Embedded Computer Modules and Boards 2016 Product Catalog

Embedded Computer Modules and BoardsExceptional Products. Great Pricing. Total Support.

2016 Product Catalog North America

Technology in Quality

It is estimated that by 2020 over 3 million engineers will be involved in designing applications for the IoT alone—that’s a lot of hardware and software teams working together in a single application. In addition to IoT, other applications like wearables and autonomous vehicles are equally disruptive technologies, and all have made a significant impact on today’s project completion times.

This constant rush to market is forcing developers to re-evaluate their traditional approach to product development: today’s embedded designs are simply too complex to develop in a step-by-step, serial fashion where designers take a hardware design and painstakingly build their software infrastructure around it. One solution is using MCU-based embedded modules (COMs or SOMs), with production-ready BSPs to reduce development time and save on design and manufacturing costs.

We believe that TQ is the industry leader in providing these solutions, and once you discover our superior manufacturing and testing sevices, the advantages of using our modules, our commitment to sustainability, and our broad product line--we think you’ll agree.

If you have any questions or would like to order our modules or one of our starter kits, contact one of our many regional sales representatives in North America.

Sincerely,

Glenn ImOberstegConvergence Promotions LLC

Modules play an integral part in today’s designs

Contents Overview of TQ-Group: The company, products and services ......... 2

TQ Embedded Modules: Overview of features and benefits ........... 3

TQ Modules: When “Standard” isn’t good enough. .................................. 4

Choosing between Architectures ...................................................................... 5

The benefits of selecting a Modular Design versus building an Integrated Solution .......................................................... 6

TQ design, testing and manufacturing services ....................................... 7

The new COMSys: TQ’s new X86 COM Express® Platforms ................ 8

Protecting your investment through Obsolescence Management and Sustainability ....................................... 9

ARM® Low-Power and NXP QorIQ™ ModulesARM® Low-Power and NXP QorIQ™ Modules - Quick Reference .................................................................................................... 10-11

TQMa28 - NXP i.MX28 (ARM926™) Processor-based Module ................................................................................ 12-13

TQMa53 - NXP i.MX537 (ARM® Cortex®-A8) Processor-based Module ................................................................................. 14-15

TQMa335x - TI AM335x (ARM® Cortex®-A8) Processor-based Module ................................................................................. 16-17

TQMa6x - NXP i.MX6 (ARM® Cortex®-A9) Processor-based Module ................................................................................. 18-19

TQMLS102xA - Dual Core ARM® Cortex® -A7 Module with NXP QorIQ™ LS102xA “Layerscape” ............................ 20-21

TQMP1020/2020 - Dual Core NXP QorIQ™ Power Architecture® Module ...................................................................... 22-23

TQMT1042 - Power Architecture® Module with NXP QorIQ™ T1042 Processor ........................................................... 24-25

COM Express® Intel®Atom™ and Intel® Core™ i3/i5/i7 Modules COM Express® Intel® Atom™ and Intel® Core™ i3/i5/i7Modules - Quick Reference ........................................................................... 26-27

TQMxE38M COM Express® Mini Module (Type 10) with Intel® Atom™ E3800 ............................................................................... 28-29

TQMxE38C - Com Express® Compact Module (Type 6) with Intel® Atom™ E3800 ............................................................................... 30-31

TQMx50UC - COM Express® Compact Module (Type 6) with Intel® Core™ i3/i5/i7 5000U ................................................................ 32-33

TQ New Products: RoboDrive high-torque, precision motors for robotics ....................................................................... 34-36

Convergence Promotions Overview: North American Sales and Distribution ................. Inside Back Cover

North American Sales and Technical Support Contact Information ............................................................................ Back Cover

TQ is a global leader in the design and manufacturing of embedded systems modules and electronics assemblies

TQ is one of Germany’s Top 10 Full Service Electronics CompaniesTQ manufactures at six locations in Germany (Seefeld, Durach, Allgäu, Murnau, Peissenberg, Peiting and Wetter an der Ruhr) as well as in Fontaines, Switzerland and Shanghai/China. TQ employs approximately 1,300 people with 150 engineers in electronic development at the following locations: Delling, Chemnitz, Leipzig, Durach and Peiting.

Providing Engineering Solutions for Industrial, IoT, Transportation, Medical, and Consumer Applications

CEM/E²MS System services: We design and produce custom electronic assemblies and ready-to-use units to your specifi-cations from concept to the finished product. We also do the design and construction of your switch gear devices.

OEM Standard Products: TQ embedded modules and Industrial PCs accelerate your time-to-market, and provide the ultimate in design flexibility. We provide modular products and solutions based on the leading MCU architectures, as well as drive systems, industrial and building automation, energy management and other solutions.

ODM Delivering Completed Products to the Marketplace: From automation to traffic engineering, TQ manufactures fin-ished products such as ticket printers for public transportation, central fire alarm systems, computer tomography, aircraft cabin controls, fork lift truck controls, medical devices, photovoltaic systems, control devices for marine engines, and many others.

Certified Quality and DependabilityTQ stands for technology in quality, and that reputation is sup-ported by the following certifications: Quality Management ISO 9001:2008Medical ISO 13485:2012 MDD (guideline 93/42/EWG)Aviation ISO 9100:2009 Automotive ISO / TS 16949:2009 Environmental Management ISO 14001:2004 Recognized Mark Recognized by UL

TQ has been awarded several times for its capacity and business development:n E²MS Award 2013: Winner of the category safeguarding the

future n E²MS Award 2011: Winner of the category Supply Chain

Management n Electronic Service Provider of the Year: 2009, 2007, 2004,

2002 n Best EMS 2015: Winner of the Categories: Obsolescence

Management, Smart EMS, and Leading Edge Manufacturing Technologies

n Best EMS 2012, 2011, 2010 and 2009: Winner of the Category Competence in Development

n Bavaria’s Best 50: 2014, 2008, 2006, 2004, 2002n 2015 Frost and Sullivan Manufacturing Excellence Award

TQ-Group Contact Information:TQ-Group, Gut Delling, Mühlstraße 2, 82229 Seefeld, Germany Phone +49 8153 9308-0 Fax +49 8153 4223 [email protected] or www.tq-group.com

2 www.EmbeddedModules.net

TQ Embedded Modules are easier, less expensive and quicker to deploy in your embedded applications

Top reasons to buy instead of build your modules

It’s easier. Building a new embedded device from the ground up is an enormous challenge and carries a lot of risk. Embedded development can be made much easier by leveraging existing solutions from TQ-Group.

It’s quicker. Deployment of a TQ production-ready module and BSP eliminates 6 to 12 months from your development timeline.

It’s less expensive. Save substantial non-recurring engineering costs by eliminating specification, parts selection, schematic, lay-out, validation and operating system porting efforts, and wireless and other certifications. Use an off-the-shelf TQ-Group module and BSP instead, and get your product to market for less.

For a quick video and tutorial on how to calculate the expenses and resources incurred in buying versus building your next de-sign, go to: www.embeddedmodules.net.

Top reasons to buy modules from TQ-Groupn When size matters: TQ-Group modules have the smallest

footprint of any module in the embedded industry.

n OS Support for Microsoft, Android, Linux, WindRiver, QNX, and other BSPs and Software Partners (OS and BSP Support for Linux is always available).

n Industrial temperature range –25°C to +85°C. Extended tem-perature range -40°C to +85°C also available

n TQ is the leader in obsolescence management and sustain-ability, so we can guarantee your modules will be available for future designs.

n Conformal coating can be added for protection against moisture, dust, chemicals, temperature extremes and harsh environments.

n Easy to install and bring-up starter kits allow you to quickly and inexpensively test and evaluate our modules

n Temperature monitoring for CPU and memoryn Technical Support and Sales offices nationwiden TQ-Group is a NXP Proven Partner, an Intel Platinum Technol-

ogy Provider and a member of the Texas Instruments Design Network, and offers the knowledge and experience to round out the enablement and implementation of total system solutions.

The industry’ssmallest module:The actual size of theTQMa28 picturedhere is only 1.024”wide x 1.576” long.

www.EmbeddedModules.net 3

Order a starter kit today and start workingWe offer a wide selection of starter kits – design platforms you can plug a module onto to enable you to evaluate the easy board bring-up, BSPs, and operation of the module. Each starter kit comes complete with the baseboard, module, power supply, etc. Shown below is the TQMP2020 module alone and being plugged onto the baseboard starter kit.

Convergence Promotions LLC is TQ’s North American Sales and Distribution Partner Convergence Promotions LLC is the embedded industry’s leading provider of partner programs in the embedded indus-try. Through EmbeddedDeveloper.com, a joint venture with Arrow Electronics, and Convergence Promotions LLC, the ARM developer’s site, Convergence reaches the largest audience of embedded developers in the world searching for the right MCUs and development tools.

Our web sites - embeddedmodules.net and convergencepro-motions.com - serve embedded engineers searching for TQ-Group’s unique module solutions in North America.

Coast-to-coast product supportConvergence Promotions LLC maintains sales offices in Northern California, Boston, and in ten locations throughout the United States so we are available to service requests quickly. Our FAEs and design centers are very knowledgeable, helpful, experienced, and available to assist you with any questions or technical assistance.

TQ Modules: When “Standard” isn’t good enough

Having standards are often necessary, but sometimes they do not achieve their purpose. The COM Module standard, for instance, only allows 50% to 70% of the Processor Pins through the DIMM Connector to the System Board. (see diagram below).

With the increasing popularity of the ARM processors from companies such as NXP and TI, each manufacturer has defined its own interfaces. Each manufacturer has a number of common interfaces, but they also all have their own unique interfaces to give them market advantage. For instance, approximately 40% of the I/O in an ARM processor is manufacturer-specific. No standard could be defined to take advantage of all the different I/O or the difference in performance from an ARM9™ to an ARM® Cortex®-A15.

The picture below highlights the problem. Standard X is imple-mented differently by Module Vendor 1 compared to Module Vendor 2. So the rationale for having a standard is destroyed and leads to confusion for the engineer trying to develop their product because they cannot access all the pins available from the processor.

So what is and isn’t available across the currently recognized module standards? The chart below shows why TQ made the decision to bring all the processor pins to the connectors.

The final results is what we call complete Design Freedom. With TQ Modules, designers can have access to 100% of the processor functions to their system board–as the chip developers intended (see diagram below).


> size

Processor

COM–Module

Systemboard

DIMM Connector

50 to 75% of Processor Functions

All Processor Functions

Standard “x”Functions de�ned in Standard

Supported Functionsof Module Vendor 1 / Processor 1

Supported Functionsof Module Vendor 2 / Processor 2

used in Standard not used in Standard

TQ modules support all pins andall functions of the processor!!!

Interchangeability is very limitedto a very few functions only!!!

Not all functions aresupported by vendor 1and 2 and each supportsdifferent functions

Func

tion

1Fu

nctio

n 2

Func

tion

3Fu

nctio

n 4

Func

tion

5Fu

nctio

n 6

Func

tion

7Fu

nctio

n 8

Func

tion

9Fu

nctio

n 10

Func

tion

11Fu

nctio

n 12

Func

tion

13Fu

nctio

n 14

Func

tion

15Fu

nctio

n 16

Func

tion

17Fu

nctio

n 18

Func

tion

19Fu

nctio

n 20

. . .

. . .

. . .

. . .

Func

tion

nµP

-Fun

ctio

n y

µP-F

unct

ion

y+1

µP-F

unct

ion

y+3

µP-F

unct

ion

y+3

. . .

. . .

. . .

. . .

. . .

µP-F

unct

ion

y+n

Processor

TQ–Module

Systemboard

< size

Robust Connector

100% of Processor Functions

Available i.MX6 pins300

250

200

150

100

50

0

Function Pinsnot available

TQMa6x DIMM200 Qseven SMARC

265

Function Pins connected throughPHY/Driver

Function Pins available on optional Connector

Function Pins available on Connector

Function Pins for internal Use

Compatibility/Function Availability Check: Is your Module Supplier giving you less functions than you need?The graph on the left shows the func-tions defined in the Standard. It also shows the large number of functions not defined in the Standard, and not available to designers. Both Module Vendor 1 and Module Vendor 2 have varying functions available--but only 50% to 70% of them are accessible to the designer. Only TQ recognizes that access to ALL the processor functions are important to customers, and so TQ makes them all available.

Only TQ allows you to choose Architectures

ARM Architecture

If your application requires:n Temp range: -25°C to +85°C (optional -40°C to +85°C)n Long-term availability 10 Years+n High data throughputn High operating reliability

Optional Requirementsn Small number of product changes / updates allowed n IEEE 1588 n Fieldbus applicationsn Small form factorn Graphics and CANn Wide availability of operating systems


TQ is unique in being able to offer you three processor architectures: ARM®, NXP Power Architecture® and Intel® X86. Now designers can choose the architecture that best suits their application from the features and benefits offered by each. To make the selection easy, we have designed a series of graphs for each architecture, showing their particular attributes and the strengths of each.

Power Architecture

If your application requires:n Full I-Temp range: -40°C to +85°Cn Long-term availability 10 Years+n Highest data throughputn High operating reliability

Optional Requirementsn Small number of product changes / updates allowedn Security engine n IEEE 1588 n Easy connection to FPGAn Small form factorn Graphics not requiredn MS Windows not required

If your application requires:n CPU performancen High-end graphicsn I/O flexibility and performancen Memoryn MS Windows

Optional Requirementsn Big cachen Security enginen Wide range of pin-compatible modules

Intel X86

Buy Vs. Build: The benefits of selecting a modular design or building an integrated solution Embedded modules are the building blocks of the embedded world, and using them alleviates many of the challenges that engineers and project managers face when designing complex applications. Some of the obstacles and costs associated with designing complex computing platforms can be overcome by using an off-the-shelf computing platform, but making the choice to build your own system or buy an embedded module is not often as simple or straightforward as it seems—and each solution has merit.

To help engineers and project managers arrive at the right decision, Convergence Promotions LLC and and TQ-Group have designed a Buy Vs. Build Calculator and an accompanying webinar.

The Buy Vs. Build Calculator The calculator is an on-line tool to help engineers calculate the costs and resources involved in building a program in-house—as opposed to buying one off-the-shelf. The calculator is populated with industry norms for resources and costs associated with all stages of the design and manufacturing process, including concept, hardware and software design, layout design,prototyping, test equipment expenses, etc.

The Buy Vs. Build WebinarThis popular on-demand webinar will show you how to calculate the Buy Vs. Build costs and use the on-line calculator to help you navigate the design phases involved, including: n Concept, selecting memory, interfaces, certificationn Hardware design, reviews, documentationn Layout design, test points, auto-routingn Initial prototyping, BOM costs, test toolsn Software design, BSP and OS selection, validationn Pre-production qualification, testingn Manufacturing costs, etc.n Risk, investment and lifecycle management

At the completion of this 30-minute free webinar you will emerge with the knowledge to accurately calculate whether to buy an embedded module or build an integrated system in-house.

Go to www.embeddedmodules.net to find both the calculator and the webinar.


Each stage of the design process is supported in this calculator, The Buy and Build industry averages are pre-calculated. The calculator shot at the top shows a calculator in the “Concept Phase” (Stage 1) without input. The shot below it shows the calculator with the engineer’s input results. You can see that the Buy and Build averages at the bottom of the calculator have increased.

At the conclusion of the production phase (Stage 9), the calculator will tally up the costs (based on 1000 final units) so the engineer can see the difference between buying a module or building an integrated design. The results will vary depending depending on the complexity of the project and the final production amount.

TQ Modules are designed, manufactured and tested to the highest engineering standards

Comprehensive Design and Electronic Manufacturing Our design capabilities and EMS, (Electronic Manufacturing Ser-vices), are a hallmark of TQ and are provided by our 160 devel-opment engineers in our design centers throughout Europe and the US. Both of these award-winning and internationally recog-nized services are an important component of our business, and provide our expertise and support worldwide.

Our customers can select from the following types of design and manufacturing to meet their strategic goals or cost objectives: n Design for Manufacturing: production optimized designn Design for Testabilityn Design for Longevity n Design for Reliability n Design for Robustness: reliability / low fault rate / longevityn Design for Service: designed for easy maintenance n Design for Environmental impact: an eco-friendly design for

RoHS, REACh, EuP, power, recycling, etc.n Design to Cost targets: designed to meet cost points

Rigid testing guarantees the highest quality products Our rigid testing procedures guarantee we only ship the highest quality products--and we stand behind every product we deliver.

Our extreme testing procedures include: n Electrical stress test (pressure, power, interference immunity)n Temperature stress test (high and low temperatures and fast

temperature change)n Mechanical stress test (vibration, impact load, stability)n Chemical stress test (corrosive gas)n HALT test (Highly Accelerated Life Test: thermic and mechanic stress test)n Longtime temperature test / longevity test (accelerated aging)


The new COMSys: TQ’s Intel® Atom™ and Intel® Core™ technology-based COM Express® Platform From Intel® Atom™ to the latest Intel® Core™ technology, the new TQ COMSys embedded PC platform provides high-end graphics performance, with easy mechanical and thermal integration.

TQ’s modular embedded PC concept banks on standards with a good future. The use of COM Express® modules ensures high availability, since the COM (Computer on Module) standard has worldwide prominence, which ensures that suitable modules are available for each new generation of x86 CPUs.

Since COM Express® modules are equipped with CPUs listed on the Intel® Embedded Roadmap and are thus available for at least seven years, there is no risk designers will constantly have to change devices, because all devices built using the TQ COMSys platform, whether Box PC, Panel PC, or individual embedded PC system, can be delivered with the same configuration or converted to the latest processor technology with minimal effort. This feature guarantees the future of investments and of the ability to meet rising standards.

The COM Express® mainboard (carrier board) MB-COME-1 in combination with a standard COM Express® module forms a very compact hardware kit that can be used for a freely scalable embedded PC platform thanks to its modular design. Because of this – with uniform interfaces and mechanical dimensions – the PC system can be easily adjusted to suit the requirements of the application. The many extension options and storage media that can be added offer a high level of flexibility and allow functionalities and performance to be extended easily, quickly and inexpensively. Typical uses are found in embedded server applications, PC systems for automation, visualization and monitoring and all applications that place high demands on quality, durability and long-term availability.


TQ protects your investment through effective Obsolescence Management and Sustainability

Implementing a lifecycle management strategy to insure continuity of supplyObsolescence is the lack of delivery by the original supply source and the consequent lack of availability due to various in-fluences. The result of obsolescence is that the required product availability, which can exceed 15 years in many business sectors, can no longer be achieved.

“Obsolescence is unavoidable and cannot be prevented but visionary and careful planning can minimize its effects and its potential high costs.”

DIN 62402:2007

To combat this, TQ’s Obsolescence Management program is designed to supply customers with n Products that are available over the long termn Product lifecycles optimized for costn High supply security coming from early risk reduction

Planning for the Short, Medium and Long-Term TQ’s Obsolescence Management strategies include strategies for short, medium and long-term solutions in approaches called the Three Pillar Model of Obsolescence Management. The model allows customers to combine or structure any of the three pillars to meet their strategic objectives.

Summary of TQ Obsolescence Management Customer ServicesIn addition to providing the customary Product Change Notifi-cations (PCNs) and Product Discontinuance Notifications (PDNs) for each customer, TQ offers a Three-Pillar full-service approach to helping plan and implement Obsolescence Management solutions, including:

Reactive Obsolescence Management If you get a discontinuation announcement, the reactive pro-gram offers a series of services including immediately passing on change notices or discontinuations for individual compo-nents, searching for alternatives and substitution, redesign, reverse engineering, and other solutions.

Proactive Obsolescence Management To preclude any unexpected discontinuation and to be able to estimate the current component situation of your systems, we can support you with a variety of proactive services including analysis of the bill of materials where the status and lifecycle

state of each individual component is determined. We also supply information on possible alternatives, vendors with current inventory, and a current average price.

Strategic Obsolescence ManagementThis approach is the most comprehensive and most effective program TQ offers, and includes, among other services:

Component Management: the current availability situation for components already in the development process is analyzed prior to creating bills of materials, allowing components to be selected strategically with regard to long-term product availability.

Obsolescence Management: A plan is designed based on a previous analysis of the bill of materials and is created in parallel with the development effort. During this activity, an overview of the complete system lifecycle is created and all actions that may possibly occur are scheduled. This can then be used to derive a detailed statement of costs. n Customized approach to meet your objectivesn Early identification of at-risk components n Avoidance of unexpected redesigns and re-qualificationsn Elimination of high-cost brokerwaren Overview of the total product lifecycle costn Flexible operating timesn Above-average on-time delivery performance n Highest data quality via active integration into the supply

chainn Direct contact with our OM corporate departmentn Consistency due to clearly defined, stable processes

To receive your copy of the TQ Brochure, Obsolescence Manage-ment: A Strategy and Vision toward the Long-term Availability of Electronic Systems, contact your sales representative.


Component Obsolescence Group

Module

Partner

Processor*

Memory*

System Interfaces

Other Interfaces

Graphics

OS

Power SupplyPower Consump.

Temp.

Size

TQMa28

NXP

i.MX287 ARM926™450 MHz

Up to 256 MB DDR24GB eMMC Flash 64 KB EEPROM

2x Ethernet 10/100 (L2 Switch)1x USB 2.0 High-Speed OTG1x USB 2.0 High-Speed HOST Up to 2x CAN 2.0B Up to 2x I²C Up to 2x SPI Up to 2x SSI/I²S Up to 5x UART

Up to 8x 12-bit ADCCPU JTAG InterfaceGPIOUp to 8x PWM

24-bit TFT Interface

Linux, WinCE 6, QNX

5V

Typically 1W

-25°C to +85°C-40°C to +85°C on request

40 mm x 26 mm

TQMa53

NXP

i.MX537 ARM® Cortex®-A8800 MHz

Up to 1G DDR34 GB eMMC Flash64 KB EEPROM

1x Ethernet 10/100 Mbit (IEEE 1588)1x USB 2.0 OTG2x USB 2.0 Host2x FlexCANESAIUp to 2x I²CSATASPDIFUp to 3x CSPIUp to 3x SSI/I²CUp to 5x UART

CPU JTAG Interface1x 16-bit Camera Interface

Analog VGAParallel 1x 24-bit (RGB) UXGADual LVDS UXGA

Linux, QNX

5V

Typically 3W


55 mm x 44 mm

TQMa335x

Texas Instruments

AM3352/3354/3359 ARM® Cortex®-A8800 MHz

256 MB DDR3L4 GB eMMC Flash64 KB EEPROMUp to 128 MB NOR Flash

Up to 1x Gigabit Ethernet - L2 Switch (IEEE 1588)2x USB 2.0 High-Speed OTGUp to 2x CAN 2.0BUp to 3x I²CUp to 2x McASP (4ch)Up to 2x SPIUp to 6x UART

Up to 8x 12-bit ADCCPU JTAG InterfaceGPIOUp to 3x PWM

24-bit TFT Interface

Linux, QNX, WEC2013

3.3V

Typically 2W


54 mm x 38 mm

TQMa6D

NXP

Dual Core i.MX6ARM® Cortex®-A9800 MHz 1 GB DDR3L4 GB eMMC Flash64 KB EEPROMUp to 128 MB NOR Flash

Up to 1x Gigabit Ethernet (IEEE 1588)1x USB 2.0 High-Speed OTG1x USB 2.0 High-Speed HOSTUp to 2x USB HSICUp to 2x FlexCANUp to 2x I²CSATASPDIFUp to 5x SPIUp to 3x SSI/I2SUp to 5x UARTESAI

CPU JTAG InterfacePCIe

DVI (HDMI)Parallel 2x 24-bit (RGB)Dual LVDS

Linux, QNX, VX Works

5V

Typically 4W


70 mm x 46 mm

TQMa6S

NXP

Single Core i.MX6 ARM® Cortex®-A9800 MHz

512 GB DDR3L4 GB eMMC Flash64 KB EEPROMUp to 128 MB NOR Flash


CPU JTAG InterfacePCIe2x 16-bit Camera Interface



5V

Typically 4W


70 mm x 46 mm

* Different processor speeds and memory sizes are available.

Page 12-13 Page 14-15 Page 16-17 Page 18-19 Page 18-19


ARM® Low-Power and NXP QorIQ™ Modules Quick Reference

TQMa6Q

NXP

Quad Core i.MX6ARM® Cortex®-A9800 MHz 1 GB DDR3L4 GB eMMC Flash64 KB EEPROMUp to 128 MB NOR Flash


CPU JTAG InterfacePCIe



5V

Typically 4W


70 mm x 46 mm

TQMLS102xA

NXP

“Layerscape” LS102xADual ARM® Cortex®-A7Up to 800 MHz Up to 1 GB DDR3LUp to 64 MB NOR Flash64 KB EEPROM

Up to 3x Gigabit Ethernet (IEEE 1588)1x USB 3.0 High-Speed HOST 1x USB 2.0 High-Speed OTGUp to 4x FlexCANUp to 3x I²CUp to 1x SATA 3.0SPDIFUp to 2x SPIUp to 4x SSI/I²SUp to 6x UART

CPU JTAG InterfaceUp to 2x PCIe

LCD (only LS1021A)

Linux

3.3V

Typically 3W

-40°C to +85°C

55 mm x 44 mm

Page 18-19 Page 20-21

* Different processor speeds and memory sizes are available.

Page 22-23 Page 22-23 Page 24-25


ARM® Low-Power and NXP QorIQ™ Modules Quick Reference

TQMP1020

NXP

P1020 Dual Core QorIQ™Power Architecture®

800 MHz

1 GB DDR3128 MB NOR Flash32 KB EEPROM

3x Gigabit Ethernet (IEEE 1588 v2)1x USB 2.0 HOST with ULPI interface2x I²C (max 400 kHz)1x DUART, max 115 kBaud (RS232)1x SPI

JTAG InterfaceUp to 16 GPIO2x PCIe 1.0a 1x TDM2x Serial RapidIO

None

Linux, QNX

3.3V

Typically 3.5 - 5W

-40°C to +85°C

74 mm x 54 mm

TQMP2020

NXP

P2020 Dual Core QorIQ™ Power Architecture®

Up to 1.0 GHz

512 MB DDR3128 MB NOR Flash32 KB EEPROM

3x Gigabit Ethernet (IEEE 1588 v2) 1x USB 2.0 HOST with ULPI interface2x I²C (max 400 kHz)1x DUART, max 115 kBaud (RS232)1x SPI

JTAG InterfaceUp to 16 GPIOLocal bus frequency: 16-bit enhanced/up to 66 MHzUp to 2x PCIe 1.0a1x TDM Up to 2x Serial RapidIO

None

Linux, QNX

3.3V

Typically 5 - 7W

-40°C to +85°C

74 mm x 54 mm

TQMT1042 (Q2 2016)

NXP

T1042 Quad Core QorIQ™ Power Architecture®

1.4 GHz

2 GB DDR3L128 MB NOR Flash32 KB EEPROMUp to 8 GB eMMC Flash (optional)

5x Gigabit Ethernet (IEEE 1588 v2)2x USB 2.0 HOST/Device/ OTG4x I²C (max. 400 kHz)2x DUART, max 115 kBaud (RS232)2x SATA 2.01x eSPI controller

JTAG InterfaceReal-Time Debug Interface (Aurora)Up to 32x GPIOs4x PCIe 2.01x TDM

LCD/TFT (up to 24-bit RGB)

Linux

5V

Typically 5 - 7W

-40°C to +85°C

74 mm x 54 mm

Module

Partner

Processor*

Memory*

System Interfaces

Other Interfaces

Graphics

OS

Power Supply

Power Consump.

Temp.

Size

TQMa28NXP i.MX28 (ARM926™) Processor-based Module

Key Features and Benefitsn NXP i.MX287 (ARM9™) MCU

n Save time and reduce costs with hardware already designed, built and tested

n All processor signals are available on the module connectors

n Rugged and superior performance connectors

n Minimize risk with proven design and production

n Each module is functional and boundary scan tested prior to shipping

n Long-term availability (life cycle management) and support

n Compact size: 1.02” x 1.58” (26mm x 40mm)

n Linux, Win CE 6.0 & QNX BSPs available

n Low-power consumption

The TQMa28 embedded moduleThe TQMa28 module supports the NXP i.MX28 ARM9™ family of processors. The i.MX28 family is a low-power, high-perfor-mance applications processor optimized for the generalembedded industrial and consumer markets. The core of thei.MX280 is NXP’s fast, proven, power-efficient implementation of the ARM926EJ-S™ core, with speeds of up to 454MHz.The memory on the module has been configured to providethe best overall performance. The module is best suited forsmart metering and for easy visualization and control appli-cations. The CPU functionality and the integration of a large number of interfaces on the module enables the module to bedeveloped very cost effectively. All the processor’s functionalityis available on the module connectors.

STKa28 starter kit makes evaluation easyThe STKa28 starter kit is an inexpensive way to test andevaluate the modules before purchasing. See the starter kit details on the TQMa28 specifications page.

When size matters:The TQMa28 has the smallest dimensions of any comparable product in the industry.

Measuring just 1.02” x 1.58”, the TQMa28 is shown here next toa US half-dollar coin.

5 V

Board-to-board connector 160 pins (All CPU functionalities available)

DDR2-SDRAM

EEPROMTemperaturesensor

eMMC Flash

i.MX28

Block Diagram TQMa28

32-bit CPU (ARM926)

12-bit ADC

Graphics / Touch

2x EthernetIEEE 1588

I/OCAN, USB, UART, SDIO


TQMa28 SpecificationsNXP i.MX28 (ARM926™) Processor-based Module

Microprocessor Specificationsi.MX287 (450MHz)

System interfacesUp to 2x Ethernet 10/100 (L2 Switch)Up to 2x CAN 2.0BUp to 5x UART1x USB 2.0 high-speed Host 1x USB 2.0 high-speed OTG1x SDIO/MMCUp to 2x I2CUp to 2x I2SUp to 2x SPIGPIOUp to 8x 12-bit ADC channels (1x high speed)Up to 8x PWM

Graphics24-bit TFT interface

MemoryUp to 256MB DDR2 SDRAM4GB eMMC64KB EEPROM

OtherReal-time clock (RTC)Temperature sensorCPU JTAG interface

Power supply5V

Ambient conditionsStandard temperature range: -25°C to +85°CExtended temperature range: -40°C to +85°C

Plug-in systemBoard-to-board plug-in system: 160 pins (2x 80)

Operating systemsLinux 2.6, Win CE 6.0, QNXAvailable on request: VxWorks

Dimensions1.02” X 1.58” (26mm x 40mm)

Module Ordering informationTQMa28-ACi.MX287@ 450MHz, 128MB DDR2, 4GB eMMC Flash,64KB EEPROM, Boot EEPROM, -40°C to +85°C

TQMa28-ADi.MX287@ 450MHz, 128MB DDR2, 4GB eMMC Flash,64KB EEPROM, Boot EEPROM, -25°C to +85°C

TQMa28-AEi.MX287@ 450MHz, 128MB DDR2, 4GB eMMC Flash,64KB EEPROM, 5V Supervisor, Boot EEPROM, -25°C to +85°C

TQMa28-AFi.MX287@ 450MHz, 256MB DDR2, 4GB eMMC Flash,64KB EEPROM, Boot EEPROM, -25°C to +85°C

STKa28 starter kit makes evaluation easyThe core of the STKa28 starter kit is the TQMa28 with an ARM9 CPU. The components contained in the starter kit constitute a modular system enabling you to develop your own product ideas, and is an inexpensive way to test and evaluate the mod-ule before purchasing. Developing your own hardware using the qualified circuit components will reduce project timescales and development of graphic interfaces can be started imme-diately using the supported display unit (available separately). The photo below shows how a module fits onto the top of the evaluation platform.

Starter Kit Ordering informationSTKa28-ADSTKa28 (Eval Kit) with TQMa28-AD, i.MX287 / 450MHz, 128MBDDR2, 4GB eMMC Flash, 64KB EEPROM, Boot EEPROM, TTL Graphic Interface, 4 Wire Touch, LVDS Graphic interface, 1x RS232, 1x RS485, GPIO 4x In / 8x Out, 2x CAN 2.0B isol., 2x USB 2.0 Host, 2x ETH 10/100, Stereo Out, Mono Mic In, RTC, tem-perature sensor, reset button, SD Interface, JTAG, Starterkit PIN header, power supply, 2GB SD Card, null modem cable, module extraction tool

STKDT070-AA7” touch-display, WVGA 800x480, 300cd, touch pen, cable set


TQMa53NXP i.MX537 (ARM® Cortex®-A8) Processor-based Module

Key Features and Benefits

n NXP i.M537 (ARM® Cortex®-A8) MCU








n Linux & QNX BSPs available, Android and Win EC7 upon request


The TQMa53 embedded moduleThe TQMa53 module supports the NXP i.MX53 Cortex-A8 family of processors with a clock speed of up to 1.2GHz.The i.MX53 family is a NXP Energy-Efficient Solutionsproduct and is optimized for both performance and powerto meet the demands of high-end, advanced applications.Ideal for a broad range of applications in the consumer, auto-motive, medical and industrial markets, the i.MX53 includesan integrated display controller, full HD capability, enhancedgraphics and connectivity features.

The TQ module is available with the i.MX537 which is targetedat a wide range of applications that require rich userinterfaces with high color displays, such as patient monitorsand human-machine interfaces (HMI).

STKa53 starter kit makes evaluation easyThe core of the STKa53 starter kit is the TQMa53 with the i.MX537 CPU from NXP. The starter kit is an inexpensive way to test and evaluate the modules before purchasing. See the start-er kit details on the TQMa53 specifications page.

5 V

Board-to-board plug-in system 240 pins

DDR3-SDRAM

EEPROM

RTC

Power

eMMC Flash

SATA

Camera IF

EthernetIEEE 1588

Core @ 800Mhz (1-1.2GHz Consumer)32KB i/d cache, 512KB L2 Cache

Cortex™-A8(i.MX53)

Block Diagram TQMa53x

Vector Floating Point Unit

Secure Boot (HAB), cryptographic accelerators

Graphic1600 x 1200 SDIO/MMC

2xCAN

Local Bus USB 2.0 I2S, I2C, SPI UART


TQMa53 SpecificationsNXP i.MX537 (ARM® Cortex®-A8) Processor-based Module

Microprocessor Specificationsi.MX537 (up to 800MHz)

System interfaces1x Ethernet 10/100 Mbit (IEEE 1588) 2x FIexCANUp to 5x UART2x USB 2.0 high-speed Host 1x USB 2.0 high-speed OTGPeriphery interfacesWEIM Bus (optional WEIM bus or parallel 24-bit graphic interface usable)Up to 3x SDIO/MMCUp to 2x I2C, Up to 3x CSPI, Up to 3x SSI/I2CESAI1x 16-bit Camera I/FSATA, SPDIF

GraphicAnalog VGAParallel 1x 24-bit (RGB) UXGA (optional WEIM bus or parallel 24-bit graphic interface usable)Dual LVDS UXGA

MemoryUp to 1GB DDR3 SDRAM4GB eMMC Flash64kB EEPROM


Power supply5V


Dimensions2.17” x 1.73” (55mm x 44mm)

Plug-in systemBoard-to-board plug-in system: 240 pins

Operating systemsLinux, QNXAvailable upon request: WEC 7, Android

Module Ordering informationTQMa53-AAi.MX537 / 800MHz, 4GB eMMC Flash, 512MB DDR3, 64kB EEPROM, -25°C to +85°C

TQMa53-ABi.MX537 / 800MHz, 4GB eMMC Flash, 1GB DDR3, 64kB EEPROM, -25°C to +85°C

TQMa53-ADi.MX537 / 800MHz, 4GB eMMC Flash, 512MB DDR3, 64kB EEPROM, 5V Supervisor, -25°C to +85°C

Starter kit makes evaluation easyThe core of the STKa53 starter kit is the TQMa53 with the i.MX537 CPU from NXP. With the preconfigured starter kit you can start immediately with the development of your application in order to achieve a fast time-to-market. To develop your own hardware you can use the certified and qualified circuit compo-nents of the starter kit in your own designs. A large accessory kit enables the connection of commercial monitors. Different dis-play solutions for a direct connection to LVDS / TTL are available upon request. The photo below shows how a module fits onto the top of the evaluation platform.

STKa53-AA Starter Kit Specs: Key Functionality:i.MX537 running at 800MHz 2x Ethernet 10/1004GB eMMC Flash 4x USB 2.0 (3x Host & 1x OTG) 512MB DDR3 1x Dual LVDS64kB EEPROM 2x CAN 2.0B Linux, QNX

Module and Starter Kit Ordering informationSTKa53-AASTKa53 (Eval Kit) with TQMa53-AA, i.MX537 / 800MHz, 512MBDDR3, 4GB eMMC Flash, 64KB EEPROM, 1x RS232, 1x RS485,2x CAN 2.0B separated, 3x USB 2.0 Host, 1x USB 2.0 OTG, 2xETH 10/100, CRT, Dual LVDS, Line Out, SATA, Mono Mic In, Line In, RTC, temperature sensor, reset button, SD interface, power supply,2GB SD card, null modem and USB cable


TQMa335xTexas Instruments AM335x (ARM® Cortex®-A8) Processor-based Module


n TI AM335x (ARM® Cortex®-A8) MCU







n Compact size: 2.13” X 1.58” (54mm x 40mm)

n Linux, WEC 2013 & QNX BSP available, VxWorks & Android upon request


The TQMa335x embedded moduleThe TQMa335x module supports the TI AM335x Cortex-A8family of processors. The AM335x family is optimized forPOWERVR SGX Graphics Accelerator subsystem for 3Dgraphics acceleration to support display and gaming effects.

Programmable Real-Time Unit and Industrial CommunicationSubsystem (PRU-ICSS) allows independent operation from the ARM processor. PRU-ICSS enables real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Ideal for home automation, industrial automation, enterprise/educational tablets, portable navigation devices and networking.

STKa335 starter kits make evaluation easyThe core of the STKa335 starter kit is the TQMa3359 with an ARM® Cortex®-A8 CPU. The starter kit is an inexpensive way to test and evaluate the modules before purchasing. See the start-er kit details on the TQMa335x specifications page.

3.3 V

Board-to-board plug-in system 240 pins (All CPU functionalities available)

DDR3L-SDRAM NOR Flash

EEPROM

RTC Power

eMMC Flash

ADC2xSPI

2xMcASP

SDIO/MMC

2xCAN

6xUART

3xI2C

2xUSB 2.0

GPIOPWM2x Gigabit

Ethernet IEEE 1588

Graphics24-bit (WXGA)

ARM® Cortex™-A8 Core@ 800MHz

EthetCAT®, Pro�net®,2xMII, UART, Timer, eCap

AM335x


256KB L2 Cache w/ECC

32KB/32KB L1 Cache w/SED

2x PRU-ICSS@ 200MHz


TQMa335x SpecificationsTexas Instruments’ AM335x (ARM® Cortex®-A8) Processor-based Module

Microprocessor SpecificationsAM3352, AM3354, AM3359 (Up to 800MHz)

System interfacesUp to 2x Gigabit Ethernet (L2 switch)Up to 2x CAN 2.0BUp to 6x UART2x USB 2.0 high-speed OTG interfaceUp to 2x SDIO/MMCUp to 3x I2CUp to 2x McASP (4ch)Up to 2x SPIGPIOUp to 8x 12-bit ADC channelsUp to 3x PWM

Graphic interface24 bit TFT Interface

MemoryUp to 512MB DDR3L-SDRAMUp to 16GB eMMC FlashUp to 128MB NOR Flash64KB EEPROM


Power supply3.3V


Plug-in systemBoard-to-board plug-in system: 240 pins (2x 120)

Operating systemsLinux, QNX, WEC 2013Available upon request: Android, VxWorks

Dimensions2.13” X 1.58” (54mm x 40mm)

Module Ordering informationTQMa3352-AAAM3352 / 800MHz, 256MB DDR3L, 4GB eMMC Flash, 64KB EEPROM, -25°C to +85°C

TQMa3354-AAAM3354 / 800MHz, 256MB DDR3L, 4GB eMMC Flash, 64KBEEPROM, -25°C to +85°C

TQMa3359-AAAM3359 / 800MHz, 256MB DDR3L, 4GB eMMC Flash, 64KBEEPROM, -25°C to +85°C

STKa335 starter kit makes evaluation easyThe core of the STKA335 starter kit is the TQMa3359-AAmodule with the TI AM3359 CPU. The starter kit enables you tostart development immediately while evaluating the TQ moduleat the same time. Because all the processor signals are availablefrom the module you will have access to all the featuresand interfaces available on the AM335, and developing yourown hardware using the qualified circuit components will reduce project timescales.

STKa3359-AA Starter Kit Specs: Key Functionality:AM3359 running at 800MHz 2x Gigabit Ethernet256MB DDR3L 4x USB 2.0 (3x Host & 1x OTG) 4GB eMMC Flash 1x LVDS64KB EEPROM 2x CAN 2.0B

Starter Kit Ordering informationSTKa3359-AASTKa335 (Eval Kit) with TQMa3359-AA, AM3359 / 800MHz, 256MB DDR3L, 4GB eMMC Flash, 64KB EEPROM, 1x RS232, 1x RS485, 2x CAN 2.0B isol., 3x USB 2.0 Host, 1x USB 2.0 OTG, 2x Gigabit Ethernet (1x EtherCat), Stereo Out, 1x LVDS, PCIe (USB), Mono Mic In, RTC, temperature sensor, reset button, SD inter-face, power supply, 4GB SD card, accessories, cable


TQMa6xNXP i.MX6 (ARM® Cortex®-A9) Processor-based Module


n NXP i.MX6 (ARM® Cortex®-A9) MCU








n Linux BSP, VXWorks & QNX available, Windows Embedded 7 & Android upon request


The TQMa6x embedded moduleThe TQMa6x module supports the NXP i.MX6x Cortex®-A9 family of processors with clock rates up to 4x 800MHz. The i.MX6x family is optimized for high performance energy efficientprocessing in general embedded, automotive, industrialand consumer applications. It can include up to four ARM® Cortex®-A9 cores, HD class video accelerator, Triple Play 3D/2D/VG accelerators, integrated PCI-e and SATA2 controllers, and optimal power savings through a new integrated power management solution that gives the family industry leading power consumption in high performance applications.

STKa6Q starter kit makes evaluation easyThe core of the STKa6Q starter kit is the TQMa6Q module with a Quad ARM® Cortex®-A9 CPU from NXP. The starter kit is an inexpensive way to test and evaluate the modules before purchasing. See the starter kit details on the TQMa6x specifica-tions page.

5 V

Board-to-board plug-in system 360 pins (All CPU functionalities available)


EEPROM

RTC Power

eMMC FlashCamera

IF5xSPI

SATASDIO/MMC

2xCAN

5xUART

3xI2S, I2C

4xUSB 2.0

Localbus

PCIe1x Gigabit

Ethernet IEEE 1588

Graphics1920 x 1200

512KB / 1MBL2 Cache

32KB I Cacheper Core

32KB D Cacheper Core

[email protected]

[email protected]

[email protected]

[email protected]

Cortex-A9Solo/Dual Light/Dual/Quad



TQMa6x SpecificationsNXP i.MX6 (ARM® Cortex®-A9) Processor-based Module

Microprocessor SpecificationsMMCIMX6 Single/Dual/Quad ARM® Cortex®-A9

System interfaces1x Gigabit Ethernet2x FIexCAN1x USB 2.0 high-speed OTG interface1x USB 2.0 high-speed host interfaceUp to 5x UART

Periphery interfacesUp to 2x USB 2.0 High-Speed Inter-Chip (HSIC)WEIM BusUp to 3x SDIO/MMC, Up to 5x SPIUp to 2x I2C, Up to 3x SS1/12SESAI2x 16-bit Camera I/FSATA, PCIe, SPDIF

GraphicDVI (HDMI)Parallel 2x 24-bit (RGB)Dual LVDS

MemoryUp to 1GB DDR3L SDRAMUp to 4GB eMMC FlashUp to 128MB NOR Flash64KB EEPROM


Power supply5V




Operating systemsLinux, VxWorks, QNX Available upon request: Windows Embedded 7, Android

Module Ordering informationTQMa6S-AA: Single Cortex®-A9 / 800MHz, 4GB eMMC Flash, 512MB DDR3L, 64KB EEPROM, -25°C to +85°C (ENET Patch: 2x I2C + ENET-Ping-Patch)

TQMa6S-AB: Single Cortex®-A9 / 800MHz, 4GB eMMC Flash, 16MB NOR Flash, 512MB DDR3L, 64KB EEPROM, -40°C to +85°C (ENET Patch: 1x I2C + 1x I2C3)

TQMa6S-AC: Single Cortex®-A9 / 800MHz, 4GB eMMC Flash, 512MB DDR3L, 64KB EEPROM, -25°C to +85°C (ENET Patch: 1x I2C1 + ENET-Ping-Patch + GPIO)

TQMa6U-AA: Dual Lite Cortex®-A9 / 800MHz, 4GB eMMC Flash, 1GB DDR3L, 64KB EEPROM, -25°C to +85°C (ENET Patch: 2x I2C + ENET-Ping-Patch)

TQMa6D-AA: Dual Cortex®-A9 / 800MHz, 4GB eMMC Flash, 1GB DDR3L, 64KB EEPROM, -25°C to +85°C, (ENET Patch: 2x I2C + ENET-Ping-Patch)

TQMa6D-AB: Dual Cortex®-A9 / 800MHz, 4GB eMMC Flash, 16MB NOR Flash, 1GB DDR3L, 64KB EEPROM, -40°C to +85°C, (ENET Patch: 1x I2C + 1x I2C3)

TQMa6D-AC: Dual Cortex®-A9 / 800MHz, 4GB eMMC Flash, 1GB DDR3L, 64KB EEPROM, -25°C to +85°C (ENET Patch: 1x I2C1 + ENET-Ping-Patch + GPIO)

TQMa6Q-AA: Quad Cortex®-A9 / 800MHz, 4GB eMMC Flash, 1GB DDR3L, 64KB EEPROM, -25°C to +85°C (ENET Patch: 2x I2C + ENET-Ping-Patch)

TQMa6D-AB: Quad Cortex®-A9 / 800MHz, 4GB eMMC Flash, 16MB NOR Flash, 1GB DDR3L, 64KB EEPROM, -40°C to +85°C, (ENET Patch: 1x I2C + 1x I2C3)

TQMa6Q-AC: Quad Cortex™-A9 / 800MHz, 4GB eMMC Flash, 1GB DDR3L, 64KB EEPROM, -25°C to +85°C (ENET Patch: 1x I2C1 + ENET-Ping-Patch + GPIO)

STKa6Q starter kit makes evaluation easyThe core of the STKa6Q starter kit is the TQMa6Q module witha Quad ARM® Cortex®-A9 CPU from NXP.

Starter Kit Ordering informationSTKa6Q-AASTKa6x (Eval Kit) with TQMa6Q-AA, Quad Cortex®-A9 CPU / 800MHz, 1G DDR3L, 4GB eMMC Flash, 64KB EEPROM, 1x RS232, 1x RS485, 2x CAN 2.0B isol., 3x USB 2.0 Host, 1x USB 2.0 OTG, 1x Giga-bit Ethernet, 1x ETH 10/100, DVI (HDMI), 1x mini PC1e, 2x LVDS, sound, RTC, temperature sensor, reset button, SD interface, power supply, 4GB SD card, cables


TQMLS102xADual Core ARM® Cortex®-A7 Module with NXP QorIQ™ LS102xA “Layerscape”


n Integrated Graphics Controller

n QorIQ™ QUICC Engine

n High speed communication via 3x Gigabit Ethernet, 2x PCle and 1x USB 3.0 interface

n Low power consumption (typ. 3 W)

n ECC protection

n Cache Coherent Interconnect bus system

n IEEE 1588 hardware support

n Security functions (optional)

n Extended temperature range

QorIQ™ high speed communication technologycombined with a Dual Core ARM® Cortex®-A7for superior networking and data processing

The TQMLS102xA minimodule is based on the LS102xA pro-cessor from NXP, and combines the ARM® core Architecture with the QorIQ™ high speed communication technology. The integrated graphics controller supports applications with display and touch.

For various applications such as networking, industrial automa-tion and controls with requirements for fast and secure data processing, there are three CPU variants available:QorIQ™ LS1020AQorIQ™ LS1021AQorIQ™ LS1022A

The Dual Core ARM® Cortex®-A7 core provides a cache Coher-ent Interconnect bus system and a clock rate up to 2 x 1.0 GHz, guaranteeing the embedded module provides a balanced ratio between high performance and power dissipation.

Block Diagram TQMLS102xA

[email protected] GHz Neon Dual Cortex-A7 [email protected] GHz Neon

32 KB I/D L1 Cache 32 KB I/D L1 Cache512 kB CoherentL2 Cache

128 KB SRAMCache Coherent Inerconnect (CCI 400)

QUICC Engine - HDLC/TDM/PB QUICC Engine - HDLC/TDM/PB

2x SPI

2x PCIe

4x I2S, 3x I2C

SATA 3

3x GbE

USB 2.0/ 3.0

Graphics

SDIO/MMC

4x CAN

6x UART


EEPROMECC ProtectionL1/L2

RTC Power

eMMCPower

Management

Board-to-board connector 280 pins (All CPU functionalities available)

3.3 V


TQMLS102xA SpecificationsDual Core ARM® Cortex®-A7 Module with NXP QorIQ™ LS102xA “Layerscape”

MicroprocessorQorIQ™ LS1020A, LS1021A, LS1022A

System interfacesUp to 3x Gigabit Ethernet (IEEE 1588)Up to 4x FlexCANUp to 3x USB 2.0 high speed OTGUp to 1x USB 3.0 high speed HOSTUp to 6x UART

Periphery interfacesUp to 1x SDIO/MMCUp to 3x I²CUp to 2x SPIUp to 4x I²SUp to 1x SATA 3.0Up to 2x PCIeSPDIF

GraphicsLCD interface (only LS1021A)

MemoryUp to 1GB DDR3L SDRAMUp to 64MB SPI NOR FlashUp to 1GB eMMC 64kB EEPROMECC protection (only LS1020A, LS1021A)

Other FeaturesReal-time clock (RTC)Temperature sensorCPU JTAG interfaceExtended power management (optional)Voltage monitoring (optional)

Power supply3.3 V

Ambient conditionsExtended temperature range: -40°C to +85°C

Dimensions55 mm x 44 mm


Operating systemsLinux Available upon request: VxWorks, QNX, PikeOS

Module Ordering informationTTQMLS1020A-AALS1020A @ 800MHz, 64MB NOR Flash, 1GB DDR3L, 64kB EEPROM, -40°C to +85°C

TQMLS1020A-ABLS1020A @ 800MHz, 64MB NOR Flash, ECC, 1GB DDR3L, 64kBEEPROM, -40°C to +85°C

TQMLS1021A-AALS1021A @ 800MHz, 64MB NOR Flash, 1GB DDR3L, 64kB EEPROM, -40°C to +85°C

TQMLS1021A-AALS1021A @ 800MHz, 64MB NOR Flash, ECC, 1GB DDR3L, 64kBEEPROM, -40°C to +85°C

TQMLS1022A-AALS1022A @ 600MHz, 64MB NOR Flash, 512MB DDR3L, 64kBEEPROM, -40°C to +85°C

STKLS102xA Starter Kit Ordering informationThe core of the STKLS102xA set is the TQMLS102xA Dual Core ARM® Cortex®-A7 module with NXP QorIQ™ LS102xA “Layer-scape”. The components contained in the starter kit constitute a modular system enabling you to develop your own designs. Development of graphic interfaces can be started immediately using the prepared combination of a closed display unit and starter kit that are matched to each other.

STKLS102xA-AA Starter KitSTKLS102xA with TQMLS102xA-AA, Dual ARM Cortex-A7/800 (600) MHz, 1 GB DDR3L, 64 MB Quad NOR Flash, 64kB EEPROM, 1x RS232, 1x RS485, 2 x CAN 2.0B separated, 3x USB 2.0 HOST, 1x USB 3.0 OTG, 3x Gigabit Ethernet, LCD Port, 1x HDMI, LVDS, 1x PCIe, 1x Mini PCIe, RTC, temperature sensor, reset button, SD interface, power supply, 4GB SD card, cable


TQMP1020/2020Dual Core NXP QorIQ™ Power Architecture® Module

Key Features and Benefitsn NXP TQMP1020/2020 QorIQ™ P1/P2 platform MCU








n Linux and QNX BSPs available

n IEEE 1588 synchronization in hardware

The TQMP1020/2020 embedded modulesThe TQMP1020/2020 embedded modules are the newestgeneration of the well-known PowerQUICC III TQM85xxmodule family. The P1 and P2 NXP QorIQ™ processor family opens up the possibility of designing new industry and communications applications.

With two e500 cores and clock speeds ranging from 2x 800MHz to 2x 1000MHz, the TQ module with its QorIQ™ processors, offers an optimal balance between data processing speed and power dissipation.

Because of the 4nm technology, power consumption ismarkedly lower than in other PowerQUICC III modules.

This along with the extended temperature range means thatit can be fitted to fanless systems. The TQMP2020 moduleis ideally suited to industrial applications where long-termavailability, outdoor ambient temperatures and small sizes are important factors.

STKP2020 starter kit makes evaluation easyThe STK2020 starter kit supports TQMP20xx and TQMP10xxmodules, and are an inexpensive way to test and evaluatethe modules before purchasing. See starter kit details on theTQMP1020/2020 specifications page.

3.3 V

Board-to-board plug-in system: 360 Pins

DDR3-SDRAM

EEPROM

RTC

Clocking

NOR Flash

Gigbit Ethernet

P2010/P1011 (1 Core)

Block Diagram TQMP1020/2020

System Bus

Local-Bus USB 2.0 SDHC/MMC DUART

Power

32KBL1 I-Cache

32KBL1 D-Cache

32-bit CPU (e500 Core)

32KBL1 I-Cache

32KBL1 D-Cache

32-bit CPU (e500 Core)256KB/512KB

L2-Cache

P2020/P1021 (2 Core)

PCIe


TQMP1020/2020 SpecificationsDual Core NXP QorIQ™ Power Architecture® Module

Microprocessor SpecificationsDual (P1020/P2020) high-performance Power Architecture® e500v2 cores

System interfaces3x Gigabit Ethernet1 USB 2.0 Host3x PCIe 1.0a1x Enhanced Local Bus 16-bit, max. 66MHz2x I2C, max. 400kHz1x SPIDUART, max. 115K Baud (RS232)Up to 16 GPIOs2x Serial Rapid I/O (SRIO)1x TDM

MemoryUp to 1GB DDR3 SDRAM (major expansion stages on request)128MB NOR Flash (major expansion stages on request)32KB EEPROMSimple expansion for example via MMC, SDHC, USB

OtherReal-time clock (RTC)WatchdogJTAG interface

Power supply3.3V

Ambient conditionsStandard temperature range: 0°C to +70°CExtended temperature range: -40°C to +85°C

Plug-in systemBoard-to-board plug in system: 360 pins

Operating systemsLinux, QNXAvailable upon request: VxWorks and more


Module Ordering informationTQMP2020P2020 Dual Core CPU with 2x 1000MHz, 1GB DDR3 SDRAM, 128MB NOR Flash, 32KB EEPROM, -40°C to +85°C

TQMP1020P1020 Dual Core CPU with 2x 800MHz, 1GB DDR3 SDRAM, 128MB NOR Flash, 32KB EEPROM, 0°C to +70°C

STKP2020 starter kit makes evaluation easyThe components contained in the starter kit comprise of a mod-ular system enabling you to develop your own product ideas, and are an inexpensive way to test and evaluate the modulesbefore purchasing. The STK2020 starter kit supports either theTQMP2020 or the TQMP1020. The photo below shows how amodule fits onto the top of the evaluation platform.

Key functionalitiesn 2x PCIe 1.0a upgrading plug-in positions for e.g. - SSD - PCIe-to-SATA cards - Graphic cards

n 3x Gigabit Ethernet ports for maximum I/O performance with IEEE 1588 support for synchronism in time of shared systems in nano seconds range

n Shunts for measuring the power consumption of the module, PCIe slots and of the baseboard. This enables an easy estimation of the power requirement and the dimen- sioning of the cooling connection in the application.

Starter Kit Ordering informationSTKa2020 Starter KitStarter kit with TQ module TQMP2020 or TQMP1020,accessories and documentation.


TQMT1042Power Architecture® Module with NXP QorIQ™ T1042 Processor


n Quad core up to 1400MHz in 28 nm SOI for the best performance per Watt ratio

n High-speed communication via 5x Gigabit Ethernet, 4x PCle and two USB 2.0 interfaces

n Dual SATA interfaces for data storage

n Easy function extensions via PCle, eSPI, I²C and local bus

n IEEE 1588 time synchronization in hardware

n Extremely compact module dimensions

n Display Interface Unit

The New TQMT1042 Delivers Higher Performanceand Less Power Consumption with theNew 64-bit Multicore Processors

The TQMT1042 embedded module embodies the next genera-tion of the well-known TQMP1020/2020 QorIQ™ product family. The QorIQ™ T1 processor family inaugurates new applications in industry and communications.

With four e5500 (64-bit) cores and a clock rate of up to 4x 1400 MHz, the TQ modules using QorIQ™ processors provide the best ratio between processing speed and power loss. The 28 nm technology significantly reduces the power consumption compared to a QorIQ™ module of the former generation.

This feature, together with the expanded temperature range and intelligent power management, enables the use in fan-free systems.

The TQMT1042 is best suited for industrial applications that demand high availability, outdoor ambient temperatures and small overall size.

Block Diagram TQMT 1042

T1022 (2 cores) 256 KB / L3 cache T1042 (4 cores)

64 bit CPU (e5500 core) 256 KBL2

cache32 KB L1D cache

32 KB L1I cache

64 bit CPU (e5500 core) 256 KBL2

cache32 KB L1D cache

32 KB L1I cache

Core™ Coherency Fabric

GigabitEthernet

PCIe SATA 2.0 QUICCEngine

USB 2.0 16b IFC SDXC/eMMC

DUART

Board-to-board connector (All CPU functionalities available)

5 V

RTC Power

Clocking EEPROM



TQMT1042 SpecificationsPower Architecture® Module with NXP QorIQ™ T1042 Processor

Microprocessor SpecificationsQuad T1042 Power Architecture® e5500 cores (64-bit)

System interfaces5x Gigabit Ethernet (with IEEE 1588v2)2x USB 2.0 HOST2x SATA 2.04x PCle 2.04x I²C, max. 400kHz1x eSPI Controller2x DUART, max. 115 kBaud (RS232)Up to 32x GPIOs2x TDM (via QUICC Engine)

GraphicsDisplay controller for TFT LCD displays (up to 24-bit RGB)

Memory2GB DDR3L SDRAM (higher capacities on request)128MB NOR Flash (higher capacities on request)32KB EEPROMSimple expansion for example via MMC, SDHC, USB

OtherReal-time clock (RTC)WatchdogJTAG InterfaceReal-Time Debug Interface (Aurora)

Power supply5V

Ambient conditionsExtended temperature range: -40°C to +85°C

Dimensions74 mm x 54 mm


Operating systemsLinux. Operating systems on requestPikeOS™, VxWorks® and more

Module Ordering information TQMT1042-AA (available Q1 2016)Quad Core T1042 @ 4x 1400MHz, 2GB DDR3L SDRAM, 128MB NOR Flash, 32KB EEPROM, -40°C to +85°C

Starter Kit Ordering information STKT1042 Starter Kit (available Q1 2016)Baseboard and STKT1042 module, 5x Gigabit Ethernet, 1x PCIe 2.0, 1x Mini PCIe, up to 2x SATA, 2x USB 2.0 HOST, 1x USB 2.0 OTG, 2x I2C, 1x RS232, 2x SPI with four chip selects, 2x UART, up to 32 GPIO, 1x LVDS, 1x SDHC, COP/JTAG interface, reset button, 12x DIP switches, bicolor status LED, buffer battery, power sup-ply, module extraction tool


TQMxE38M-AA(Premium I–Temp)

Intel

AtomTM E3845 Quad Core Up to 1.91 GHz

2 MB L2-Cache4 GB DDR3L-1333 ECC (soldered)1x SD Card Interface

1x Gigabit Ethernet (Intel® i210)1x I²C2x SATA 2.0 (up to 3 Gb/s)3x Serial Port (Rx/Tx)1x SPI1x USB 3.03x USB 2.0

1x Intel® HD Audio (HDA)1x LPC Bus3x PCIe 2.0 (up to 5 Gb/s)1x SMBus

Intel® HD Graphics542/792 MHz2x Digital Display Interface (DDI)

TPM 1.2

Linux, Windows

4.75V - 20V

Typically 10W

-40°C to +85°C

COM Express® Mini,Type 10, 84mm x 55mm

TQMxE38M-AG(Premium)

Intel

AtomTTM E3845 Quad Core Up to 1.91 GHz





TPM 1.2

Linux, Windows

4.75V - 20V

Typically 10W

0°C to +60°C


TQMxE38M-AB(Mainstream)

Intel

AtomTTM E3827 Dual Core1.75 GHz





none

Linux, Windows

4.75V - 20V

Typically 8W

0°C to +60°C


TQMxE38M-AF(Mainstream Light)

Intel






none

Linux, Windows

4.75V - 20V

Typically 8W

0°C to +60°C


TQMxE38M-AE(Light)

Intel





Intel® HD Graphics533/533 MHz2x Digital Display Interface(DDI)

none

Linux, Windows

4.75V - 20V

Typically 6W

0°C to +60°C


Module

Partner

Processor

Memory

System Interfaces

Other Interfaces

Graphics

TPM

OS

Power Supply

Power Consump.

Temp.

Size

* Different processor speeds and memory sizes are available.26 www.EmbeddedModules.net


COM Express® Intel®Atom™ and Intel® Core™ i3/i5/i7 Modules - Quick Reference

TQMxE38M-AC(Entry Level)

Intel

Atom™ E3815 Single Core1.46 GHz

512 KB L2-Cache2 GB DDR3L-1066 ECC (soldered)1x SD Card Interface



Intel® HD Graphics400/400 MHz2x Digital Display Interface(DDI)

none

Linux, Windows

4.75V - 20V

Typically 5W

0°C to +60°C


Page 28-29

TQMx50UC-AA(Entry Level)

Intel

Core™ i3-5010U Dual CoreUp to 2x 2.1 GHz

3 MB L2-Cache4 GB DDR3L-1600 (soldered)

1x Gigabit Ethernet (Intel® i218-LM) with IEEE 15881x I²C4x SATA Gen3 (up to 6 Gb/s)2x Serial Port (Rx/Tx)1x SPI2x USB 3.08x USB 2.0

1x Intel® HD Audio (HDA)8x GPIO1x LPC Bus4x PCIe 2.0 (up to 5 Gb/s)1x SMBus

Intel® HD Graphics 5500300/900 MHz2x Digital Display Interface LVDS (18/24-bit, Single/ Dual Channel)

none

Linux, Windows

8.5V - 20V

Typically 10W

0°C to +60°C

COM Express® Compact,Type 6, 95mm x 95mm

TQMx50UC-AB(Mainstream)

Intel

CoreTM i5-5350U Dual Core2x 1.8 GHz / 2.9 GHz Turbo




Intel® HD Graphics 6000300 MHz / 1 GHz2x Digital Display Interface LVDS (18/24-bit, Single/ Dual Channel)

TPM 1.2 / 2.0

Linux, Windows

8.5V - 20V

Typically 10W

0°C to +60°C


TQMx50UC-AC(Premium)

Intel

CoreTM i7-5650U Dual Core2x 2.2 GHz / 3.2 GHz Turbo




Intel® HD Graphics 6000300 MHz / 1 GHz2x Digital Display Interface LVDS (18/24-bit, Single/ Dual Channel)

TPM 1.2 / 2.0

Linux, Windows

8.5V - 20V

Typically 10W

0°C to +60°C


Module

Partner

Processor

Memory

System Interfaces

Other Interfaces

Graphics

TPM

OS

Power Supply

PowerConsump.

Temp.

Size

TQMxE38M-AD(Gateway I-Temp)

Intel

Atom™ E3805 Dual Core1.33GHz

1 GB L2-Cache2 GB DDR3L-1066 ECC (soldered)1x SD Card Interface



none

TPM 1.2

Linux, Windows

4.75V - 20V

Typically 3W

-40°C to +85°C


TQMxE38C-AA(Premium I-Temp)

Intel

Atom™ E3845 Quad Core1.91 GHz




2x Digital Display Interface (DDI)

TPM 1.2

Linux, Windows

4.75V - 20V

Typically 10W

-40°C to +85°C



* Different processor speeds and memory sizes are available. www.EmbeddedModules.net 27

COM Express Intel®Atom™ and Intel® Core™ i3/i5/i7 Modules - Quick Reference

TQMxE38C-AB(Mainstream Light)

Intel

Atom™ E3827 Quad Core1.75 GHz




2x Digital Display Interface (DDI)

none

Linux, Windows

4.75V - 20V

Typically 8W

0°C to +60°C


Page 30-31

TQMxE38MCOM Express® Mini Module (Type 10) with Intel® Atom™ E3800


n Intel® Atom™ E3800 (Bay Trail-I)n Up to 8GB DDR3L with ECC support, solderedn Optimized for ultra-low powern Extended temperature supportn Reach featured uEFI BIOS with easyconfiguration, multi-setup and touch supportn TQMx86 board controller with flexible customization options (flexiCFG)n TPM 1.2 / 2.0n iRTC (highly accurate industrial real-time clock)n “Green ECO-Off” (minimum of standby power)n Watchdog and thermal managementn Highest reliability, 24/7 certifiedn Very robust design, conformal coating capability

The TQMxE38M Mini Module for rugged andextreme environments

The TQMxE38M enables the implementation of powerful and economical x86 based systems and is based on the internation-al established PICMG™ standard COM Express® Mini (COM.0, R2.1).

The type 10 compliant pin-out gives the designer access to all the interfaces of the CPU and the full range of the Intel® Atom™ processor capabilities can be utilized.

Direct access to interfaces like digital display interface (DDI) / embedded DisplayPort (eDP) and the USB device interface gives the user unlimited flexibility to use the features of the CPU to maximize the capabilities of any application.

Features such as low power and extended temperature support, combined with its compact and robust design and options like conformal coating for extreme environments, extends its suit-ability for ruggedized industry, railway and aviation applications.

Block Diagram TQMxE38M

EEPROMSPD

HW Monitor opt. TPM

TQMx86 BoardController

WDog, I2C, UART,Glue, �exiCFG

EEPROMuser

uEFI BIOSFlash

opt.USBPhy

GbECtrl

DDR3L

DDI0 DDI1 PCIe PCIeSATA

USB 3.0USB 2.0

USB 2.0USB ULPI

USB 3.0 DevHDA

SMB LPC

HSUARTGPIO

SPISDCard

Power4.75-20V

DDR3L with ECCsoldered down

EthernetLVDS/eDPDDI0

PCIE 0-2PCIE 3 SATA 0-1

USB 3.0 0USB 2.0 0

USB 2.0 1-3USB 2.0 7 USB 3.0 1

Device HDASMBUS

SD/GPIOSPI (Flash) LPC

LPC

I2CSER 0/1

FAN Ctrl isvdSys/PWR Ctrl

COM Express Module Connector A/B - Type 10 Pin-Out

PCI E

xpre

ss G

en 2

3x1

opt

USB

3.0

(SS)

dev

ice

5MB

SDCa

rd o

r GPI

O

4x G

PO/4

x GP

IO o

pt.

LPC

Intel® Atom™ E3800 Series Intel® Atom™ E3800 Series


TQMxE38M SpecificationsCOM Express® Mini Module (Type 10) with Intel® Atom™ E3800

CPUIntel® Atom™ E3800 (Bay Trail-I)E3805: 2x 1.33GHz, 1MB L2-Cache, 3W, w/o graphicsE3815: 1x 1.46GHz, 512KB L2-Cache, 5WE3825: 2x 1.33GHz, 1MB L2-Cache, 6WE3826: 2x 1.46GHz, 1MB L2-Cache, 7WE3827: 2x 1.75GHz, 1MB L2-Cache, 8WE3845: 4x 1.91GHz, 2MB L2-Cache, 10W

MemoryDDR3L: 2 GB, 4 GB, (8 GB) with ECC supportEEPROM: 32 kbit (24LC32)

Graphics2x Digital Display Interface (DDI) for eDP 1.3, DP 1.1a, DVI, HDMI 1.4a or LVDS (with external converter)

System Interfaces1x Gigabit Ethernet (Intel® i210) (external IEEE1588 sync optional through TQ flexiCFG)1x USB 3.0, 3x USB 2.0, 1x USB 3.0 device

Peripheral Interfaces2x SATA 2.0 (up to 3Gb/s), eSATA capable3x PCIe 2.0 (up to 5Gb/s) (4th lane optional, if no Ethernet)1x LPC bus1x Intel® HD audio (HDA)1x I2C, (2nd I2C optional) (master/slave capable)1x SMBus1x SPI (for exteral uEFI BIOS flash)2x Serial port (Rx/Tx, legacy compatible) (4 wire optional through TQ flexiCFG)1x SD card interface / optional 8x GPIO (multiplexed)

Security ComponentsTPM (SLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0)

Other FeaturesTQMx86 board controller with watchdog and flexiCFGIndustrial real-time clock (iRTC)Hardware monitor

Ambient ConditionsStandard temperature: 0°C to +60°CExtended temperature: -40°C to +85°C

Power SupplyVoltage: 4.75V - 20V 4.75V - 20V Standby (optional) 3V Battery / GoldCAP (optional)Power: typ. 3 - 6W / max. 12W (Green ECO-Off: < 0.1W)

Form Factor / DimensionsCOM Express® Mini, type 10, 84 mm x 55 mm

Ordering InformationTQMxE38M-AA (“Premium I-Temp.”) E3845 (Quad Core, 1.91GHz, 2MB L2-Cache, HD Gfx 542/792 MHz, 10W), 4GB DDR3L-1333 ECC, TPM 1.2, USB 3.0 Device Sup-port (limited driver support), Extended Temp. -40°C to +85°C

TQMxE38M-AG (“Premium”) E3845 (Quad Core, 1.91GHz, 2MB L2-Cache, HD Gfx 542/792 MHz, 10W), 4GB DDR3L-1333 ECC, TPM 1.2, USB 3.0 Device Sup-port (limited driver support), Standard Temp. 0°C to +60°C

TQMxE38M-AB (“Mainstream”)E3827 (Dual Core, 1.75GHz, 1MB L2-Cache, HD Gfx 542/792 MHz, 8W), 4GB DDR3L-1333 ECC, Standard Temp. 0°C to +60°C

TQMxE38M-AF (“Mainstream Light”) E3827 (Dual Core, 1.75GHz, 1MB L2-Cache, HD Gfx 542/792 MHz, 8W), 2GB DDR3L-1333 ECC, Standard Temp. 0°C to +60°C

TQMxE38M-AE (“Light”) E3825 (Dual Core, 1.33GHz, 1MB L2-Cache, HD Gfx 533/533 MHz, 6W), 2GB DDR3L-1066 ECC, Standard Temp. 0°C to +60°C

TQMxE38M-AC (“Entry-Level”) E3815 (Single Core, 1.46GHz, 512KB L2-Cache, HD Gfx 400/400 MHz, 5W), 2GB DDR3L-1066 ECC, Standard Temp. 0°C to +60°C

TQMxE38M-AD (“Gateway I-Temp.”) E3805 (Dual Core, 1.33GHz, 1MB L2-Cache, no Gfx, 3W),2GB DDR3L-1066 ECC, TPM 1.2, iRTC, USB 3.0 Device Support (limited driver support), Extended Temp. -40°C to +85°C

Options: CPU, memory, TPM, iRTC, USB device, special configurations

AccessoriesTQMxE38M-HSP: Heatspreader for TQMxE38M according to the COM Express® specification

TQMxE38M-HSP-LP: Heatspreader for TQMxE38M, lowprofile for very flat designs

Evaluation platform MB-COME10-1: Mainboard for COMExpress® Minimodules, Type 10 Interfaces: DP, eDP/LVDS, 2x Gb Ethernet, 4x USB, USB device, 3x COM, audio, mini PCIe, mSATA, 2.5” SSD, SD card, riser extension with PCIe and USB, fan, debug, 170 mm x 170 mm

TQMx86 software tools For uEFI BIOS programming and to adapt/configure setupdefault values (including multi config), boot logo.


TQMxE38CCOM Express® Compact Module (Type 6) with Intel® Atom™ E3800

Key Features and Benefitsn Intel® Atom™ E3800 (“Bay Trail-I”)n Up to 8GB DDR3L with ECC support, solderedn Optimized for ultra low powern Extended temperature support n Rich featured uEFI BIOS with easy-config., multi-setup and

touch-supportn TQMx86 board-controller with flexible customization options

(flexiCFG)n USB 3.0 device interfacen TPM 1.2 / 2.0n iRTC (highly accurate industrial real-time clock)n ‘Green ECO-Off’ (minimum of standby power)n Watchdog and thermal management

n Very robust design, conformal coating availablen Long term availability (life cycle management) with support

Where CPU performance, large memory requirements and high end graphics are a mustThe TQMxE38C embedded module enables the implementa-tion of a powerful but also economical x86 platform based on the PICMG™ standard COM Express® Compact, 170 x 170 mm COM.0, R2.1. From the type 6 compliant pin out (2x 220 pins) the user has access to all the interfaces of the CPU, so all the fea-tures of the Intel® Atom™ processor can be used. Direct access to interfaces such as the digital display interface (DDI)/embed-ded DisplayPort (eDP) and USB devices gives you the freedom to use the features of the CPU in the way that suits you best.

The compact and robust design as well as the low power consumption, extended temperature and the option to use conformal coating, makes the module suitable for use in rugged environments such as industrial, transportation and aerospace.

Block Diagram TQMxE38C

4.75 - 20 V

DDR3Lsoldered2/4/8 GB

eMMC

EEPROM HW Monitor

UEFI BIOS Flash TPM

Board controller (�exi CFG)12C, 2x UART, GPIO. FAN, Sys, WDog

SPI

SMBusLPC

HDA1x USB 3.0

2x SATA

7x USB 2.0

4x PCIe

Graphics2x DDI/eDP

GigabitEthernet

eDP toLVDS

COM Express Module Connector A/B - 2x 220 Pins Type 6 Pinout

Intel® Core™ E3800 Series

GbE PHY


TQMxE38C SpecificationsCOM Express® Compact Module (Type 6) with Intel® Atom™ E3800

CPUE3827: 2x 1.75GHz, 1MB L2-Cache, 8WE3845: 4x 1.91GHz, 2MB L2-Cache, 10W

MemoryDDR3L-SDRAM: 2GB, 4GB, (8GB) with ECC support, soldered32KB EEPROM (24LC32) 1x SD card interface / optional 8x GPIO (multiplexed)

System Interfaces1x Gigabit Ethernet (Intel® i210) - (external IEEE1588 sync optional through TQ flexiCFG)1x I²C (2nd I²C optional) (Master/Slave capable)2x SATA 2.0 (up to 3Gb/s), eSATA capable2x Serial Port (Rx/Tx, Legacy compatible, 4-wire optional through TQ flexiCFG)1x SPI (for external uEFI BIOS flash)1x USB 3.07x USB 2.0

Other interfaces & busses1x Intel® HD Audio (HDA)1x LPC Bus3x PCIe 2.0 (up to 5Gb/s) 4th lane optional, if no ethernet1x SMBus

Security ComponentsSLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0

Graphic2x digital display interface (DDI) for eDP 1.1a, DVI, HDMI 1.4a or LVDS (18/24-bit, single/dual channel)

Other FeaturesTQMx86 board controller with watchdog and flexiCFGIndustrial real-time clock (iRTC)Hardware monitorSupervisor: Hardware monitor for thermal management

Ambient ConditionsStandard temperature: 0°C to +60°CExtended temperature: -40°C to +85°C

Power SupplyVoltage: 4.75V - 20V 4.75V - 20V Standby (optional) 3V Battery / GoldCAP (optional)Power: typ. 3 - 6W / max. 12W(Green ECO-Off: < 0.1W)

Form Factor / DimensionsCOM Express® Compact, type 6, 95 mm x 95 mm

Ordering InformationTQMxE38M-AA (“Premium I-Temp.”) E3845 (Quad Core, 1.91GHz, 2MB L2-Cache, HD Gfx 542/792 MHz, 10W), 4GB DDR3L-1333 ECC, TPM 1.2, Extended Temp. -40°C to +85°C

TQMxE38C-AB (“Mainstream Light”) E3827 (Dual Core, 1.75GHz, 1MB L2-Cache, HD Gfx 542/792 MHz, 8W), 2GB DDR3L-1333 ECC, Standard Temp. 0°C to +60°C

TQMxE38C-xx Configuration on requestSpecify your requirements for CPU (E38xx), memory, eMMC, interfaces and temperature range

AccessoriesTQMxE38C-HSP Heatspreader for TQMxE38C according to the COM Express® specification

TQMxE38C-HSP-LP Heatspreader for TQMxE38C, low profile for very flat designs

TQMx86 software tools For uEFI BIOS programming and to adapt / configure setup default values (including multi config), bootlogo, etc.

Mainboard MB-COME6-1 Mainboard for COM Express® Compact module, Type 6 Mini ITX format (170mm x 170mm) provides the following interfaces: 2x Gigabit Ethernet (external), 2x USB 3.0 (external), USB 2.0 (2x external, 1x internal), RS232 (1x external, 1x internal), 1x RS422 (internal), 1x mSATA socket (internal), 1x 2.5” HDD/SDD socket (internal), 1x CFast socket (internal), 1x mPCIe socket (with μSD Card socket integrated on board), 2x Display Port (external), 1x LVDS/eDP (internal), 1x audio, 2x fan, optional security TPM 1.2 or TPM2.0, 12V DC power supply


TQMx50UCCOM Express® Compact Module (Type 6) with 5th Generation Intel® Core™ i3/i5/i7 5000U


n Intel® Core™ 5000U series (Broadwell-U) with up to 32GHz / 4MB cachen Up to 16GB DDR3L on board memoryn Best performance per Watt ratio (15W TDP)n Reach featured uEFI BIOS with easy configuration, multi- setup and touch supportn TQMx86 board controller with flexible customization options (flexiCFG)n TPM 1.2 / 2.0n iRTC (highly accurate industrial real-time clock)n “Green ECO-Off” (minimum of standby power)n Watchdog and thermal managementn Highest reliability, 24/7 certifiedn Rugged design / Conformal coating capability

TQMx50UC for Superior Graphics PerformanceLike 3D Scanning and Gesture Control

The TQ compact TQMx50UC is ideal for appplications requiring outstanding CPU and graphics performance. The Intel® Core™ i3, Intel® Core™ i5 and Intel® Core™ i7 processors enable a new wave of innovation with features such as 3D scanning, gesture control, and voice commands.

The integrated Intel® graphics core HD5500/HD6000 guaranties the best graphics experience and supports up to three indepen-dent display interfaces with up to 4K resolution.

With Multi Stream Transport (MST), according to DisplayPort 1.2 standard, it’s possible to drive multiple external HD displays from one single output.

The overall performance benefits from the ultra-fast DDR3L-1600 onboard memory and up to 4MB cache. For industrial applica-tions, the module delivers also high bandwidth interconnection with PCI Express, SATA Gen3, USB 3.0 and Gigabit Ethernet with IEEE 1588 support.

Block Diagram TQMx50UC

8.5 - 20 V

DDR3Lsoldered Bank A

2/4/8 GB

DDR3Lsoldered Bank B

2/4/8 GB

EEPROM HW Monitor

UEFI BIOS Flash opt. TPM

Board controller (�exi CFG)12C, 2x UART, GPIO. FAN, Sys, WDog

SPI

SMBusLPC

HDA2x USB 3.0

4x SATA

8x USB 2.0

4x PCIe

GraphicseDP + 2x DDI

GigabitEthernet

eDP toLVDSeDP

COM Express Module Connector A/B C/D - 2x 220 Pins Type 6 Pinout

Intel® Core™ 5000 U-SeriesCore™ i7-5650U / Core™ i5-5350U / Core™ i3-5010U

GbE PHY


TQMx50UC SpecificationsCOM Express® Compact Module (Type 6) with 5th Generation Intel® Core™ i3/i5/i7 5000U

CPUi3-5010U: 2x 2.1GHz, 3MB Cache, HD5500i5-5350U: 2x 1.8GHz / 2.9GHz Turbo, 3MB Cache, HD6000i7-5650U: 2x 2.2GHz / 3.2GHz Turbo, 4MB Cache, HD6000Hyper-Threading and Virtualization support15W TDP max. (configurable down to 9.5/10W)

MemoryDDR3L-1600: 4GB, 8GB, 16GB, soldered down32KB EEPROM (24LC32)

Interfaces1x Gigabit Ethernet (Intel® i218-LM) with IEEE 15882x USB 3.0 (with USB 2.0 backward compatibility)8x USB 2.0 (incl. USB 3.0 ports)4x SATA Gen3 (up to 6Gb/s)4x PCIe 2.0 (up to 5Gb/s) (4x1 or 1x4)1x LPC bus1x Intel® HD audio (HDA)1x I2C, (2nd I2C optional) (master/slave capable)1x SMBus1x SPI (for external uEFI BIOS Flash)2x Serial Port (Rx/Tx, legacy compatible)8x GPIO

GraphicsThree independent display outputs:2x Digital Display Interface / DP++ with up to 4K @ 60HzLVDS Interface (18/24-bit, Single/Dual Channel), up to 4K (optional eDP 1.3 with 4 lanes instead of LVDS)Intel® Quick Sync Video and Wireless Display support

Additional Components and ControllerTPM (SLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0) TQMx86 board controller with watchdog and TQ flexiCFGIndustrial real-time clock (iRTC) with high accuracyHardware monitor for thermal management

Power SupplyVoltage: 8.5V - 20V 5V Standby (optional) 3V battery / GoldCAP on carrier (optional)Power: typ. 10W / max. 18W (Green ECO-Off: < 0.1W)

EnvironmentStandard Temperature: 0°C to +60°CExtended Temperature: -40°C to +85°C (on request)

Form Factor / DimensionsCOM Express® Compact, type 6, PICMG COM.0 R2.195 mm x 95 mm

Ordering InformationTQMx50UC-AA (Entry Level) Intel Core i3-5010U (2x 2.1GHz, 3MB Cache, HD5500 Gfx), 4GB DDR3L-1600, Standard temperature 0°C to +60°C

TQMx50UC-AB (Mainstream) Intel Core i5-5350U (2x 1.8GHz / 2.9GHz Turbo, 3MB Cache,HD6000 Gfx), 4GB DDR3L-1600, TPM, Standard temperature0°C to +60°C

TQMx50UC-AC (Premium) Intel Core i7-5650U (2x 2.2GHz / 3.2GHz Turbo, 4MB Cache,HD6000 Gfx), 8GB DDR3L-1600, TPM, Standard temperature0°C to +60°C

Options: CPU, memory, TPM, iRTC, LVDS/eDP, special configurations

AccessoriesTQMx50UC-HSPHeatspreader for TQMx50UC according to the COM Express® specification

TQMx86 software tools For uEFI BIOS programming and to adapt / configure setupdefault values (including multi config), boot logo.

Evaluation platform MB-COME6-1 Mainboard for COM Express® Compact/Basic, Type 6 Interfaces: 2x DP++, eDP/LVDS, 2x Gb Ethernet, 2x USB 3.0, 3x USB 2.0, 3x COM, audio, mini PCIe, mSATA, 2,5” SSD, CFast, riser extension with 2x PCIe and USB, fan, debug, 170 mm x 170 mm


New Products from TQ and Convergence:RoboDrive: TQ’s High-torque Precision Motors for Robotics

Drives developed for aerospace applicationsRoboDrive technology was developed by the Institute forRobotics and Mechatronics of the German Aerospace Centre(DLR). This technology, patented by TQ-Systems, combines a high torque curve and power density relative to the weight and installation space.

Features and Benefitsn Lightweight: ½ the weight of comparable motorsn High torque with compact design: ½ the size of comparable motorsn High power density through maximum copper fill factorn Stator and rotor design reduces power lossn Used as direct drive with reduced motor speedn Highly precise controllability and positioning accuracyn High efficiency with compact designn Modeled drive, tool-based optimization over the entire drive trainn Hollow shaft design

Technical Overviewn Outer diameter range from 25 - 115 mmn Largest hollow shaft on the marketn Torque 0.1 - 40 Nmn Rotational speed up to 25,000 rpmn No coggingn Zero lash-back

34 www.robodrives.com

RoboDriveA breakthrough in robotic motor technology

Comparison of TQ’s RoboDrive motors with thebest commercially available motorsThe DLR results show TQ’s RoboDrive motors with only half the weight and half of the power losses of the best commercially available motors.

A Breakthough in Motor TechnologyIn the past, robot manufacturers have taken the best available motors off the shelf for their robots, without being optimized for robotic applications (comparatively slow rotational speed through high dynamics, permanently reversing operationaround zero speed) and aiming at minimal weight and power losses.

Two years of studies at the DLR in a concurrent engineering and optimization process took into account all the electromag-netic and other physical effects, short copper paths, optimal coil winding and coil filling aspects between the magnetic iron poles.

Out of this optimization process came the conclusion that the stator poles had to be subdivided and wound separately. This resulted in the technology for robotic applications that RoboDrives excels in.

www.robodrives.com 35

The graphs on this page are from Experimental Robotics VIII, edited by Professor Bruno Siciliano and Paolo Dario, published by Springer. The information is the result of studies conducted on the RoboDrive motors by the Institute for Robotics and Mechatronics of the German Aerospace Centre (DLR).

100

90

80

70

60

50

40

30

20

10

00 200 400 600 800 1000 1200 1400

weight rotor + stator [g]

loss

es a

t 1.3

Nm

. zer

o sp

eed

[W]

curve of optimalmotor designs

RBE1811

RBE2111

RBE1516

RBE1813

RBE1815

the best commerciallyavailable motors

selected designfor RoboDrive

Concurrent-Engineering

Analytical modelmotor parameters asfunction of geometric data[k, n, M, ....] = F(L, D, Z, ....)

“Geometry”

goal parameterssinus-�owparameter couplings

“Analytical”optimization

design-proposal

verif ication

prototype

investigation

nonlinearcomputation

“airgap”

FEM-computationoptimization forsinus-�owairgappole and magnet formparameter couplingsmarginal e�ects

linearcomputations

geometry data

RoboDriveDesigned to drive precision robotic and medical applications

Benefitsn Freedom of designn Variable solutions for different drive tasksn Small overall length, flat drive: e.g. for exoskeletonsn Hollow shaft e.g. for optical passage, cable, media, shafts, material, welding wiren Light weight construction: weight reduction for aviation, mobile devicesn Accurate positioning and very constant velocity: e.g. for robotic, optic or analytic applications, surface processingn Thermally safe overload, high peak acceleration, short cycle timen Free from wear / long life timen Quiet

Applicationsn Robotics Lightweight robot (LBR) Robot axes Gripper and clamp systemsn Medical Actuated instruments Guided optics Mobile surgical devices Intensive caren Aviation Seat actuator Door / Latch Bleed Air Unmanned aerial vehiclesn Optics Camera (aperture control) Gimbal operation Cableway propulsion Laser (beam treatment)n Mechanical engineering Alternative for hydraulics / pneumatics

36 www.robodrives.com

Convergence Promotions Embedded Modules Sales, Technical Support and Distribution Services in North America

Convergence Promotions Embedded Modules Sales, Technical Support and Distribution Services in North AmericaTQ’s North American Partner is Convergence Promotions LLC, a leading Embedded Marketing firm in North America. For over three decades, Convergence Promotions LLC has been the premier provider of partner programs and eco-systems in the embedded industry. We have designed and managed silicon and tools ecosystems for a dozen of the world’s electronics companies, including Intel, Motorola, Microsoft, Siemens, Freescale, Infineon, AMD, ARM, Micro-soft, and others.

Our partner programs serve as a catalyst, bringing like-minded businesses together. These programs create synergy for sponsors and partners by providing an envi-ronment that fosters business relations, create customer awareness to increase sales for both the sponsor and their partners and encourages technical discussion to improve products and services.

Engineering Resources We make it easy for engineers and suppliers to find, compare and buy MCUs and development tools through our web site, and monthly industry newsletters reach over 400,000 engineers a month.

In addition to the TQ site EmbeddedModules.net, Conver-gence Promotions LLC owns Embedded Developer, a joint venture with Arrow Electronics. TQ sales and distribution offices in Boston and Silicon Valley, as well as FAEs, design centers, and manufacturing reps throughout the US, allows Convergence Promotions to support customers coast-to-coast in a timely manner.

Convergence Promotions LLC Contact information (N. America)2220 Sunset Point, Discovery Bay, CA 94505 USAPhone: +1 (925) 516-6227 Fax: +1 (925) 240-0001www.convergencepromotions.com

www.EmbeddedModules.net

TQ-Group North American Sales and SupportTQ sales, distribution, and technical support is managed by Convergence Promotions LLC, with offices in Northern California and Boston, Massachusetts, and sales locations throughout the Western United States.

Convergence Promotions is the embedded industry’s leading provider of partner programs in the embedded industry. Convergence reaches the largest audience of embedded developers in the world searching for MCUs and development tools with it’s ARM developer’s site, EmbeddedDeveloper.com (a joint venture with Arrow Electronics and Convergence).

For more information on TQ Embedded modules:

President, Convergence Promotions LLC:Glenn ImObersteg - California, USAPhone: (925) 516-6227 Cell: (408) [email protected]

Embedded Modules and SBCs Products and Support:Vaughn Orchard - Massachusetts, USAPhone: (508) 209-0294 Cell: (978) [email protected]

RoboDrives and Energy Management Products and Support:Michael ImObersteg - California, USAPhone: (925) 640-7042 Fax: (925) [email protected]

Business and Operations: (Incl. Shipping and Fulfillment):Kathleen West - California, USAPhone: (925) 240-0002 Cell: (925) 525-3977 Fax: (925) [email protected]

Embedded Engineering and Applications SupportLuis Torrico - Rhode Island, USAPhone: (401) [email protected]

Product liability, copyrights and disclaimers: The contents of this publication are the property of TQ-Group GmbH and Convergence Promotions, LLC. No portion of this pub-lication may reproduced in part or in whole without express permission, in writing, from Convergence Promotions, LLC. All product names, descriptions, specifications, prices and other information are subject to change without notice. TQ-Group and Convergence Pro-motions, LLC take no responsibility for false or misleading information, errors or omissions. All specifications are subject to change without notice. For the latest updates to specifica-tions, please refer to www.embeddedmodules.net. ARM, ARM9, ARM9E, ARM946E, ARM920T, ARM926EJ-S, ARM11, Cortex-A8, and Cortex-A9, are trademarks of ARM Ltd. All other brands or product names are the property of their respective holders.

Published January 2016 by Convergence Promotions, LLC. Printed in the USA

Manufacturer’s Reps in North America:San Diego Corporate HeadquartersLA Sales, Sierra Sales, North Coast Sales

Lee DavisPresident, Senior Sales Engineer, Southern CaliforniaPhone: (760) 727-0053 Cell: (619) 991-1139 [email protected]

North Coast Sales(Serving Northern California and Northern Nevada)

Olga DeGourSenior Sales Engineer, Penninsula OfficePhone: Cell: (408) 839-8482 [email protected]

Jim AlldaySenior Sales Engineer, North and East Bay OfficePhone: (209) 890-3062 Cell: (805) 794-0030 [email protected]

Sierra Sales(Serving Colorado, Wyoming, Montana, Arizona, New Mexico, SoutheastIdaho, Western Texas, Northwest Nebraska)

Kelvin AistSenior Sales Engineer, Colorado Sales OfficePhone: (720) 870-4500 Cell: (303) 877-0847 [email protected]

Bob RozellSenior Sales Engineer, Arizona Sales OfficePhone: (480) 967-6163 Cell: (602) 799-2075 [email protected]

Kjell BjorgeSenior Sales Engineer, Utah Sales OfficePhone: (801) 947-8558 [email protected]

Ralph PalmerSenior Sales Engineer, New Mexico Sales OfficePhone: (505) 286-8808 Cell: (505) 331-0856 [email protected]

Los Angeles Sales(Serving Southern California, Southern Nevada, Hawaii)

Dave BaileySenior Sales Engineer, San Diego OfficePhone: (858) 635-5670 Cell: (858) 705-2303 [email protected]

Jim BolekSenior Sales Engineer, Valencia Sales OfficePhone: (661) 702-9226 Cell: (661) 510-9736 [email protected]

Art LamarchinaSenior Sales Engineer, Orange County Sales OfficePhone: (818) 519-7154 Cell: (818) [email protected] Catalog V1 Number 1

Documents

Embedded Computer Modules and Boards 2016 Product Catalog