Flex Manufacturing Concepts

7/31/2019 Flex Manufacturing Concepts

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Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 1 of 138

AGIAbbie Gregg, Inc.

Based on a Model

completed for the United

States DisplayConsortium (USDC)

Titled,

Flexible Microelectronics

and Roll-to-RollProcessing Study


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Lara York

AGI: VP Advanced Technology

BS Engineering United States Military Academy, West PointMS Systems Management USC

Co-Author : Roll to roll manufacturing of Flexible Displays


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Background:Critical Steps in Modeling of Factories for Cost

Reduction, Yield Improvement and Output forFlexible Displays and Electronics

The race is on to get new applications to market.

How do I insure time to market and a successfulproduct launch?

Presented by:Lara York, Vice President Advanced Technology

Images courtesy of E Ink, Citala, Aveso Displays, Estee Lauder


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Case Studies

Touch Screen-Digitizer Moving from sheet process in development to either tech

transfer to a production line OR outsource to remote foundry

Flexible Reflective Display Moving from small lab R&D to manufacturing in nearby factory

Flexible Battery Moving from medium scale sheet based production to high

volume, low cost production at several worldwide sites


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The Existing Lab Setup

Slow

Sheets

Manual

Image courtesy of Display Science


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Vision of the Roll to Roll Line

Clean

Automated

High Yield

Images courtesy of Northfield Automation and Creo, Inc.


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Baseline Existing/Proposed Processing

List each process (travelers are helpful) Dont skip even the most trivial step List off line support steps (premixing of inks, pre cut of laminated materials, etc. etc.)

List associated tools and equipment List process parameters

Pareto the most critical parameters for each step- work on top 3 Include

Observations of products- metrology tools and criteria

Environmental conditions Settings on equipment Expected defects and faults

List process times (set up, wait time, process) List materials Obtain cost data (equipment, materials, labor, overhead etc)


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Example of Process Detail Needed

Etch Process C- Lab process that needs to be scaled up:

Immersion in an etch solution Immersion in DI water baths Rinsing with DI water Drying in the oven Etch process details

Etchant: Hypochlorite solution 2. Temp = 25C3. Time= 45 sec We do this in our lab in a plastic bath 3 baths one after the other first bath 20 sec, second bath 20 sec, third bath 1 min (Do you know why?) Requires Shaking the film/bath in each stage (video the motions)

Observations:

The material swells in water and becomes sensitive to mechanical stress QC Test etched lines:

Resistance x : 300 Kohm 30 Kohm Resistance between lines: greater than 5Mohm


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Process Detail Needed for Lamination

Lamination Position the y substrate on a milimetric paper Clean with antistatic spray Laminate PSA to the y substrate using an antistatic gun and

a laminating roller at Pressure A +/- a, temperature B+/-b Remove PSA residue around the substrate y using a sharp

knife Position the film x to film y using positioning aid #1 Remove PSA liner and lamination of film x using antistatic

gun and lamination roller. Clean upper side of film with antistatic spray

Parameters Class 100 Clean Room (probably we can use 1000 but never

been tested).

Material type: Adhesives Research PSA1 Positioning aid #1 - Works for specific product dimensions.

Equipment Antistatic spray Laminating roller Antistatic gun Sharp knife Milimetric paper

Images courtesy of confidential clients


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Ask the People Who Inspect the Product

Inspectorssee morethan theyrecord

Identifyprocesses/tools andmaterials not

on thetraveler

Image courtesy of confidential client


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Capture All Visual Aids in Production

Crispdefinition offailing andpassing units.

Communicateto offshorefoundries withphotos.



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Notes on Product Dimensions R&D

Be sure tocapture valuesandengineering

commentsand anyengineeringevaluation

steps


Registration marks.


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Observe Two Different Operators,Especially Manual Tool Setups

Pilot for automation may reveal new variables

Operators may not support automation at first

Images courtesy of confidential client


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Baseline Existing Materials

Materials Control Know your vendors

Who supplies them? What percentage of their volume does your product represent? Now? In a year? Can they ramp fast? Does your product push the statistical control of their product specification? Do

the distribution of requirements overlap? Is there a guard band? Have a relationship with at least 2 suppliers for each critical material

Keep looking, dont give up

What new features in the materials would make your next steps easier?

How can you evaluate these NOW? Can you and are you identifying lots, batches of material? Do you understand how your suppliers manufacture and qualify their lots? How do you plan to qualify /trace materials in your line?

Risks of multiple simultaneous qualifications aremultiplicative if not exponential!

Mass markets tolerate few glitches in supply!



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Baseline Existing Processing

Device tolerances

Define critical parameters Establish a realistic tolerance for each

Add up cumulative tolerances - draw out and review any

cumulative mechanical tolerances Plan for iterative product design

Create guard bands for all critical tolerances and most secondarytolerances

Define tolerances for each tool/equipment

Verify that cumulative tolerances match: Deviceto equipment

Registration Registration Registration


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Make Alignment Keys with Metrology

1st Layer:Initial Pattern

2nd Layer:Perfect!

3rd Layer:Misaligned


Image enhanced to show misalignment.


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Printer Settings Variables

Know everysetting

Know tooling

parameters

Images courtesy of Litrex Corporation and confidential client


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Manufacturing Scale Up Plan

Sheet to roll transition THE BIG STEP Dont change too many things at once

Product size

Product complexity (minimum geometry, registration, number of layers)

Sheet size to roll size

Tool/equipment type

Process method

Facility conditions: temperature, relative humidity

Be sure your material handling and tool suppliers understand theproduct geometry and cleanliness required

Do a rigorous layout to be sure equipment and support equipment willfit and be accessible for maintenance.

Match rates throughout the system based on number of passes- usea mathematical model.


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Layout Space for Tools

Think aboutmaintainabilitywhen linkingseveral

processes in aroll to roll line

Maintenanceand Operator

Set Back

Image courtesy of PowerPaper / Graphic Solutions, Inc.


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Use Vertical Space Wisely Multi-level roll to roll lines

are common

Cleanliness andmaintenance need to beplanned



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Manufacturing Scale Up Plan Technology transfer goals and techniques:

Goal is timely start up and yielding product no later than 3rd lot/roll. No surprises regarding product performance in the field.

Capability to run 1 Million products per month. More than 10,000 square feetper week in first year.

Techniques:

Rigorous tool acceptance Bring materials and test plan to tool vendors

Source inspect

Test runs at vendor site

Compare foundry baselines to in house/lab process Short loop test all different steps

Develop metrology to verify product parameters

Simulate roll to roll process with sheets Use partially completed product staged Keep good product at 30% of process steps spread throughout process to pinpoint failure point:

1,2,3,4,5,6,7,8,9,10,11,12,13,14,15

Stage product at these steps.


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How factory and cost modeling can help Keep track of tools and equipment, and associated parameters

including thruput, depreciation and maintenance costs, and requiredpersonnel

Separate material handling from process costs, space and thruput

Keep track of recipes separately from tools to allow mix and matchscenarios and change in process flows

Keep track of material usage and cost- optimize device size andconfiguration to eliminate costly raw material waste

Be able to vary minor elements and see thruput, cycle time and yieldresponses

Obtain costs per square foot or cost per device Compare roll to roll and sheet based costs, space, headcount, tool sets.

Determine where wind/unwind stations should be located, based onthruput matching.


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Critical issues in materials supply

Waste in roll format vs. Sheet format

Slip sheet and protection materials used during

processing are critical in most roll to rollproducts. Can be costly

Can require additional equipment and process steps

Storage and preprocessing of materials Environmental control organic materials

Shelf life

Cross contamination


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Half meter wide web, scale up of sheet process,multiple lines.


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Waste From Roll to Roll Processing

Up to 50%waste ispossible

Need careful

productdesign,recycle ifpossible



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Capital equipment options for scale up -Timing,cost, and potential pitfalls

Sections of the process where roll to roll can beeffectively started:

Vacuum deposition- PVD

Screen printing

Laminating Punching

Picking and placing

Drying and curing

Process sections with critical alignment and

registration will be most difficult.


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Curing and Drying in Roll Format Oven

Engineered to havehigh degree ofcontrol and minimizespace



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Worldwide partnering strategies Find partners with core skills that you need Printers Makers of plastic film Converters Materials experts: fabric, paper, foils

Cleanliness and cleaning experts Test and measurement of electronic devices including test devicedesign

Develop a collaboration strategy for tool andmaterial vendors. Provide real materials to betested on tools under development.

License product with critical specs defined, butless than specific processes defined to capitalizeon partner ideas for processing.


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Creative Scale Up Approach

To make a million units per month, tool vendor developed a processbased on pick and place from lead frame and IC packaging industry,adapting flexible roll to roll materials from sheet based process

Images courtesy of Estee Lauder and PowerPaper / Graphic Solutions, Inc.

Power correcting patch fordeeper eye lines/wrinkles.

Product utilizes flexible battery.


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Intellectual property caveats

Process - Methods not understood

Materials -Beware the secret goo

Tests - Test patterns not developed



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Cost Reduction

Traditional printers are seeking new markets and have valuableequipment and process skills.

Seek capital equipment and materials suppliers from least costindustry.

Impact ofubiquitous RFID will be that roll to roll electronicproducts will develop low cost techniques - reducing 10x in next5 years.

Convergence with consumer applications and pricing such asclothing, skin patches, blankets, cell phones, books/ebooks.

RFID tag courtesy of Graphic Solutions, Inc.


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Technology ImprovementRecent Accomplishments

Web handling control and

alignment of patterns andlayers

Improved cameras and optics forin line data collection andimmediate response alignment ofweb

Improved web handlingmechanisms

Temperature and Humiditycontrolled environments

Image courtesy of (top) PowerPaper / Graphic Solutions, Inc., and Northfield Automation


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Technology ImprovementRecent Accomplishments that can be used in modeling

Sophisticated inks, fluids and gels with both electronicand physical properties Inks with electronic properties Gels with various methods of cure to seal temporarily,

permanently Viscosity control of inks and gels by temperature and RH

control

Substrates and surfaces with engineered properties tofacilitate product design or process.

Temperature hardened to minimize shrinkage Impregnated with Aluminum Oxides for translucency/opacity Polished surfaces to reduce defects Moisture barrier coatings Punched, laser drilled and formed surface cavities

Inlays for small semi flexible applications Credit cards with chip/display/battery/interconnect

Images courtesy of Aveso Displays


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Based on a Model

completed for the United

States DisplayConsortium (USDC)

Titled,

Flexible Microelectronics

and Roll-to-RollProcessing Study


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Technical Contributors

Dr. M. Robert Pinnel Chief Technical Officer , USDC Jeff Innocenzo Staff Research Engineer, DuPont Technologies

Charlie Lang Senior Research Associate, DuPont Displays

Dr. Michael Carmody Sr. Laboratory Head, Eastman Kodak Company

Janice Mahon - VP, Technology Commercialization, Universal Display Corporation

Stewart Hough VP, Business Development, Cambridge Display Technology

Paul Wickboldt VP, Equipment Engineering, FlexICs

Dr. Peter Slikkeveer Principal Scientist, Philips Research The Netherlands Emiel Lenders Group Manager, Philips Research The Netherlands

Malcolm Thompson, MJT Associates

Robert F. Praino, Jr. - VP Operations, Vitex Systems Inc.

Michelle Moore Associate Industrial Engineer, AGI

Mark Winter Process Engineer, AGI

Bernie Kaplan Senior Equipment Engineer, AGI


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Study Scope

The purpose of this study is to provide theUnited States Display Consortium (USDC)with the industrial design parameters

related to Roll-to-Roll processing of flexibledisplays and microelectronics.

Completed in Fall of 2003


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Study Task

Develop a cost and capacity model to determinethe following:

Individual Product Cost per Square Foot

Overall Factory Cost Estimates

Equipment Cost Labor Cost

Substrate and Outsourcing Costs

Approximate Cleanroom Space/Cost Required byClean Class


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Study Scope

Members of AGI and selected members of theUSDC team jointly developed the devicescenario and AGI researched the manufacturingmethods Active Matrix and/or Passive Matrix

Small Molecule OLED (OLED) and/or Polymer OLED (PLED)

Lamination Encapsulation and/or Masked DepositionEncapsulation

Substrate Material PET (1000 roll by 24)

Display 3.25 by 3.25


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Active Matrix versus Passive Matrix

Active Matrix TFT transistor to address each pixel

Less power since no external circuitry

Faster refresh rates

More difficult to manufacture

Better product lifetime

Passive Matrix Anode/ cathode strips at right angles, intersections

make-up pixels

Suffer from ghosting with fast refresh rates

Easier to make Shorter lifetimes

Images courtesy of Philips (top) and Citala

Example of Activebackplane (not LED)

Example of Passivebackplane (not LED)


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Active MatrixTop Gate Cross Section


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Active MatrixBottom Gate Cross Section


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Passive MatrixCross Section


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Process Flows - Active Matrix

Unwind, Conveyorized develop system w/rinse, drysystem for reel to reel transport, Inspect, WindDevelopDevelop, Rinse and dry with air knives215

Unwind, step and repeat exposure, WindExposure, Step and RepeatAlign and Expose210

Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry,WindRoll CoatClean, Coat & Cure205

Unwind, XeCl Pulsed Excimer Laser, WindLaser, Pulsed ExcimerPolySi Anneal200

Unwind, PECVD Deposit, WindPECVD DepositSilicon Nitride, Amorphous Polysilicon,

N+ dopant190

Unwind, Conveyorized DES system w/extra clean rinse,dry system for reel to reel transport, Inspect,

WindDevelop, Etch, Strip Line

Develop, Etch (Gate Metal),Strip thephotoresist then dry with air knives

with extra clean rinse180



Unwind, DC Magnetron Sputter, RewindSputter, DC MagnetronSputter Dep Gate 1 Metal150

Unwind, Microwave PECVD, RewindPECVD, MicrowaveVacuum Dep Dielectric Barrier Layer

and Cure140

Unwind, Punch, Aqueous Web Cleaner, Unpatternedinspect, WindClean, Aqueous WebWeb Punch and Clean130

StageStageStaging Area100

Tool ActionToolOperationStep


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Process Flow - Active Matrix Cont.



Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry,Wind

Roll CoatClean, Coat & Cure

275

Unwind, Sputter, RewindSputter, InterconnectSputter Dep Interconnect

270

Unwind, Conveyorized DES system w/extra cleanrinse, dry system for reel to reel transport,

Inspect, Wind

Develop, Etch, Strip LineDevelop, Etch (ITO), Strip thephotoresist then dry with air

knives with extra clean265




255

Unwind, Sputter, RewindSputter, ITOSputter Dep/ ITO250

Unwind, Conveyorized DES system w/ extra cleanrinse, dry system for reel to reel transport,

Inspect, Wind

Develop, Etch, Strip LineDevelop, Etch (Nitride), Strip thephotoresist then dry with air





230

Unwind, Conveyorized Ultrasonic clean w/rinse &drysystem, Inspect, Wind

Clean, UltrasonicUltrasonic Clean

225

Unwind, Reactive Ion Etch, Dry Strip, WindReactive Ion EtchDry Etch (RIE Si) and Resist Strip

220


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Process Flow - Active Matrix Cont.


Unwind, Laser Repair, WindLaser RepairLaser Repair Shorts330

Unwind, TFT Active Device Test, windTest, TFTTest and Review320

Unwind, Conveyorized Ultrasonic clean w/rinse & drysystem, Inspect, WindClean, UltrasonicUltrasonic Clean315

Unwind, Reactive Ion Etch, Dry Strip, WindReactive Ion EtchDry Etch (RIE Passivation) and Resist

Strip310

Unwind, Conveyorized develop system w/rinse, drysystem for reel to reel transport, Inspect, WindDevelopDevelop, Rinse and dry with air knives305



Unwind, PECVD, WindPECVD DepositPECVD Passivation Layer290

Unwind, Conveyorized DES system w/extra cleanrinse, dry system for reel to reel transport, Inspect,


Develop, Etch (Interconnect Metal),Strip the photoresist then dry with air



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Process Flows - Passive Matrix

Unwind, Passive Device Test, WindPassive Electrical TestTest and Review570

Unwind, Conveyorized DES system w/extra clean rinse, drysystem for reel to reel transport, Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (Metal) ,Strip the photoresistthen dry with air knives with extra clean560

Unwind, Proximity Exposure, WindExposure, ProximityAlign and Expose550

Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, WindRoll CoatClean, Coat & Cure540

Unwind, Sputter, WindSputterSputter Dep Metal530

Unwind, Conveyorized DES system w/ extra clean rinse, drysystem for reel to reel transport, Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (SiO2) ,Strip the photoresistthen dry with air knives with extra clean520



Unwind, Microwave PECVD, WindPECVD, MicrowaveVacuum Dep SiO2490

Unwind, Conveyorized DES system w/extra clean rinse, dry

system for reel to reel transport, Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (ITO), Strip the photoresist

then dry with air knives with extra clean480



Unwind, Sputter/ITO, WindSputter, ITOSputter Dep/ ITO440

Unwind, Microwave PECVD, WindPECVD, MicrowaveVacuum Dep Dielectric Barrier Layer and

Cure430

Unwind, Punch, Aqueous Web Cleaner, Unpatterned inspect, WindClean, Aqueous WebWeb Punch and Clean410

StageStageStaging for PET400



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OLED versus PLED

OLED Material applied using vacuum evaporation through a

shadow mask or other vacuum based transfer process

More mature process

Used in the majority of applications

PLED Material typically applied using Ink Jet Printing

Technology is still maturing

Scale up has presented mechanical and material control

challenges

We have included both in our model forcompleteness


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Process Flow - OLED

Unwind, Clean, Evaporate Color 1 Hole, LE, Transport Layer,Evaporate Color 2 Hole, LE, Transport layers, Evaporate Color 3

Hole, LE, Transport Layer, Evaporate Cathode, Send toencapsulation interfaceEvap, OLED

Evap Multiple Layers for

Three Colors andEvaporate Cathode720

Unwind, Plasma Clean, WindClean, PlasmaPlasma Clean710

Unwind, Tacky Roller, Corona Treating System, WindClean, CoronaMechanical and UV

Ozone Clean705

IncomingIncomingIncoming Active or

Passive Roll700


Small Molecule OLED (OLED) is a three color scenario

Evaporation method with shadow mask was selected for the model


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Electro Luminescent Displays

Organic Electro Luminescent Displays: OLEDsChallenges

OLEDs must be hermetically sealed from exposure to humidity and oxygenor cathode fails and dark spots occur over time.

OLED devices are current driven rather than voltage driven, requiring

parameter control over current rather than voltage, making driver designdifferent than LCD or Plasma displays

Scale up of small molecule processes requires large vacuum equipmentwith high levels of process control and mask positioning.


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OLED Technology Basics

Organic EL is obtained simply by placing a charge-transporting and light

emitting organic materials between two electrodes (one of which istransparent) and applying a suitable bias.

The organic material may be a polymer, deposited by various solutionprocessing techniques, or low molecular weight molecules (commonly calledsmall molecules), deposited by evaporation or sublimation in vacuum.

Total device thickness (excluding the substrate) is less than 1 micron.Active films are very thin, less than 1000 angstroms.

When biased, charge is injected into the highest occupied molecular orbital(HOMO) at the anode (positive), and the lowest unoccupied molecular orbital(LUMO) at the cathode (negative), and these injected charges (referred to asholes and electron, respectively) migrate in the applied field until two

charges of opposite polarity encounter each other, at which point annihilateand produce a radioactive state- light.


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Elemental Structure of Color EL

R G B

WR G B

(a) Line-up MethodUsing the R,G, andB

Luminescent Materials(EL)

(b) White Color EL / Color FilterMethod

7) Color Filter6) Metal Electrode5) The Second Insulation

Film4) Light Emitting Layer3) The First Insulation

Film2) Transparent Electrode1) Glass Substrate

Light

Light

ElectroLuminescent (EL) Displays


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OLED Process Flow

OLEDs are typically fabricated on a transparent substrate on which the first electrode(usually indium-tin-oxide which is both transparent and conductive) is first deposited.

Passive matrix has only patterned electrode substrate Active matrix has TFT substrate with pixel area (electrode) on which OLED

structure is created Then one or more organic layers are coated by either thermal evaporation in the case

of small organic dye molecules, or spin coating of polymers.

In addition to the luminescent material itself, other organic layers may be used toenhance injection and transport of electrons and/or holes. The total thickness of the organic layers is of order 100 nm.

Lastly, the metal cathode (such as magnesium-silver alloy, lithium-aluminum orcalcium) is evaporated on top.

These metals are chosen for their low workfunctions in order that they provideefficient injection of electrons.

The two electrodes add perhaps 200 nm more to the total thickness of the device. Therefore the overall thickness (and weight) of the structure is mostly due to the

substrate itself. After deposition the samples are encapsulated and operated under a nitrogen

atmosphere in order to prevent damage due to oxidation.


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Process Flows - PLED

Thermal Evap Receive interface, Reorient Roll, Evaporate Cathode, Interface withencapsulationEvap, CathodeThermal evap cathode650

Ink Jet Receive Station, Deposit First Quarter Color 1 Layer, Deposit SecondQuarter Color 1 Layer, Tension Adjust, Deposit Third Quarter Color 1 Layer,Deposit Final Quarter Color 1 Layer, Tension Adjust, First Quarter Color 2 Layer,Deposit Second Quarter Color 2 Layer, Tension Adjust, Deposit Third Quarter 2Color Layer, Deposit Final Quarter Color 2 Layer, Tension Adjust, First QuarterColor 3 Layer, Deposit Second Quarter Color 3 Layer, Tension Adjust, DepositThird Quarter Color 3 Layer, Deposit Final Quarter Color 3 Layer, Tension Adjust,Cure, Inspect, Send to Thermal Evap InterfaceInkjet Color Layers Deposit

Color 1 Dep, Color 2 Dep,Color 3 Dep and Cure640

Unwind, Deposit First Quarter Buffer Layer, Deposit Second Quarter Buffer Layer,Tension Adjust, Deposit Third Quarter Buffer Layer, Deposit Final Quarter BufferLayer, Oven Cure, Send to Ink Jet Receive StationInkjet Buffer Layer DepositBuffer layer dep and bake630


Unwind, Tacky Roller, Corona Treating System, WindClean, CoronaMechanical and UV Ozone

Clean610

IncomingIncomingIncoming Active or Passive

Roll600


Polymer OLED (PLED) is three color scenario

Ink Jet Process for PEDOT Buffer and Color application

Evaporation of the Cathode Metals


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Lam versus Dep

Lamination (LAM) A lamination process is used to enclose or

encapsulate the finished devices. Multi-layer filmsprovide good protection but add cost.

Deposition (DEP) A chemical vapor deposition is used to protect the

finished devices

High initial capital equipment cost has limited

widespread use The model includes both options


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Process Flow - Lamination Encapsulation

Active Device TestTest, Active DeviceTest each Device875

Device InspectionDevice InspectionInspection of Devices873

Die Punch cut of shorting barsDie Punch 3Cut Shorting Bars871

Die Punch Device out of bottom sheetDie Punch 2Cut Sheets Into Individual Devices870

Die Punch top sheet, pull off excessDie Punch 1Free Contacts860

Load Sheets, Cure Seal, Unload SheetsSeal OvenCure the Seal850

Cut bottom sheet, Align and Tack, Laminate, cutthe top sheet and push offLaminate, Combine Sheets

Cut bottom roll into sheets (18" by 24"),laminate top roll to bottom

(device) sheet,830

Align Device RollReceive from evaporatorIncoming OLED or PLED Devices are

bottom roll820

Tacky Roller, Corona Treatment, Screen Printer,UV CureScreen Printer

Mechanical and UV Ozone Clean,Screen print adhesive and partialcure810

Unwind top rollUnwind Top RollUnwind top roll (Encapsulant)800



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Process Flow - Deposition Encapsulation

Active Device TestTest, Active DeviceTest each Device955

Device InspectionDevice InspectionInspection of Devices945

Die Punch cut of shorting barsDie Punch 3Cut shorting bars942

Die Punch Device out of bottom sheetDie Punch 2Cut Sheets Into Individual Devices940

Delaminate and wind mask, Send Bottom Rollto Die PunchLaminate, RemovePeel off laminate935

Receive Masked Roll, Microwave PECVDPECVD, Microwave Inert

Vacuum Coat Organic andInorganic layers and DurableOvercoat and Cure920

Unwind, Align mask sheet, Laminate MaskSheet, Send to PECVDLaminate Mask Pattern

Laminate Mask Pattern to thebottom roll910

Align Device RollReceive from evaporatorIncoming OLED or PLED Devices

as bottom roll900



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Active Matrix w/ OLED

The minimum geometry for the Active Matrix display desired was 2 microns on thecontacts only and 4-micron lines and spaces. The 2-micron contacts may still be problematic for some tools. See notes below for

Align and Expose tools.

Active matrix


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Passive Matrix w/PLED

The PassiveMatrix displaydevicegeometries are:330 m (13 mil)lines with 25.4m (1 mil)spaces

G

R

R

R

B

B

B

G

G


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Devices on Web

There are 35displays for each24 x 18 area (5rows and 7columns)

There are areas foroptical alignment

marks andmechanical punchalignment locationsat the edges,outside of thedevice array.


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Substrate Material Concerns

Substrate material (both processed and purchased)

assumed as standard PET substrate with protectivecoatings transparent coating

high resistance permeation barrier to oxygen, moisture andchemicals

flexibility of coatings (no coating cracking/fatigue) Improved thermal stability is assumed in the model

Standard TFT fabrication requires temperatures abovethose that can be tolerated by most polymers.


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Model Assumptions Due to

temperatureconstraints of thePET web, the toolselection fordeposition ofmaterials(evaporation orsputter) for the Activeand Passive matrixsubstrates waslimited to toolvendors who hadexperience with therequired cooling ofthe web during

processing. Batch type web coater for EB depositionPicture from Von Ardenne Anlagentechnik GmbH AIMCAL

Presentation, Richter 2002


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Model Assumptions Wind and unwind location choices have been made by reviewing

actual processing tools and methods for the following product types: TAB (Tape Automated Bonding), Chip on flex, Lead frame, food

packaging/labeling, medical device packaging, touch screens, TV and displayantiglare films, etc.


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Model Assumptions Pricing, Throughput, Footprint of Tools

Firm tool supplier proposals were used from tooldatabase developed over past three years

Vendor discussions were documented for new or

developing tools Benchmarking to roll to roll tools from other

industries, and PC board processing forHDI/Flex

Cleanliness/process from FPD base tools Integration costs were well benchmarked due to

recent AGI roll to roll projects

Some RFPs were not completed in time for the

stud and unofficial estimates were received for


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Model Assumptions Layout, Cleanliness and Pattern protection

Combined Industry standards for roll-to-rollindustry with the clean classifications requiredfor display and microelectronics processing.

Standard Industrial practices for tool

groupings and workflow resulting in layouts.

Interleafs are included during wind/unwind ofthe rolls to control sticking, scratching andcontamination at the following steps: Coat,

Align and Expose and Develop before dryetch.


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Web Speed versus Output

The output of the line will depend on the speed of the web. If the entire line runs at 1 foot/minute and assume an overallutilization of 92% and a 90% yield, the output would be:

1 ft/min * 1440 min/day * 7 days * .92 (utilization) * .90 (yield)

Equals 8,346 linear feet per week

Since the web is 2 foot wide, each linear foot equals 2 square feet

The output is 8,346 lf * 2 ft equals 16,692 square feet per week

Since the devices are 3.25 by 3.25 inches, there are 35 devices forevery 18 by 24 inch web section. This is 11.67 devices per square foot.

The output equates to 194,795 devices per week.


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Web Speed versus Multiple Use Tools

Multiple use tools have a significant impact on actual throughput.

If a tool can support 6 linear feet of web per minute, the impact of multipleuses is:

1.0 ft/min6

1.2 ft/min5

1.5 ft/min4

2 ft/min3

3 ft/min2

6 ft/min1

Effective ThruputNumber of Uses


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Line Balance Dictates Multiple Tools:Tool Counts: Active Matrix @ Volume: 66k/week

Aqueous

Clean

Stepper

Stepper

StepperStepper

Stepper

Stepper

Stepper

Stepper

Stepper

Stepper

Stepper

Stepper

Roll Coat

Roll Coat

Roll Coat

Develop

Develop

Develop

Develop

Develop

Develop

1

9236

TFTTest

2

Tool Counts

Throughput Rates 1.2 ft/min3.5 ft/min

6 ft/min3.0 ft/min6 ft/min

Roll Coat

Roll Coat

Roll Coat

TFTTest

Develop

Develop

Develop

Note: Line Balanced to full Clean utilization (.92 Aqueous Clean)


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Jupiter 3.xTM

Jupiter 3.xTM

was developed by AGI to help ourclients make better decisions. Based on standard industrial engineering methods

and practices

Combines cost, capacity, and space allocation

modeling in one user-friendly package Developed in Microsoft Excel to allow ease of use and

customization to clients individual requirements

Includes Material Handling data, analysis, and impactfor roll to roll and individual substrate processing

Jupiter 3.xTM allows the user to modify inputs ina given model and immediately see the results.


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All data which is not scenario-specific, suchas tool costs, uptimes, process times, etc. arecontained in a stand-alone file which acts as acentral database, allowing apples-to-applescomparison of different scenarios based on the

same tool set. Some examples of differenttypes of scenarios are:

Different factory schedules

Different demands per product

Ramp plans Rolls vs. sheet handling in same tool type or

process

Jupiter 3.xTM


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Jupiter 3.xTM Inputs


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Jupiter 3.xTM Outputs


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Switch to live model demonstration

Jupiter 3.xTM


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Possible Flows

DepOLEDPassive8

DepPLEDPassive7

LamOLEDPassive6

LamPLEDPassive5

DepOLEDActive4

DepPLEDActive3

LamOLEDActive2

LamPLEDActive1EncapsulationLEDBackplaneFlow Number


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Process Yield Assumptions

88.9%Active Mature58.7%Active Start Up

91.4%Passive Mature68.1%Passive Start Up

Cumulative YieldsCumulative Yields

96.4%Dep87.3%Dep

96.4%Lam87.3%Lam

98.5%OLED95.0%OLED

98.5%PLED95.0%PLED

96.2%Passive82.1%Passive

93.4%Active70.8%Active

Resulting Product Yield:Resulting Product Yield:

98.5%OLED Evap95.0%OLED Evap

98.5%Ink Jet Dep95.0%Ink Jet Dep

97.0%Test, Active90.0%Test, Active

98.0%Test, Passive90.0%Test, Passive

97.0%Test,TFT85.0%Test,TFT

99.4%Inspection97.0%Inspection

Yield Assumptions:Yield Assumptions:

Used for 5000 or more sq ft/wkUsed for < 5000 sq ft/wk

Mature ProductStart-up


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USDC Cost per Sq Ft

2,000 6,000 10,000 14,000 20,000 40,000 70,000 100,00023,332 69,996 116,660 163,324 233,320 466,640 816,620 1,166,600

Active PLED Lam $365.82 $61.71

Active OLED Lam $378.44 $74.36

Active PLED Dep $365.82 $61.79

Active OLED Dep $384.14 $152.94 $111.68 $100.07 $85.43 $79.95 $74.73 $74.44

Passive PLED Lam $244.91 $90.79 $61.11 $48.65 $40.31 $36.47 $35.47 $34.23

Passive OLED Lam $258.09 $46.44

Passive PLED Dep $250.76 $34.32Passive OLED Dep $264.72 $46.56

Sq Ft per Week:

Devices per Week:

Device Cost Results($ per Square Foot versus Volume)

We did not include the detail of each of these models. We only ran them toidentify the slope of the Price to Volume Chart.


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Device Cost Results$ per Square Foot versus VolumeFor Volumes 0 to 100,000 SF per week

USDC Results

$0

$50

$100

$150

$200

$250

$300

$350

$400

0 20,000 40,000 60,000 80,000 100,000

Sq Ft/Wk

$

perSq

Ft

Act,OLED,Dep

Pass,PLED,Lam

$ 74.44

$ 34.23

D i C t R lt


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At an output level of 100,000 square feet/per week, the cost per squarefoot breaks down as:

Backplane:

Active Matrix $45.35

Passive Matrix $18.19

Light Emitting Post Processing: OLED $25.30

PLED $12.45

Encapsulation:

Dep $ 3.79

Lam $ 3.59

Device Cost Results

2.5 X

2.0 X

1.1 X


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Cost Contributors at 100k Sq Ft/ Wk

Flow Number 5, Lowest Cost Combination, Passive, PLED, Lam

Category Percent

Materials 43.3%

Equipment 31.6%

Overhead 11.9%

Direct Labor 7.0%

Direct Facilities 6.2%

Flow Number 4, Highest Cost Combination, Active, OLED, Dep

Category Percent

Materials 55.9%

Equipment 25.7%

Overhead 8.4%

Direct Labor 6.0%

Direct Facilities 3.9%

Materials

Equipment

Overhead

Direct Labor

Direct Facilities

Materials

Equipment

Overhead

Direct Labor

Direct Facilities


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Overall Model Results

426,689561,25597,833118,182Total Square Ft

Number ofTools801272530

Facility Cost($M)$219.1M$304.0M$49.7M$61.8M

$282.0M$496.7M$68.3M$113.1MTool Cost ($M)

High VolumeMinimum Number of Tools

Operators per

Shift681271113

100,000100,00014,00010,000Device Demand (Sq

Ft per wk)

$34.23$74.44$48.65$111.68Product Cost per

Sq Ft

Low Cost Flow #5(Passive, PLED, Lam)

High Cost Flow #4(Active, OLED, Dep)

Low Cost Flow #5(Passive, PLED, Lam)

High Cost Flow #4(Active, OLED, Dep)


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General Model Results Tools per Square Foot

The average for this model is 0.51 tools per 1,000 square foot. The Semiconductor Benchmark for 200mm wafer tools is 5 tools per 1,000

square foot

Material handling costs Wind/ Unwind robots cost $125,000 each The average for this model is 1.37 robots per tool

Material Costs (Cost Contributor per square foot of web) OLED Evaporation sources $16.56 Chemicals (Dev, Etch, Strip) $ 5.88 to 7.84 (depending on flow) Cathode Evaporation sources $ 2.15


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Tool ResultsSlowest Throughput per Machine

For Passive, PLED, Dep

Inkjet Color Dep 1.5 Ft/min

Inkjet Buffer Dep 1.5 Ft/min

Sputter Steps 2.0 Ft/min

For Active, OLED, Lam

Exposure, S & R 1.2 Ft/min

PECVD Deposit 2.0 Ft/min

Sputter Steps 2.0 Ft/min


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Pareto of Tool Throughput

1

7

9

6

1

15

0

2

4

6

8

10

12

14

16

1 2 3 4 5 6

Feet per Minute

Quantity

ofTools


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Tool ResultsLargest Cost per Individual Tool


Evap, OLED $ 23.7M

PECVD Deposit $ 9.2M


Inkjet Color Deposit $ 11.1M

Inkjet Buffer Deposit $ 6.8M


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Pareto of Tool Cost

14

3

7

4 4

1

2

0

2

4

6

8

10

12

14

16

< $ 1M $ 1M $ 2M $ 4M $ 5M $ 10M >$ 23M

Tool Cost in Millions

Nu

mberofToolsinEach

CostCategory

*InkJet includes: Buffer, Color, Cathode Tool Cost

*


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Largest Percent of Total Tool Cost(At an output level of 100,000 square feet per week)


PECVD Deposit 19.8%

Evap, OLED 19.1%

Total of All Tools $ 374.2M


Inkjet Color Deposit 25.8%

Inkjet Buffer Deposit 15.7%

Total for All Tools $ 215.2M


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Tools are much larger


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Tool Discussions Problematic Tools

Off Shore Vendors seem most responsive, best capitalized and willing todevelop clean web tools for:

Develop, Etch, Strip and other wet processes

Step and repeat expose

OLED Evap

Cathode Evap

Domestic Development Stretches into the future for some new tools

Ink Jet printing of PLED

Laser polysilicon anneal

Test and repair flex displays

Deposit barrier coatings


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Tool Selection Photo Patterning Concerns

No align and expose tools were capable of meeting

the resolution and registration range needed forActive Matrix Devices on flex (2 to 4 micron and 1micron registration). Now 5-8 micron line/space limit Need to optimize

Light Intensity

Resist Thickness

Pre-alignment time

Can we Mix/ Match with Proximity?

Expect a Japanese tool vendor to get there first(Ushio, Toray)

USDC funding domestic effort (Azores)


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Tool Selection Specialty Process Deposition Concerns

Background of deposition tools: PVD and CVD: Well known technology (solar cells have used long web

processing tools for decades) Sputtering/PECVD tool is large and expensive Cooled Drums used for PET cooling during deposition Some linear sources and round targets are in use for other

materials Cathode/OLED Evaporation tools in design (Tokki, Applied Films,Ulvac, CHA) Roll to roll decoupled from OLED research Expect a Japanese tool vendor to get there first (Tokki, Ulvac) USDC funding domestic effort CHA


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Tool Selection Specialty Tools

Niche Market Tools - Research and

development effort is ongoing Ink Jet Patterning : Seiko Epson, Litrex, MicroFab,

Spectra- Other applications. Environment, thruputconcerns.

XeCl Pulsed Laser: GAM for changing amorphous

silicon into polysilicon. Thruput, temp of web, andintegration concerns Integration Technology

Other experts (Northfield, ECD, Preco) inprocess/web need to be supported

Creation of Inert Environment Web Handling Automation


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Bottleneck - Ink Jet PLED printing

Although InkJet printing is without adoubt the most cost effectivemethod, the throughput of theInkJet tool in its proposed state isroughly 0.25 feet per minute.

AGI optimized this throughput byproviding partial processing inredundant tools to improve the web

speed revealing the deposition line,which is :

423 feet long!

Litrex 80Lsource: www.litrex.com


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Bottleneck - Step and Repeat Align/Expose

Step and Repeat

exposure shot sizeis now limited toabout 200mmround, 141 x141mm square.

With a reticle/shotof 170 x 170 mm, 4PDA devices can beexposed in one shotwithout stitching.

1234

5 10

6 7 8 9

11 12

B ttl k R t t Ph t Fl


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Bottleneck- Re-entrant Photo Flows

Multiple tools required immediately due to re-entrant flows: Photo

Step and Repeat, Align and Expose for Active Matrix (6 layers)

One Develop Dry Etch

One Develop Wet Etch

Standardization of chemicals will become criticalto minimize bottleneck issues

Web Movement vs. Sheet Handling


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Web Movement vs. Sheet Handling

Tool Cost

Throughput Yield

Material Cost

Materials: Photoresist applied with Roller coater will have large,

costly waste for sheets Sput targets cost will increase since not as much from a given

target hits a sheet vs a web.

Material Handling

Factory layout

Sheets lower

Web higherAdvantage to sheet due to ability to not continueprocessingrejects

Advantage to the web.

Sheets may cost more to handle

More flexible with sheet handling


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What do we gain in Web Flex Display Manufacturing?

Pull out the Glass Cost ($32.57 - $9.70):

Delta is $22.87

$32.57 sf(savings)

Glass TFT is more than AM (Web)

$45.35 sfActive Matrix Back Plane (100k/wk)

$77.92 sfGlass TFT (AGI benchmark)

PET is cheaper than glass by $9.70 a sf

$10.00 sf1737f Aluminosilicate Glass

.30 sfPET with barrier

.07 sfPET without barrier


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What If?

TheStepperthruputis

cutinhalf?TheClea

nroomAr

eaFactor

goesup1

5%?

OLEDEvaptool

costgoesdown

30%?

TheInkJet

thruput

improves5x?

DirectLaborCostsarecutinhalf?

5th Annual Flexible Displays & Microelectronics Conference


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100 of 138Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906

Are We There Yet?

Updates to the Roll to RollManufacturing Cost Model

for Flexible Displays

Updated Fall 2005Presented Spring 2006

5 Annual Flexible Displays & Microelectronics ConferenceFebruary 6-9, 2006 | Phoenix, Arizona

Image courtesy of Plastic Logic


101/139



Introduction

Background In 2003, we developed and presented

a roll-to-roll model at the USDCconference to determine:

Individual Product Cost per Square Foot

Overall Factory Cost Estimates

Equipment Cost

Labor Cost

Substrate and Outsourcing Costs

Approximate Cleanroom Space/CostRequired by Clean Class

For 2006, we have updated that study


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Are We There Yet?

Process Is there a process consistent with roll-to-rollthat can be used?

R & D

Low volume production

High volume production Roll-to-roll

Equipment Do all the necessary tools exist?

Application Is there an application that requires roll-

to-roll volumes? Financial Do the numbers justify the necessary

investment?


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The Last Three Years

What has happened since the firstreport?:

Flexible Display Center at ASU

CAMM established at Binghamton

University Number of Flexible Display

Conferences increased, so hasattendance

Roll-to-roll Process Lines added Flexible Batteries - Solicore, Power Paper Solar Cells - Unisolar RFID Tags - Alien

Display image courtesy of SiPix


104/139



The Last Three Years

What did not happen: No killer application identified

Smart Card -Signage eBooks - Curved Watches

No obvious best process identified

OLED/PLED moisture effects on plastic notsolved

No major tool orders placed for displayprocessing in Roll-to-Roll format

Should we change the basic process


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Should we change the basic processflows?

The process flows and tools were reviewed tosee if there were compelling reasons to addor eliminate items from the sequencepresented in 2003.

There is no obvious perfect or home runprocess that everyone is using.

The main changes to the flows will be

presented The tradeoffs between the flows will be

presented.

What flow combinations are


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What flow combinations areincluded?

DepOLEDPassive8

DepPLEDPassive7

LamOLEDPassive6

LamPLEDPassive5

DepOLEDActive4

DepPLEDActive3

LamOLEDActive2

LamPLEDActive1

EncapsulationLEDBackplaneFlow Number

All flows use 1000 ft by 2 ft rolls of PET to make a 3.25 inch by 3.25 inchdisplay on 18 inch by 24 inch format


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Ch i th PLED Fl


108/139



Changes in the PLED Flow

Changes in PLED Process Litrex has seen significant progress in ink jet tools

New tools reduce overall footprint required forPLED process

Image courtesy of Litrex


109/139


110/139

2006 Device Cost Results


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2,000 100,000

23,332 1,166,600

Active PLED Lam $370.30 $64.80Active OLED Lam $410.60 $80.76

Active PLED Dep $378.64 $65.00

Active OLED Dep $418.10 $80.96

Passive P LED Lam $230.29 $31.24

Passive OLED Lam $266.12 $46.72

Passive PLED Dep $237.95 $31.42Passive OLED Dep $274.62 $46.94

Sq Ft per Week:

Devices per Week:

2006 Device Cost Results($ per Square Foot versus Volume)

Results presented by flow and volume.

2006 Device Cost Results


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$ per Square Foot versus VolumeFor Volumes 0 to 100,000 SF per week

USDC Results

$0

$50

$100

$150

$200

$250

$300

$350

$400

0 20,000 40,000 60,000 80,000 100,000

Sq Ft/Wk

$

perSq

Ft

Act,

OLED,Dep

Pass,

PLED,Lam

$ 80.96

$ 31.24


113/139


114/139


115/139

Active Matrix Flow Options


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Active Matrix Flow Options

$ 67.14

$ 80.80

$ 80.96

Cost at

100,000sq ft/ wk

-17.1%

-0.2%

N/A

Percent

Change inDevice Cost

AM 3

AM 2

AM 1

Process Flow

Designation

Baseline process using large areaexposure rather than a Stepper forall of the photo layers

Baseline process without LaserRecrystallization Steps

Baseline

Description


117/139

P i PLED L Fl 2003 / 2006 C i


118/139



Passive, PLED, Lam Flow 2003 / 2006 Comparison

Less 104 K for PLED322 K427 KTotal Square Ft

Number ofToolsNo Change8080

Facility Cost($M)Less $ 51 M for PLED Space$ 169 M$ 219 M

Less $ 26 M for PLED

Plus $ 12 M for Passive$ 267 M$ 282 MTool Cost ($M)

Operators

per ShiftNo Change6868

$ 31.24$ 34.23Product Cost

per Sq Ft

Comments2005/20062002/2003

Model results at 100Ksquare feet per week


119/139


120/139

Major Cost Contributors


121/139



Major Cost Contributors(At an output level of 100,000 square feet per week)

Tools for Active, OLED,Dep

Exposure $171 M PECVD Deposit $115 M

Evap, OLED $ 71 M

Tools for Passive,PLED, Lam

Inkjet $ 67 M

Sputter $ 35 M

PECVD $ 28 M

Materials

OLED Evap Sources $17.82 / sq ft Develop, etch, strip chemicals $3.75 to $5.92 / sq ft Cathode Evap Source $2.31 / sq ft


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Recommendations


126/139



Continue funding improvements in

photolithographic align / expose tools for flexibleprocessing

Continue funding materials research

Fund active and passive matrix development

with electrophoretic, electrochromic, andcholesteric LCD based display technologies

Continue to improve OLED/PLED Materials

Stability

Moisture resistance

Cost


127/139

Acknowledgements


128/139



Acknowledgements

Support from the United States DisplayConsortium (USDC) and the Army ResearchLabs (ARL)

Tool and material vendors for their inputs


129/139



Appendices

Baseline Process Flow - Active Matrix (AM 1)


130/139



AM 3

AM 2

AM 3

Unwind, Conveyorized develop system w/rinse, drysystem for reel to reel transport, Inspect,

WindDevelopDevelop, Rinse and dry with air knives215



Unwind, XeCl Pulsed Excimer Laser, WindLaser, Pulsed ExcimerPolySi Anneal200

Unwind, PECVD Deposit, WindPECVD DepositSilicon Nitride, Amorphous Polysilicon, N+

dopant190


Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (Gate Metal),Strip thephotoresist then dry with air knives with

extra clean rinse180



Unwind, DC Magnetron Sputter, RewindSputter, DC MagnetronSputter Dep Gate 1 Metal150

Unwind, Microwave PECVD, RewindPECVD, MicrowaveVacuum Dep Dielectric Barrier Layer and

Cure140

Unwind, Punch, Aqueous Web Cleaner,Unpatterned inspect, WindClean, Aqueous WebWeb Punch and Clean130

StageStageStaging Area100


column indicates step is changed for alternate flows AM 2 or AM 3

Baseline Process Flow Active Matrix (AM 1)

Baseline Process Flow - Active Matrix (AM 1) Cont.


131/139



AM 3

AM 3

AM 3





275

Unwind, Sputter, RewindSputter, InterconnectSputter Dep Interconnect270


Inspect, Wind

Develop, Etch, Strip LineDevelop, Etch (ITO), Strip thephotoresist then dry with

air knives with extra clean

265




255

Unwind, Sputter, RewindSputter, ITOSputter Dep/ ITO250

Unwind, Conveyorized DES system w/ extra cleanrinse, dry system for reel to reel transport,

Inspect, Wind

Develop, Etch, Strip LineDevelop, Etch (Nitride), Strip thephotoresist then dry with

air knives with extra clean

245




230

Unwind, Conveyorized Ultrasonic clean w/rinse &drysystem, Inspect, Wind

Clean, UltrasonicUltrasonic Clean225

Unwind, Reactive Ion Etch, Dry Strip, WindReactive Ion EtchDry Etch (RIE Si) and ResistStrip220


Baseline Process Flow Active Matrix (AM 1) Cont.

Baseline Process Flow - Active Matrix (AM 1) Cont.


132/139



AM 3


Unwind, Laser Repair, WindLaser RepairLaser Repair Shorts330

Unwind, TFT Active Device Test, windTest, TFTTest and Review320

Unwind, Conveyorized Ultrasonic clean w/rinse &dry system, Inspect, WindClean, UltrasonicUltrasonic Clean315

Unwind, Reactive Ion Etch, Dry Strip, WindReactive Ion EtchDry Etch (RIE Passivation) and

Resist Strip310

Unwind, Conveyorized develop system w/rinse, dry

system for reel to reel transport, Inspect, WindDevelop

Develop, Rinse and dry with air

knives305



Unwind, PECVD, WindPECVD DepositPECVD Passivation Layer290

Unwind, Conveyorized DES system w/extra cleanrinse, dry system for reel to reel transport, Inspect,


Develop, Etch (Interconnect Metal),Strip the photoresist then dry with air


Baseline Process Flow Active Matrix (AM 1) Cont.


Process Flows - Passive Matrix


133/139



Unwind, Passive Device Test, WindPassive Electrical TestTest and Review570

Unwind, Conveyorized DES system w/extra clean rinse, drysystem for reel to reel transport, Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (Metal) ,Strip the photoresistthen dry with air knives with extra clean560



Unwind, Sputter, WindSputterSputter Dep Metal530

Unwind, Conveyorized DES system w/ extra clean rinse, drysystem for reel to reel transport, Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (SiO2) ,Strip the photoresistthen dry with air knives with extra clean520



Unwind, Microwave PECVD, WindPECVD, MicrowaveVacuum Dep SiO2490

Unwind, Conveyorized DES system w/extra clean rinse, dry

system for reel to reel transport, Inspect, WindDevelop, Etch, Strip Line

Develop, Etch (ITO), Strip the photoresist

then dry with air knives with extra clean480



Unwind, Sputter/ITO, WindSputter, ITOSputter Dep/ ITO440

Unwind, Microwave PECVD, WindPECVD, MicrowaveVacuum Dep Dielectric Barrier Layer and

Cure430

Unwind, Punch, Aqueous Web Cleaner, Unpatterned inspect, WindClean, Aqueous WebWeb Punch and Clean410

StageStageStaging for PET400


Process Flows Passive Matrix

Process Flow - OLED


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Unwind, Clean, Evaporate Color 1 Hole, LE,

Transport Layer, Evaporate Color 2 Hole, LE,Transport layers, Evaporate Color 3 Hole, LE,Transport Layer, Evaporate Cathode, Send toencapsulation interfaceEvap, OLED

Evap Multiple

Layers for ThreeColors andEvaporateCathode720


Unwind, Tacky Roller, Corona Treating System,WindClean, Corona

Mechanical andUV Ozone Clean705

IncomingIncomingIncoming Active or

Passive Roll700


Process Flow OLED

Process Flow - PLED


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Documents

Flex Manufacturing Concepts