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ITO - INDIUM TIN OXIDE Damage free sputtering at high throughput For sensitive substrates and sub layers Low temperature anneal for reduced downstream processing Photo courtesy of OSRAM Radiance offers custom configurations for ITO sputter according to substrate type and application. From HB LEDs to Displays, Radiance enables damage free deposition onto both conventional and sensitive polymeric / inorganic semiconductor substrates. Simple tooling solutions exist for handling of 2, 4, 6 or 8 inch substrates at high throughput and the Radiance platform can be extended with additional process modules, cathodes and cassette stations as production demands grow. Evatec’s process solutions are tailored in collaboration with customers for the optimum balance of transmission and sheet resistance. Proprietary system design allows substrate materials and sub layers normally susceptible to plasma damage to be protected during sputter. Peak ITO performance can also be achieved without high temperature post anneal, protecting temperature sensitive substrates, reducing downstream processing times and increasing production throughput. ITO Process Performance Target Composition 90:10 Typical Deposition Rates Up to 80Å/kWmin according to application Typical Transmission Values (Film ONLY) On Sapphire: > 90% On Corning; Eagle XG: > 95% Typical Sheet Resistance Values <70Ω/sq @ 600Å, <10Ω/sq @ 3200Å (2400Å)

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Page 1: EVA_ITO_iWEB

ITO - INDIUM TIN OXIDEDamage free sputtering at high throughput

• For sensitive substrates and sub layers

• Low temperature anneal for reduced downstream processing

Photo courtesy of OSRAM

Radiance offers custom configurations for ITO sputter

according to substrate type and application. From HB LEDs

to Displays, Radiance enables damage free deposition

onto both conventional and sensitive polymeric / inorganic

semiconductor substrates. Simple tooling solutions exist for

handling of 2, 4, 6 or 8 inch substrates at high throughput

and the Radiance platform can be extended with additional

process modules, cathodes and cassette stations as

production demands grow.

Evatec’s process solutions are tailored in collaboration

with customers for the optimum balance of transmission

and sheet resistance. Proprietary system design allows

substrate materials and sub layers normally susceptible to

plasma damage to be protected during sputter. Peak ITO

performance can also be achieved without high temperature

post anneal, protecting temperature sensitive substrates,

reducing downstream processing times and increasing

production throughput.

ITO Process Performance

Target Composition 90:10

Typical Deposition Rates Up to 80Å/kWmin according to application

Typical Transmission Values (Film ONLY)

On Sapphire: > 90%On Corning; Eagle XG: > 95%

Typical Sheet Resistance Values

<70Ω/sq @ 600Å, <10Ω/sq @ 3200Å (2400Å)

Page 2: EVA_ITO_iWEB

Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded by any data contained within Evatec quotations, manuals or specifications.

Evatec Ltd.Lochrietstrasse 14CH-8890 FlumsSwitzerlandTel: + 41 81 720 1080Fax: + 41 81 720 [email protected]

ITO - INDIUM TIN OXIDE

Throughput of 2” wafers according to thickness and number of cathodes

Typical ITO deposition results

Throughput of 4” wafers according to thickness and number of cathodes

Throughput of 6” wafers according to thickness and number of cathodes

Transmission according to wavelength at

different film thicknesses