Thin-Film Integrated Passives Devices - US 3DS OUTSCALE...Consumer market segment is the key domain application for IPD devices Low volume Gaming Devices / Stations Industrial & home

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From Technologies to Markets

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Thin-Film Integrated

Passives Devices

Publication date: February 2018

Biographies & contacts

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Mattin GRAO TXAPARTEGI, Technology & Market Analyst, Power Electronics

Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is in charge of inverter architecture evolutions and passivecomponents (from capacitors to protection devices). Previously, he worked as an intern at the French car maker Renault, designing power convertersfor electric car chargers. He graduated from Grenoble INP with an Engineering degree in Electrical Systems, followed by a specialization in embeddedsystems for transportation. He then earned an advanced master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time,he oversaw managerial, financial, and marketing fields within the aeronautics industry.

Contact: [email protected]

Amandine PIZZAGALLI, Market & Technology Analyst, Equipment and Materials Manufacturing

Amandine Pizzagalli oversees the equipment and materials fields for the Advanced Packaging and Manufacturing team at Yole Développement. She graduatedwith a degree in Electronics Engineering, specializing in semiconductors and nanoelectronic technologies. Before joining Yole, Amandine worked for AirLiquide with an emphasis on CVD and ALD processes for semiconductor applications.


Jérôme Azémar, Senior Market & Technology Analyst, Advanced Packaging

Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team of Yole Développement. As a technology and market analyst since 2013, Jérôme

provided numerous market research and strategy analysis on Power Electronics, Advanced Packaging and Semiconductor Manufacturing and he performed several

presentations, keynotes and market briefings in semiconductors conferences. Upon graduating from INSA Toulouse with a Master’s in Microelectronics and Applied Physics,

he joined ASML and worked in Veldhoven for three years as an Application Support Engineer, specializing in immersion scanners. During this time, he acquired

photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. Whilst with ST, he developed new processes, co-authored

an international publication and worked on metrology structures embedded on reticules, before joining Yole Développement in 2013.


Thin-Film Integrated Passives Devices

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COMPANIES CITED IN THE REPORT

3D Glass solutions, Amkor, ASE, AVX/ATC, Broadcom/Avago, CEA-LETI, Crocus Technology, Fraunhofer-IISB institute, Fraunhofer-IZM institute, Georgia Institute of Technology, IMEC, Infineon, Qualcomm/TDK Epcos, Ibiden, Johanson

Technology, Maxim Integrated, Murata/Ipdia, NXP, Onchip devices, ON Semiconductor, Qorvo, Shinko, STATS ChipPAC, STMicroelectronics, Skyworks, Texas Instrument, TSMC, Unimicron, Wavenics, Vishay, and more…

(non-exhaustive list)


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REPORT OBJECTIVES

• This report - Yole’s third research update for the IPD market in the field of semiconductor applications - provides an understanding ofapplications, technology trends, and market forecasts, by market segment

• This report’s objectives are to:• Provide detailed information regarding IPD applicability

• Detailed analysis of the major applications using IPD today, and potential applications that could use IPD substrate

• IPD roadmap, by application

• Review the current status of IPD adoption on the market

• Deliver an overview of IPD manufacturing’s technological trends (substrate type, material type)

• Understand IPD key benefits and added value

• How does IPD differ from the other alternative technologies?

• Understand the remaining challenges for IPD implementation

• Offer market metrics at IPD market level for ESD/EMI, RF, and digital/mixed signal applications (2016 - 2022)

• Evaluate market developments in terms of market size (volume, value) and substrate sizes/formats

• Overall 2017 IPD market share -– breakdown by substrate type

• 2017 IPD market share by substrate type, for RF IPD, ESD/EMI IPD, and Digital mixed signal IPD

• Explore the competitive landscape and identify key IPD players in technology development and manufacturing

• Give an overview of who is doing what, and each market’s specificities

• Market share of the key 2017 IPD manufacturers: pure IPD manufacturers: OSATs, IDMs, and foundries and their market share

• Furnish an overview of the technologies available for IPD structuration, and their challenges

• Technology process, specification, supply chain, and value chain

• This report does not cover the following applications where IPD are applied or could be applied:• Thick-film IPD (based on LTCC ceramic substrate)

• IC IPDs

• RF CMOS


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TABLE OF CONTENT

• Introduction, definitions & methodology 6

• Objectives of the report

• Who should be interested in this report?

• Companies cited in this report

• Definitions, limitations & methodology

• Glossary

• Executive summary 18

• IPD market segment 57

• IPD segmentation: RF IPD, ESD/EMI IPD, digital mixed signal IPD

• IPD attributes vs applications requirements

• IPD market segment

• IPD drivers

• IPD technologies manufacturing_____________________71

• IPD technology requirements & options

• Inductors (multilayer planar inductors, 3D inductors…)

• Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)

• IPD substrate type _103

• Substrate type for IPD manufacturing

• IPD market share – breakdown by substrate type

• IPD devices market forecast 114

• In $M, in wafer eq. with attached growth rates

• Volume shipments for each IPD by application (ESD/EMI, RF IPD,

Digital mixed signal)

• IPD shipments by substrate type (Silicon, Glass, GaAs, SOI…)

• IPD shipments by wafer size (6” / 8” / 12”)

• IPD players and manufacturers suppliers 126

• 2017 IPD player market shares and revenues

• Overall player market shares based on 2017 IPD revenues

• Supply chain 136

• Conclusions________________________________________142

• Appendix

• IPD definition

• IPD integration/packaging platforms

• IPD players (example of IPD products for each player)


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REPORT METHODOLOGY

Technology analysis methodology Information collection


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REPORT METHODOLOGY

Market forecast methodology


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SCOPE OF THE REPORT

Thick film IPD

Rigid

organic

IPD platforms

IPD technologies

Scope of the Report

Thin film IPD

SOCSystem on Chip

technology

Advanced substrate technology (Fan-

Out WLP)

flex

Ceramic LTCC Plastic

laminate

Silicon Glass GaAs SOI Alumina RF CMOS

Traditional substrates

Organic


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IPD - BENEFITS AND DRIVERS

IPD added value

Time to Market

Functionalities/

system integration

Performance

Thin-film

IPD driversMiniaturization

Cost-effective solution

• High reliability

• Stable electrical performance

• Better tolerance/precision

• Footprint reduction of the

electronic system

• Low profile and 3D integration

• Low weight

• High-density routing capabilitiesManufacturing cost reduction due to

minimizing passive device placement time

Making a system-in-package (SiP) with

IPD takes less time than making a new

system-on-chip (SoC)

Ascend the value chain by

seizing more system value

Flexibility

• Design flexibility (tunable values and

component characteristics)

• Flexible assembly and integration


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ESD + EMI

ESD + MCF (multi component filtering)

ESD + TVS

EMI filtering alone

ESD alone

Thin film IPD applications

ESD/EMI protection Digital & mixed signal RF devices

IPD DEVICES APPLICATIONS

What are the final applications where IPDs are used?

Matching

Filtering

Baluns

Diplexers

Couplers

Pull-ups / Pull-downs

Decoupling,

tank and blocking

capacitors

Analog filtering

Capacitors, resistors, inductorsCapacitors, resistors, inductors +

diodes zenerThin-Film Integrated Passives Devices

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IPD TYPE - MARKET SEGMENT BY FUNCTION

IPD type - Segmentation by electronic function

• 3 key IPD categories of applications have been identified depending on their electronic functions they canprovide

RF IPD

(or hyper, microwave) passive devices

• Matching, filtering, RF decoupling, RF ESD protection

• Integration of R, L, C, baluns, diplexers, waveguides,…

ESD/EMI protection

(ESD/EMI IPD)

• ESD protection, transient voltage suppression (TVS), and signal conditioning

• Integration of Zener diodes, R, L, C

• Submounts with embedded Zener diodes for High Brightness LED’s

Digital and mixed-signal passive devices

(logic and mixed signal IPD)

• Pull-ups, pull-downs for circuit versioning, power decoupling, tank and blocking capacitors, analog filtering, DC/DC conversion…

• Combinations of R,L,C, resistor and capacitor networks, discrete Thin-Film devices, silicon capacitors

• Digital interposers (MCU,CPU, GPU, FPGA)


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ImportantPrimary attribute: very important

IPD ATTRIBUTES VS APPLICATION REQUIREMENT

RF IPD(or hyper, microwave) passive devices

ESD/EMI IPD(ESD/EMI protection)

Digital & mixed signal

IPD

Miniaturization

Density integration

Tolerance/Accuracy

Functionalities/ System

integration

Cost effective

Time to market

Technology

Drivers

1 2 Less critical3 4 Not very important

1

3

1

2

3

1

4

4

2

3

1

3


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IPD APPLICATIONS

Where are IPDs used?

Understand in what

applications IPDs

are used…

And where they

are emerging


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IPD AT A GLANCE: APPLICATION MARKETS

Type of markets segment integrating IPD devices by integrated systems (end-products)

Digital and mixed signal IPD ESD/EMI IPDRF IPD

Consumer

Industrial / Scientific / Medical (ISM)

Network & server equipment

Buildings & homes utilities equipment

Automotive Automotive

Defense & aerospace


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Mobile Phones

Notebook & tablets

High volumes

Network & server

equipment

WHERE DO WE FIND IPD DEVICES

Highest market volume integrating IPD devices

Consumer

market

segment is the

key domain

application for

IPD devices

Low volume

Gaming Devices / Stations

Industrial & home

networking

Military &

aerospace

Medical &

life ScienceTransportation

(automotive)

IPD devices

> 2B units

< 1M units


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MORE SLIDES EXTRACTS

IPD technology overview

IPD technology

overview


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THIN-FILM IPD DEVICES SUBSTRATE TYPE

Substrate type for IPD manufacturing

• There are numerous potential substrate type that could be used for IPD manufacturing

Six type of substrates canbe used for IPD manufacturing

IPD substrate type

Sapphire

SiliconHigh resistivity

Glass GaAs

Alumina wafer

SOI


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Which substrates are used by which company?

Information about the substrate types used by each

IPD market


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IPD MARKET FORECAST- BREAKDOWN BY IPD TECHNOLOGY

Breakdown per application

The overall IPD

market is

mostly driven

by the ESD/EMI

IPDs market

which stands

for more than

60% of the total

IPD market

ESD/EMI IPDs

RF IPDs

Mixed Signal IPD market

Silicon (Si)

Si Glass GaAs

AluminaSOI

Si


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IPD markets: Market forecasts 2016-2022

IPD forecasts by market segments,

substrates and applications

As well as market shares

by market


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2017 IPD VOLUME – BREAKDOWN BY SUBSTRATE TYPE

IPD volume split by substrate type

Siliconsubstrate isthe main IPD substratetechnologyin 2017, withmore than80% marketshare


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Supply chain: Key IPD manufacturers' positioning, by IPD application area

Explanations of how Yole sees the different business models

related to IPDs

Reasons why some business models

works better than other


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Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.

The thin-film IPD process offers finer pitch feature, better tolerance control, higher flexibility, and packages possessing higher integration than other commonly available technologies, i.e. PCB and low temperature co-fired ceramic (LTCC) technologies. These aspects explain IPD’s expansion over the last years, and its promising continued growth.

Today, electrostatic discharge (ESD) and electromagnetic interference (EMI) protection are IPD’s primary applications, but RF front-end modules requiring IPD baluns, diplexers, matching, etc. are fast-increasing too. Currently, consumer applications (especially smartphones) are the big consumers of IPDs in RF front-end modules, or for ESD/EMI protection. Miniaturization, low cost, and high-value precision are the added-values IPDs bring to these applications. Planar structure capacitors, inductors, and resistors are built

using thin-film deposition technologies with high-performance results. A wide variety of dielectric and resistive materials are proposed by a large number of companies, depending on the desired performance of the IPD.

3D structure technologies have also been available for a couple of years now, especially for achieving excellent capacitance density values in silicon-trench capacitors. This new technology has opened new business opportunities for IPDs in other applicative markets, as was demonstrated with the iPhone 7 and its A10 processor, which integrates several silicon-trench capacitors under the microprocessor’s bumps. In the digital & mixed signal market, integration density and miniaturization are the priorities - therefore conventional planar technologies can’t be used since the capacitance densities are currently far from what’s required.

In this report, Yole Développement explains each application’s different requirements, and the IPD technologies being used to answer increasing demand.

THIN-FILM INTEGRATED PASSIVE DEVICESMarket & Technology report - January 2018

DRIVEN BY MINIATURIZATION, HIGHER PERFORMANCE, AND LOWER COST, IPD DEVICES OFFER GREAT OPPORTUNITIES IN THE SMARTPHONE MARKET

Driven by application diversification, IPDs (integrated passive devices) continue their promising growth.

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Overview of the IPD device

market, segmented by IPD type and application

• Update of our 2016 - 2022 IPD market forecast, segmented by application: RF IPD, ESD/EMI IPD, and digital mixed signal IPD

• Overview of the substrate type used for thin-film IPD, segmented by IPD application

• Update of key 2017 IPD manufacturers’ market share, by IPD type

• Overall IPD market share - breakdown by substrate type

• Analysis of 2017 IPD market share, by substrate type for each IPD application: RF IPD, ESD/EMI IPD, and digital mixed signal IPD

• Update of our 2016 - 2022 IPD market forecast, by substrate type and wafer size

• Key technical insights into IPD technology trends and challenges

• Overview and status of the IPD technologies applied today for each key application

• In-depth analysis of the different market segments using RF IPD, ESD/EMI IPD, and digital mixed signal IPD

• Comprehensive overview of the competitive landscape and market share for all main laser equipment manufacturers involved in the semiconductor industry

• Important technical insights and a detailed analysis of IPD solutions/trends/requirements/challenges, by application

• IPD roadmap for new technology adoption

ESD + EMI

ESD + MCF

ESD + TVS

EMI filtering alone

ESD alone

Thin film IPD applications

ESD/EMI protection

Digital & mixed signal RF devices

Matching

Filtering

Baluns

Diplexers

Couplers

Pull-ups / Pull-downs

Decoupling, tank and blocking capacitors

Analog filtering

Capacitors, resistors, inductors Capacitors, resistors, inductors + diodes zener

ESD: Electrostatic Discharge EMI: Electromagnetic Interference TVS: Transient Voltage Suppresor MCF: Multi Component Filtering

(Yole Développement, January 2018)

Thin film IPD application overview

THIN-FILM INTEGRATED PASSIVE DEVICES

DIFFERENT BUSINESS MODELS AND DIFFERENT EXPECTATIONS FOR A COMPLEX SUPPLY CHAIN

As mentioned earlier, IPDs have a variety of applications and high potential in numerous areas. This, combined with large range of solutions, creates a diversified supply chain - depending on the end-application targeted. This diversity is actually even more complex considering the different types of manufacturers and their business models: pure players, OSATs, IDMs, foundries, etc. Many producer types can be involved in IPDs but with different resources and objectives.

IDMs/foundries use IPDs as options to complete their offers and make them more appealing for customers.

The focus is not to make a pure business of IPD, but to use it as an added-value for their products. The most illustrative example is TSMC promoting its decoupling capacitors to save more space and increase efficiency in Apple’s processors – a solution that has opened the door for IPD in large volumes for advanced applications.

OSATs have a similar approach in terms of priority and promotion, but with different integration capabilities. Most OSATs have IPD offers in their portfolio and implement them upon customer request. Their solutions are either more standardized IPDs, or supplied from pure players to integrate them in packages afterwards.

Pure players like IPDiA (now part of Murata) are, by definition, pushing for the spread of IPD solutions. These solutions must convince customers that they are vital for implementing passives in their integration. In order for this to happen, IPDs must be seen either as an easily-outsourceable commodity or as a differentiator justifying new supplies. In both cases strong development is required, which pure players are pushing for.

This report analyzes the different business models, rationales for IPD manufacturing, and expectations for this market according to various offers.

In 2017 the overall IPD market generated a revenue exceeding $750M, and is expected to peak at more than $1B by 2022. As of 2017, this market is driven mostly by the ESD/EMI IPDs market, which represents more than 60% of the total IPD market, followed by RF IPD. Mixed signal IPD did not represent a significant volume and is still an emerging IPD market.

Although it is difficult to predict the success of digital mixed signal IPD, we see a small penetration rate (driven mainly by decoupling applications) in smartphone processors, where miniaturization is a key driver. Moreover, a few medical applications also

require decoupling capacitors in IPD format, where again miniaturization and high capacitance density are essential.

In terms of substrate material, although silicon remains the only mainstream solution for ESD/EMI IPD and digital mixed signal (presently 100% in these IPD commercial devices), there are a wide variety of substrates available for RF IPD manufacturing. Indeed, advanced requirements such as substrate loss are considered for RF applications. Also, due to the limitation in terms of insertion loss as well as dielectric loss for silicon, various alternative substrates such as glass and GaAs are being integrated into some RF IPD products manufactured by STMicroelectronics, Murata, Qorvo, and others.

Glass is an appealing choice for high-frequency applications requiring low dielectric loss and low insertion loss. Meanwhile, GaAs is especially advantageous for its smaller size and higher performance in terms of linearity and noise characteristics, especially at high frequencies. Consequently, we expect these substrates to take market share in the RF IPD market.

This report offers a comprehensive overview of the substrates used in each IPD manufacturing process, a detailed analysis of technology trends, and a market forecast by IPD application type. Moreover, an IPD market forecast split by wafer size and substrate type has been calculated for the 2016 - 2022 timeframe.

IPD forecasts : breakdown by technology type - 2017


Si

Si Glass GaAs

Alumina SOI

Si

Total IPD revenue > $750M

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2016 2017 2018 2019 2020 2021 2022

in t

erm

s of

rev

enue

Mixed Signal IPD market RF IPDs ESD/EMI IPDs

IPD passives devices supply chain


ESD/EMI protection RF IPD Digital & Mixed signal

Pure IPD manufacturers

IDMs & foundries

Substrate & packaging

OSATs

R&D institutes

DESPITE SILICON’S DOMINATION IN THE IPD MARKET, ALTERNATIVE SUBSTRATES ARE DISRUPTING THE RF IPD MARKET

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)3D Glass Solutions, Amkor, ASE, AVX/ATC, Broadcom/Avago, CEA-LETI, Crocus Technology, Fraunhofer-IISB Institute, Fraunhofer-IZM Institute, Georgia Institute of Technology, IMEC, Infineon, Qualcomm/TDK Epcos, Ibiden, Johanson Technology, Maxim Integrated, Murata/Ipdia, NXP, Onchip Devices, ON Semiconductor, Qorvo, Shinko, STATSChipPAC, STMicroelectronics, Skyworks, Texas Instruments, TSMC, Unimicron, Wavenics, Vishay, and more...

AUTHORSAs an Senior Technology and Market analyst, Jérôme Azémar is member of the Advanced Packaging & Manufacturing team of Yole Développement (Yole). Jérôme is daily managing the production of technology & market reports as well as custom consulting projects. He also takes part in the business development of these activities. Upon graduating from INSA Toulouse (France) with a master’s in Microelectronics & Applied Physics, he joined ASML in the Netherlands and worked as Application Support Engineer for three years. Then he honed over a two-year stint as a Process Engineer at STMicroelectronics (France).

Introduction, definitions & methodology 6

> Report objectives > Who should be interested in this report?> Companies cited in this report> Definitions, limitations & methodology> Glossary

Executive summary 18

IPD market segment 57

> IPD segmentation: RF IPD, ESD/EMI IPD, digital mixed signal IPD

> IPD attributes vs. application requirements> IPD market segment> IPD drivers

IPD technologies manufacturing 71

> IPD technology requirements and options> Inductors (multilayer planar inductors, 3D inductors, etc.)> Capacitors (i.e. planar vs. trench geometries, SiO2 vs.

SiN vs. BST vs. PZT capacitors)

IPD substrate type 103

> Substrate type for IPD manufacturing> IPD market share - breakdown by substrate type

IPD devices - market forecast 114

> In $M and wafer eq., with attached growth rates > Volume shipments for each IPD, by application (ESD/

EMI, RF IPD, digital mixed signal)> IPD shipments, by substrate type (silicon, glass, GaAs, SOI) > IPD shipments, by wafer size (6” / 8” / 12”)

IPD players and manufacturers’ suppliers 126

> 2017 IPD player market share and revenue> Overall player market share based on 2017 IPD revenues

Supply chain 136Conclusions 142Appendix

> IPD definition> IPD integration/packaging platforms > IPD players (example of IPD products for each player)

Yole Développement presentation

TABLE OF CONTENTS (complete content on i-Micronews.com)

Mattin Grao Txapartegi is a Technology & Market Analyst, Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated to the evolution of inverters architecture and passive components. And today, he investigates power packaging to understand the latest technical challenges and market evolution. Previously he acquired a comprehensive expertise in the design of power converters for EV at Renault. As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation.

• TSMC Deep Trench Capacitor Land-Side Decoupling Capacitor in Apple’s A10 Application Processor

• Silicon Capacitor Technology and Cost Review• 5G’s Impact on the RF Front-End Industry• Glass Substrate Manufacturing in the

Semiconductor Field

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RELATED REPORTS

OBJECTIVES OF THE REPORT• Provide detailed information regarding IPD devices’ applicability • Detailed analysis of the major applications using IPD today, and potential applications that could require

an IPD substrate • Offer an IPD device application roadmap • Discuss the current status of IPD adoption in the market• Present an overview of IPD manufacturing’s technological trends (substrate type, material type) • Understand IPD devices’ key benefits and added-value • Review the remaining challenges for IPD device implementation • Provide market metrics at IPD market level for ESD/EMI, RF, and digital/mixed signal applications (2016 - 2022)• Evaluate market developments in terms of market size (volume, value) and substrate sizes/formats• Reveal a competitive landscape and identify key IPD players in technology development and manufacturing• Analyze technology process, specification, supply chain, and value chain

Amandine Pizzagalli is a Technology & Market Analyst at Yole Développement (Yole). Amandine is part of the development of the Advanced Packaging & Semiconductor Manufacturing Business Unit with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on equipment, materials and manufacturing processes. Amandine is graduated in Electronics from CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and has a master focused on Semiconductor Manufacturing Technology, from KTH Royal Institute of Technology (Sweden).

WHAT’S NEW• Status of the IPD industry, and evolution since 2012• Update of our 2016 - 2022 IPD market forecast for RF IPD, ESD/EMI, and digital mixed signal IPD • Update and market share for key 2017 IPD manufacturers: pure IPD manufacturers, OSATs,

IDMs, and foundries• New analysis based on the competitive landscape and market share of IPD manufacturers, by

IPD applications covered in this report (RF, ESD/EMI, digital mixed signal)• Overall IPD market share - breakdown by substrate type• New analysis of 2017 IPD market share by substrate type, for RF IPD, ESD/EMI IPD, and digital

mixed signal IPD• Key technical insights and detailed analysis of IPD solutions, trends, requirements, and

challenges - by application

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr

MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com

REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports

CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])

© 2018

Yole Développement

FromTechnologies to Market

Source: Wikimedia Commons

http://www.yole.fr/

http://www.yole.fr/

2©2018 | www.yole.fr | About Yole Développement

FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS

MEMS & Sensors

Solid State Lighting(LED, OLED, …)

Compound Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries / Energy Management

Power Electronics

Displays

RF

Devices &

Techno.

Advanced

Substrates

Software

http://www.yole.fr/

http://www.yole.fr/


3 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization of

innovative optical systems

• Financial services (due diligence,

M&A with our partner)

www.yole.fr

o Reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

http://www.yole.fr/

http://www.yole.fr/

http://www.yole.fr/

http://www.yole.fr/

https://www.i-micronews.com/reports.html

https://www.i-micronews.com/reports.html

https://www.i-micronews.com/media-kit.html

https://www.i-micronews.com/media-kit.html


6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

http://www.yole.fr/

http://www.yole.fr/


OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

http://www.yole.fr/

http://www.yole.fr/


ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

http://www.yole.fr/

http://www.yole.fr/


SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators and

end-users

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

http://www.yole.fr/

http://www.yole.fr/


SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

http://www.yole.fr/

http://www.yole.fr/


o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


OUR 2018 REPORTS COLLECTION (1/3)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 - Update

− Silicon Photonics 2018 - Update

− Consumer Biometrics: Sensors & Software 2018 - Update

− MEMS Pressure Sensors 2018

− Air Quality Sensors 2018

− Sensors for AR/VR 2018

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− Gas & Particles Sensors

− MEMS Pressure Sensors

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

RF DEVICES AND TECHNOLOGIES


− RF Front End Module and Connectivity for Cellphones 2018 – Update

− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals

2018 - Update

− RF GaN 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Radar Technologies for Emerging Applications 2018 *

− Radar Technologies for Automotive 2018

− RF & Photonic Technologies for 5G Infrastructure 2018


− RF Front-End Modules in Smartphones

− RF GaN *


− RF Front End Module – Patent Landscape Analysis

− RF GaN – Patent Landscape Analysis

IMAGING & OPTOELECTRONICS


− Status of the CMOS Image Sensor Industry 2018 – Update

− Status of the Compact Camera Module Industry 2018 - Update

− 3D Imaging and Sensing 2018 - Update

− Imaging for Industry and Automation 2018

− Sensors for Robotic Vehicles 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− LiDARs 2018

o QUARTERLY UPDATE – by Yole Développement

− CMOS Image Sensors 2018 *


− CMOS Image Sensors

− Compact Camera Modules


− LiDAR – Patent Landscape Analysis

− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping

SOFTWARE


− Consumer Biometrics: Sensors & Software 2018 - Update

− Processing Hardware and Software for AI: Integration Challenges 2018

Update : 2017 version still available / *To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING


− Status of Advanced Packaging Industry 2018 - Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates

Like PCB Trends

− Fan-Out Packaging 2018 – Update

− 3D TSV and Monolithic Business Update 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Power Packaging Modules 2018 - Update

− Discrete Power Packaging 2018 – Update

− MEMS Packaging and Testing 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update

− Status of Panel Level Packaging 2018

− Trends in Automotive for Advanced Packaging 2018

− Processing Hardware and Software for AI: Integration Challenges 2018

− Integrated Passive Devices (IPD) 2018


− RF Front-End SiP

− Fan-Out Packaging *


− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

MANUFACTURING


− Manufacturing Wafer Starts for More than Moore 2018

− Equipment for More than Moore: Technology & Market Trends for Lithography &

Bonding/Debonding 2018

− Equipment for More than Moore: Technology & Market Trends for Thin Film

Deposition & Etching 2018


− Wafer Bonding Technology Overview 2018

MEMORY


− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update


− Memory Market 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement

− Memory Pricing 2018 (NAND & DRAM)


− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018

COMPOUND SEMICONDUCTORS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018 *

− Power SiC 2018: Materials, Devices, and Applications - Update

− Power GaN 2018: Materials, Devices, and Applications – Update

− RF GaN 2018 – Update

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018


− Power SiC Devices

− Power GaN Devices


− Power SiC – Patent Landscape Analysis

− Status of the GaN IP – Patent Landscape Analysis


http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (3/3)

POWER ELECTRONICS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 - Update

− Power Packaging Modules 2018 - Update

− Discrete Power Packaging 2018 - Update

− EV/HEV Market Expectations and Technology Trends - Update

− Wireless Charging Market Expectations and Technology Trends 2018

− Integrated Passive Devices (IPD) 2018


− Power ICs Market 2018 – Update


− Power ICs Market 2018 *

− Power Modules *

BATTERY AND ENERGY MANAGEMENT


− Status of Battery Industry Update with Focus on Manufacturing 2018 *

− Battery Pack Technology and Business Opportunities 2018 - Update


− Solid-State Batteries – Patent Landscape Analysis

SOLID STATE LIGHTING


− IR LEDs and Lasers 2018 - Update

− Automotive Lighting 2018 – Update

− UV LEDs 2018 - Update

− VCSELs 2018

− Lasers 2018

− Light Shaping Technologies 2018

− LiFi 2018


− VCSELs 2018

− UV LEDs 2018 *

DISPLAYS


− MicroLED Displays 2018 – Update

− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update

− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -

Update *

− Displays for AR / VR / MR 2018

− Non Display Applications of MicroLEDs 2018 *


− MicroLED Display – Patent Landscape Analysis

MEDTECH


− Status of the BioMEMS Industry 2018 - Update

− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update

− Neuro-Technologies for Healthcare and Consumer Applications 2018

− CRISPR Technology: From Lab to Industries 2018

− Portable Medical Imaging 2018

− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018

− Liquid Biopsy 2018: From Isolation to Downstream Applications

− Chinese Microfluidics Industry 2018


− Microfluidic IC Cooling – Patent Landscape Analysis

− Circulating Tumor Cell Isolation – Patent Landscape Analysis

− Organ-on-a-Chip – Patent Landscape Analysis


http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS


− Status of the MEMS Industry 2017

− High End Inertial Systems Market and Technology 2017

− Magnetic Sensors Market and Technologies 2017

− MEMS and Sensors for Automotive - Market and Technology Trends 2017

− Acoustic MEMS and Audio Solutions 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

o REVERSE COSTING REPORT – by System Plus Consulting

− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –

Reverse Costing Report

− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report

− MEMS Packaging 2017 - Reverse Costing Review

− Bosch BMP380 Pressure Sensor – Reverse Costing Report

IMAGING & PHOTONICS


− Status of the CMOS Image Sensor Industry 2017

− 3D Imaging and Sensing 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Camera Module Industry Market and Technology Trends 2017


− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse

Costing Report

− Camera Module Physical Analyses Overview 2017

RF DEVICES AND TECHNOLOGIES


− RF Front End Modules and Components for Cellphones 2017

− Advanced RF System-in-Package for Cell Phones 2017

− 5G Impact on RF Front-End Industry 2017

ADVANCED PACKAGING


− Status of the Advanced Packaging Industry 2017

− Embedded Die Packaging: Technology and Market Trends 2017

− Fan-Out: Technologies and Market trends 2017

− Advanced Substrates Overview: From IC Package to Board 2017

− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

− Advanced RF System-in-Package for Cellphones 2017

− Memory Packaging Market and Technology Report 2017

− MEMS Packaging 2017

− Emerging Non-Volatile Memory 2017


− NVIDIA Tesla P100 - Reverse Costing Report

− MEMS Packaging - Reverse Technology Review

− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review

SOFTWARE


− Embedded Software in Vision Systems

MEDTECH


− Status of the Microfluidics Industry 2017

− Solid-State Medical Imaging 2017

− Organs-On-Chips 2017

− Connected Medical Devices Market and Business Models 2017

− Artificial Organ Technology and Market analysis 2017

− Medical Robotics Technology & Market Analysis 2017

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (2/3)

MANUFACTURING


− Laser Technologies for Semiconductor Manufacturing 2017

− Equipment and Materials for 3D TSV Applications 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

BATTERIES & ENERGY MANAGEMENT


− Status of the Rechargeable Li-ion Battery Industry

− Market Opportunities for Thermal Management Components in Smartphones

DISPLAYS


− MicroLED Displays

− Quantum Dots and Wide Color Gamut Display Technologies

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

SOLID STATE LIGHTING


− LED Packaging 2017: Market, Technology and Industry Landscape

− CSP LED Lighting Modules

− IR LEDS and VCSELs - Technology, Applications and Industry Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− Automotive Lighting: Technology, Industry and Market Trends 2017

− Horticultural LED Lighting: Market, Industry, and Technology Trends

POWER ELECTRONICS


− Status of the Power Electronics Industry 2017

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Gate Driver Market and Technology Trends 2017

− Power MOSFET 2017: Market and Technology Trends

− Power Module Packaging: Material Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017


− Power Management ICs Market 2017


− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report

− Silicon Capacitor - Technology and Cost Review

− Industrial 100V MOSFET - Technology and Cost Review

− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor

Combo – Reverse Costing Report

COMPOUND SEMICONDUCTORS


− Bulk GaN Substrate Market 2017

− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS

− Power SiC 2017: Materials, Devices, Modules, and Applications

− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 11,200+

monthly unique visitors, the

10,500+ weekly readers of

@Micronew se-newsletter

Several key events planned for

2018 on different topics to

attract 120 attendees on average

Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager

http://www.yole.fr/

http://www.yole.fr/

mailto:[email protected]


CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

• Japan:

• Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account ManagerEmail: [email protected] - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)

• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80

o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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