GaN 2018: Materials, Devices, and Applications – Update

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –Update

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018


− Power SiC Devices

− Power GaN Devices


− Power SiC – Patent Landscape Analysis

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (3/3)

POWER ELECTRONICS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 - Update

− Power Modules Packaging 2018 - Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for EV/HEV 2018 - Update

− Wireless Charging Market Expectations and Technology Trends 2018

− Integrated Passive Devices (IPD) 2018


− Power ICs Market 2018 – Update


− Power ICs Market 2018*

− Power Modules*

BATTERY AND ENERGY MANAGEMENT


− Solid State Electrolyte Battery 2018

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 -

Update


− Solid-State Batteries – Patent Landscape Analysis

− Status of the Battery IP – Patent Watch 2018 & Patent Activity 2017

SOLID STATE LIGHTING


− IR LEDs and Lasers 2018: Technology, Industry and Market Trends - Update

− Automotive Lighting 2018: Technology, Industry and Market Trends - Update

− UV LEDs 2018: Technology, Industry and Market Trends - Update

− VCSELs 2018: Technology, Industry and Market Trends

− LiFi 2018: Technology, Industry and Market Trends


− VCSELs 2018

− UV LEDs 2018 *

DISPLAYS


− MicroLED Displays 2018 – Update

− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update

− Displays and Optical Vision Systems for AR / VR / MR 2018


− MicroLED Display – Patent Landscape Analysis

MEDTECH


− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical

Applications 2018 - Update

− Point-of-Need Testing: Application of Microfluidic Technologies - Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Ultrasound technologies for Medical, Industrial and Consumer 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy 2018: From Isolation to Downstream Applications

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation Laboratory Markets 2018*


− Microfluidic IC Cooling – Patent Landscape Analysis

− Circulating Tumor Cell Isolation – Patent Landscape Analysis

− Organ-on-a-Chip – Patent Landscape Analysis

− OCT Medical Imaging – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS


− Status of the MEMS Industry 2017

− High End Inertial Systems Market and Technology 2017

− Magnetic Sensors Market and Technologies 2017

− MEMS and Sensors for Automotive - Market and Technology Trends 2017

− Acoustic MEMS and Audio Solutions 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

o REVERSE COSTING REPORT – by System Plus Consulting

− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –Reverse Costing Report

− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report

− MEMS Packaging 2017 - Reverse Costing Review

− Bosch BMP380 Pressure Sensor – Reverse Costing Report

IMAGING & PHOTONICS


− Status of the CMOS Image Sensor Industry 2017

− 3D Imaging and Sensing 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Camera Module Industry Market and Technology Trends 2017


− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse

Costing Report

− Camera Module Physical Analyses Overview 2017

RF DEVICES AND TECHNOLOGIES


− RF Front End Modules and Components for Cellphones 2017

− Advanced RF System-in-Package for Cell Phones 2017

− 5G Impact on RF Front-End Industry 2017

ADVANCED PACKAGING


− Status of the Advanced Packaging Industry 2017

− Embedded Die Packaging: Technology and Market Trends 2017

− Fan-Out: Technologies and Market trends 2017

− Advanced Substrates Overview: From IC Package to Board 2017

− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

− Advanced RF System-in-Package for Cellphones 2017

− Memory Packaging Market and Technology Report 2017

− MEMS Packaging 2017

− Emerging Non-Volatile Memory 2017


− NVIDIA Tesla P100 - Reverse Costing Report

− MEMS Packaging - Reverse Technology Review

− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review

SOFTWARE


− Embedded Software in Vision Systems

MEDTECH


− Status of the Microfluidics Industry 2017

− Solid-State Medical Imaging 2017

− Organs-On-Chips 2017

− Connected Medical Devices Market and Business Models 2017

− Artificial Organ Technology and Market analysis 2017

− Medical Robotics Technology & Market Analysis 2017

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (2/3)

MANUFACTURING


− Laser Technologies for Semiconductor Manufacturing 2017

− Equipment and Materials for 3D TSV Applications 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

BATTERIES & ENERGY MANAGEMENT


− Status of the Rechargeable Li-ion Battery Industry

− Market Opportunities for Thermal Management Components in Smartphones

DISPLAYS


− MicroLED Displays

− Quantum Dots and Wide Color Gamut Display Technologies

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

SOLID STATE LIGHTING


− LED Packaging 2017: Market, Technology and Industry Landscape

− CSP LED Lighting Modules

− IR LEDS and VCSELs - Technology, Applications and Industry Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− Automotive Lighting: Technology, Industry and Market Trends 2017

− Horticultural LED Lighting: Market, Industry, and Technology Trends

POWER ELECTRONICS


− Status of the Power Electronics Industry 2017

− Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017

− Gate Driver Market and Technology Trends 2017

− Power MOSFET 2017: Market and Technology Trends

− Power Module Packaging: Material Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017


− Power Management ICs Market 2017


− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report

− Silicon Capacitor - Technology and Cost Review

− Industrial 100V MOSFET - Technology and Cost Review

− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor

Combo – Reverse Costing Report

COMPOUND SEMICONDUCTORS


− Bulk GaN Substrate Market 2017

− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS

− Power SiC 2017: Materials, Devices, Modules, and Applications

− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

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are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person.Events

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increasing your brand/product

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Targeted audience

involvement equals clear,

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Webcasts are a smart,

innovative way of

communicating to a wider

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Benefit from the i-Micronews.com

traffic generated by the 11,200+

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Several key events planned for

2018 on different topics to

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Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager

http://www.yole.fr/

http://www.yole.fr/

mailto:[email protected]


CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: [email protected] – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: [email protected] – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (Korea, Singapore, India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan)

Email: [email protected] - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development


• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnershipwith Woodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development


o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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FromTechnologies to Market - US 3DS OUTSCALE · • Growth,pressure range,type of sensor used • Market forecast by type of sensors • Competitive landscape p 46 • MEMS ranking