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FP7 - ICT Work Programme 2009-10
3.1-3.2 Nanoelectronics
3.3 Microsystems & smart Miniaturised Systems
3.4 Flexible, organic & large area electronics
Warsaw 2009,Poland.
Dirk BeernaertHead of Unit – Nanoelectronics
Ex. Director at interim for ENIAC Joint Undertaking
Information Society & Media Directorate-General
European Commission
The European policy framework
“Lisbon”Strategy
(growth & jobs)
“Goteborg” SustainableDevelopment Strategy(quality of life &
well being)
R&D in a holistic and global contextIncreased international cooperation on RTD, impact and risk assessments, common
initiatives for sustainable growth (reduce CO2), Green IT, autonomous driving, safety, ….
Nanoelectronics & microsystems & large area electronics:
enabling and pervasive!
All elements have to work together to make it happen
- Research & Development & Innovation & Industrial Policy
- Legislation
- Lead Markets & Innovative Public Procurement
- Research + Education + Innovation (triangle of knowledge)
- Regional Policy
2
Presentations Outline
• Objective 3.1 Nanoelectronics technology
• Objective 3.2 Nanoelectronics design
• Objective 3.3 Flexible, organic & large area electronics
• Objective 3.9 Microsystems and Smart Miniaturised Systems
• Questions
Presentation Outline
• Introduction
• Motivation for the Objective
• Content of the Objective (details in WP)
• Expected Impact (see WP)
• Funding Schemes & Budget
3
General Introduction
Cooperation Programme - thematic areas (€ million)
Health
€ 6100
Food, agriclture,
and biotechnology
€ 1935
Information and
Communication
Technologies
€ 9050
Nanosciences,
Materials and new
Production
Technologies
€ 3475Energy
€ 2350
Environment
€ 1890
Security
€ 1400
Space
€ 1430
Socio-economic
sciences and
humanities
€ 623Transport
€ 4160
FP7 Cooperation Programme
ICT is the largest in the Cooperation
programme with € 9,05 billion (28%)
Joint Technology Initiatives & ERANET
International Co-operation… including
4
WP - ICT challenges
Europe should lead 3 major technology and socio-economic
transformations:
-Future internet
-Alternative paths to ICT components and systems
-ICT for sustainable development
The increasingly smaller, cheaper, more reliable and low consumption electronic components and systems taking into account the alternative paths to next generation technologies and building the basis for innovation in all major products and service.
Challenge 3:
Components, Systems, Engineering
www.artemis-office.org
www.eniac.eu
www.smart-systems-integration.org
www.photonics21.de
cordis.europa.eu/ims
JTI
JTI
5
Challenge 3: Components, Systems, Engineering
Objectives
– IST-2007.3.2: Design of semiconductor components and electronic-based miniaturised systems (25 M€)
– IST-2007.3.3: Flexible organic and large area electronics (60 M€) – IST-2007.3.4: Embedded systems design (28 M€)– IST-2007.3.6: Computing systems (25 M€)– IST-2007.3.8: Organic photonics and other disruptive photonics technologies (30 M€)
– IST-2007.3.1: Nanoelectronics technology (35 M€)– IST-2007.3.5: Engineering of networked monitoring and control systems (32 M€)
– IST-2007.3.7: Photonics (60 M€)– IST-2007.3.9: Microsystems and smart miniaturised systems (80 M€)
Call 4Nov 2008
Call 5July 2009
FP7 ICT WP 09-10: Nanoelectronics
• Two objectives
– IST-2007.3.1: Nanoelectronics technology (35 M€)
– IST-2007.3.2: Design of semiconductor components
and electronic-based miniaturised systems (25 M€)
Total FP7: 60 M€
6
Mo
ore
’s L
aw
: M
inia
turi
za
tio
n
Baselin
e C
MO
S:
CP
U, M
em
ory
, L
og
ic
130nm
90nm
65nm
45nm
32nm
22nm
Beyond CMOS
More than Moore: Diversification
Analog/RF Passives HV PowerSensors
ActuatorsBiochips
Information
Processing
Digital content
System-on-Chip
(SoC)
Interacting with people and environmentNon-digital content SoC & System-in-Package
(SiP)Combining SoC and SiP: Higher Value Systems
European Roadmap for Nanoelectronics
‘More
Moore’
‘More than
Moore’
Design
Automation
Equipment and
Materials, Manufacturing
He
tero
ge
ne
ou
s
Inte
gra
tio
n
Be
yo
nd
CM
OS
FP7(ICT-NMP)
WP 2007-2008WP 2009-2010
National /
regional
programmes
Joint Technology Initiative
Multi-Annual Strategic Plan
Annual Work Programme
Eureka
(Catrene)
White Book
Call1
Coordination
ENIAC Industry-driven long-term vision
5+ €bn
ENIAC SRAimplementation
7
FET FP 7 JTI Catrene Comp
Research Pole
Research
Council
Closer time to market
Closer to applications
Size of cooperation / EU level
Role of strategic alliances: global alliances, involvement of system houses,
involvement of material and equipment suppliers
Role of infrastructure: from research tools towards the fab is the lab
Converging technology: a lot of room at the interface, a new multi-disciplinary
game with new actors and new rules? System thinking from the beginning?
University driven / Institute driven - industry guided / industry driven & executed
Role of partnership
The funding landscape in Nanoelectronics Research
Framework Program 7
WP 2007-2008: Next-Generation Nanoelectronics Components & Electronics
Integration (call1 86 M€)
Smaller, higher performance, lower cost: “More Moore”Integration and diversification: Systems-on-Chip, Systems-in-PackageLong Term Future: Beyond CMOS
(Technology - Design - Manufacturing – Equipment)
WP 2009-2010: Nanoelectronics Technology and Manufacturing (call 5 – 35 M€)
WP 2009-2010: Design of semiconductor components and electronics based
miniaturised systems (call 4 – 25 M€)
8
Thematic Coverage Call 1
TechnologyRequested: 137 M€
Funded: 50 M€
37 %
DesignRequested: 108 M€
Funded: 9 M€
8 %
ManufacturingRequested: 28 M€
Funded: 5 M€
18 %
Equipm./Metrol.Requested: 79 M€
Funded: 12 M€
15 %
ModellingRequested: 17 M€
Funded: 5 M€
29 %
GenericRequested: 12 M€
Funded: 6 M€
50 %
Funded
Technology
58%
Modelling
5%
Manufacturing
6%
Equip/Metr
14%
Generic
7%Design
10%
0
10
20
30
40
50
60
70
80
90
100
Funded LB BT Funded LB BT Funded LB BT
Beyond CMOS More Moore More than Moore
M€Generic
Design
Equip/Metrol
Manufacturing
Modelling
Technology
Thematic overview call 1
9
FP7 ICT WP 09-10: Nanoelectronics
• Two objectives
– IST-2007.3.1: Nanoelectronics technology (35 M€)
– IST-2007.3.2: Design of semiconductor components
and electronic-based miniaturised systems (25 M€)
Total FP7: 60 M€
Motivation for the Objective 3.1
The continuous miniaturisation on
integrated electronic components has almost
reached the physical and technological
limits
• integration of a large number of less
known materials
• complex technological solutions
• increase of R&D and semiconductor
manufacturing costs
Industrial R&D in Europe is shifting
towards a product oriented approach by
adding extra functionalities to the basic
components
Combination of
miniaturisation and
functionalisation, ‘More
Moore’ and ‘More than
Moore’ devices into total
system solutions through the
process of monolithic and
heterogeneous integration
10
Motivation for the Objective 3.1
Challenges Manufacturing:
Keep manufacturing competency in Europe
Flexible manufacturing of customised products
• Reduce cycle time
• Enhance production quality and variability control
• Improve equipment productivity
• Reduce the environmental impact
• Support heterogeneous integration
• Foster advanced system integration and functionalized packaging
Objective 3.1: Nanoelectronics technology
Focus on:a) Miniaturisation and functionalisation
� Beyond CMOS domain
� Advanced aspects of the ‘More than Moore’ domain
� their integration and their interfacing with existing technologies
b) Manufacturing technologies
� Flexible manufacturing with a high product mix and joint equipment assessment
� prepare for more disruptive approaches
c) Support measures
11
a) Miniaturisation and functionalisation
� Beyond 22 nm devices, advanced components with lower
scaling factors including non-CMOS devices, and
� their integration and interfacing with very advanced CMOS
Activities with a high risk factor
Industrialisation perspective beyond 2014 and
having a generic development focus
Funding schemes:
STREPs
NoE
3.1 Nanoelectronics technology
Target outcome
b) Manufacturing technologies
• New semiconductor manufacturing approaches,
processes and tools for flexible manufacturing and
sustainable short cycle time manufacturing
• Joint assessments of novel process/metrology
equipment and materials and wafer integration
platforms
• Supporting 200/300mm wafer integration platforms
• Preparatory work for 450mm wafer processing
Funding schemes: STREPs, IP
3.1 Nanoelectronics technology
Target outcome
12
c) Support measures
• Roadmaps, benchmarks, selection criteria for the industrial use of ‘Beyond CMOS’
• Access to affordable silicon state-of-the-art technologies for prototyping and low volume and to design expertise and commercial tools
• Stimulation of interest of young people, training and education
• Linking of R&D strategies and stimulation of International Cooperation
• Support and coordination of preparatory work for 450 mm processing and equipment
Funding schemes:
CSA
Budget:
4.5 M€
3.1 Nanoelectronics technology
Target outcome
� Call 5
� Open: 31 July 2009
� Close: 3 November 2009
� Funding schemes:
a) Miniaturisation and functionalisation: STREPs and one NoE;
b) Manufacturing technologies: STREPs and at least one IP
c) Support measures: CSA
� Indicative budget distribution - 35 M€:
� IP/STREP 27.5 M€
� NoE 3 M€
� CSA 4.5 M€
3.1 Nanoelectronics technology
Summary
13
Motivation for the Objective 3.2
Existing Design Methods cannot keep pace with the new technology generations
which result in:
•Decreased component reliability & expected lifetime,•Increased process variability, EMC effects & power dissipation problems.
Existing Design Methods cannot keep pace with the ever increasing
component/system complexity which results in:
•Increased design costs and time to market,•Requirements for Heterogeneous integration and architectural innovation, •Increased power consumption,•Difficult system testing and verification. •Decreased system reliability
Motivation for the Objective 3.2
New Design Methods are needed to address the challenges
• Address the whole design process in an integrated way, from system architecture to component/system manufacturing and testing,
• Integrate in the design process, H/W & S/W, reliability, EMC, thermal effects, heterogeneous components,
• Design reliable complex systems / chips containing 100 Billions of unreliable and variable devices
• Handle packaging requirements and innovative architectures,
• Improve modelling and verifications at all levels.
14
3.2 Design of…
Target outcomes
a) Improved design platforms, interfaces, methods and tools
� to enhance design competences and productivity taking advantage
of the cooperation between system research, circuit design and
process development
� to enable the efficient realisation of very complex circuits from the
system architecture down to the transistor layer using deep
submicron technologies and heterogeneous integration of different
functions or different technologies in very compact systems and
subsystems including SoC and SiP
Funding schemes:
at least 1 IP
STREPs
Budget:
21.5 M€
b) Support Measures
� Bringing research results outside the consortia (dissemination, training and education), and access to supported project results, tools and methodologies
� Setting up of networked centres of excellence and a design infrastructure to validate research results & IP Blocks
� Stimulation of International Cooperation in particular with Russia and India
3.2 Design of…
Target outcomes
Funding schemes:
CSA
Budget:
3.5 M€
15
� Call 4
� Now Open (19 November 2008)
� Close: 1 April 2009 (at 17:00 Brussels time)
� Funding schemes:
a) Improved design platforms, interfaces, methods and tools: IP
and STREPs
b) Support measures: CSA
� Indicative budget distribution - 25 M€:
� IP/STREP 21.5 M€
� CSA 3.5 M€
3.2 Design of…
Summary
European research on the web:
http://cordis.europa.eu
http://ec.europa.eu/comm/research/future/
Information Society and Media:
http://ec.europa.eu/information_society/
http://cordis.europa.eu/ist/
http://cordis.europa.eu/ist/directorate g
http://cordis.europa.eu/ist/nano/
Contact:
Information Society and Media:
http://ec.europa.eu/information_society
http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html
European research on the web:
http://cordis.europa.eu
http://www.eniac.eu
Contact:
16
Flexible, Organic & Large Area Electronics
FP7 Call 4, Objective 3.3
FOLAE
17
What is FOLAE ?
An emerging field …combining(no priority order)
- Organic / Inorganic materials
- Low Temp processes
- Nano-structuring of materials / interfaces
- Flexible substrate capability
- Productive in-line processing
- Large (device / substrate) area manufacturing
- Efficient electron <- -> photon conversions
The prospects of FOLAE
….
Organic and Large Area Electronics has been predicted to reach in 2 decades a market size of the order of that of
silicon today
• New markets not competing withsilicon
• New manufacturing paradigms
• Building on traditional industries
• More energy-efficient manufacturing
• Less material waste
• High market growth potential
Ultimate prospect:From wafer batch processing to Roll-to-Roll electronics manufacturing
18
FOLAE in Europe
FP7 is a major step towards Flexible, Organic and Large Area Electronics
• FP7 ICT Call1 Obj. 3.2 was the first specific call for proposals on FOLAE
• After calls 1 & 2, 17 new R&D projectsin this field have been started, with a budget of around +/- 58 M€ in ICT
•Obj. 3.3 of Call 4 is a unique opportunity to X2 the FOLAE momentum in FP7 and, in combination with MS programmes, to reach critical mass in the area
(a) Devices and building blocks
IPs (min 50%) & Streps (min 30%)
(b) Flexible or foil-based systems
IPs (min 50%) & Streps (min 30%)
(c) Networks of Excellence
Call 4 Objective ICT-2009.3.3:
“Flexible, Organic and Large Area Electronics”
(d) Support measures
R&D
R&D
R&D coordination
Non R&D
54.5 M€
4 M€
1,5 M€
19
• Device concepts / manufacturing
Organic / Inorganic Materials on flexible or transparent
substrates
Process / Material co-development including interface
engineering
Large-area in-line compatible processes & Manufacturing
modes, small feature size
Issues: device architectures & performance, stability, yield,
modelling, process-tolerant design, characterisation,
reliability, environmental and recycling issues
(a) Devices and building blocks
Device demonstrators: • p/n TFTs, A/D blocks• power converters• memories• thin-film batteries • sensors• active RF
(b) Flexible or foil-based systems
• functional foil - / heterogeneous integration
- Addressing complexity of building blocks integration
- Flexible / Stretchable substrates, textile
- Interconnects with discrete devices and thinned ICs
Device demonstrators:• e-paper, Signage, e-card• RF-ID tags• Energy storage systems, OPV/ batteries• OLED based systems,• Chemical/Physical/bio sensors includingsignal processing
• Transparent electronics
20
(c) Networks of Excellence:
- Structuring and integrating of the research capacities
- Training and education
- Coordination of R&D,
- Promoting links between R&D institutions’ activities and Industrial needs
- Standardisation
(d) Support measures
- Promoting international collaboration
- Access to prototyping and design competences
- Coordination of national, regional and EU-wide R&D programmes
- Training and education for SMEs
(c) Networks of Excellence
(d) Support measures
4 M€
1.5 M€
ICT-2009.3.8: Organic photonics and other disruptive photonics technologies
• Organic, polymer, single molecule and carbon-nanotube based photonic components, including hybrid organic-inorganic components
(I) Organic photonics (STREP)
(II) Disruptive/cutting-edge photonic technologies and materials (STREP, NoE)
Objective ICT.2009-3.8
Call 4: 19 Nov´08-1 April´09Budget: 30 M€25 M€ (STREP)5 M€ NoE
• Effects at the limit of the light-matter interaction in nanophotonics
21
Objective 3.3 versus 3.8 a) ?
For OLEDs and PVs, the choice between submission to 3.3 or 3.8 depends on the «center of gravity» of the proposal:
- If the core is OLED/PV basic photonic device � 3.8 a)
- If the core is integration of OLED/PV functionalities in electronic systems and/or manufacturability � 3.3
Ex: OLED display, area sensor
Microsystems in the ICT Programme
Objective 3.9 : Microsystems and Smart Miniaturised Systems
22
MICROSYSTEMS = Integration of technologies and
functions
Nanoelectronics
Photonics
Microfluidics Biology
Micromechanics
MicrosystemsMaterials
Chemistry
Technologies:
Microsystems: At least 2 Technologies, 2 Functions (sensing-
actuating), and “Miniaturised”!
Functions:
Sensing, storing, processing, actuation, communication
Process
Communicate
InteractStore
Actuate Actuate
Sense
Close-loop
Microsystems get smart ����Smart systems
• Describe a situation, diagnose, and/or
• Predict, decide, help to decide, and/or
• Interact with the environment
• Smart (Miniaturised) System
Able to:
23
1. Multiple Research fields to combine
Mechanics, electronics, fluidics, biology, magnetism, photonics
2. Multiple Materials need to work side by side
Semiconductor, ceramic, glass, organic
3. Multiple Functions to integrate
Sensing, processing, logic, memory, communication
4. Multiple Integration technological options
�Heterogeneous integration
Monolithic, hybrid, multichip
Main Challenges for Microsystems and smart
miniaturised systems
Convergence and Integration – Some
examples
Lab-on-Chip
(OPTOLABCARD)
Neural Probe arrays
(NEUROPROBES)
Smart Fabrics (PROETEX)
GSM phone
Microrobotic surgery
(ARAKNES)
Photonic biosensor (NEMOSLAB)
Nanoelectronics
Photonics
Microfluidics
Biology
MicromechanicsChemistry
RF
24
(a) Heterogeneous Integration
(b) Autonomous energy efficient smart systems
(c) Application-specific Microsystems and Smart Miniaturised Systems
Biomedical
Telecommunicatio
ns
Environment
Food/Bevera
ge
Transport,
Safety and
Security Smart Fabrics,
Interactive
Textile
(d) Coordination and Support actions
ICT Objective ICT-2009.3.9:
“Microsystems and smart miniaturised systems”
(a) Heterogeneous Integration
Multiple core technologies and materials, integrated and interfaced:
Emphasis: - Innovative concepts of industrial relevance
Focus:
1. Heterogeneous technologies for more intelligence in microsystems:
- multi-sensing, processing, wireless communication, actuation
2. Address the “value chain” for more efficient manufacturing:
Materials, modeling, design, processes, packaging, characterisation, testing
3. Disruptive approaches for nanosensor-based microsystems
25
(b) Autonomous energy efficient smart systems
Objective:
Long-lasting autonomous operation
Challenges:
1. Energy:
Scavenging, storage and transmission
Power generation, accumulation and consumption
2. Communication:
Smart transceivers for wireless communication of sensor-based systems:
(reconfigurable, low power, adaptive, miniature…)
(c) Application-specific Microsystems (1/2)
1. Lab-on-chip platforms, from R&D to validation in
Drug discovery, diagnosis/therapy
emphasis: integration of sample preparation, flexibility to multiple-type assays
2. Microinstruments for cell manipulation and micro-injection
3. Microsystems interacting with the human body
- miniaturised active implants
- bio-robots and non-invasive microsystems
(monitoring, diagnosis and therapy)
Biomedical
Miniaturisation for multi-functional networked microsystems
1. Smart RFID
2. Ultra-low power transceivers
3. Reconfigurable antennaTelecommunicatio
ns
Note: Biosensors and microfluidic chips/components “as such” out of scope
26
(c) Application-specific Microsystems (2/2)
Environement
Food/Beverage Multi-sensing microsystems for:
• Environment (including water treatment)
• Food and beverages quality and safety
Emphasis: reliability and cost
Transport,
Safety and Security 1. Transport: Safety critical microsystems:
Emphasis: smart systems for the full electrical vehicle
2. Safety and Security: Sensors and actuators
Emphasis: networking capabilities, harsh environment
Smart Fabrics,
Interactive Textile
Multi-functional textiles and fabrics:
Seamless integration of functions:
sensing, actuating, communication, processing, power sourcing
- Integration of fibre-level components into textiles
- Stretchable and wearable electronics embedded in textiles
- Fully integrated Smart Fabric and Interactive Textile (SFIT)
(d) Coordination and Support actions
1. Techno-economic analysis
2. Dissemination and promotion actions, public awareness
3. Identification of international cooperation opportunities
4. Coordination between Technology providers and Users
(for in-vitro diagnostics and food/beverage quality)
27
Budget and “Instruments”
(a) Heterogeneous Integration
(b) Autonomous energy efficient smart systems
(c) Application-specific Microsystems
Biomedical
Telecommunications
Environement
Food/Beverage
Transport,
Safety and
Security Smart Fabrics,
Interactive
Textile
(d) Coordination and Support actions
Budget
77 M€
3 M€
“Instrument”
IP or STREP
STREP
IP or
STREP
CSA
• Directorate G:http://cordis.europa.eu/fp7/ict/programme/challenge3_en.html
• Challenge ICT-2007.3.3 & 3.9:
http://cordis.europa.eu/fp7/ict/organic-elec-visual-display/home_en.html
• Contact: [email protected]@ec.europa.eu
More information ?
28
Conclusion
Can Europe be competitive in nanoelectronics?
Yes WE can!!!!
We can all together do better?
Yes we can
- If Europe wants to survive, grow and take the lead in electronics (nanoelectronics, miniaturised smart systems & large area electronics.
- If Europe thinks this industry is necessary, strategic and need to be supported for Europe’s competitiveness and its social and environmental aims.
Then we can not wait and must support Research and Innovation with visionary, mid and long term oriented and economical and public appealing initiatives.
but
Equally this industry and its associations must take into account the whole ecosystems they are operating in incl. political environment, manufacturing aspects & represent all actors on European ground.
European Research PolicyEuropean Research Policy
There is light in the darkThere is light in the dark
Thank you for your attention.
29
3.1 Nanoelectronics technology
Expected Impact
� Strengthened competitiveness of the European nanoelectronics
industry
� Contribution to the competitiveness and the attractiveness of
Europe to investments
� New electronics applications of high economic and socio-
economic relevance
� Maintained European knowledge and skills,
� Increased critical mass of resources and knowledge,
� Contribution to preserving a critical mass of manufacturing
capacity in Europe
3.2 Design of…
Expected Impact
� Innovation in product architecture and increased efficiency in
product design with reduced costs & time to market (2013-2015)
� Capability in Europe to design in a reliable manner products that
use the most advanced IC manufacturing and integration processes
� Maintained leading position of Europe in product innovation and
design for major application fields.
� Use of new devices for new functionalities
30
• Reinforce leadership position of Europe in the creation of flexible or large area electronics tailored to meet key societal and economic needs
ICT-2009.3.3: Flexible, organic and large area electronics
• Expected impact
Objective ICT.2009-3.3“Flexible, organic and large area electronics”
Call 4: 19 Nov´08-1 April´09Budget: 60 M€54.5 M€ CP (STREP/IP) minimum 50% IP, minimum 30% STREP 4 M€ NoE, 1.5 M€ CSA
• Contribution to the evolution of traditional industries in the EU, such as printing and clothing industries, towards the e-media revolution
• Sustainable electronic device performance and manufacturing costs matching low capital investment requirements and new market opportunities
Extra Conclusion
Can Europe be competitive in nanoelectronics?
Yes WE can!
Can WE do better?
Of course WE can!
Can we make ENIAC a success?
Yes, altogether WE can.