FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly

8/8/2019 FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly

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3D integration is a rapidly emerging technology that vertically stacks and interconnects multiple materials,

technologies, and unctional components to orm highly integrated micro- and nanosystems or cross-sec-

torial applications such as medical implantable devices, intelligent sensors, fash memory, computer me-

mory, camera chips, and radio requency devices in mobile phones. 3D integration is a very promising

area o technological development and shows huge economic potential;

The state-o-the-art technology or 3D integration relies on robotic pick-and-place machines and machine

vision, which cannot be simultaneously very ast and very accurate. I high precision e.g. a micrometer

is needed, the cycle time o the integration can be very long, rom e.g. over ten seconds to minutes, or

even not achievable.

Concept o sel alignment :

Self alignment will contribute to fastand accurate 3D integration. Theinaccuracy of a fast pick and placeprocess is compensated by a liquidlayer that generates the driving forcefor accurate alignment.

ContExt

Component and interace design are important items in FAB2ASM enabling sel alignment. Essential or

3D integration is stacking o chips including electrical connection by through silicon via’s.

Main step or 3D Integration

sELF ALiGnmEnt For 3D intEGrAtion

MEMS RF AnalogLogic

DRAM

Component and interace design

Ultraast robotic coarse placing

High precision sel-alignment

Fixing and Bonding

3D Integration



Applied research

WP2: Componentsand Interaces (IMEC)

WP3: High Precision Assembly (UFC)

WP4: Bondingand Joining (EMPA)

Industrialdevelopment

WP5: Integrationand Reliability (AALTO)

Demonstration

WP6: Demonstrations(NXP)

WP1: Specifcations and roadmapping

WP7: Dissemination, training and exploitation (UT)

WP8: Management ( AALTO)

ProJECt struCturE

FAB2ASM will develop a new manuacturing technology or 3D integration o mi-

croelectronics and microsystems which is simultaneously very ast and very accurate

– which currently is the bottle neck limiting industry take-up.

FAB2ASM will overcome the current confict between speed and accuracy by joining

the traditional robotic tools with the physics o sel-alignment – where tiny chips will

align due to surace tension o liquid or other physical orces acting at the microscale.

FAB2ASM will develop a highly industry relevant technology that not only reuses most

o the industrial process steps, but also improves the perormance o the integration

process in terms o precision and eciency.

FAB2ASM will allow handling o small (100 µm) and/or thin dies (20 µm) and ultra

high speed assembly (40,000 unit per hour), while ensuring industry proven relia-

bility. Three industry-led demonstrators will validate the achievements in the elds o

manuacturing equipment, photonic IC and microelectronics.

obJECtivEs

Robotics

Surace chemistry

Microabrication Microelectronics

Optoelectronics

Nanomaterials



Industrial partners

Beam Express, Switzerland

NXP, The Netherlands

Management consulting

ALMA Consulting Group, France

Research partners

AALTO University, Finland (coordinator)

University o Twente, The Netherlands

University o Franche-Comté, FranceEMPA, Switzerland

IMEC, Belgium

Supported by the European commission through the 7th Framework Programme or Research and deve-lopment with up to 4.7 Mio € out o a total budget o 7.1 Mio €

This 3 year project will run rom 1st May 2010 to 30th April 2013.

Project Coordinator:

Aalto University

Dr. Tech., Adjunct Proessor Quan Zhou, +358 9 470 25241

quan.zhou@tkk.

With the support o:

ALMA Consulting Group

Emmanuelle Bur, +33 (0)4 72 35 88 27

[email protected]

www.ab2asm.eu

Consortium

ACKnoWLEDGmEnt

Documents

FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly