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Programme at a glance

Welcome to the EMPC 2005

Scientific Programme Sunday, June 12

Scientific Programme Monday, June 13

Scientific Programme Tuesday, June 14 10

Scientific Programme Wednesday, June 15 14

General Information 17

Exhibitors 23

Proceedings 39

Author Index 609

T1B/UB Hannover 89

128 291 486

3

PROGRAMME AT A GLANCE

13.00-18 00

14.00-18.00

18.00

Registration desk open

Professional Development Courses

Welcome Reception at the Congress Centre

09.00

09.10-11.00

11 00- 11 20

11.20-13.00

13 00-14 00

14.00-15.40

15 40- 16 20

16 20-18.00

09 00-10 40

10.40-11.20

11.20-13 00

13 00-14 00

14.00-15.40

' 15 40-16 20

16.20-18.00

09.00-10.40

10.40-11 20

11.20-13.00

13.00-13.30

Ambassador

Welcome

Invited Lectures

SESSION 1

Manufacturing Technologies I

Bach Beethoven

SESSION 3

3D Packaging

SESSION 5

Interconnection Technologies

SESSION 2

Power

SESSION 4

Optoelectronics Packaging

SESSION 6

Quality and Reliability I

Marquee

Coffee Break

Lunch Break

POSTER SESSION I

Coffee Break

IMECAT SESSION

SESSION 7

Advanced Packaging

Coffee Break

SESSION 9

Applications

SESSION 11

Flexible Substrates

SESSION 13

Materials

SESSION 8

MEMS Packaging

SESSION 10

Lead-Free Materials

CM SESSION

SESSION 12

Electrical Modelling & Signal Integrity

SESSION 14

Optoelectronic Applications

Lunch Break

POSTER SESSION II

Coffee Break

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LATE PAPERS SESSION

SESSION 15

Materials & Processing

SESSION 17

Interconnection Substrates

Closing Session

SESSION 16

Quality & Reliability II

SESSION 18

Manufacturing Technologies II

Coffee Break

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13 00 Registration desk open

14 00 - 18 00 Professional Development Courses

Professional Development Course 1:

Adhesive technology - innovative bonding technique for microelectronicsOrganiser Helmut Schafer & Thomas Gesang, Fraunhofer IFAM, Bremen

18.00 Welcome Reception in the Marquee

Professional Development Course 2:

Enabling Technologies for RF and microwave SiP

Organiser Walter De Raedt, IMEC, Leuven

Plenary Opening Session

09 00

09 10

09 40

10 20

Welcome and Opening Remarks

Introduction to the conference location „Oud-Sint Jan" and the city of BruggeEva Tahon, Curator of Oud-Sint Jan, Memling Museum, Museum of Our Lady of the Pottene, Belgium

Keynote Address: From the hell of physics to the heaven of Ambient IntelligenceEmile Aarts, Philips Research, The Netherlands

Keynote Address: Beyond Moore's law: Package level integrationCarlo Cognetti, STMicroelectronics, Italy

11.00-11.20 i^fimm^t^m^m^^mm^m^m^

Ambassador MONDAY, JUNE 13

SESSION 1: Manufacturing Technologies I

Chairmen Gordon P (Hungary) - Kurzweil K (France)

11.20 High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer

bumping technology

Pudas M \ Hagberg J \ Leppavuon S \ Vahakangas J.1, Manessis D2, Patzelt R2, Ostmann

A3, Reichl H3 -1University of Oulu, Finland, Technical University Berlin, 3Fraunhofer Institute

for Reliability and Microintegration (IZM), Germany

11 45 A study on waving mechanism and reliability of chip on film (COF) packageChung CL1, Fu SL\ Huang H2, Kuo D2, Lin SJ2, Huang HS2, Lu TB2 - 1l-Shou

University, 2ChipMOS Technologies Inc,Taiwan

12 10 Measurements and modeling of thickness distribution to improve the uniformity of

evaporated thin films

Balogh B, Farkas C, Harsanyi G, Illyefalvi-Vitez Z, Levies R - Budapest University of

Technology and Economics, Hungary

12.35 Lead-free assemblyGanesan S

,Pecht M - University of Maryland, USA

SESSION 2: Power

Chairmen Muller J (Germany) - \la\ev S (Russia)

11 20 Properties evaluation of ALSIC TPG test product

Occhionero M A, Adams RW - Ceramics Process Systems Corp, USA

11 45 Fabrication and evaluation of miniaturized CSP power transistors

de Samher M \ van Grunsven E.\ van den Ackerveken T.\ Heyes D2 - 'Philips Center for

Industrial Technology, The Netherlands, 2Philips Semiconductors, UK

12 10 High performance power conversion using planar interconnect technologyFillion R A, Bauer C2, Delgado E \ Beaupre R.1, McConnelee P1 - 1GE Global, ^TechLead

Corp, USA

12 35 Development of low power 700°C microheater in low temperature cofire ceramic

Jones W K, Reddy S, Wang J. - Florida International University, USA

SESSION 3: 3D Packaging SESSION 4; Optoelectronic Packaging Poster Session I

Chairmen Barneah U (Israel) - Rames JC (France)

14.00 Stacked Die Technology Solutions for wCSP

Memory Packages

Liu H,Tan H B

, Chong D,Win P., Teo J., Wang C.K. -

United Test and Assembly Center Ltd, Singapore

14.25 System integration issues for stacked 3D packageKaija K

, Mantysalo M , Miettmen J,Ristolainen EO.-

Tampere University of Technology, Finland

14.50 Technology for embedding active dies

Ostmann A ', De Baets J 2, Knechbaum A3, Kostner H *,Neumann A' - Fraunhofer IZM, 2IMEC, 3AT&S,"Datacon, "TU Berlin, Germany

15.15 Advanced-chip-to-wafer technology: enabling tech¬

nology for volume production of 3D system integra¬tion on wafer level

Scheiring C ', Kostner H ', Lindner P2, Pargfneder S.2 -

'Datacon Semiconductor Equipment, Austria; 2EV

Group

Chairmen. Delrosso G (Italy) - Smnadurai N (UK)

14 00 Die-to-wafer molecular bonding for optical inter¬

connects and packagingKostrzewa M.\ Di Cioccio L \ Zussy M1, Roussin J C \Fedeli J M1, Kernevez N \ Regreny P.2 - 'CEA-DRT-LETI / DIHS-CEA / GRE; 2Ecole centrale de Lyon,France

14 25 In-situ fabrication of micro-optical elements in

transparent encapsulants with excimer laser-abla¬tion

Naessens K,Rits O

,Bockstaele R

,Baets R. - Ghent

University, Belgium

14.50 Low-cost optoelectronic packages: development of

a fast alignment technique and a stable bondingprocess for single-mode optical fibers

PliskaAC, Kunde J \ Grossmann S\ Bosshard Ch.\Battig R2, Pawlik S2, Saintenoy S2, Schmidt B2 -

'CSEM SA, 2Bookham, Switzerland

15.15 Packaging solution with a 3-dimensional couplingscheme for direct optical interconnects to the chipRits O., Bockstaele R., Naessens K, Baets R - Ghent

University, Belgium

Chairmen- Bruinsma N (The Netherlands) - De Baets J (Belgium)A tour of the posters will be made. The poster presenterswill give further comments on their work

1 Low stress, high strength isotropic conductive film adhesive

for large area bonding of thermally mismatched substratesCollins A , Schuermans J2 - 'Emerson & Cuming, USA, 2Emerson& Cuming, ICI Belgium N V, Belgium

2 Development of silicon ball grid array packageRudakovVI1, PlisN I2, MochalovB V, RomanovA.A2-'Russian

Academy of Sciences, MSC «Angstrem», Russia

3 Steady state electro-thermal simulations of digital CMOScircuits

Golda A, Kos A - AGH University of Science and Technology,Poland

4 Thermomechamcal stressing of microelectronic structures

Novotny M - Brno University ofTechnology, Czech Republic

5 Ball-bonding process robustification with regard to space

applicationsUbon S P, Paelmck P, Goffin B -Alcatel ETCA, Belgium

6 Effect of two different thermal cycle profiles on the reliabilitybehavior of lead-free solder jointsAndersson C'2, Andersson DR", Tegehall PE'3, Liu J'" -

'Swedish Microsystem Integration Technology (SMIT) Center,aCfia/mers University of Technology, Mo/ndal, Sweden, 3lVF

Industnal Research and Development Corporation, Sweden

7 Needs and challenges for partnerships and joint develop¬ments in advanced packagingPieters P - IMEC, Belgium

8 New investigations of high performance 'PCB' structures for

signal integrity complianceCodreanu N D, Svasta P, lonescu C - Politehnica University of

Bucharest, Romania

9 Tantalum and niobium capacitors: technology and character¬istic parameters comparisonSikula J ', Sedlakova V1, Hoesch P2, Sita Z3, Zednicek T3 - 'Brno

University of Technology, 2Charles University, 3AVX, Czech

Republic

10 Investigation of lead-free solder joints reliability by thermal

modellingBulva J, Szendiuch ! - Brno University of Technology, Czech

Republic

SESSION 5: Interconnection Technologies SESSION 6: Quality & Reliability I IMECAT SESSION

Chairmen: Codreanu N. (Romania) - van Veen C. (The Netherlands)

16.20 Lead free assembly of fine pitch wafer level CSPs

Boulanger R., Meilunas M., Borgesen P. - Universal

Instruments Corp., USA

16.45 Development and evaluation of photodefined ele¬

ments for microwave modules in LTCC for space

applications

Perrone R., Driie K.H., Thust H., Trabert J., Hein M. -

TU llmenau, Germany

17.10 Ultra-fine pitch flip chip for high I/O die

Bauer C.E.\ Neuhaus H.J.2, Jain W.F.3, Taran A.4 -

'TechLead Corp.; 2Scitv1axx Solutions Inc., USA;

3Chipbond Technology Corp., Taiwan; "Microelectronic

Assembly Innovations, Russia

17.35 Packaging approach for nano CMOS wiringBalachandran J.1, Brebels S.\ Carchon G.\ De Raedt

W.1, Nauwelaers B.2, Beyne E.' - 'IMEC; 2Katholieke

Universiteit Leuven, Belgium

Chairmen: Detemmerman D. (Belgium) - Nemeth P. (Hungary)

16.20 Essential new process control tools for scanningacoustic microscopyHoward A.M.', Clement A.2, Vanderstraeten D.3,Waldron F.4 - Towcester Technical Services, UK;2STMicroelectronics, France; SAMI Semiconductor,Belgium; "National Microelectronics Research Centre,Ireland

16.45 Electrical characteristics of an epoxy resin at hightemperatures (400°C), and their dependence on

thermal agingGonon P., Boudefel A., Nemamcha M. - Lab. for

Electrostatics and Dielectric Materials, French National

Center for Scientific Research and University of

Grenoble, France

17.10 High temperature degradation of wire bonds in

commercial plastic encapsulated microcircuits

Teverovsky A., Sharma A. - NASA/GSFC, USA

17.35 A novel test data acquisition system for vibration

testing of daisy chained assemblies

Urbanski K.\ Falat T.', Felba J.', Ganesan S.2, Pecht

M.z - 'Wroclaw University of Technology, Poland;

University of Maryland, USA

Chairman: Vanfleteren J. (Belgium)

FP5-CSG-IMECAT: introduction and highlights of

an EC funded project on lead-free materials and

assembly development technologiesVanfleteren J. - lMEC/TFCG Microsystems, Belgium

Development of a lead-free solder paste

Wiese J. - W.C. Heraeus GmbH & Co KG, Germany

Technological advancements in lead-free wafer-

bumping using stencil printing technologyManessis D.1, Patzelt R.\ Ostmann A.2, Aschenbrenner

R.2, Reichl H.\ Wiese J.3, Modes C.3 - TU Berlin,

Germany; 2Fraunhofer Institute for Reliability and

Microintegration, Germany; 3W.C. Heraeus GmbH &

Co.KG, Germany

Lead-free Flip Chip: a comparison between lead-

free solder and adhesives

Vandecasteele B.', Vanfleteren J.', Manessis D.2,

Ostmann A.2, Hagedom H.W.3, Wiese J.3 - 'IMEC /

TFCG Microsystems, Belgium; 2Fraunhofer Institute for

Reliability and Microintegration, Germany; 3W.C.

Heraeus GmbH & Co.KG, Germany

Thermo-mechanical FEM analysis of lead free and

lead containing solder for Flip Chip applicationsGonzalez M.\ Vandevelde B.\ Vanfleteren J.2,

Manessis D.3 - 'IMEC, Belgium; 2IMEC/INTEC/TFCG,

Belgium; TU Berlin, Germany

Lead-free soldering development for assembly of

complex telecom boards

Schildermans I., Willems G. - Alcatel Bell, Belgium

Lead-free electronic assembly for automotive appli¬cations

Mango M. - Centra Ricerche FIAT, Italy

Development of the lead free soldering process for

portable applications

Maattanen J.'2, Maakannas G.1 - 1Elcoteq Network Co;Tampere University of Technology, Finland

Ambassador

TUESDAY. JUNE 14

Beethoven

SESSION 7: Advanced Packaging

Chairmen Rames JC (France) - van Veen C (The Netherlands)

SESSION 8: MEMS Packaging

Chairmen-Barneah U (Israel) - Valev S (Russia)

09.00 The cross-talk reduction in an RF System on Chip 09.00 Development and verification of a standard packa-through waferscale packaging ging library for advanced MEMS designvan Veen C

,de SamberM.1, Bergveld H J', Whitmore Schropfer G', Keiji Y.2, Maekoba H.2, da Silva M.2 -

M.2, Bartek M.3, Teomim D.4, Ostmann A.5 - 'Philips, The 'Coventor Sari, France, 2Coventor Inc, USA

Netherlands, 2DEK Printing Company Ltd, UK; TU

Delft, The Netherlands, "Shellcase, Israel; TU Berlin,

Germany

09.25 Vertical integration of RF passive components in 09.25 Plasma activated wafer bonding for polymer based

stacked wafer-level packages //-fJuidic MEMS applicationsBartek M, Sinaga S.M., Burghartz J.N. - Delft Pelzer R.L, Farrens S. - EV Group, Austria

University of Technology, The Netherlands

09.50 FCOB: packaging issues for RF-MEMS applications 09.50 Benchmarking different substrates for thick-film

and reliability study sensors of mechanical quantitiesStoukatch S \ Webers T.', Winters C.\ Ratchev P.', Belavic D.\ Hrovat M.2, Santo Zarnik M.\ Cilensek J.2,

Baert K1, Beyne E.\ Oya Y.2, Okubora A.2 - 'IMEC, Jaroslaw K.3, Golonka L3, Dziedzic A.3, Smetana W.4,

Belgium; 2SONY Corp , Japan Homolka H.4, Reicher R.4 - 'HIPOT-R&D; 2Jozef Stefan

Institute, Slovenia; 3Wroclaw University of Technology,Poland; "Vienna University of Technology, Austria

10.15 A new concept for packaging of silicon biosensors 10.15 Hermeticity investigation of sealed 0-level packagesNellissen T, Weekamp W., van Delft J., Ansems W., based on the damping characteristics of the MEMS

Janssen E.

Pnns M, Megens M , Wimberger-Friedl R., device

van lersel B - Philips. The Netherlands Jourdain A \ De Coster J.2, De Moor P.1, Puers R.2,

Tilmans H.A.C - 'IMEC; 2KULeuven, Belgium

GLOBAL BUSINESS COUNCIL SESSION

Chairmen- Detemmerman D (Belgium) - Smnadurai N (UK)

09.00 Creating start-up companies in microelectronic

packaging and interconnection technologyDr. Jos Peeters, Capricorn Venture Partners, Belgium

09.25 The role of Europe in a global microelectronics

economy

Hutton M. - BPA, UK

09.50 Contract manufacturing in Europe - a formula for

success

Barnwell P - Custom Interconnect, UK

10.15 The growing market for SiP

Vardaman EJ. - TechSearch International, USA

10.40-11.20 ^^7^1**̂ ^>c* j*^W *

SESSION 9. Applications SESSION 10. Lead-Free Materials THE CERAMIC INDUSTRY INITIATIVE SESSION

Chairmen GolonkaL (Poland) - MullerJ (Germany)

11 20 Packaging issues for a medical monitoring device

incorporated in a tooth prosthesisVan Ham J ', Claes W' De Cooman M ', Naert I', Van

Lierde C 2 Beckers J L3, Puers R' - 1KU Leuven,

Materialise, 3Uni-Dent N V, Belgium

11 45 A silicon based system in package technologyvan Grunsven E', de Samber M', Burghoom M',Bunel C 2 Chevne D2, Ledam S 2

- 'Philips Centre for

Industrial Technology The Netherlands, 2PhilipsSemiconductors, France

12 10 24 GHZ radar sensor integrates patch antenna and

frontend module in single multilayer LTCC sub¬

strate

Kulke R \ Gunner C', Holzwarth S \ Kassner J \ Lauer

A1, Rittweger M', Uhlig P\ Weigand P2 - 1IMST,2DuPont de Nemours, Germany

12 35 Structuration of micro-fluidic devices based on

LTCC technologyBirol H

,Maeder T, Jacq C

,Straessler S

, Ryser P -

Ecole Polytechnique Federate de Lausanne,Switzerland

Chairmen Gordon P (Hungary) - Osterwinter H (Germany)

11 20 A study of brittle to ductile fracture transition tem¬

peratures in bulk PB-free solders

Ratchev P\ Loccufier T1, Vandevelde B ', Teliszewski

S2, Werkhoven D2, Verhnden B3 - 'IMEC, 2lnterflux

Electronics, 3Katholieke Universitert Leuven, Belgium

11 45 Investigation of the influence of UBM on lead free

flip chip solder fatigue life by explicit finite element

modeling of intermetallic layersLimaye P12, Vandevelde B1, Labie R', Ratchev P',

Beyne E', Vandepitte D2, Verhnden B2 - 'IMEC,2Katholieke Universiteit Leuven, Belgium

1210 On lead-free soldering of QFP, BGA components on

PCBs with different finishes for industrial applica¬tions

Biglan M Jr \ Gernts G2, van Helvoort M3, Sloof W G \Peekstok E', Biglan M H' - 1Mat-Tech BV, 2NewaysAdvanced Applications BV, 3Phi(ips Medical Systems,"Delft University of Technology, The Netherlands

Chairmen Kurzweil K (France) - Muckett S (UK)

11 20 A digital beam-forming antenna module for a

mobile multimedia terminal in LTCC multilayer

technique

Uhlig P et al - IMST, Germany

11 45 MCM-C for 10Gbps optical transmitters

Muukkonen E,Hietala J - Asperation Oy, Finland

12 10 Active cooling technology in packaging of missile

electronic

Refol M - MBDA-F, France

12 35 Effects of joint structures and materials on the reli¬

ability of LTCC/PCB/BGA interconnections

Vahakangas J et al - University of Oulu, Finland

SESSION 11: Flexible Substrates SESSION 12: Electrical Modelling & Signal Integrity Poster Session II

Chairmen Collander P (Finlandl - Norlyng S (Denmark) Chairmen CodreanuN (Romania) - SikulaJ (Czech Republic)

14.00 C1RCONFLEX: an ultra-thin and flexible technology 1400 Electrical characterization of high performancefor RF-ID tagsDekker R ', Dumling M 2, Fock J -H 3, Gourhant 0.",Kubnn R 2, MichielsenTM ', Pohlmann H 3, SchnrttW.3,Tombeur A M H ', Zoumpoulidis T2 - 'Philips Research,The Netherlands; Technical University Hamburg-Harburg "Philips Semiconductors, Germany, "EcoleNationale Supeneure de Physique de Grenoble, France

14 25 ACF flip chip joints on LCP substrates with thin 14.25

chipsFrisk L, Ristoiainen E - Tampere University of

Technology, Finland

memory FBGA BOC packageGospodinova M

,Nan G

,Thomas J

, Subraya R., HeldJ - Infineon Technologies AG, Germany

Lead free assembly: novel electrically conductive

adhesives compatible with 100 % Sn metallisations

Dreezen G, Luyckx G - Emerson & Cuming, (CI

Belgium N.V, Belgium

14.50 Investigation of a laser assisted 3D bending tech- 14.50 Analysis of via structures in 3D packagenology for high density flexible circuits Mantysalo M

,Ristoiainen E O - Tampere University of

Berenyi R, Balogh B

,Gordon P - Budapest University Technology, Finland

of Technology and Economics, Hungary

15.15 High performance, high power, high I/O chip-on-flex 15 15 On-chip RF isolation in stacked wafer-level pack-packaging agesFillion R ', Bauer C E2 - 'GE Global Research Center; Sinaga S M

,Bartek M

, Burghartz J.N - Delft UniversityTechLead Corp ,

USA of Technology, The Netherlands

10

11

Chairmen De Mey G. (Belgium) - Van Daele P (Belgium)

Atour of the posters will be made. The poster presenterswill give further comments on their work.

A micro fluidic electrochemical cell based on micro systempackaging technologies applicable for biosensor developmentpurposes

Harsanyi G, Santha H Berenyi R Balogh B - Budapest UniversityofTechnology and Economics, Hungary45° out-of-plane turning mirrorsfor optical printed circuit boardsVan Steenberge G, Geennck P Van Put S, Hendnckx N, BosnianE, Ottevaere H, Thienpont H, Van Daele P - Ghent University,Belgium

Prediction ofthe radiated emission of an 32 bits microcontrollerBen Dhia S', Sicard E'2, Bouhouch L3, Stemecke T" -

'LESIA/INSA/DGEI; 2EADS CCR, France, 3Ensaof Agadir, Morocco,"Infineon, Germany

Genetic algorithms based methodology for optimizing thermal

performances of micro-channel cooling systems on chipCodreanu C, Codreanu I, Obreja V - National Institute for Researchand Development in Microtechnologies (IMT), Romania

Properties and stability of thick-film resistors with low process¬

ing temperatures - effect of composition and processing

parametersMenot-Vionnet S, Gnmaldi C, Jacq C , Maeder T, Ryser P - Ecole

Polytechnique Federate de Lausanne (EPFL), Switzerland

Surface-mount assembly ofintegrated LTCC micrc-fluidic mod¬

ules - an SMT flow sensor

Foumier Y Birol H,Jacq C, Corradini G, Maeder T, Ryser P -

Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland

Integration of light detection in LTCC fluidic microsystemsStefanow M , Golonka L, Radojewski J, Roguszczak H, Zawada T- Wroclaw University of Technology, Poland

Integration of sensors and electronics in textile foruse in infant

medicine

Hermans B, Coosemans J, Puers R - K U Leuven, Belgium

Quantification and optimization of environmental stability ofTyrePressure Sensors (TPMS) using physico-chemical methods

Tavemier S', Chen J2 van der Wiel A2 'Karel de Grote

Hogeschool vzw, 2Melexis, BelgiumA method to evaluate internal cavity pressure of sealed MEMSdevices

De CosterJ', Jourdain A2, Puers R ' Tilmans H A C2 - 'KULeuven,2!MEC, Belgium

Influence of different types of surfaces of pads on mechanical

properties of electrically conductive adhesives and solders

Duraj A, Mach P - Czech Technical University, Czech Republic

SESSION 13 Materials SESSION 14: Optoelectronic Applications LATE PAPERS SESSION

Chairmen BelavicD (Slovenia) -MuckettS (UK) Chairmen Delrosso G (Italy) - Golonka L (Poland) Chairmen Puers R (Belgium) - Van Daele P (Belgium)

16 20 Photo-resist technology for wafer level packaging 16 20 LTCC-based optical elements for opto-electronic 16 20 Customised thin film goes PCB and high density

and MEMS applications

Topper M, Lopper Ch

,Hauck K, Roder J

,

Baumgartner T, Reichl H - Fraunhofer IZM, Germany

applicationsBuss W', Schreiber P\ Brode W2, Heymel A2,

Bechtold F3, Muller E 3, Bartnitzek T3, Pawlowski B",

Kaschlik K s- 'Fraunhofer Institute IOF, 2SIEGERTTFT,

3VIA Electronic, "Hermsdorfer Institute for Technical

Ceramics, 5Mikrotechnik+Sensonk, Germany

Kaegi D - Reinhardt Microtech, Switzerland

16.45 Dielectric properties of an epoxy/silver nanocom- 16 45 Multilayer optical interconnections integrated on a 16 45 Thermal characterization of pulse-activated micro-

posite for embedded capacitors

Boudefel A, Gonon P, Nemamcha M - Lab for

Electrostatics and Dielectric Materials, French National

Center for Scientific Research, University of Grenoble,

France

printed circuit board

Hendnckx N,Van Steenberge G ,

S., Bosman E, Van Daele P

Belgium

Geennck P, Van Put

- Ghent University,

electronic devices by thermoreflectance-based sur¬

face temperature scanning

Komarov P L, Burzo M G,Raad P E - Southern

Methodist University, USA

1710 Development and processing of an anodic bond-

able LTCC tapeMuller E

,Pawlowski B

,Rothe P, Ehrt R

, Heymel A ,

Weiland A,Kaschlik K - VIA Electronic, Germany

1710 Indium solder bump technology for ultra high den¬

sity interconnects in hybrid image sensors

John J ', de Moor P\ Colin T2, Borgers T1, HooylaertsP2, Van Hoof C '

- 'IMEC, 2XenlCs, Belgium

1710 High performance chip scale package solutions for

image sensor device

Chao YC,Liu J

,Lee YJ

, Chang J, Wang J

,Chou A.,

Yang E,Lu A - ChipMOS Technologies Inc

,Taiwan

17 35 Integrated thick-film hybrid microelectronics 17 35

applied on different material substrates

Jacq C 1 Vionnet-Mennot S \ Maeder T12, Ryser P1 -

'Ecole Polytechnique Federate de Lausanne, 2Sensile

Technologies SA, Switzerland

Direct write technologies for integrated optics

Hughes PJ, Tyndall National Institute, Ireland

17 35 C4NP. next generation lead-free solder bumpingTonnies D - Suss MicroTec Germany

19.00

20 00

Sec>Jf/oW%«/ieTo|wr%f ^§^%.

Ambassador WEDNESDAY, JUNE 15

SESSION 15: Materials & Processing

Chairmen Nemeth P (Hungary) - Norlyng S (Denmark)

09.00 Mesoscale deposition technology

Hedges M,Renn M.2, Kardos M.2 - 'Neotech Services MTP, Germany; 2Optomec Inc,

USA

09.25 Variable Frequency Microwave (VFM) curing of die attach and underfill materials

Fontana F\ Casati D\ Balen E\ Hicks K2, Ahmad I.2 - 'Celestica, Italy, lambda

Technologies, USA

09.50 MyraniteTM for electronics encapsulation and Electro-Magnetic Compatibility

(EMC)Sinnadurai N - ATTAC, UK

10.15 Wafer backside coating of die attach adhesives

Winster A', Hamstra A2, Groenhuis R.2 - 'Ablestik, UK; 2Philips Semiconductors, The

Netherlands

SESSION 16: Quality & Reliability II

Chairmen-DziedzicA (Poland) - Sikula J (Czech Republic)

09.00 Shear property and intermetallic compound (IMC) growth of the Al/electroless

nickel gold under bump metallurgy (UBM)/Iead free solder bumps with multiple

reflow effect

Mohd Salleh M.\ Ahmad I.1, Jalar A1, Omar G.2 - 'Universiti Kebangsaan, 2ON

Semiconductor, Malaysia

09.25 Long-term reliability of "x"BGA solder joints drastically depends on PCB raw

material and design: uvias in pad

Bnzoux M,Leclerc A - Thales Research and Technology, France

09.50 Effect of thick-film materials on the mechanical integrity of high-strength ceramic

substrates

Maeder T., Jacq C, Corradini G, Ryser P - Ecole Polytechnique Federate de Lausanne,

Switzerland

10 15 Electro-migration behaviour of Pb-free flip chip bumps

Labie R, Beyne E - IMEC, Belgium

«L40-11.20 Coffee Break (Marquee)

i^H^MIWW

SESSION 17: Interconnection Substrates

Chairmen: Belavic D. (Slovenia) - Collander P. (Finland)

11.20 DBC (Direct Bonded Copper) substrate with integrated flat heat pipeSchulz-Harder J.*, Dezord J.B.2, Schaeffer C.3, Avenas Y", Puig O.5, Rogg A.', Exel K.1

- 'Curamik, Germany; 2Alcatel Space; 3LEG; 4LEG-ENSIEG; 5CNES

11.45 Development and evaluation of fine line structuring methods for microwave pack¬

ages in satellite applications

Reppe G.\ Muller J.2, Pohlner J.2, Thust H.3, Perrone R.3 - 'RHe Microsystems; 2Micro

Systems Engineering; TU llmenau, Germany

12.10 LTCC modules for a multiple phase shifter with RF-MEMS-switch integrationBartnitzekT, van Dijk Raymond, Muller E. - VIA Electronic Hermsdorf, Germany; TNO-

FEL, The Netherlands

12.35 The 2004 International Electronics Manufacturing Initiative (iNEMI) technologyroadmaps

Aschenbrenner R.', Pfahl R.C.2, Bird J.M.3 - 'Fraunhofer IZM, Germany; 2iNEMI; 3Amkor

Technology Inc

SESSION 18: Manufacturing Technologies II

Chairmen: Dziedzic A. (Poland) - Osterwinter H. (Germany)

11.20 A novel method of fabrication of mixed LTCC-solid ceramics systemsKita J., Rettig R, Moos R. - University of Bayreuth, Germany

11.45 Precise drilling and structuring of LTCC materials using a 355nm YAG-laser

Drue K.H. - Technische Universitat llmenau, Germany

12.10 Integrated magnetics on silicon for power supply on chipO'Mathuna C.\ O'Donnell T.\ Wang N.\ Rinne K.2, O'Sullivan D.3 - 'Tyndall National

Institute; "University of Limerick; "University College Cork, Ireland

12.35 Low cost electronics packaging via 3-D MEMS ink jetSchoeppler M.W., Creach L.T. - Spectra Inc, USA

13.00

13.15

Closing Session

Presentation of best paper and best poster awards

Closing remarks by the Organising Committee and the IMAPS-Europe Liaison Committee

Ul