SSC – SPUTTER SOURCESHigh rate deposition of metals, dielectrics and TCOs

• 200 or 300mm diameter

•DC,DCPulsed,MidFrequencyorRF

•Nouniformityshapers

The SSC series cathodes are prepared for deposition of metals,

dielectrics and TCOs. Proprietary tunable rotating magnet

systems ensure deposition processes can be optimised for

the best combination of target life, film thickness uniformity

and process cost according to customers exact needs.

Process options include DC, DC Pulsed, Mid Frequency

or RF. Cathode / power supply switching options can be

configured according to process and budget constraints.

Uniformity shapers have been eliminated, maximizing

deposition rates and avoiding a potential source of substrate

contamination through particle shedding.

In situ plasma emission monitoring in combination with

closed loop gas inlet control ensures reactive processes

achieve the correct film stoichiometry. Broad band optical

monitoring available on either the Single Process Module

(SPM) or Batch Process Module (BPM) ensures correct end

point termination in complex optical stacks.

Water cooled foils behind the target enable efficient target

cooling and eliminate the possibility of water leakage into

the process module during cathode maintenance or target

exchange. A simple target clamping ring keeps target change

times to an absolute minimum.

Upto5SSCsourcesonasingleBatchProcessModule

SSCcathodeconfiguredforRFsputter

Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded by any data contained within Evatec quotations, manuals or specifications.

Evatec Ltd.Lochrietstrasse 14CH-8890 FlumsSwitzerlandTel: + 41 81 720 1080Fax: + 41 81 720 1081info@evatecnet.comwww.evatecnet.com

SSC – SPUTTER SOURCES

Target with clamping ring and cooling foil for safe operation and rapid target change

3Dsurfacediagramshowingfilmthicknessuniformity

Depositionon200mmwaferwith±1.5%uniformity

SSC200 SSC300

Nominaltargetdiameter

200mm 300mm

TargetForm Single piece or bondedtobackingplate according material

Single piece or bondedtobackingplate according material

SputterModes DC,DCPulsed, MidFrequency,orRF

DC,DCPulsed, MidFrequency,orRF

ProcessControl

MagnetronspeedMagnetronheight

MagnetronspeedMagnetronheight

Target Lifetime Magnetsystemsoptimised according to application

Magnetsystemsoptimised according to application

Process Options

Singleorco-sputter,PIADincombinationwithPlasmaSource

Singleorco-sputter,PIADincombinationwithPlasmaSource

Target Cooling Indirect Indirect